CN100593844C - Package process of image inducting IC chip - Google Patents
Package process of image inducting IC chip Download PDFInfo
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- CN100593844C CN100593844C CN200710144090A CN200710144090A CN100593844C CN 100593844 C CN100593844 C CN 100593844C CN 200710144090 A CN200710144090 A CN 200710144090A CN 200710144090 A CN200710144090 A CN 200710144090A CN 100593844 C CN100593844 C CN 100593844C
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- chip
- inducting
- image
- circuit
- packaging technology
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Abstract
The invention relates to the packaging technology of an image sensor integrated circuit chip. The invention is characterized by comprising the steps that a plurality of circuit modules are printed ona whole placode original plank stuff side by side; each image sensor integrated circuit chip is arranged on each circuit module for die bond in one-to-one way. Each integrated circuit chip is bonded with each circuit module by routing; gluewater is coated on the edge of each image sensor integrated circuit chip and ambient independent circuit modules, and the height of the gluewater is slightly higher than the height of the image sensor circuit chip; the whole filter glass which is not cut covers the sealed gluewater and is roasted for solidify; at last the whole filter glass is cut along thedividing line of each circuit module, then a circuit base plate with a single and completely sealed image sensor integrated circuit chip is formed. The whole packaging technology of the invention onlyhas a cutting process, which greatly simplifies the process of previous repeatedly and separately cutting all materials and reduces the process cost; the placode original plank stuff is fully used, and raw materials are saved.
Description
Technical field
The present invention relates to the video sensing device, specifically be meant a kind of packaging technology of image inducting IC chip.
Background technology
The encapsulation of image inducting IC can be described as a very exquisite careful science and art, because the video recording analysis function of the function value core image inducting IC module of digital camera from strength to strength, but body is more and more small, whether how more to save material, save man-hour, being image inducting IC encapsulation dealer can surpass other same dealer aspect the economic production capacity, have the ability to obtain the deciding factor of order.
Image inducting IC chip packaging technology of the prior art can be with reference to the flow chart of Fig. 1, and the while is with reference to the intact envelope finished product cut-away view of Fig. 2, by shown in these figure as can be known, it is at first solid one by one brilliant on the former sheet material of full wafer substrate that does not cut with image inducting IC chip 10, image inducting IC chip 10 and the former sheet material of full wafer substrate are bound together with line 11, be coated with glue 20 again on image inducting IC chip 10 edges and circuit substrate 50 thereof, with soon having cut into the single glass 30 that is slightly less than image inducting IC chip 10 top areas, cover on image inducting IC chip 10, around the blended rubber water 40 coating image inducting IC chips 10, frame around glass 30 and the image inducting IC chip 10 is sealed, the former sheet material of cutting substrate behind the baking-curing in addition, cut the circuit substrate 50 of telling the intact envelope of piece plate face image inducting IC chip 10, circuit substrate 50 to every single intact envelope image inducting IC 10 carries out packaging and testing again, and this kind technology has following shortcoming:
At first, needing single glass to seal one by one adheres on the image inducting IC chip 10, expend many man-hours and manpower, and the big glass of monoblock must be cut out many single glass that are divided into required size before making, not only increase the processing cost that glass is got the raw materials ready, and follow-up the need again cuts into Pork-pieces circuit substrate to the former sheet material of substrate again, the increase of multiple tracks cutting work and cutting cost before and after producing, can't have once cutting simultaneously and cut glass, former sheet material generating routine of substrate and cost simplify benefit.
Secondly, owing on the former sheet material of substrate, be easy to cutting for making the module that has encapsulated, all can carry out the gong plate to the full wafer circuit substrate again, reserving gaps makes every independent circuits substrate residual bar dowel.This gong plate method also will promote the circuit substrate cost.And owing to reserve these a little slits, also must move out of partly plate face of the former sheet material of substrate by sky, the former sheet material of substrate can't fully be utilized, add when the former sheet material of cutting substrate becomes the circuit substrate of the intact envelope of piece plate face image inducting IC chip, paste neat plastics support frame for making to cut edge, reach not only smooth but also do not have unnecessary side cut wooden partition and take when putting the space, just must cut one by one at the edge separately along wantonly two adjacent plastics support frames, excise reserving gaps completely, make a common cutter just can cut the work of adjacent object, increase twice cutting quantity at least, cause cutting cost to increase, and reserving gaps is excised into the way of waste material again, also forms the waste to the former sheet material of substrate, promotes material cost.
