CN100585911C - Organic luminescence display manufacturing method - Google Patents

Organic luminescence display manufacturing method Download PDF

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Publication number
CN100585911C
CN100585911C CN200710180264A CN200710180264A CN100585911C CN 100585911 C CN100585911 C CN 100585911C CN 200710180264 A CN200710180264 A CN 200710180264A CN 200710180264 A CN200710180264 A CN 200710180264A CN 100585911 C CN100585911 C CN 100585911C
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Prior art keywords
substrate
electrode
raised structures
emitting display
light emitting
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CN200710180264A
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CN101136456A (en
Inventor
陈瑞兴
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Xiamen Tianma Display Technology Co Ltd
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AU Optronics Corp
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    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K50/00—Organic light-emitting devices
    • H10K50/80—Constructional details
    • H10K50/85—Arrangements for extracting light from the devices
    • H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
    • H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
    • H10K59/80—Constructional details
    • H10K59/875—Arrangements for extracting light from the devices
    • H10K59/879—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses

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  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Electroluminescent Light Sources (AREA)

Abstract

This invention provides an organic luminescent display and its manufacturing method, in which, the display includes: a base board with multiple convex structures formed on a first side of the board, and the height of the convex structure is 4000-12000, the width is 3-7mum, a first electrode set on a second side of the board opposite to the first one, an organic luminescent layer set on the first electrode and a second electrode set on the organic luminescent layer.

