CN103633251A - Light extraction device and organic electroluminescent device applying light extraction device and preparation method - Google Patents
Light extraction device and organic electroluminescent device applying light extraction device and preparation method Download PDFInfo
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- CN103633251A CN103633251A CN201210312592.1A CN201210312592A CN103633251A CN 103633251 A CN103633251 A CN 103633251A CN 201210312592 A CN201210312592 A CN 201210312592A CN 103633251 A CN103633251 A CN 103633251A
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
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- H10K50/858—Arrangements for extracting light from the devices comprising refractive means, e.g. lenses
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Abstract
The invention provides a light extraction device and a preparation method thereof. The light extraction device comprises a high refractive index transparent substrate and a light extraction layer which is formed on the high refractive index transparent substrate. The refractive index of the high refractive index transparent substrate is fixed so that total reflection from an organic layer to the substrate can be effectively eliminated. With changing of a light path of total reflection, light extraction rate can be enhanced by the light extraction layer so that the light extraction device is simple in structure and high in light extraction rate. The invention also provides an organic electroluminescent device containing the light extraction device and the preparation method of the light extraction device. The light extraction device is arranged between a base plate and a first electrode and capable of extracting light beams limited in an organic functional layer so that the light extraction device has high-efficient light extraction rate. Besides, after the device is packaged, channels entered by water vapor and oxygen are less so that the service life of the device is enhanced.
Description
Technical field
The present invention relates to organic electroluminescence device field, specifically a kind of light takes out parts, applies its organic electroluminescence device and preparation method thereof.
Background technology
The English full name of OLED(is Organic Light Emitting Device, the meaning is organic electroluminescence device, referred to as OLED) as Display Technique of future generation, have that colour gamut is wide, response is fast, the advantage such as wide viewing angle, pollution-free, high-contrast, complanation.
Typical OLED device architecture, generally comprise glass substrate, the first electrode, the second electrode and be arranged on two interelectrode organic luminescence function layers, reflection because the index matching of layers of material causes, is limited in device the wide part that luminescent layer sends.As the refractive index of air is approximately 1, the refractive index of glass is generally 1.5, organic function layer is 1.7-1.8, when light beam arrives low-index material from high-index material, will there is total reflection at interface in the light beam that is greater than critical angle, the light being reflected back toward will come back reflective, refraction between each functional layer, and final consumption cannot be removed application at device inside.Research shows, OLED is actual to be issued to airborne light output efficiency and to only have 20% left and right, has 80% light beam be limited or consume at device inside, and wherein, what be limited in organic function layer inside accounts for 50%, is limited in to account for 30% in glass substrate.How to improve the light beam that is limited in OLED inside and will be improve OLED device efficiency and the key technology in life-span.
For different light restriction schemes, the light that has developed several different methods raising OLED takes out efficiency.For taking out, be limited in the light-emitting component that the light beam in substrate: Chinese patent literature CN102620235A discloses a kind of light taking-up film and applied it, the light-emitting area that light taking-up film is placed in substrate is on outer surface, for taking out the light beam that is limited in substrate, this light takes out film and comprises a microlens array film and at least one optical thin film, microlens array film has relative first surface and second surface, and having a plurality of lenticules is located on first surface, optical thin film is covered on first surface, and optical thin film comprises a plurality of optical particles and a skim, wherein optical particle is located in rete, rete has and is less than as the refractive index of lens arra film and is greater than or equal to the refractive index of air, the quantity of the total reflection producing when optical thin film enters air with minimizing light.Wherein, the film material of optical thin film is the material that polyethylene terephthalate, poly-naphthoic acid ethyl ester etc. have high index of refraction.As everyone knows, simple high index of refraction optical film can effectively be eliminated total reflection; Microlens array can change by refraction the light path of total reflection light beam with the optical particle with high index of refraction, can effectively improve the luminous efficiency of device.But, the refractive index of membrane material depends on thickness and the evenness of film to a great extent, in this patent documentation, optical thin film takes shape on microlens array, and evenness is very poor, and optical particle is entrained in rete, make Monitoring Thickness of Optical Thin-Film inhomogeneous, simultaneously easy air-and water-permeable, these have all had a strong impact on the effect that high refraction film layer should be brought into play, and have reduced the light taking-up efficiency that light takes out film; And this light to take out film be plural layers, complex structure, manufacture craft are lengthy and tedious.In the disclosed light-emitting component of this patent documentation, this blooming is placed in the outside of substrate, only can take out the light beam being limited in glass substrate, and the light beam process being limited in a large number in organic function layer is come back reflective, refraction, final consumption cannot be removed application at device inside.