In addition, the image inducting IC chip packaging technology of prior art also has technology as shown in Figure 3, and please be simultaneously with reference to the intact envelope finished product cut-away view of Fig. 4, by shown in the figure as can be known, it is at first with on solid brilliant one by one in not cutting but the former sheet material of full wafer substrate of fixed plastics support frame 70 of image inducting IC chip 60, image inducting IC chip 60 and the former sheet material of full wafer substrate are bound together with line 61, and glue 80 is coated plastics support frame 70 frames push up, with soon having cut into the single glass 81 that slightly is same as plastics support frame 70 peripheral sizes, cover on plastics support frame 70, in addition behind the baking-curing, seal the image inducting IC chip 60 in the frame, the former sheet material of cutting substrate again, cut the circuit substrate 90 of telling the intact envelope of piece plate face image inducting IC chip 60, circuit substrate 90 to every single intact envelope video sensing IC chip 60 carries out packaging and testing again, and this kind technology is also just like preceding described various shortcomings.
Summary of the invention
The invention provides a kind of packaging technology of image inducting IC chip, its main purpose is to overcome shortcomings such as existing image inducting IC chip packaging technology has the multiple tracks cutting technique, the expense that wastes time and energy material, technology cost height; Another object of the present invention is to overcome the shortcoming of the former sheet material of existing image inducting IC chip packaging technology waste substrate.
The present invention adopts following technical scheme: a kind of packaging technology of image inducting IC chip may further comprise the steps: 1) print a plurality of circuit modules side by side on the former sheet material of full wafer substrate; 2) with each image inducting IC chip one by one correspondence be positioned over and carry out solid crystalline substance on each circuit module; 4) by routing each integrated circuit (IC) chip and each circuit module are tied up and connected together; 5) with glue application on each image inducting IC chip edge and independent circuits module all around thereof; 6) the uncut filter glass of full wafer is covered in the sealing top, and baking-curing; 7) cut along each circuit module line of demarcation, form the circuit substrate of single intact envelope image inducting IC chip.
The packaging technology of aforementioned a kind of image inducting IC chip, described step 2) further may further comprise the steps after: location hole is offered in the position of departing from each circuit module on the former sheet material of substrate, by this location hole with put cooperating of tool dowel, the former sheet material of substrate is fixed in puts on the tool.
The packaging technology of aforementioned a kind of image inducting IC chip further may further comprise the steps after the described step 5): plant the tin ball at the another side of each circuit module.
The packaging technology of aforementioned a kind of image inducting IC chip, the total height of described sealing is greater than the height of image inducting IC chip.
By the above-mentioned description of this invention as can be known, compare with prior art, the present invention has following advantage: one, and whole packaging technology has only cutting action one, has simplified operation in the past greatly, has reduced the technology cost; Two, the former sheet material of substrate is fully used, and saves material.
Description of drawings
Fig. 1 is the flow chart of the image inducting IC chip packaging technology in a kind of prior art;
Fig. 2 is the cutaway view of the intact envelope of the image inducting IC chip finished product in a kind of prior art;
Fig. 3 is the flow chart of the image inducting IC chip packaging technology in the another kind of prior art;
Fig. 4 is the cutaway view of the intact envelope of the image inducting IC chip finished product in the another kind of prior art;
Fig. 5 is the flow chart of image inducting IC chip packaging technology of the present invention;
Fig. 6 is the technique component of image inducting IC chip packaging technology of the present invention and the three-dimensional installation diagram of putting tool;
Fig. 7 is the cutaway view of the intact envelope of image inducting IC chip of the present invention finished product;
Fig. 8 is the intact envelope of image inducting IC chip of the present invention finished product application example schematic diagram.
Embodiment
The specific embodiment of the present invention is described with reference to the accompanying drawings.
Fig. 1 to Fig. 4 has shown that the packaging technology flow process of the image inducting IC chip of prior art has reached envelope finished product sectional structure, in the existing detailed description of background technology.
