CN1009117B - Composite cathode motherboard that the electrolytic etching of metal refining is used and manufacturing process thereof - Google Patents
Composite cathode motherboard that the electrolytic etching of metal refining is used and manufacturing process thereofInfo
- Publication number
- CN1009117B CN1009117B CN 85104858 CN85104858A CN1009117B CN 1009117 B CN1009117 B CN 1009117B CN 85104858 CN85104858 CN 85104858 CN 85104858 A CN85104858 A CN 85104858A CN 1009117 B CN1009117 B CN 1009117B
- Authority
- CN
- China
- Prior art keywords
- titanium
- copper
- motherboard
- composite cathode
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Images
Landscapes
- Prevention Of Electric Corrosion (AREA)
- Electrolytic Production Of Metals (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The present invention is the cathodic master plate and the manufacturing process thereof of used for non-ferrous metal such as electrolytical refined copper, nickel, cobalt.Composite cathode motherboard of the present invention overcome the shortcoming of the cloudy plate motherboard that copper, stainless steel and melting distortion titanium plate make, and kept the advantage that copper, titanium are used for cathodic master plate simultaneously again, the electric conductivity height, keep good electrical to be connected with the conduction earrings, easily peel off kind of a plate, corrosion resistant is only, plants plate and produces sheet rate height.This kind motherboard is adopted isostatic pressing-hot rolling technology, do not needed big specification powder rolls and vacuum sintering furnace, be applicable to the manufacturing of big specification composite cathode motherboard.
Description
The present invention is the powder metallurgy cathodic master plate of used for non-ferrous metal such as electrolytical refined copper, nickel, cobalt and the manufacture method of this kind motherboard.
At present, in non-ferrous metals such as electrolytic etching of metal refined matte, nickel, cobalt are produced, the cathodic master plate that adopts copper and copper alloy plate or stainless steel plate or melting distortion titanium plate to make usually.This different materials respectively has shortcoming, is not comparatively ideal cathodic master plate material.Copper and copper alloy cathodic master plate have good electrical conductivity, but not corrosion-resistant; In addition, the kind plate that generates on motherboard is difficult for peeling off, be on cathodic master plate separant coating, this had both increased cost, had polluted electrolytic solution again, relic rate height simultaneously, labour intensity is big.The stainless steel cathode motherboard is corrosion-resistant, but poorly conductive, the kind plate also is difficult for peeling off, and also wants separant coating.Melting distortion titanium is done cathodic master plate, and corrosion-resistant, its surface film oxide makes kind of a plate be easy to peel off, need not separant coating, produce the sheet rate up to more than 90%, but this material price height, poorly conductive uses the bath voltage of titanium cathodic master plate to exceed 10-30% than the bath voltage with the cathode motherboard.In addition, use the connectivity problem of existence of titanium motherboard and conduction earrings.Electrolytic deposition is slow when being connected with titanium conduction earrings, production cycle is long, when being connected with the copper earrings, because titanium and copper directly weld the generation frangible compounds, and can only adopt bolt to connect or riveted joint, but the junction is easily loosening when having the potential corrosion life-time service between titanium and copper, not only causes bath voltage rising 10-40%, and has reduced the work-ing life of motherboard.The A77-8 paper is pointed out in the U.S. TMS collection of thesis, and when low current density, the titanium motherboard is connected with stainless steel screw with the copper earrings, and be 6-12 month work-ing life; Be connected with copper rivet between titanium motherboard and copper earrings, its working life is 24-36 month.Because motherboard is different with the material of earrings, is certainly existing the potential corrosion problem, influences work-ing life.Under the situation of high current density, must use fixedly connected, make the conduction earrings with titanium core copper rod or copper core titanium rod, wherein conduction earrings work-ing life of titanium core copper rod is more than 3 years, but this syndeton complexity and cost height, the copper-clad titanium rod boring that is used as the conduction earrings to be exposed titanium core wherein, then titanium core and titanium motherboard are weldingly connected by the titanium post.
Clear 42-24984 document has proposed a kind of titanium copper-clad combination electrode plate, except that copper is exposed in the upper surface of motherboard, all the other all is all coated by titanium, the shortcoming of kind electrode is the same problem that is connected with the conduction earrings that exists, because motherboard one end dew copper is not corrosion-resistant, be not suitable for electrorefining nickel, cobalt use again.