For taking out, be limited in the light beam in organic function layer, Society for Information Display, 2009, International Symposium Digest of Technical Papers(is translated into: 2009 international symposium of annual Society for Information Display technical paper digests) reported one piece of article < < High Efficiency 200-lm/W Green Light Emitting Organic Devices Prepared on High-Index of Refraction Substrate > > (being translated into: high index of refraction substrate is prepared the 200-lm/W green glow organic luminescent device of high light efficiency) for 907 pages, by adopting the glass of high index of refraction, eliminate the total reflection at organic function layer and glass substrate interface, improve OLED device efficiency.Although this method has good light, take out effect, glass of high refractive index manufacturing technology difficulty is large, cost is high.
Meanwhile, Chinese patent literature CN102299266A discloses a kind of substrate and manufacture method of organic electroluminescence device, between the transparent substrates of this substrate and the first electrode, is provided with scattering layer and planarization layer, and production technology is relatively simple, can volume production; Can effectively the light beam being limited in organic function layer be taken out, but scattering layer and planarization layer are molded directly within on substrate, during device package, this scattering layer and planarization layer provide steam and oxygen to enter the passage of device inside, directly make the life-span variation of device, also can affect light efficiency performance simultaneously.
If changing disclosed light taking-up film in Chinese patent literature CN102620235A is arranged on the substrate of substrate, for taking out the light beam of organic function layer, can exist equally light to take out film is molded directly within on substrate, during device package, steam and oxygen easily take out film by this light and enter device inside, this light takes out film provides oxygen and aqueous vapor to enter the passage of device inside, directly affect the life-span of device, also can affect light efficiency performance simultaneously.
Summary of the invention
For this reason, technical problem to be solved by this invention is that the light be limited in the light beam in organic luminescence function layer in prior art for taking out takes out parts or complex structure, is not suitable for volume production, or light takes out that parts form that steam, oxygen enter the passage of device inside and the problem that affects device lifetime.Thereby provide a kind of light to take out the light that efficiency is high, technique simply and not affects device lifetime and take out parts, and apply organic electroluminescence device and preparation method that this light takes out parts.
For solving the problems of the technologies described above, the technical solution used in the present invention is as follows:
Provide a kind of light to take out parts, comprise,
Light for organic electroluminescence device takes out parts, comprises,
Refractive index is higher than the high refractive index transparent substrate of the refractive index of transparency carrier in organic electroluminescence device;
Be molded over the light removing layer of described high refractive index transparent substrate surface, for suppressing to incide from the light of described high refractive index transparent substrate outgoing the total reflection of described transparency carrier.
Described smooth removing layer is scattering layer or microlens array layer.
Described scattering layer comprises that light transmittance is greater than the scattering particles of the refractive index that 80% matrix and refractive index be greater than organic function layer.
Described matrix is photoresist, and described scattering particles are TiO
2or SiO
2or ZnO or ZrO
2minuteness particle.
The initial particle of described scattering particles is 0.02-0.8 μ m.
Described scattering layer thickness is 0.3-3 μ m.
A preparation method who takes out parts for the light of organic electroluminescence device, comprises the following steps:
(1) obtain refractive index higher than the high refractive index transparent substrate of the refractive index of transparency carrier in organic electroluminescence device;
(2), at described high refractive index transparent substrate surface moulding light removing layer, light removing layer is wherein for suppressing to incide from the light of described high refractive index transparent substrate outgoing the total reflection of described transparency carrier.
