CN100596256C - 将材料图样连续沉积在基底上的设备和方法 - Google Patents

将材料图样连续沉积在基底上的设备和方法 Download PDF

Info

Publication number
CN100596256C
CN100596256C CN200680025659A CN200680025659A CN100596256C CN 100596256 C CN100596256 C CN 100596256C CN 200680025659 A CN200680025659 A CN 200680025659A CN 200680025659 A CN200680025659 A CN 200680025659A CN 100596256 C CN100596256 C CN 100596256C
Authority
CN
China
Prior art keywords
mask
substrate
roller
cylinder
control system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN200680025659A
Other languages
English (en)
Chinese (zh)
Other versions
CN101223834A (zh
Inventor
唐纳德·J·穆克卢尔
杰弗里·H·托其
丹尼尔·H·卡尔森
詹姆斯·N·多布斯
约翰·T·斯特兰德
罗纳德·P·斯万松
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of CN101223834A publication Critical patent/CN101223834A/zh
Application granted granted Critical
Publication of CN100596256C publication Critical patent/CN100596256C/zh
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/14—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using spraying techniques to apply the conductive material, e.g. vapour evaporation
    • H05K3/143—Masks therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41F—PRINTING MACHINES OR PRESSES
    • B41F15/00—Screen printers
    • B41F15/08—Machines
    • B41F15/0831—Machines for printing webs
    • B41F15/0836—Machines for printing webs by means of cylindrical screens or screens in the form of endless belts
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/04—Coating on selected surface areas, e.g. using masks
    • C23C14/042—Coating on selected surface areas, e.g. using masks using masks
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
    • B41P—INDEXING SCHEME RELATING TO PRINTING, LINING MACHINES, TYPEWRITERS, AND TO STAMPS
    • B41P2215/00—Screen printing machines
    • B41P2215/10—Screen printing machines characterised by their constructional features
    • B41P2215/12—Screens
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0393—Flexible materials
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/01—Tools for processing; Objects used during processing
    • H05K2203/0104—Tools for processing; Objects used during processing for patterning or coating
    • H05K2203/0134—Drum, e.g. rotary drum or dispenser with a plurality of openings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physical Vapour Deposition (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
CN200680025659A 2005-07-12 2006-07-11 将材料图样连续沉积在基底上的设备和方法 Expired - Fee Related CN100596256C (zh)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US17941805A 2005-07-12 2005-07-12
US11/179,418 2005-07-12
PCT/US2006/027063 WO2007008992A2 (en) 2005-07-12 2006-07-11 Apparatus and methods for continuously depositing a pattern of material onto a substrate

Publications (2)

Publication Number Publication Date
CN101223834A CN101223834A (zh) 2008-07-16
CN100596256C true CN100596256C (zh) 2010-03-24

Family

ID=37637931

Family Applications (1)

Application Number Title Priority Date Filing Date
CN200680025659A Expired - Fee Related CN100596256C (zh) 2005-07-12 2006-07-11 将材料图样连续沉积在基底上的设备和方法

Country Status (4)