Description

The manufacture method of organic light emitting display
The application be that May 9, application number in 2004 are 200410042241.9 the applying date, denomination of invention divides an application for the patent application of " organic light emitting display and manufacture method thereof ".
Technical field
The present invention relates to a kind of electrooptical device, particularly relate to a kind of organic light emitting display and manufacture method thereof.
Background technology
When light transmits, enter one during by a high index material, according to Snell ' slaw:n than the low-refraction material between glass, dielectric layer and air 1* sin θ 1=n 2* sin θ 2Principle (n 1Represent the refractive index of high index material, n 2Representative is than the refractive index of low-refraction material, θ 1Represent the incidence angle of light, θ 2Represent the ray refraction angle), the phenomenon of total reflection can take place, promptly at high index (n 1) light in the material is because of incidence angle (θ 1) excessive surpass a critical angle and produce 1 the degree refraction angle (θ 2) light, make incident ray can't penetrate into this than low-refraction (n 2) material.
For the organic light emitting display (OLED) that belongs to self-luminous character, because the existence of above-mentioned optical phenomena, for example make in a pixel electrode (pixel), the internal light source that part arranged promptly can because of total reflection so can't disperse out, cause the loss of part light, influence luminous efficiency.In addition, the general employed negative electrode of OLED (cathode) is the metallic aluminium (Al) of easy reflection ray, and working as OLED is then having under the environment of external light source, and the demonstration of its GTG or contrast can add that the reverberation of glass reduces greatly because of the reverberation of aluminium.Have traditionally to add a light polarizing film and reduce the influence of external light source, but after sticking light polarizing film, can cause the decline of internal light penetrance again, be unfavorable for the lifting of luminous efficiency equally display effect.
Existing organic light emitting display structure is as United States Patent (USP) the 6th, 366, No. 017 revealer of institute, as shown in Figure 1, on substrate 10, be formed with an anode (anode) 12, a luminescent layer (emissive layer) 13 and one transparency conducting layer (transparent conducting layer) 14 in regular turn.After luminescent layer 13 produced light, part light can pass transparency conducting layer 14 and come out from front illuminated, and part light then produces total reflection in inside, whole light transmission capacity is reduced, and causes the component efficiency variation.For solving this problem, existing method promptly adds a distributed Bragg reflector (Distributed BraggReflector, DBR) 15 on transparency conducting layer 14, in order to reduce the light of inner full-reflection, increase component efficiency, make the positive bigger light quantity that obtains, promote picture brightness.
But because distributed Bragg reflector 15 can make light concentrate on certain angle, produce outside phenomenon of dazzling light, GTG shows or the quality of contrast and destroy, and therefore, the lifting of whole display effect be there is no help, and improved the cost of making.
Summary of the invention
In view of this, the object of the present invention is to provide a kind of organic light emitting display, the phase sees through structural modification, reduces the probability of total reflection, and reduces outside influence of dazzling light, makes OLED that better performance be arranged.
In order to reach above-mentioned purpose, the invention provides a kind of organic illuminated display structure, comprise a substrate, on one first of this substrate, be formed with a plurality of raised structures, wherein the height of this raised structures is the 4000-12000 dust, width is the 3-7 micron; One first electrode is arranged on one second of this substrate, and this second relative with this first; One organic luminous layer is arranged on this first electrode; And one second electrode, be arranged on this organic luminous layer.
A plurality of raised structures that the present invention forms on substrate utilize optical mask pattern definition to form to comprise several shapes and the suitable size of tool of circular arc, trapezoidal or rectangle etc., and the feature of these raised structures will be specified among the embodiment that carries the back.Please refer to Fig. 2,, can urge incidence angle θ by the raised structures 20 of this substrate and air interface formation 1Diminish and make refraction angle θ 2And then diminish, and significantly reduce the total reflection of internal light, increase it to penetrate efficient, in addition when extraneous light is desired to enter substrate, also because the small out-of-flatness on surface makes extraneous light after arriving the surface, present a uniform scattering phenomenon, avoided outside possibility of dazzling light.
The present invention provides a kind of manufacture method of organic light emitting display in addition, comprises the following steps: to provide a substrate; On one first of this substrate, form the photoresist layer of a composition; Photoresist layer with this composition is that etching mask defines this substrate to form a plurality of raised structures; Form one first electrode on one second of this substrate, this second relative with this first; On this first electrode, form an organic luminous layer; And on this organic luminous layer, form one second electrode.
The present invention provides a kind of manufacture method of organic light emitting display again, comprises the following steps: to provide a substrate; On one first of this substrate, form the photoresist layer of a composition; Photoresist layer with this composition is that etching mask defines this substrate to form a plurality of raised structures, and wherein the height of this raised structures is 4000～12000 dusts, and width is 3～7 microns; Remove the photoresist layer of this composition; Form one first electrode on one second of this substrate, this second relative with this first; On this first electrode, form an organic luminous layer; And on this organic luminous layer, form one second electrode.
The production method of organic light emitting display of the present invention, the microspike that directly will help to increase penetrance is made on the substrate, exempt the complicated process that must add semiconductor layers such as a distributed Bragg reflector in the existing method in addition, the advantage that real tool is simplified and reduced cost, and these raised structures decapacitation effectively improve outside the penetrance, under the situation that does not increase extra design and manufacture technology, the also dispersion effect of lifting subassembly simultaneously.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, a preferred embodiment cited below particularly, and cooperate appended graphicly, elaborate.