Described smooth removing layer is scattering layer or microlens array layer.
Described smooth removing layer is high index of refraction scattering layer, and described step (2) specifically comprises the following steps:
(21) prepare scattering layer solution: after scattering particles, dispersant, solvent are ground, cross leaching filtrate, then gained filtrate is mixed with matrix and made scattering layer solution;
(22) by scattering layer solution coating film forming on high refractive index transparent substrate, obtain continuous scattering layer.
In described step (21), the light transmittance of described matrix is greater than 80%, and the refractive index of described scattering particles is greater than the refractive index of organic function layer.
Described matrix is photoresist, and described scattering particles are TiO
2or SiO
2or ZnO or ZrO
2minuteness particle.
The initial particle of described scattering particles is 0.02-0.8 μ m.
Described scattering layer thickness is 0.3-3 μ m.
Described smooth removing layer is microlens array layer, and described step (2) specifically comprises the following steps:
(31) rotary coating one deck photoresist layer in the one side of described high refractive index transparent substrate;
(32) adopt photoetching technique, photoresist layer is made as to the substrate of column structure;
(33), by the substrate heating of the column structure in step (32), the upper bottom surface of each column structure of melting convexes to form a lenticule.
Simultaneously, a kind of organic electroluminescence device is provided, comprise transparency carrier, the first transparency electrode, organic function layer, the second electrode, and be arranged on light taking-up parts between described transparency carrier and described the first electrode, it is that above-mentioned light takes out parts that described light takes out parts; And described light takes out described smooth removing layer and the described transparency carrier of parts and directly fits, and described high refractive index transparent substrate and the first electrode are directly fitted.
Meanwhile, provide a kind of preparation method of organic electroluminescence device, comprise the steps:
(10) described light is taken out to parts and be fitted on described transparency carrier, after laminating, described smooth removing layer and the described transparency carrier of described light taking-up parts are directly fitted;
(11) on taking out the face at described high refractive index transparent substrate place of parts, described light makes the first transparency electrode;
In described the first transparency electrode, make in turn organic function layer and the second electrode;
(13) device package.
In described step (10), light is being taken out to parts and is also comprising before being fitted in substrate the step of cutting, specifically: light is taken out to parts and be cut into the step that the light corresponding with light-emitting zone size dimension takes out component unit.
It is bench-type that described light after cutting takes out component unit.
Technique scheme of the present invention has the following advantages compared to existing technology:
(1) described light taking-up parts comprise high refractive index transparent substrate and light removing layer, and described smooth removing layer is high index of refraction scattering layer or microlens array layer.The refractive index of high refractive index transparent substrate is fixed, and can effectively eliminate organic layer to the total reflection of substrate, and high index of refraction scattering layer or microlens array layer can, by changing total reflection light path, improve light extraction efficiency; Simple in structure, light extraction efficiency is high; The described organic electroluminescence device that is provided with light taking-up parts, described light takes out parts and is arranged between substrate and the first electrode, can effectively take out the light beam that is limited in organic function layer inside, has efficient light and takes out efficiency; Described light takes out described smooth removing layer and the laminating of described transparency carrier of parts, the first transparency electrode is produced on the described high refractive index transparent substrate of described light taking-up parts, large and the surfacing of high refractive index transparent chip density, when carrying out device package, even if cap and high refractive index transparent substrate coordinate encapsulation, also can reach the effect of isolation steam and oxygen, effectively raise the life-span of device.
(2) the light removing layer of described light taking-up parts can be prepared by spin coating process and photoetching process, and technique is simple, is applicable to large-scale production.
(3) material of described high refractive index transparent substrate is polyethylene terephthalate substrate or PEN or polyphenylene sulfide, not only possess higher refractive index, and cost is relatively low.
(4) particle diameter of described scattering particles is 0.02-0.8 μ m, and its particle size and wavelength of light, in ad eundem, can be avoided fiber-loss, effectively scatter visible light light.