Country Link
EP (1) EP1902601A2 (enExample)
JP (1) JP2009501280A (enExample)
CN (1) CN100596256C (enExample)
WO (1) WO2007008992A2 (enExample)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20080171422A1 (en) * 2007-01-11 2008-07-17 Tokie Jeffrey H Apparatus and methods for fabrication of thin film electronic devices and circuits
KR101504388B1 (ko) 2008-06-26 2015-03-19 가부시키가이샤 니콘 표시소자의 제조방법 및 제조장치
US8339573B2 (en) 2009-05-27 2012-12-25 3M Innovative Properties Company Method and apparatus for photoimaging a substrate
US20110065282A1 (en) * 2009-09-11 2011-03-17 General Electric Company Apparatus and methods to form a patterned coating on an oled substrate
KR101201755B1 (ko) * 2010-11-02 2012-11-15 삼성에스디아이 주식회사 진공 증착 장치 및 이를 이용한 진공 증착 방법
JP5736857B2 (ja) * 2011-03-09 2015-06-17 凸版印刷株式会社 成膜装置
JP5733507B2 (ja) * 2011-03-17 2015-06-10 凸版印刷株式会社 成膜方法
JP5937876B2 (ja) * 2012-04-18 2016-06-22 名古屋メッキ工業株式会社 めっき繊維製造装置及び方法
CN103668047A (zh) * 2012-09-03 2014-03-26 香港纺织及成衣研发中心有限公司 真空镀膜图案生成装置及方法
EP3184140B1 (en) * 2015-12-21 2021-10-06 Dentsply IH AB Catheters with bevelled drainage holes as well as method and device for forming such holes
CN112226730A (zh) * 2020-09-30 2021-01-15 广州国显科技有限公司 柔性掩膜版和蒸镀装置

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5395643A (en) * 1991-09-18 1995-03-07 International Business Machines Corporation Method of and apparatus for depositing solder on a printed circuit board
WO2001035703A1 (en) * 1999-11-08 2001-05-17 Speedline Technologies, Inc. Improvements in solder printers
US20050109811A1 (en) * 2003-11-21 2005-05-26 Swanson Ronald P. Method and apparatus for controlling a moving web

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB2248039B (en) * 1990-08-31 1994-12-07 Ricoh Kk Printer using a stencil
US6897164B2 (en) 2002-02-14 2005-05-24 3M Innovative Properties Company Aperture masks for circuit fabrication

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5395643A (en) * 1991-09-18 1995-03-07 International Business Machines Corporation Method of and apparatus for depositing solder on a printed circuit board
WO2001035703A1 (en) * 1999-11-08 2001-05-17 Speedline Technologies, Inc. Improvements in solder printers
US20050109811A1 (en) * 2003-11-21 2005-05-26 Swanson Ronald P. Method and apparatus for controlling a moving web

Also Published As

Publication number Publication date
CN101223834A (zh) 2008-07-16
EP1902601A2 (en) 2008-03-26
WO2007008992A3 (en) 2007-05-24
JP2009501280A (ja) 2009-01-15
WO2007008992A2 (en) 2007-01-18

Similar Documents

Publication Publication Date Title
US20080011225A1 (en) Apparatus and methods for continuously depositing a pattern of material onto a substrate
EP2488429B1 (en) Apparatus and method for processing long, continuous flexible substrates
CN100596256C (zh) 将材料图样连续沉积在基底上的设备和方法
JP6308247B2 (ja) パターン形成方法
GB2458986A (en) Apparatus for patterning thin films on continuous flexible substrates
KR101578259B1 (ko) 기점을 기재 상에 형성하기 위한 장치 및 방법
EP3028132B1 (en) Modifying printing based on cross-web distortions
US7100510B2 (en) Method for registering patterns on a web
US20100043659A1 (en) Method for registering patterns on a web
KR102516387B1 (ko) 5차원 위치 제어 장치를 활용한 롤투롤 레지스터 정밀 제어 시스템 및 방법
WO2013065451A1 (ja) 基板処理装置および基板処理方法
KR101869821B1 (ko) Rtr 노광 시스템
CN213368229U (zh) 薄膜处理系统
KR101863946B1 (ko) Rtr 노광 제어방법
CN212933489U (zh) 触控薄膜
KR20190037620A (ko) 레지스터피더를 활용한 1-d ambr 제어 기반의 롤투롤 레지스터 제어 시스템
JP5493959B2 (ja) パターン形成装置、パターン形成方法及び表示素子の製造装置
CN113766737A (zh) 薄膜处理系统和方法
JP4359303B2 (ja) 建築用板材の製造装置および製造方法
CN113766759A (zh) 薄膜处理系统和方法

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20100324

Termination date: 20110711