CN100592063C - Device for canceling wafer sample surface charge effect and its usage method - Google Patents
Device for canceling wafer sample surface charge effect and its usage method Download PDFInfo
- Publication number
- CN100592063C CN100592063C CN200610118507A CN200610118507A CN100592063C CN 100592063 C CN100592063 C CN 100592063C CN 200610118507 A CN200610118507 A CN 200610118507A CN 200610118507 A CN200610118507 A CN 200610118507A CN 100592063 C CN100592063 C CN 100592063C
- Authority
- CN
- China
- Prior art keywords
- metal grill
- bolt
- disk
- spring
- sample stage
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Analysing Materials By The Use Of Radiation (AREA)
Abstract
The invention discloses a set of charge removing devices. During the surface analysis of a wafer, the analysis is easy to make an error due to the fact that the surface of the wafer has a charge effect. The invention eliminates the problem by a set of devices and the corresponding using method. The devices provided by the invention comprise: a metal mesh, a sample stage and a bolt assembly. When the wafer is placed on the sample stage, the metal mesh is put down to conduct the accumulated charges on the surface of the wafer away through the metal mesh. The invention conveniently and effectively solves the problem that the charge effect produces the analysis error.
Description
Technical field
The present invention relates to the Apparatus and method for that surface analysis is used in the SIC (semiconductor integrated circuit) manufacturing field, particularly eliminate the Apparatus and method for that the disk surfaces electric charge is used in the SIC (semiconductor integrated circuit) during surface analysis.
Background technology
Development along with semicon industry, the Auger electron spectrometer of using as surface analysis (hereinafter to be referred as Auger), because it is to the high susceptibility of sample surfaces 70A left and right sides element, being applied in the semicon industry more and more widely is in the analysis of especially surface contamination aspect.
But the charge effect of sample surfaces material is more and more serious to the influence of Auger sample.
When for example being used for the Auger analysis, charge effect has just produced analysis result and has seriously influenced.
Auger utilizes electron beam in the sample surfaces motion process, and resulting Auger electron spectroscopy is done analysis.Because every kind of unit have feature Auger electron energy separately, so can be used to determine contained chemical constitution.
But the existence of charge effect makes the power spectrum drift, even spectral line distorts, so just can not the contained composition in correct analysis surface, had a strong impact on the correctness of analysis result.
Traditional sample stage structure as shown in Figure 1 and Figure 2, wherein 1 is pedestal, 2 is overcoat, sample is placed on the pedestal 1, overcoat 2 card is pressed on it, second fixed sample first can lead away the electric charge on sample surface.But owing to be the outer ring, so the charge effect that can eliminate is very limited.
And existing usefulness solves the Auger sample surface charge effect method of analyzing influential problem respectively there is shortcoming.
The method that the Auger sample surface charge effect is eliminated in common being used at present is as follows:
At sample surfaces plating Pt; At the foraminate aluminium foil of sample surfaces wrap; Make charge compensation with low-energy ion at sample surfaces.
But above method but all has shortcoming separately.
Can cause damage and Pt signal also can influence the collection of other feeble signals too by force to sample surfaces at sample surfaces plating Pt; Success ratio in the foraminate foil samples preparation of sample surfaces wrap is very low; Need specific installation and make charge compensation at sample surfaces, the cost costliness with low-energy example.
Therefore, when carrying out surface analysis in the actual production, press for a kind of not impact analysis, simple to operation, the apparatus and method that do not need the elimination sample charge effect of extra specific installation with low cost.
Summary of the invention
At the problem that occurs in the prior art, the present invention proposes a kind of apparatus and method of novel elimination sample charge effect.
The device that the present invention proposes is made of three parts:
Metal grill, sample stage and two cover bolt assemblies constitute.