The manufacture method of clad metal sheet is a lot, and clear 42-24984 patent has proposed two kinds of sheet materials (titanium and copper) shaping techniques under explosive.Explosion forming compound titanium copper-clad plate is made electrode through hot rolling, pickling, operation such as cold rolling.Kind electrode is owing to use the metal sheet of melting processing, and price is higher, and manufacturing process, equipment are also complicated.The high conduction titanium electrode that United States Patent (USP) U.S4256810 proposes with roll compacting, sintering process production, there are the following problems for the electrode of this explained hereafter (1), and electrode mainly is made of two-layer sintering titanium valve, because the electric conductivity of titanium valve is low more than copper, required current density when reaching electrolysis, have only the titanium plate cross section of increasing or strengthen electric current, the former expends, and the titanium material is many, and the latter has increased power consumption, all is unsuitable for doing electrolytic etching of metal purified cathodic master plate.(2) inner core with outer compacting or rolling after will be 1600-1800 following vacuum sintering 2～3 hours, thereby form a large amount of copper-titanium frangible compounds, reduce the strength of materials, reduced the work-ing life of electrode, thereby also be unsuitable for doing electrolytic etching of metal purified cathodic master plate.(3) owing to adopt powder rolls, directly rolling composite plate vacuum sintering again, for the cathodic master plate about the employed 800 * 800mm of common metal electrorefining, the powder rolls and the vacuum sintering furnace that then need big specification, not only power consumption is big, the apparatus and process complexity, and the powder rolls of this big specification are difficult to obtain or often can not be fully used.The clear 57-41521 of Japanese Patent Laid communique has introduced titanium plate powder hot rolling method, is that titanium valve is placed the plasticity-jacket, and the vibration jacket makes titanium valve closely knit, vacuumizes, and seals, and carries out hot rolling then.The advantage of this method is that sintering and densification are carried out simultaneously, and technology is simple, but can not be used to produce composite sheet, can only be used for the roll forming of single metal powder or powdered alloy.
The objective of the invention is to make various forms of composite cathode motherboards, it has the electric conductivity height, and is corrosion-resistant, easily peels off the advantage of kind of plate.
Another object of the present invention is to produce the composite cathode motherboard that electrolytic etching of metal refinings such as being applicable to copper, nickel, cobalt is used.
The 3rd purpose of the present invention is to find out a kind of production technique of suitable large size composite cathode motherboard, and technology is simple, and productive expense is low.
The 4th purpose of the present invention is will be in good being connected of the simple conduction of implementation structure between motherboard and the conduction earrings.
At last, the objective of the invention is to use cheap material to make cathodic master plate.
In order to achieve the above object, the present invention wishes to avoid the copper motherboard and is difficult for peeling off kind of plate and shortcoming not corrosion-resistant, that titanium motherboard electric conductivity is low, the advantage of giving full play to copper motherboard electric conductivity height, be connected easily, no potential corrosion, life-span being grown and the titanium motherboard is corrosion-resistant, easily peel off the strong point of kind of plate with copper conduction earrings, utilize powder metallurgy process earlier metal powder layer (copper and/or the iron) part of granularity for 300-40 μ to be coated or all be coated in the ti powder layer of 800-40 μ, make the compound motherboard of various forms of consistency of thickness then.In order to strengthen the metallurgical binding between high conductivity metal and the titanium, the mixed powder that can add both betwixt is as transition layer.To titanium, copper composition board, the mixed transition layer is Ti-Cu3-50Wt%, and to titanium, iron composition board, the mixed transition layer is Ti-Fe3-50 weight %.In order to make this motherboard, the present invention proposes a kind of powder cold isostatic compaction-hot rolling technology, it is packed into by multiple metal-powder layering in the mould, waits the closely knit moulding of static pressure, vacuum-treat, jacket soldering and sealing, hot rolling goes operation such as jacket to form.In cold isostatic press with 0.5-2.5 newton/centimetre
2Unit pressure be pressed into the composite powder base.The composite powder base cooled off in the back ductile metal jacket of packing in atmosphere, then sealing at 350-550 ℃ of following vacuum-treat 1-3 hour.To be wrapped in and be heated to 800-950 ℃ in the stove, be incubated 5-30 minute, rapidly jacket be sent into hot rolling in the hot rolls, in hot rolling, finish sintering and densification simultaneously.Hot rolling working modulus first is 10-50%, removes jacket after being rolled to desired size.In order to prevent the copperhead pressure welding of jacket and composite cathode motherboard end, before the composite powder base is packed jacket into, be preferably in the copperhead surface and coat molybdenumdisulphide.
