CN100582762C - Device for measuring thermal conductive property - Google Patents
Device for measuring thermal conductive property Download PDFInfo
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- CN100582762C CN100582762C CN200510037243A CN200510037243A CN100582762C CN 100582762 C CN100582762 C CN 100582762C CN 200510037243 A CN200510037243 A CN 200510037243A CN 200510037243 A CN200510037243 A CN 200510037243A CN 100582762 C CN100582762 C CN 100582762C
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- conductive property
- thermal conductive
- measuring thermal
- interfacial material
- microscope
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Abstract
The provided detection device for heat conduction property comprises: a heating part and cooling part every with a support plane to form a gap, a microscope to amplify the gap, and a DC. This invention can detect the heat interface material width and its thermal conductivity.
Description
[technical field]
The present invention relates to a kind of device for measuring thermal conductive property, relate in particular to a kind of device for measuring thermal conductive property of thermal interfacial material.
[background technology]
In recent years, along with the fast development of semiconductor devices integrated technique, the integrated degree of semiconductor devices is more and more higher, yet it is more and more littler that device volume becomes, and its demand to heat radiation is more and more higher, has become a more and more important problem.For satisfying this needs, the fan heat radiation, various radiating modes such as water-cooled auxiliary heat dissipation and heat pipe heat radiation are extensively used, and obtained certain radiating effect, but contact interface out-of-flatness because of heating radiator and thermal source, generally be in contact with one another area less than 2%, the contact interface that neither one is desirable, fundamentally influenced the effect of semiconductor devices to the heat sink heat, therefore, traditional heating radiator improves the heat transference efficiency between semiconductor devices and heating radiator by increasing the higher thermal interfacial material of a coefficient of heat conductivity to increase the interface contact area between heating radiator and semiconductor devices.
Therefore, the heat-conductive characteristic of thermal interfacial material to the influence of the heat transfer effect between semiconductor devices and heating radiator greatly.In the performance history of thermal interfacial material, its heat-conductive characteristic of experimental measurement is an indispensable important step, and the thermal interfacial material of every kind of different formulations all can carry out the experimental measurement of heat-conductive characteristic earlier after allotment is come out, determine whether it satisfies the demands.Therefore, the heat-conductive characteristic that how could measure thermal interfacial material exactly plays important effect to the development of thermal interfacial material.
The thermal resistance of thermal interfacial material and heat-conduction coefficient are the basic parameters of thermal interfacial material performance, and its computing formula is as follows:
Wherein, K is a heat-conduction coefficient; θ is a thermal resistance; Q is a heat flux; A is the cross-sectional area of heat conduction direction; L is the heat conduction distance, i.e. the thickness of thermal interfacial material; T1, T2 are respectively the temperature at two interfaces of thermal interfacial material.
Prior art provides a kind of thermal interfacial material measuring equipment, the method that this device measures the thermal interfacial material thermal resistance is in an adiabatic environment, two copper billets clip thermal interfacial material with fixation pressure, one end is a colling end for the fire end other end, the temperature that measures the thermal interfacial material two ends by thermopair is in the hope of the temperature difference, and the distance that measures between two copper billets by slide calliper rule draws thermal interfacial material thickness.Calculate the thermal resistance and the heat-conduction coefficient that can draw this thermal interfacial material by heat conducting relational expression then.Yet, because the thermal interfacial material general thickness is very little, therefore be difficult to accurately measure its thickness, thereby be difficult to accurately measure the coefficient of heat conductivity of thermal interfacial material.
In view of this, provide a kind of device for measuring thermal conductive property of thermal interfacial material heat-conduction coefficient that can accurately measure in fact for necessary.
[summary of the invention]
Below, will a kind of device for measuring thermal conductive property that can accurately measure the thermal interfacial material heat-conduction coefficient be described with embodiment.
A kind of device for measuring thermal conductive property is used for thermal interfacial material and measures, and it comprises: a heating part and a cooling end, and described heating part and cooling end have a load plane respectively, form a slit between the described load plane; And a microscope and a digital camera, described microscope is used to amplify slit between described load plane, and described digital camera is used to take slit between load plane after described microscope amplifies.
With respect to prior art, the device for measuring thermal conductive property that embodiments of the invention provide, utilize a microscope and a digital camera to cooperate, amplify slit width degree between load plane by microscope, the slit width degree is measured the thickness of thermal interfacial material between the load plane after amplifying by the digital camera shooting then, thereby the error in the time of can reducing thermal interfacial material thickness and measure is measured the heat-conduction coefficient of thermal interfacial material exactly.