Wherein, metal grill has two parts to constitute, and a part is the round-meshed sheet metals in both sides, and another part is that middle metal grill constitutes, and wherein the diameter of the circular hole on the sheet metal is greater than the screw diameter of above-mentioned bolt, less than the diameter of bolt head.Middle metal grill by be parallel to each other, horizontal and vertical two groups of wire nettings that bonding jumper is connected to form arranged in a uniform, the hole of this wire netting is rectangular, and is evenly distributed, size is identical.
Sample stage is made of the brace table of pedestal and support disk.
The pedestal of sample stage and existing pedestal are basic identical, respectively are connected with a derby that supports the projection that disk to be analyzed uses at the right and left of pedestal, and as the brace table of the support disk on the sample stage, what disk can level is placed on it.For bolt can pass through, have a manhole on the derby of this projection, the diameter of this round tube hole is also greater than the screw diameter of above-mentioned bolt, less than the diameter of bolt head.
The position of two through hole is aimed at mutually with metal grill, and promptly the spacing of two circular holes on two through hole spacing and the metal grill is identical on the pedestal, and two through hole is arranged in one on the footpath on the pedestal.
Every cover bolt assembly is made of bolt, first, second two springs and nut.
Metal grill is positioned over sample stage top, and the two through hole on the metal grill is overlapped with through hole on the sample stage.
From top to bottom, bolt is inserted in the through hole of metal grill both sides, and passes first spring, puts into the through hole on the sample stage, is inserted in second spring afterwards, nut is screwed in the bolt bottom, to withstand the lower end of second spring again.
Before placing disk, will push up on second bolt, make second length of spring compressed, thereby make metal grill can upwards lift certain distance, thereby the disk sheet can be put on the sample stage under the metal grill.
And first spring will make the metal grill certain position of upspringing, and when needs are led away electric charge, bolt be pressed down, first length of spring compressed, and bolt moves downward and drives bolt head and press down metal grill thereupon, and metal grill is pressed on the disk surfaces.Metal grill is contacted with disk and since pedestal can be in the Auger board ground connection, thereby metal grill is by bolt ground connection.So just can lead away the electric charge on the disk surfaces.But after the elimination electric charge is finished, remove the pressure on the bolt.Grid is under the restoring force effect of spring, and the segment distance that moves upward breaks away from and the contacting of disk, thereby in test process, do not contact with disk, thereby also the test result formation of disk is not influenced.
In addition, because horizontal and vertical bonding jumper is equally distributed on the metal grill, so, this metal grill can also be assisted as the coordinate diagram of disk and seek wafer pattern.
By this device, and simple to operate, do not need extra equipment, do not need extra operation yet.
Description of drawings
Fig. 1 is the structural drawing of the platform that uses in the prior art;
Fig. 2 is the vertical view of the platform that uses in the prior art;
Fig. 3 is the structural drawing of embodiment 1 device;
Fig. 4 is the vertical view of embodiment 1 device;
Wherein, 1 is the pedestal of sample stage, and 2 is lid, and 3 is the brace table of sample stage, and 40 is bolt, and 41 is nut, and 42 is first spring, and 43 is second spring, and 5 is metal grill.
Embodiment
The present invention is described further below in conjunction with Figure of description and embodiment.
Specific embodiment
The device that present embodiment proposes is made of three parts, referring to Fig. 3:
Sample stage is made of the brace table of pedestal and support disk.
Pedestal and existing pedestal are basic identical, respectively are connected with a derby that supports the projection that disk to be analyzed uses at the right and left of pedestal, as the brace table that supports sample.For bolt can pass through, have a manhole on this brace table, the diameter of this round tube hole is also greater than the screw diameter of above-mentioned bolt, and less than the diameter of bolt head, the diameter of this through hole is also greater than the screw diameter of above-mentioned bolt 40, less than the diameter of bolt head.So that bolt 40 can pass through this through hole.The position and the metal grill of two through hole are corresponding, and promptly the spacing of two circular holes on two through hole spacing and the metal grill is identical on the pedestal, and two through hole is arranged on the diameter on the pedestal.