(5) particle diameter of described scattering layer Thickness Ratio scattering particles is slightly large, can guarantee that scattering particles are all positioned at scattering layer, makes the scattering layer surfacing making.
(6) light is taken out to the light taking-up component unit that parts are cut into light-emitting zone size dimension, again described film unit is fitted in to the correspondence position of described light-emitting zone on transparency carrier, during encapsulation, light takes out parts and is positioned at cap, guarantees better packaging effect.
(7) the described light taking-up component unit after cutting is bench-type, avoids the ITO electrode layer of evaporation to occur fracture, guarantees the continuity of ITO electrode layer, and then guarantees conductive effect.
Accompanying drawing explanation
For content of the present invention is more likely to be clearly understood, below according to a particular embodiment of the invention and by reference to the accompanying drawings, the present invention is further detailed explanation, wherein
Fig. 1 is preparation method's flow chart of a kind of organic electroluminescence device that contains light taking-up parts of one embodiment of the invention;
Fig. 2 is OLED structural representation prepared in Fig. 1;
Fig. 3 is OLED structural representation prepared in embodiment tetra-;
Fig. 4 is the structural representation that light described in embodiment tetra-takes out component unit;
In figure, Reference numeral is expressed as: 1-high refractive index transparent substrate, 2-light removing layer, 3-transparent glass substrate, 4-ITO transparent anode layer, 5-organic function layer, 6-cathode layer, 7-packaging plastic, 8-cap, 41-small pieces PEN transparent substrate, 42-small pieces scattering layer.
Embodiment
For making the object, technical solutions and advantages of the present invention clearer, below in conjunction with accompanying drawing, embodiment of the present invention is described further in detail.
The organic electroluminescence device that light takes out parts that contains as the embodiment of the present invention one, as shown in Figure 2, comprise transparent glass substrate 3, ITO(indium oxide) transparent anode layer 4, organic function layer 5, cathode layer 6, and the light being arranged between described transparent glass substrate 3 and described ITO transparent anode layer 4 takes out parts, wherein, ITO transparent anode layer 4 forms first electrode layer of the present embodiment, the second electrode lay that cathode layer 6 forms in the present embodiment, described light takes out parts and further comprises, high refractive index transparent substrate 1 and the light removing layer 2 that is molded over described high refractive index transparent substrate 1 surface, in the present embodiment, described high refractive index transparent substrate 1 for PEN(English name be polyethylene naphtha late, mean PEN) transparent substrate, described smooth removing layer 2 is scattering layer, the substrate of scattering layer and described transparent glass substrate 3 is directly fitted, and described PEN transparent substrate and ITO transparent anode layer 4 are directly fitted.Described scattering layer wherein comprises that light transmittance is greater than the TiO that 80% photoresist and refractive index are greater than the refractive index of organic function layer 5
2(titanium dioxide) scattering particles, described TiO
2initial particle be 0.02-0.8 μ m, the thickness of the described scattering layer making is 0.3-3 μ m, and as preferably, the thickness of described scattering layer is greater than the initial particle of described scattering particles, can guarantee that more scattering particles are arranged in described scattering layer, the evenness of the described scattering layer that assurance makes.
In the present embodiment, the refractive index of PEN transparent substrate is fixed, and can effectively eliminate total reflection, and scattering layer can, by changing total reflection light path, improve light extraction efficiency; Whole light takes out the simple in structure of parts, and light extraction efficiency is high; The described organic electroluminescence device that is provided with light taking-up parts, described light takes out parts and is arranged between glass transparent substrate 3 and ITO transparent anode layer 4, can effectively take out the light beam that is limited in organic function layer inside; ITO transparent anode layer 4 is produced on the described PEN transparent substrate of described light taking-up parts, large and the surfacing of PEN transparent substrate density, when carrying out device package, cap and high refractive index transparent substrate coordinate encapsulation, also can reach the effect of isolation steam and oxygen, effectively raise the life-span of device.