Description of drawings
Fig. 1 is according to United States Patent (USP) the 6th, 366, No. 017, and the generalized section of an organic light emitting display.
Fig. 2 is according to embodiments of the invention, and internal light source is through the schematic diagram of protrusion surface and flat surfaces.
Fig. 3 a is according to the first embodiment of the present invention, the generalized section of organic light emitting display manufacturing process before photoresist layer removes.
Fig. 3 b is according to the first embodiment of the present invention, the generalized section of organic light emitting display manufacturing process after photoresist layer removes.
Fig. 3 c-1 is according to the first embodiment of the present invention, the generalized section of organic light emitting display.
Fig. 3 c-2 is according to the first embodiment of the present invention, the generalized section of another organic light emitting display.
Fig. 3 d is according to the first embodiment of the present invention, the generalized section of another organic light emitting display.
Fig. 4 a is for according to a second embodiment of the present invention, the generalized section of organic light emitting display manufacturing process.
Fig. 4 b-1 is for according to a second embodiment of the present invention, the generalized section of organic light emitting display.
Fig. 4 b-2 is for according to a second embodiment of the present invention, the generalized section of another organic light emitting display.
Fig. 4 c is for according to a second embodiment of the present invention, the generalized section of another organic light emitting display.
Fig. 5 is according to embodiments of the invention, and external light source is through the scattering phenomenon schematic diagram of protrusion surface.
The simple symbol explanation
Existing part (Fig. 1)
10～substrate;
12～anode;
13～luminescent layer;
14～transparency conducting layer;
15～distributed Bragg reflector;
Embodiment of the invention part (Fig. 2 to Fig. 5)
20,50,310,410～raised structures;
60～scattering phenomenon;
70～non-parallel beam;
300,400～substrate;
The photoresist layer of 305～composition;
320,420～the first electrodes;
330,430～organic luminous layer;
340,440～the second electrodes;
3001,4001～surface of first base;
3002, second of 4002～substrate;
n 1The refractive index of～high index material;
n 2～than the refractive index of low-refraction material;
θ 1The incidence angle of～light;
θ 2～ray refraction angle.
Embodiment
Embodiment 1
See also Fig. 3 a to Fig. 3 d, the first embodiment of the present invention is described, the making of organic light emitting display.At first, shown in Fig. 3 a, provide a substrate 300.Substrate 300 is the glass or the plastic base of a printing opacity, and wherein this plastic base is made of polyethylene terephthaldehyde ester (polyethyleneterephthalate), polyester (polyester), Merlon (polycarbonates), policapram (polyimide), Arton, polyacrylate (polyacrylates) or polystyrene (polystyrene) material.
Then, covering a sectional pattern on one first 3001 of substrate 300 for example be the photoresist layer 305 of the composition of circular arc, and the sectional pattern of the photoresist layer of all the other compositions be trapezoidal or rectangle etc. for example, wherein is preferably selection with circular arc.Afterwards, be etching mask definition substrate 300 with the photoresist layer 305 of this composition, on first 3001 of substrate 300, to form a plurality of raised structures 310.Remove the photoresist layer 305 of this composition subsequently, shown in Fig. 3 b.
Next, promptly size, shape facility and the function of these raised structures 310 are done a detailed description.The height of these raised structures 310 serves as preferred the selection substantially between 4000～12000 dusts with 6000 dusts, and the width of these raised structures 310 serves as preferred the selection substantially between 3～7 microns with 5 microns.The section shape of these raised structures 310 includes circular arc, trapezoidal or rectangle (shown in Fig. 3 d) etc., wherein the contact angle of this arc-shaped structure and substrate 300 is not more than 90 degree, and spend with 45 is preferred the selection, this trapezium structure belongs to a shape and structure (shown in Fig. 3 c-1 and Fig. 3 c-2) up-narrow and down-wide or wide at the top and narrow at the bottom, and above-mentioned these raised structures 310 are preferred the selection with circular arc.
These raised structures 310 have a lenticule (microlens) function, and its refractive index changes according to the substrate 300 of different materials substantially between 1.3～1.9.These projection 310 mats provide the structure with a plurality of refraction minute surfaces, reach substantially more than 10% with the penetrance that increases internal light, and increase internal light or the extraneous light scattering phenomenon at interface simultaneously.The wet etch method of hydrofluoric acid etch liquid carries out for example to contain to form the etching step of these raised structures 310.Etchant concentration is substantially between 2.5%, and etch temperature is substantially between 25 degree Celsius, and etching period forms the raised structures 310 with Desired Height and width substantially between 6～10 minutes with control.
Continuous one first electrode 320 that forms is on one second 3002 of substrate 300, and this second 3002 with respect to this first 3001.First electrode 320 is a transparency electrode, and this transparency electrode is indium tin oxide (ITO), indium-zinc oxide (IZO), Zinc-aluminium (AZO) or zinc oxide (ZnO), serves as preferred the selection with indium tin oxide (ITO) wherein.
Then, form an organic light-emitting structure layer on first electrode 320, this organic light-emitting structure layer from bottom to top includes an electron transfer layer (not icon), an organic luminous layer 330 and a hole transport layer (not shown) in regular turn, wherein organic luminous layer 330 is made of the luminous organic material of single or multiple lift, and its material comprises the fluorescence (fluorescence) or phosphorescence (phosphorescence) luminescent material of micromolecule or macromolecule.The above-mentioned micromolecule luminous organic material that is covered on first electrode 320 forms in the vacuum evaporation mode, and high molecular luminous organic material then forms with rotary coating, ink-jet or screen painting mode.