The present invention compared with the prior art, its advantage is:
(1) owing to used matrix material, make the existing high electric conductivity of motherboard, corrosion-resistant again, easily peel off kind of a plate.Relatively reduce power consumption with the titanium motherboard, relatively to peel off kind of plate easy with the copper motherboard, plants plate and produce the sheet rate and bring up to 98% by 75% of copper motherboard, prolonged the motherboard life-span, saved the labor force, reduced labour intensity.
(2) because starting material titanium, copper, the iron of manufacturing cathodic master plate all are metal-powder, its cost is than with identical sheet metal significant reduction being arranged.
(3) can adopt multi-form motherboard structure and material to make different cathodic master plates, be applicable to the production of different metal electrorefining.
(4) owing to adopted and wait static pressure powder compacting-hot rolling technology, do not need the powder rolls and the vacuum sintering furnace of big specification, make during hot rolling and metal powder sinteredly carry out simultaneously, can save the energy and reduce operation with the processing densification.
(5) can stretch out outside the titanium skin owing to conductive core, (accompanying drawing 1,2,4), mode of connection such as can adopt welding with the copper earrings, rivet, be threaded or directly be connected with the power supply guide rod, this connection has avoided the titanium motherboard to be connected the potential corrosion that is produced with riveted joint, the bolt of copper earrings, improved the work-ing life of junction, and syndeton is simple.
(6) various forms of motherboard of the present invention selectively is applicable to the electrorefining of copper, nickel, cobalt, manganese and precious metal.
(7) powder compacting-hot rolling technology of the composite sheet that proposes of the present invention also is applicable to and makes Ti-Cu(or Fe) matrix material of in addition other metal, and two-layer above matrix material.
Accompanying drawing 1 copperhead titanium volume recombination cathodic master plate
Accompanying drawing 2 copperhead titanium copper-clad composite cathode motherboards
Accompanying drawing 3 full-enclosed titanium copper-clad (or iron) composite cathode motherboards
Accompanying drawing 4 copperhead titanium iron clad composite cathode motherboards
Embodiment 1
Present embodiment is Ti-Cu composite cathode motherboard (Fig. 2).The copper inner core is except that head stretches out, and rest part is all coated by titanium.Copperhead can adopt welding, bolt to be connected with the conductive copper earrings or weld, and has eliminated titanium motherboard titanium earrings and has connected the shortcoming that is connected with titanium motherboard copper earrings, realizes that favorable conductive connects.In order to increase the outer field bonding strength of copper inner core and titanium, between is put into Ti-Cu3～50 weight %(2-2) the mixed transition layer.This motherboard electric conductivity height is planted plate and is easily peeled off, and the relic rate is low, and is corrosion-resistant.The manufacturing process of this motherboard is: the 320-40 μ titanium valve with L300XB310XH10mm evenly is tiled in the mould earlier, with dividing plate copperhead is partly separated, do not made titanium valve, spread the mixed transition layer of the thick Ti-Cu3-50 weight % of 2～4mm on titanium valve, 300-40 μ copper powder then tiles, thick 20mm, in kind spread Ti-Cu3～50 weight %(2-2 afterwards again), titanium valve covers template then, put on the isostatic pressing machine, with 2 newton/centimetre
2Unit pressure is pressed into the composite powder base of L200XB290XH20mm, put into vacuum oven 400 ℃ of following vacuum-treat 1 hour, in the thick iron jacket of the 1～2mm that packs into after the cooling, in the groove of logical water coolant with gas welding or argon arc welding with the jacket sealing, to be wrapped in then and be heated to 850 ℃ in the stove, be incubated after 10～15 minutes, rapidly jacket be sent into the hot rolls hot rolling, hot rolling first working modulus greater than 20%, so that guarantee the bonding strength of composition metal.All the other pass reductions are not less than 5%, and finishing temperature is 300～400 ℃, and the plate after the hot rolling cuts four limits annealing 20 minutes under 650～750 ℃ after the cooling under atmosphere or vacuum state, remove the jacket iron sheet.