Distortion as above-described embodiment, it is Polyethylene terephthalate that described PEN transparent substrate can be PET(English name of the prior art, mean PETG) or PSS(English name be Polyphenylene sulfide, meaning polyphenylene sulfide) transparent substrate substitutes, other same above-described embodiment, can realize object of the present invention equally, belong to protection scope of the present invention; And the refractive index of the transparent substrate of employing is better, the effect that light takes out is just better.Wherein, adopting PSS(English name is Polyphenylene sulfide, means polyphenylene sulfide) transparent substrate forms embodiments of the invention three as described high refractive index transparent substrate.
As the distortion of above-described embodiment, described scattering particles TiO
2also can be SiO
2(silicon dioxide), ZnO(zinc oxide) or ZrO
2the minuteness particle of (zirconia) replaces, and other same above-described embodiment, can realize object of the present invention equally, belongs to protection scope of the present invention.
As other embodiments of the invention, described smooth removing layer can suppress to incide from the light of described high refractive index transparent substrate outgoing for other other parts replacement of total emission of described transparency carrier, such as pyramid light removing layer or optical grating diffraction layer, wherein pyramid light removing layer suppresses total reflection by refraction, and optical grating diffraction layer suppresses full transmitting by diffraction; Can realize equally the bright object of we, belong to protection scope of the present invention.
Shown in accompanying drawing 1, in above-described embodiment one, contain the manufacture method that light takes out the organic electroluminescence device of parts, specifically comprise the steps:
First, prepare light and take out parts:
S1, prepares light and takes out parts, makes one deck high index of refraction scattering layer on PEN transparent substrate, and scattering layer is by TiO
2be blended in transparent photomask glue and make by common photoetching spin coating proceeding, wherein, TiO
2with the mass ratio of photoresist be 1:4, described high index of refraction scattering layer thickness is 0.3-3 μ m.
S2, the face that light prepared in step S1 is taken out to the scattering layer place of parts is directly fitted on the substrate of glass transparent substrate 3, and laminating can be used double faced adhesive tape, common adhesive liquid glue etc.
S3, at PEN transparent substrate direct sputter one deck ITO transparent anode layer 4 on the face of moulding scattering layer not: adopt direct current magnetron sputtering process to prepare the ITO transparent anode layer 4 of 150nm, ITO target is indium stannum alloy, its composition ratio In(indium): Sn(tin)=90%:10%.In preparation process, partial pressure of oxygen is 0.4Sccm, and argon partial pressure is 20Sccm; Prepare after ITO electrode layer, adopt lithographic method to etch ITO transparent anode layer 4.
S4, puts into each functional layer of evaporation chamber evaporation: evaporation hole transmission layer, luminescent layer, electron transfer layer, electron injecting layer successively.Evaporate process middle chamber pressure is lower than 5.0 * 10-3Pa, the thick N of evaporation 40nm first, and N-bis-(naphthalene-1-yl)-N, N '-diphenyl-benzidine (is called for short: NPB) as hole transmission layer; The method evaporation 30nm that steams altogether with double source thick 9,10-bis-(2-naphthyl) anthracene (is called for short: ADN) He four tertiary Ding Ji perylenes (are called for short: TBPe) as luminescent layer, the ratio of through-rate control TBPe in ADN is 7%; The Alq3 of evaporation 20nm is as electron transfer layer; The LiF of evaporation 0.5nm is as electron injecting layer.The aluminium of evaporation 150nm on organic function layer (chemical formula is Al) is as negative electrode layer by layer 6.
S5, adopts after conventional packaged type encapsulation with UV packaging plastic, cap, makes OLED device.
The organic electroluminescence device containing light taking-up parts as the embodiment of the present invention two, comprise transparent glass substrate 3, ITO transparent anode layer 4, organic function layer 5, cathode layer 6, and the light being arranged between described transparent glass substrate 3 and described ITO transparent anode layer 4 takes out parts, described light takes out parts and further comprises, high refractive index transparent substrate 1 and the light removing layer 2 that is molded over described high refraction substrate surface.In the present embodiment, described high refractive index transparent substrate 1 is PEN transparent substrate, and described smooth removing layer 2 is microlens array layer.Wherein, after fitting, described microlens array layer is directly fitted with described glass transparent substrate 3, and ITO transparent anode layer 4 is produced on the described PEN transparent substrate of described light taking-up parts.