Wherein, metal grill 5 has two parts to constitute: a part is the round-meshed sheet metals in both sides, and a part is middle metal grill in addition.Wherein the diameter of the circular hole on the sheet metal is greater than the screw diameter of above-mentioned bolt, less than the diameter of bolt head.Middle metal grill by be parallel to each other, horizontal and vertical two groups of wire nettings that bonding jumper is connected to form arranged in a uniform, the hole of this wire netting is rectangular, and is evenly distributed, size is identical referring to Fig. 4.
For bolt 40 can pass through, also have a manhole on the sample stage equally, the diameter of this round tube hole is also greater than the screw diameter of above-mentioned bolt, less than the diameter of bolt head.
Other parts of pedestal and existing pedestal are basic identical.
Bolt assembly is made of bolt 40, first spring 42 and second spring 43 and nut 41.
Before placing disk, will push up on second bolt, make second length of spring compressed, thereby make metal grill can upwards lift certain distance, thereby the disk sheet can be put on the sample stage under the metal grill.
And first spring will make the metal grill certain position of upspringing, and when needs are led away electric charge, bolt be pressed down, first length of spring compressed, and bolt moves downward and drives bolt head and press down metal grill thereupon, and metal grill is pressed on the disk surfaces.Metal grill is contacted with disk and since pedestal can be in the Auger board ground connection, thereby metal grill is by bolt ground connection ground connection.So just can lead away the electric charge on the disk surfaces.But after the elimination electric charge is finished, remove the pressure on the bolt.Grid is under the restoring force effect of spring, and the segment distance that moves upward breaks away from and the contacting of disk, thereby in test process, do not contact with disk, thereby also the test result formation of disk is not influenced.
So by present embodiment, simple to operate, do not need extra equipment, do not need extra operation yet and can realize location easily zone to be analyzed on the disk.
Claims (5)
1. device of eliminating wafer sample surface charge, contain metal grill, sample stage, and bolt assembly, metal grill wherein, the through hole that mutual correspondence is all arranged on the sample stage, metal grill is positioned on the sample stage, connect by bolt assembly, it is characterized in that described bolt assembly contains bolt, first spring and two springs of second spring, nut, wherein, be inserted in first spring behind the through hole of bolt insertion metal grill, insert sample stage through hole rear lower separately again and be inserted in second spring and the nut of screwing on, metal grill links to each other with base station in the sample stage by bolt, and base station is the inner ground connection of Auger electron spectrometer.
2. device as claimed in claim 1, it is characterized in that above-mentioned metal grill is by a rectangular metal net that is parallel to each other, horizontal and vertical two groups of bonding jumpers arranged in a uniform are connected to form, the both sides of this wire netting stretch out one section respectively, about coordinate the separately sheet metal of a strip, and respectively have a circular hole in the centre position of the extended sheet metal of the right and left, all have on the sample stage with described metal grill on the corresponding through hole of through hole.
3. a device as claimed in claim 2 is characterized in that the screw diameter of the diameter of the circular hole on the above-mentioned metal grill greater than above-mentioned bolt, less than the diameter of bolt head.
4. method of using device as claimed in claim 1 to eliminate the disk surfaces electric charge, before it is characterized in that placing disk, on lift bolt and make second length of spring compressed, make metal grill can upwards lift certain distance, disk is put on the sample stage under the metal grill; Press down bolt second spring is replied, first length of spring compressed, bolt head presses down metal grill thereupon, and metal grill is pressed on the disk surfaces; Make metal grill ground connection, thereby lead away the stored charge on the disk, after having eliminated the electric charge of disk surfaces, remove the acting force on the bolt, metal grill is under the first spring restoring force effect, the certain distance that moves upward, thus break away from and the contacting of disk, thus avoid the influence of metal grill to follow-up test.