Embodiment 2(Fig. 1)
Present embodiment is copperhead (1-1) titanium motherboard (1-3).Top adopts copperhead to be connected with the conductive copper earrings, realizes that favorable conductive connects.In order to improve strength of joint, the periphery in copperhead and titanium plate junction has Ti-Cu3～50 weight %(1-2) the mixed transition layer, realize metallurgical binding preferably.This motherboard characteristics are in light weight, and are corrosion-resistant.
Embodiment 3(Fig. 3)
This embodiment is the composite cathode motherboard of full-enclosed titanium (3-3) copper-clad or iron (3-1).In order to increase bonding strength, between copper and titanium or iron and titanium, added Ti-Ci3～50 weight % or Ti-Fe3～50 weight %(3-2) the mixed transition layer.The motherboard of this kind structure is because all be enclosed in copper or iron in the titanium plate, so erosion resistance is best, except being used for cupric electrolysis, can also do cathodic master plate in nickel, cobalt, manganese electrolysis.
Embodiment 4
Present embodiment is copperhead (4-1) titanium (4-3) iron clad (4-4) composite cathode motherboard (Fig. 4).Head adopts copperhead to be connected with conductive copper earrings conduction.Between titanium and iron, put into Ti-Fe3～50 weight %(4-2) the mixed transition layer, strengthen both bonding strength.This motherboard conducts electricity than the Ti motherboard, and is corrosion-resistant, easily peels off kind of a plate, low price.
Claims (8)
1, the composite cathode motherboard used of electrolytic etching of metal refining is composited by titanium and high conductivity metal copper or iron, it is characterized in that:
(1) composite cathode motherboard used of said electrolytic etching of metal refining is made for the raw material layering by titanium valve and copper powder and/or iron powder;
(2) have between titanium and high conductivity metal and strengthen the transition layer of metallurgical binding between the two, the mixed transition layer of titanium, copper composition board is Ti-Cu3-50 weight %, and the mixed transition layer of titanium, iron composition board is Ti-Fe3-50 weight %.
2, the composite cathode motherboard of using according to the said electrolytic etching of metal refining of claim 1 is characterized in that the motherboard head is a copper, and rest part is a titanium.
3, the composite cathode motherboard of using according to the said electrolytic etching of metal refining of claim 1 it is characterized in that with titanium copper clad, but wherein part copper is not coated by titanium.
4, the composite cathode motherboard of using according to the said electrolytic etching of metal refining of claim 1 is characterized in that with titanium copper or iron all being coated.
5, the composite cathode motherboard of using according to the said electrolytic etching of metal refining of claim 1 is characterized in that copper docks with iron, with titanium iron and part copper is coated.
6, the composite cathode motherboard manufacturing process used of electrolytic etching of metal refining comprises dress powder, closely knit, jacket soldering and sealing, hot rolling, removal jacket operation, and the feature of this technology is:
(1) said dress powder is according to the motherboard structure form metal-powder layering to be packed in the mould;
(2) said closely knit be adopt 0.5-2.5 newton/centimetre
2Pressure under isostatic cool pressing;
(3) the powder base after closely knit is through 350-550 ℃, vacuum-treat in 1-3 hour;
(4) soldering and sealing again in the jacket of packing into of the powder base after the vacuum-treat;
(5) said hot rolling, 800-950 ℃ of its hot rolling heating cycle is incubated 5-30 minute, and working modulus is 10-50% first.
7, according to the said manufacturing process of claim 6, it is characterized in that sheet material after the hot rolling under atmosphere or vacuum through 650-750 ℃ of anneal.