In the present embodiment, microlens array layer can, by changing total reflection light path, improve light extraction efficiency; Whole light takes out the simple in structure of parts, can effectively eliminate total reflection, and light extraction efficiency is high; The described organic electroluminescence device that is provided with light taking-up parts, described light takes out parts and is arranged between glass transparent substrate 3 and ITO transparent anode layer 4, can effectively take out the light beam that is limited in organic function layer inside; ITO transparent anode layer 4 is produced on the described PEN transparent substrate of described light taking-up parts, large and the surfacing of PEN transparent substrate density, when carrying out device package, cap and high refractive index transparent substrate coordinate encapsulation, also can reach the effect of isolation steam and oxygen, effectively raise the life-span of device.
The organic electroluminescence device manufacture method containing light taking-up parts of the embodiment of the present invention two is as follows:
First, prepare light and take out parts:
S21, prepare light and take out parts, on PEN transparent substrate, be coated with one deck photoresist, thickness is 20 μ m, adopt photoetching technique to produce the figure of column structure, be then heated to the column structure photoresist of melting due to surface tension effects, marginal portion first raises up, then mid portion projection, finally forms protruding structure and forms lenticule.
S22, the lenticule aspect of prepared light in step S21 being taken out to parts is fitted in glass substrate 3, and laminating can be used double faced adhesive tape, common adhesive liquid glue etc.;
S23, is being fitted with sputter one deck ITO electrode on the substrate of film substrate, adopts ITO transparent anode that direct current magnetron sputtering process prepares 150nm layer by layer, and ITO target is indium stannum alloy, its composition ratio In:Sn=90%:10%.In preparation process, partial pressure of oxygen is 0.4Sccm, and argon partial pressure is 20Sccm.Prepare after ITO electrode layer, adopt lithographic method to etch ITO transparent anode layer 4.
S24, puts into each functional layer of evaporation chamber evaporation, 5.Evaporation hole transmission layer, luminescent layer, electron transfer layer, electron injecting layer successively.Evaporate process middle chamber pressure is lower than 5.0 * 10
-3pa, first the thick NPB of evaporation 40nm is as hole transmission layer; The ADN that method evaporation 30nm that the double source of usining steams is altogether thick and TBPe are as luminescent layer, and it is 7% that through-rate is controlled the ratio of TBPe in ADN; The Alq of evaporation 20nm
3as electron transfer layer; The LiF of evaporation 0.5nm is as electron injecting layer.On organic function layer, the Al of evaporation 150nm is as the second electrode lay.
S25, adopts after conventional packaged type encapsulation with UV packaging plastic, cap, makes OLED device.
As embodiments of the invention four, as shown in accompanying drawing 3-4, the structural similarity in its structure and embodiment mono-to embodiment tri-, from above-described embodiment unique different be that described light takes out parts and only at light-emitting zone, distributes.
The preparation method of the OLED device of embodiments of the invention four structures is as follows:
S41, prepares light and takes out parts, makes one deck high index of refraction scattering layer on PEN transparent substrate, and scattering layer is by TiO
2be blended in transparent photomask glue and make by common photoetching spin coating proceeding, the TiO of mixing
2with the mass ratio of photoresist be 1:4, thickness is 0.3-3 μ m.
S42, light prepared in step S41 is taken out to the light taking-up component unit that parts are cut into luminous zone size dimension, it is bench-type that the light cutting into takes out component unit, wherein small pieces scattering layer 42 is large scale face, small pieces PEN transparent substrate 41 is small size face, small pieces scattering layer 42 is fitted in the luminous zone of transparent glass substrate 3, and laminating can be used double faced adhesive tape, common adhesive liquid glue etc.It is bench-type that described light after cutting takes out component unit, is formed on the mild transition of ITO electrode layer on coplanar not, avoids occurring fracture, guarantees the continuity of ITO electrode layer, and then guarantees conductive effect; Meanwhile, it is bench-type that light takes out parts, only at light-emitting zone, distributes; After encapsulation, described light takes out parts and is positioned at cap, and device encapsulates by cap and glass substrate, can obtain the packaging effect of isolating better steam and oxygen.