With reference to Fig. 5, be present embodiment image inducting IC chip packaging technology flow chart, simultaneously with reference to the technique component of Fig. 6 and put the tool schematic diagram, and the intact envelope finished product cut-away view of Fig. 7, by shown in these figure as can be known, the image inducting IC chip packaging technology in the present embodiment may further comprise the steps:
The former sheet material 100 of the substrate that will not cut at first, be printed as array side by side, every group of printed circuit with several independent circuits modules 101,102, offer location hole 103,104,105 (step S1) one by one departing from independent circuits module 101,102 specified points; Location hole 103,104,105 with the former sheet material 100 of substrate faces toward the dowel 201,202 of putting tool 200 again, be positioned over and put location (step S2) on the tool 200, subsequently in each independent circuits module 101,102 precalculated position, place an image inducting IC chip 300 and consolidated brilliant (step S3), and with corresponding contact mutually routing 106 connections (step S4) of image inducting IC chip 300 with independent image transmission circuit module 101; Coat on each image inducting IC chip 300 edge and the independent circuits module all around 101,102 thereof with sealing 400 again, and make the height (step S5) of sealing 400 amounts of being coated with a little more than image inducting IC chip 300; The filter glass 500 that a monoblock is not cut is covered in the sealing 400 and dowel 104 that is coated with around each independent circuits module 101,102 then, baking-curing sealing 400 (step S6) again; Border along former sheet material 100 each the independent circuits module 101,102 of substrate cuts at last, cuts out the independent circuits substrate 700 (step S8) of each intact envelope image inducting IC chip 300.
The above-mentioned bottom of promptly finishing does not have the image inducting IC chip encapsulating structure of tin ball, if draw up the bottom to have the image inducting IC chip encapsulating structure of tin ball, as long as again at the another side of independent circuits module, plant tin ball 600,601 more one by one and get final product (step S7).
Thus, by the filter glass 500 that intact envelope image inducting IC chip 300 on former sheet material 100 of substrate and the former sheet material 100 of substrate is covered, single is cut out the independent circuits substrate 700 that has cut out envelope image inducting IC chip 300, and after the independent circuits substrate 700 of single intact envelope image inducting IC chip 300 carried out packaging and testing and veritify, can be as shown in Figure 8, shipment is fitted to the pick-up lens 800 interior image spaces of digital camera product, accepts to handle camera lens lens 801 and transmits the shadow of injecting.
Above-mentioned only is a specific embodiment of the present invention, but design concept of the present invention is not limited thereto, and allly utilizes this design that the present invention is carried out the change of unsubstantiality, all should belong to the behavior of invading protection range of the present invention.
Claims (3)
1, a kind of packaging technology of image inducting IC chip is characterized in that may further comprise the steps:
1) on the former sheet material of full wafer substrate, prints side by side a plurality of circuit modules, offer location hole one by one departing from independent circuits module specified point;
2) location hole with the former sheet material of substrate faces toward the dowel of putting tool, is positioned over to put on the tool and locatees;
3) with each image inducting IC chip one by one correspondence be positioned over and carry out solid crystalline substance on each circuit module;
4) by routing each integrated circuit (IC) chip and each circuit module are tied up and connected together;
5) with glue application on each image inducting IC chip edge and independent circuits module all around thereof;
6) the uncut filter glass of monoblock is covered in the sealing and dowel that is coated with around each independent circuits module, and the baking-curing sealing;
7) cut along each circuit module line of demarcation, form the circuit substrate of single intact envelope image inducting IC chip.
2, the packaging technology of a kind of image inducting IC chip as claimed in claim 1 is characterized in that further may further comprise the steps after the described step 6): plant the tin ball at the another side of each circuit module.
3, the packaging technology of a kind of image inducting IC chip as claimed in claim 1 is characterized in that: the total height of described sealing is greater than the height of image inducting IC chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710144090A CN100593844C (en) | 2007-12-21 | 2007-12-21 | Package process of image inducting IC chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200710144090A CN100593844C (en) | 2007-12-21 | 2007-12-21 | Package process of image inducting IC chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101339909A CN101339909A (en) | 2009-01-07 |
| CN100593844C true CN100593844C (en) | 2010-03-10 |
Family
ID=40213935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200710144090A Expired - Fee Related CN100593844C (en) | 2007-12-21 | 2007-12-21 | Package process of image inducting IC chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100593844C (en) |
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2007
- 2007-12-21 CN CN200710144090A patent/CN100593844C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101339909A (en) | 2009-01-07 |
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| C14 | Grant of patent or utility model | ||
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| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100310 Termination date: 20171221 |