8,, it is characterized in that the powder base is coated with molybdenumdisulphide on the copperhead surface before the jacket of packing into according to claim 6,7 said manufacturing process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 85104858 CN1009117B (en) | 1985-06-26 | 1985-06-26 | Composite cathode motherboard that the electrolytic etching of metal refining is used and manufacturing process thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 85104858 CN1009117B (en) | 1985-06-26 | 1985-06-26 | Composite cathode motherboard that the electrolytic etching of metal refining is used and manufacturing process thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN85104858A CN85104858A (en) | 1987-01-07 |
| CN1009117B true CN1009117B (en) | 1990-08-08 |
Family
ID=4794105
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 85104858 Expired CN1009117B (en) | 1985-06-26 | 1985-06-26 | Composite cathode motherboard that the electrolytic etching of metal refining is used and manufacturing process thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN1009117B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100424231C (en) * | 2002-01-25 | 2008-10-08 | 艾萨山矿业有限公司 | Hanger bar |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101177049B (en) * | 2007-11-23 | 2011-06-15 | 中南大学 | Method for preparing Cu-TiNi composite material |
| CN104308161B (en) * | 2014-10-16 | 2017-02-01 | 中国工程物理研究院材料研究所 | Preparation method of boron carbide/aluminum composite board |
| CN113897643A (en) * | 2021-10-11 | 2022-01-07 | 兰州理工大学 | Sandwich composite metal electrolysis and deposition cathode plate |
| CN116162968B (en) | 2023-03-17 | 2023-09-22 | 赣州晨光稀土新材料有限公司 | Tungsten electrode for rare earth molten salt electrolysis and preparation method thereof |
-
1985
- 1985-06-26 CN CN 85104858 patent/CN1009117B/en not_active Expired
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100424231C (en) * | 2002-01-25 | 2008-10-08 | 艾萨山矿业有限公司 | Hanger bar |
Also Published As
| Publication number | Publication date |
|---|---|
| CN85104858A (en) | 1987-01-07 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101121974B (en) | High-strength high-conduction strengthened dispersion copper alloy and preparation method thereof | |
| CN100464001C (en) | High-strength high-conductivity oxidation-resisting low-silver copper-base alloy and preparation thereof | |
| CN101092710B (en) | Production method of composite board of titanium / copper | |
| CN101426960B (en) | Tin-plated Cu-Ni-Si alloy strip | |
| CN100507065C (en) | Carbon fiber reinforced nickel-based composite material and producing method thereof | |
| CN107096994A (en) | The diffusion welding (DW) fitting and its production method of a kind of high-purity zirconia composite ceramics and red copper | |
| CN104894494A (en) | Preparation method of carbon fiber mesh reinforced copper-based wear-resisting material | |
| CN112962119A (en) | Composite electrode plate for non-ferrous metal electrodeposition and preparation method thereof | |
| CN101092709A (en) | Composite board of lead / copper, and production method | |
| CN101345142A (en) | Electrical contact material with Ti3SiC2 multi-layer compound structure and preparation technique | |
| CN1009117B (en) | Composite cathode motherboard that the electrolytic etching of metal refining is used and manufacturing process thereof | |
| CN101797687B (en) | Preparation method of TiAl alloy with fine grain full synusia tissue | |
| US20240043964A1 (en) | Device and method for preparing low-impurity regenerated brass alloy through step-by-step insertion of electrode | |
| CN1119842C (en) | Electrically conductive terminal cast with Al-Cu alloy | |
| CN105478725A (en) | Method for preparing bi-metal composite through solid copper solid-liquid composite and extrusion combination | |
| US4541912A (en) | Cermet electrode assembly | |
| CN111468718A (en) | Silver copper oxide sheet-shaped electric contact and preparation method thereof | |
| CN1035089C (en) | Electrical low-resistivity Ag/SnO2 contact material and preparation thereof | |
| CN108396335B (en) | Cermet base inert anode used for aluminium electrolysis and guide rod connection structure and preparation method | |
| CN110504119A (en) | A kind of preparation method of silver-bearing copper composite electric contact material | |
| CN1265409C (en) | Copper/rare-earth oxide/carbon contact and method for producing same | |
| CN1595570A (en) | Silver/nickel/rare-earth oxide/carbon contact and method for producing same | |
| CN107841765A (en) | A kind of Zinc electrolysis anode material and preparation method thereof | |
| CN110592430B (en) | TiAl alloy plate thermo-electric coupling non-sheath preparation method | |
| CN1293237C (en) | Production method for electrical contact material |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C13 | Decision | ||
| GR02 | Examined patent application | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CX01 | Expiry of patent term |