S43, sputter one deck ITO electrode on the substrate that is fitted with small pieces PEN transparent substrate 41, adopts ITO transparent anode that direct current magnetron sputtering process prepares 150nm layer by layer, and ITO target is indium stannum alloy, its composition ratio In:Sn=90%:10%.In preparation process, partial pressure of oxygen is 0.4Sccm, and argon partial pressure is 20Sccm.Prepare after ITO electrode layer, adopt lithographic method to etch ITO transparent anode layer 4.
S44, puts into each organic function layer 5 of evaporation chamber evaporation.Evaporation hole transmission layer, luminescent layer, electron transfer layer, electron injecting layer successively.Evaporate process middle chamber pressure is lower than 5.0 * 10
-3pa, first the thick NPB of evaporation 40nm is as hole transmission layer; The ADN that method evaporation 30nm that the double source of usining steams is altogether thick and TBPe are as luminescent layer, and it is 7% that through-rate is controlled the ratio of TBPe in ADN; The Alq of evaporation 20nm
3as electron transfer layer; The LiF of evaporation 0.5nm is as electron injecting layer.On organic function layer, the Al of evaporation 150nm is as the second electrode lay.
S45, adopts after conventional packaged type encapsulation with UV packaging plastic, cap, makes OLED device.
Light is taken out to the light taking-up component unit that parts are cut into light-emitting zone size dimension, more described unit is fitted in to the correspondence position of described light-emitting zone on transparent glass substrate 3, during encapsulation, light takes out parts and is positioned at cap, guarantees better packaging effect.
As comparative example one of the present invention, referring to the structure in embodiment mono-and preparation method, from embodiment mono-unique different be that OLED device in comparative example one does not contain light and takes out parts, other is with embodiment mono-.
As comparative example two of the present invention, referring to the structure in embodiment mono-and preparation method, from embodiment mono-unique different be that OLED device in comparative example two does not contain light and takes out parts, but on glass substrate 3, be coated with one deck scattering layer, scattering layer is by TiO
2be blended in transparent photomask glue and make by common photoetching spin coating proceeding, the TiO wherein mixing
2with the mass ratio of photoresist be 1:4, thickness is 0.3-3 μ m; Be coated with sputter one deck ITO electrode on the substrate of scattering layer again.
Test a kind of light extraction efficiency that takes out the organic electroluminescence device of parts containing light of the present invention, OLED prepared by the first to the 4th embodiment has carried out luminance test, and compare to the OLED device in comparative example two with comparative example one, wherein comparative example one is the basis of comparison, and test result is as shown in the table:
As seen from the above table, the brightness of the organic electroluminescence device that contains light taking-up parts of the present invention is than representing that the comparative example one of prior art and the brightness of comparative example two have the lifting of matter, and luminous efficiency improves greatly.
Obviously, above-described embodiment is only for example is clearly described, and the not restriction to execution mode.For those of ordinary skill in the field, can also make other changes in different forms on the basis of the above description.Here exhaustive without also giving all execution modes.And the apparent variation of being extended out thus or change are still among protection scope of the present invention.
Claims (18)
1. the light for organic electroluminescence device takes out parts, it is characterized in that, comprise,
Refractive index is higher than the high refractive index transparent substrate of the refractive index of transparency carrier in organic electroluminescence device;
Be molded over the light removing layer of described high refractive index transparent substrate surface, for suppressing to incide from the light of described high refractive index transparent substrate outgoing the total reflection of described transparency carrier.
2. light according to claim 1 takes out parts, it is characterized in that: described smooth removing layer is scattering layer or microlens array layer.