Afterwards, form one second electrode 340 on organic luminous layer 330, second electrode is a transparency electrode, metal electrode or combination electrode, wherein combination electrode is coincided by above-mentioned multi-layered electrode and forms, the material of metal electrode is selected the alloy of forming from the group that lithium, magnesium, calcium, aluminium, silver, indium, gold, nickel and platinum are formed or above-mentioned two or more element, and combination electrode material is promptly selected the group that forms from lithium, magnesium, calcium, aluminium, silver, indium, gold, nickel, platinum indium tin oxide, indium-zinc oxide, Zinc-aluminium or zinc oxide.
Embodiment 2
See also Fig. 4 a to 4c and scheme, the second embodiment of the present invention is described, the making of organic light emitting display.At first, shown in Fig. 4 a, provide a substrate 400.Substrate 400 is the glass or the plastic base of a printing opacity, and wherein this plastic base is made of polyethylene terephthaldehyde ester (polyethyleneterephthalate), polyester (polyester), Merlon (polycarbonates), policapram (polyimide), Arton, polyacrylate (polyacrylates) or polystyrene (polystyrene) material.
Then, on one first 4001 of substrate 400, cover a dielectric layer 410, dielectric layer 410 is a light transmissive material, comprise silica, silicon nitride or silicon oxynitride, its refractive index is substantially between 1.3～1.9, preferred person is 1.5, according to different change of refractive index of substrate 400, so that keep identical refractive index between substrate 400 and the dielectric layer 410.The thickness of dielectric layer 410 is preferably 6000 dusts substantially between 4000～12000 dusts, and dielectric layer 410 is formed by sedimentation, as the presumptive area of the raised structures of follow-up formation.
The continuous photoresist layer (not shown) that forms a composition is on dielectric layer 410, and the sectional pattern of the photoresist layer of this composition for example be circular arc, trapezoidal or rectangle etc., wherein be preferably selection with circular arc.Afterwards, be etching mask definition dielectric layer 410 with the photoresist layer of this composition, to form a plurality of raised structures 410.Remove the photoresist layer of this composition subsequently.
Next, promptly size, shape facility and the function of these raised structures 410 are done a detailed description.The height of these raised structures 410 serves as preferred the selection substantially between 4000～12000 dusts with 6000 dusts, and the width of these raised structures 410 serves as preferred the selection substantially between 3～7 microns with 5 microns.The section shape of these raised structures 410 includes circular arc, trapezoidal or rectangle (shown in Fig. 4 c) etc., wherein the contact angle of this arc-shaped structure and substrate 400 is not more than 90 degree, and spend with 45 is preferred the selection, this trapezium structure belongs to a wide at the top and narrow at the bottom or up-narrow and down-wide shape and structure (shown in Fig. 4 b-1 and Fig. 4 b-2), and above-mentioned these raised structures 410 are preferred the selection with circular arc.
These raised structures 410 have a lenticule (microlens) function, and mat provides the structure with a plurality of refraction minute surfaces, reach substantially more than 10% with the penetrance that increases internal light, and increase internal light or the extraneous light scattering phenomenon at interface simultaneously.The etching step that forms these raised structures 410 carries out with induction coupling type plasma in the dry ecthing method or reactive ion etching.
The temperature of this etching step is substantially between 40 degree Celsius, and pressure is substantially between 5～100 millitorrs, and the time, power formed the raised structures 410 with Desired Height and width substantially between 100～1500 watts with control substantially between 6 minutes.
Continuous one first electrode 420 that forms is on second 4002 of one of substrate 400, and this second 4002 with respect to this first 4001.First electrode 420 is a transparency electrode, and this transparency electrode is indium tin oxide (ITO), indium-zinc oxide (IZO), Zinc-aluminium (AZO) or zinc oxide (ZnO), serves as preferred the selection with indium tin oxide (ITO) wherein.
Then, form an organic light-emitting structure layer on first electrode 420, this organic light-emitting structure layer from bottom to top includes an electron transfer layer (not icon), an organic luminous layer 430 and a hole transport layer (not shown) in regular turn, wherein organic luminous layer 430 is made of the luminous organic material of single or multiple lift, and its material comprises micromolecule or high molecular fluorescence (fluorescence) or phosphorescence (phosphorescence) luminescent material.The above-mentioned micromolecule luminous organic material that is covered on first electrode 420 forms in the vacuum evaporation mode, and high molecular luminous organic material then forms with rotary coating, ink-jet or screen painting mode.
Afterwards, form one second electrode 440 on organic luminous layer 430, second electrode is a transparency electrode, metal electrode or combination electrode, wherein combination electrode system is coincided by above-mentioned multi-layered electrode and forms, the material of metal electrode is selected the alloy of forming from the group that lithium, magnesium, calcium, aluminium, silver, indium, gold, nickel and platinum are formed or above-mentioned two or more element, and combination electrode material is promptly selected the group that forms from lithium, magnesium, calcium, aluminium, silver, indium, gold, nickel, platinum indium tin oxide, indium-zinc oxide, Zinc-aluminium or zinc oxide.
The present invention make and display device structure, as Fig. 3 or 4 and shown in Figure 5, when internal light will penetrate substrate 300 or 400, because the kick 310 or 410 of substrate 300 or 400, the incidence angle of ejaculation light at substrate 300 or 400 interfaces 50 diminished, the probability of satisfying the total reflection generation greatly reduces, improve luminous efficiency, and when extraneous light will enter substrate 300 or 400, also because the small out-of-flatness on surface makes extraneous light arrive these interface 50 backs because of producing different incidence angles degree scattering 60, and the light that enter substrate 300 or 400 this moment no longer is directional light, shown in 70 among Fig. 5, after the refraction through negative electrode reflection and substrate 300 or 400 surfaces 50, also produce the situation of scattering, make when observation display, the difficult light of dazzling, comprehensively above-mentioned, OLED can be had a better demonstration performance.
Though the present invention discloses as above with preferred embodiment; yet it is not in order to limit the present invention; those skilled in the art can make and changing and retouching without departing from the spirit and scope of the present invention, thus protection scope of the present invention should with accompanying Claim the person of being defined be as the criterion.