[description of drawings]
Fig. 1 is the device for measuring thermal conductive property synoptic diagram that the embodiment of the invention provides.
[embodiment]
Below in conjunction with accompanying drawing the present invention is described in further detail.
See also Fig. 1, the device for measuring thermal conductive property 1 that provides for present embodiment, it comprises: a heating part 10 and a cooling end 20, there is a load plane 11 described heating part 10, described cooling end 20 has a load plane 21, described load plane 11,21 is faced mutually, forms a slit, and this slit is used to be provided with thermal interfacial material 50 to be measured; And a microscope 30 and a digital camera 40, described microscope 30 is aimed at described slit, be used to amplify 11,21 slits of described two load planes, described digital camera 40 aligming microscopes 30 eyepieces, be used to take 11,21 slits of two load planes of amplifying, to be used for calculating the width in 11,21 slits of two load planes through described microscope 30.
Described heating part 10 can further comprise a plurality of in order to the ducts 12 of thermopair to be installed, and a plurality of duct described in the present embodiment 12 is parallel to each other and be parallel to load plane 11, and is equidistant arrangement in the direction away from load plane 11.Described a plurality of duct 12 can be through hole or blind hole, is blind hole in the present embodiment, uses blind hole can reduce thermopair is subjected to air flow in the measurement process influence.Described heating part 10 also can comprise a through hole 13, and described through hole 13 is in order to insert a heating rod.Heating part 10 can comprise a plurality of through holes 13, and 10 of heating parts described in the present embodiment illustrate a through hole 13.The material of described heating part 10 can be selected from copper, aluminium or X alloy etc.
Described cooling end 20 can further comprise a plurality of in order to the ducts 22 of thermopair to be installed, and a plurality of duct described in the present embodiment 22 is parallel to each other and be parallel to load plane 21, and is equidistant arrangement in the direction away from load plane 21.Described a plurality of duct 22 can be through hole or blind hole, is blind hole in the present embodiment.Described cooling end 20 also can comprise a through hole 23, and described through hole 23 is in order to feed heat eliminating medium.Cooling end 20 can comprise a plurality of through holes 23, and 20 of cooling ends described in the present embodiment illustrate a through hole 23.The material of described cooling end 20 can be selected from copper, aluminium or X alloy etc.
Described microscope 30 and digital camera 40 can be selected as required, and preferably, the enlargement factor of described microscope 30 is greater than 10 times, and described digital camera 40 has dynamic shooting ability, and promptly it can be taken by certain hour at interval continuously by setting.Utilize this function can photograph thermal interfacial material 50 and reach the preceding variation in thickness of steady state (SS), can measure the thickness of each time point thermal interfacial material 50, utilize thermopair to measure the temperature approach of 11,21 of each time point two load planes again, can understand the heat-conductive characteristic changing condition before thermal interfacial material 50 reaches steady state (SS) thus.
In actual measurement process, whole device for measuring thermal conductive property 1 is coated in the thermal insulation material, after thermal interfacial material 50 reaches thermal steady state, calculate the temperature value at thermal interfacial material 50 two ends by the data of thermocouple measurement, can calculate the thermal resistance of thermal interfacial material 50 again according to the heating power of heat conductive rod.And then the photo of taking gained according to digital camera 40 by the computer image acquisition calculate the thickness of thermal interfacial material 50, in conjunction with before the thermal resistance calculated can calculate heat-conduction coefficient after thermal interfacial material 50 reaches steady state (SS).
With respect to prior art, the device for measuring thermal conductive property that embodiments of the invention provide, utilize a microscope and a digital camera to cooperate, amplify slit width degree between two load planes by microscope, the slit width degree is measured the thickness of thermal interfacial material between the load plane after amplifying by the digital camera shooting then, thereby the error in the time of can reducing thermal interfacial material thickness and measure, thereby can measure the heat-conduction coefficient of thermal interfacial material exactly.
Be understandable that, concerning one skilled in the relevant art, can make other various corresponding changes and distortion by technical conceive according to the present invention, and all these changes and distortion all should belong to the protection domain of claim of the present invention.
Claims (9)
1. device for measuring thermal conductive property, being used for thermal interfacial material measures, it comprises: a heating part and a cooling end, described heating part and cooling end have a load plane respectively, form a slit between the described load plane, it is characterized in that: described device for measuring thermal conductive property further comprises a microscope and a digital camera, and described microscope is used to amplify slit between described load plane, and described digital camera is used to take slit through between the load plane after the described microscope amplification.