5. a method as claimed in claim 4 is characterized in that utilizing above-mentioned metal grill as coordinate diagram with after the disk placement, seeks the pattern on the disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610118507A CN100592063C (en) | 2006-11-20 | 2006-11-20 | Device for canceling wafer sample surface charge effect and its usage method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200610118507A CN100592063C (en) | 2006-11-20 | 2006-11-20 | Device for canceling wafer sample surface charge effect and its usage method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101191760A CN101191760A (en) | 2008-06-04 |
| CN100592063C true CN100592063C (en) | 2010-02-24 |
Family
ID=39486893
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200610118507A Expired - Fee Related CN100592063C (en) | 2006-11-20 | 2006-11-20 | Device for canceling wafer sample surface charge effect and its usage method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100592063C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109696403B (en) * | 2017-10-23 | 2021-08-13 | 中国科学院重庆绿色智能技术研究院 | Sample chamber for immersed microscopic imaging |
| CN109557704A (en) * | 2019-01-16 | 2019-04-02 | 合肥诚辉电子有限公司 | A kind of antistatic liquid crystal display |
-
2006
- 2006-11-20 CN CN200610118507A patent/CN100592063C/en not_active Expired - Fee Related
Non-Patent Citations (4)
| Title |
|---|
| 氮化硅绝缘介质膜的SAM分析研究. 陈明华等.微电子技术，第24卷第6期. 1996 |
| 氮化硅绝缘介质膜的SAM分析研究. 陈明华等.微电子技术，第24卷第6期. 1996 * |
| 高性能陶瓷材料的俄歇能谱分析. 虞玲等.无机材料学报，第15卷第5期. 2000 |
| 高性能陶瓷材料的俄歇能谱分析. 虞玲等.无机材料学报，第15卷第5期. 2000 * |
Also Published As
| Publication number | Publication date |
|---|---|
| CN101191760A (en) | 2008-06-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN109755846B (en) | Automatic assembling equipment for rectangular electric connector for medical instrument | |
| CN104777417A (en) | Modular PCB testing jig | |
| CN105118791A (en) | Directly-inserted power semiconductor module test clamp | |
| CN100592063C (en) | Device for canceling wafer sample surface charge effect and its usage method | |
| CN1170311C (en) | Manufacture of semiconductor device and equipment therefor | |
| CN213068959U (en) | High-voltage-resistant jig for coil plate | |
| CN2896285Y (en) | Chip resistor network pressurizing and aging screening clamp | |
| CN211554060U (en) | Multifunctional circuit board test fixture | |
| CN105675924A (en) | Detection fixture for ozone machine power panel | |
| CN105425139A (en) | Chip failure analysis test equipment | |
| CN217360092U (en) | Portable PCB board tester | |
| CN203812856U (en) | Chip placing device | |
| CN102809706A (en) | Mutual inductor automatic detection line secondary wiring device | |
| CN206387879U (en) | Automobile one-key start device ICT test fixture platforms | |
| CN210181161U (en) | Wafer probe station | |
| CN211669245U (en) | Fixing device of circuit board test fixture | |
| CN209086328U (en) | A kind of varistor detection device | |
| CN212514892U (en) | Quick testing arrangement of alarm circuit board electrical property | |
| CN203745573U (en) | ICT test needle bed | |
| CN105719985B (en) | A kind of detecting system of bga chip | |
| CN205723457U (en) | A kind of detecting system of bga chip | |
| CN205981452U (en) | LED chromaticity coordinates test machine | |
| CN212207588U (en) | Floating mechanism for protecting probe | |
| CN219657154U (en) | Nonlinear fault prediction equipment for electromechanical equipment | |
| CN210171976U (en) | Electronic production device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Effective date: 20111201 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20111201 Address after: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Co-patentee after: Semiconductor Manufacturing International (Beijing) Corporation Patentee after: Semiconductor Manufacturing International (Shanghai) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20100224 Termination date: 20181120 |