Claims (6)

1, a kind of manufacture method of organic light emitting display comprises:
One substrate is provided;
On one first of this substrate, form the photoresist layer of a composition;
Photoresist layer with this composition is that etching mask defines this substrate to form a plurality of raised structures;
Remove the photoresist layer of this composition;
Form one first electrode on one second of this substrate, this second relative with this first;
On this first electrode, form an organic luminous layer; And
On this organic luminous layer, form one second electrode.
2, the manufacture method of organic light emitting display as claimed in claim 1, wherein this raised structures is an arc-shaped structure, the contact angle of itself and this substrate is not more than 90 degree.
3, the manufacture method of organic light emitting display as claimed in claim 1, wherein this raised structures is a trapezium structure up-narrow and down-wide or wide at the top and narrow at the bottom.
4, the manufacture method of organic light emitting display as claimed in claim 1, wherein this raised structures is a rectangular configuration.
5, a kind of manufacture method of organic light emitting display comprises:
One substrate is provided;
On one first of this substrate, form the photoresist layer of a composition;
Photoresist layer with this composition is that etching mask defines this substrate to form a plurality of raised structures, and wherein the height of this raised structures is 4000～12000 dusts, and width is 3～7 microns;
Remove the photoresist layer of this composition;
Form one first electrode on one second of this substrate, this second relative with this first;
On this first electrode, form an organic luminous layer; And
On this organic luminous layer, form one second electrode.
6, the manufacture method of organic light emitting display as claimed in claim 5, wherein this raised structures is an arc-shaped structure, the contact angle of itself and this substrate is not more than 90 degree.
CN200710180264A 2004-05-09 2004-05-09 Organic luminescence display manufacturing method Expired - Lifetime CN100585911C (en)

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CN102544390B (en) * 2010-12-07 2015-03-25 群康科技(深圳)有限公司 Manufacturing method of micro-lens structure and image display system comprising micro-lens structure
WO2015080422A1 (en) * 2013-11-27 2015-06-04 네오뷰코오롱 주식회사 Method for manufacturing substrate, substrate, method for manufacturing organic electroluminescence device, and organic electroluminescence device

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