3. light according to claim 2 takes out parts, it is characterized in that: described scattering layer comprises that light transmittance is greater than the scattering particles that 80% matrix and refractive index are greater than the refractive index of organic function layer in organic electroluminescence device.
4. light according to claim 3 takes out parts, it is characterized in that, described matrix is photoresist, and described scattering particles are TiO
2or SiO
2or ZnO or ZrO
2minuteness particle.
5. light according to claim 4 takes out parts, it is characterized in that, the initial particle of described scattering particles is 0.02-0.8 μ m.
6. light according to claim 5 takes out parts, it is characterized in that, described scattering layer thickness is 0.3-3 μ m.
7. for the light of organic electroluminescence device, take out a preparation method for parts, it is characterized in that, comprise the following steps:
(1) obtain refractive index higher than the high refractive index transparent substrate of the refractive index of transparency carrier in organic electroluminescence device;
(2), at described high refractive index transparent substrate surface moulding light removing layer, light removing layer is wherein for suppressing to incide from the light of described high refractive index transparent substrate outgoing the total reflection of described transparency carrier.
8. preparation method according to claim 7, is characterized in that, described smooth removing layer is scattering layer or microlens array layer.
9. preparation method according to claim 8, is characterized in that, described smooth removing layer is high index of refraction scattering layer, and described step (2) specifically comprises the following steps:
(21) prepare scattering layer solution: after scattering particles, dispersant, solvent are ground, cross leaching filtrate, then gained filtrate is mixed with matrix and made scattering layer solution;
(22) by scattering layer solution coating film forming on high refractive index transparent substrate, obtain continuous scattering layer.
10. preparation method according to claim 9, is characterized in that, in described step (21), the light transmittance of described matrix is greater than 80%, and the refractive index of described scattering particles is greater than the refractive index of organic function layer in organic electroluminescence device.
11. preparation methods according to claim 10, is characterized in that, described matrix is photoresist, and described scattering particles are TiO
2or SiO
2or ZnO or ZrO
2minuteness particle.
12. preparation methods according to claim 11, is characterized in that, the initial particle of described scattering particles is 0.02-0.8 μ m.
13. preparation methods according to claim 12, is characterized in that, described scattering layer thickness is 0.3-3 μ m.
14. preparation methods according to claim 8, is characterized in that, described smooth removing layer is microlens array layer, and described step (2) specifically comprises the following steps:
(31) rotary coating one deck photoresist layer in the one side of described high refractive index transparent substrate;
(32) adopt photoetching technique, photoresist layer is made as to the substrate of column structure;
(33), by the substrate heating of the column structure in step (32), the upper bottom surface of each column structure of melting convexes to form a lenticule.
15. 1 kinds of organic electroluminescence devices, comprise transparency carrier, the first transparency electrode, organic function layer, the second electrode, and be arranged between described transparency carrier and described the first electrode light and take out parts, it is characterized in that, it is that the arbitrary described light of claim 1-6 takes out parts that described light takes out parts; And described light takes out described smooth removing layer and the described transparency carrier of parts and directly fits, and described high refractive index transparent substrate and the first electrode are directly fitted.
The preparation method of 16. 1 kinds of organic electroluminescence devices as claimed in claim 15, is characterized in that, comprises the steps:
(10) described light is taken out to parts and be fitted on described transparency carrier, after laminating, described smooth removing layer and the described transparency carrier of described light taking-up parts are directly fitted;
(11) on taking out the face at described high refractive index transparent substrate place of parts, described light makes the first transparency electrode;
(12) in described the first transparency electrode, make in turn organic function layer and the second electrode;
(13) device package.
The preparation method of 17. organic electroluminescence devices according to claim 16, it is characterized in that, in described step (10), light is being taken out to parts and is also comprising before being fitted in substrate the step of cutting, specifically: light is taken out to parts and be cut into the step that the light corresponding with light-emitting zone size dimension takes out component unit.
The preparation method of 18. organic electroluminescence devices according to claim 17, is characterized in that, it is bench-type that the described light after cutting takes out component unit.
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