2. device for measuring thermal conductive property as claimed in claim 1 is characterized in that: described heating part comprises a plurality of in order to the duct of thermopair to be installed.
3. device for measuring thermal conductive property as claimed in claim 1 is characterized in that: described cooling end comprises a plurality of in order to the duct of thermopair to be installed.
4. as claim 2 or 3 described device for measuring thermal conductive property, it is characterized in that: described a plurality of ducts are equidistant arrangement on the direction perpendicular to load plane.
5. device for measuring thermal conductive property as claimed in claim 1 is characterized in that: described heating part comprises a through hole at least, and described through hole is in order to insert heating rod.
6. device for measuring thermal conductive property as claimed in claim 1 is characterized in that: described cooling end comprises a through hole at least, and described through hole is in order to feed heat eliminating medium.
7. device for measuring thermal conductive property as claimed in claim 1 is characterized in that: the material of described heating part and cooling end is selected from copper, aluminium or X alloy.
8. device for measuring thermal conductive property as claimed in claim 1 is characterized in that: the described slit of described microscope alignment.
9. device for measuring thermal conductive property as claimed in claim 1 is characterized in that: described digital camera is aimed at described microscope ocular.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510037243A CN100582762C (en) | 2005-09-09 | 2005-09-09 | Device for measuring thermal conductive property |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN200510037243A CN100582762C (en) | 2005-09-09 | 2005-09-09 | Device for measuring thermal conductive property |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1928538A CN1928538A (en) | 2007-03-14 |
| CN100582762C true CN100582762C (en) | 2010-01-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN200510037243A Expired - Fee Related CN100582762C (en) | 2005-09-09 | 2005-09-09 | Device for measuring thermal conductive property |
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| CN (1) | CN100582762C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105628730A (en) * | 2015-12-17 | 2016-06-01 | 北京航空航天大学 | Contact thermal resistance type test equipment with stable heating system |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103364101B (en) * | 2013-07-08 | 2015-02-25 | 中国电子科技集团公司第十一研究所 | Thermal interface uniformity detecting system and method |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86102931A (en) * | 1986-04-29 | 1987-11-11 | 北京钢铁学院 | Heat-conduction coefficient tester |
| US5441343A (en) * | 1993-09-27 | 1995-08-15 | Topometrix Corporation | Thermal sensing scanning probe microscope and method for measurement of thermal parameters of a specimen |
| JP2003194755A (en) * | 2001-12-27 | 2003-07-09 | Mitsumi Electric Co Ltd | Method of testing semiconductor package |
| CN2695961Y (en) * | 2004-04-13 | 2005-04-27 | 鸿富锦精密工业（深圳）有限公司 | Device for investigating thermal surface material |
| CN2706760Y (en) * | 2004-05-28 | 2005-06-29 | 鸿富锦精密工业（深圳）有限公司 | Heat interface material testing platform |
-
2005
- 2005-09-09 CN CN200510037243A patent/CN100582762C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN86102931A (en) * | 1986-04-29 | 1987-11-11 | 北京钢铁学院 | Heat-conduction coefficient tester |
| US5441343A (en) * | 1993-09-27 | 1995-08-15 | Topometrix Corporation | Thermal sensing scanning probe microscope and method for measurement of thermal parameters of a specimen |
| JP2003194755A (en) * | 2001-12-27 | 2003-07-09 | Mitsumi Electric Co Ltd | Method of testing semiconductor package |
| CN2695961Y (en) * | 2004-04-13 | 2005-04-27 | 鸿富锦精密工业（深圳）有限公司 | Device for investigating thermal surface material |
| CN2706760Y (en) * | 2004-05-28 | 2005-06-29 | 鸿富锦精密工业（深圳）有限公司 | Heat interface material testing platform |
Non-Patent Citations (2)
| Title |
|---|
| 导热胶粘剂研究. 周文英，齐暑华，李国新，牛国良，寇静利.材料导报，第19卷第5期. 2005 * |
| 高导热电封装复合材料界面热传导的扫描热显微镜分析. 吉元，钟涛兴，高晓霞，毋立芳，陈皓明，王秀凤，韩立，谢志刚.电子显微学报，第20卷第3期. 2001 * |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105628730A (en) * | 2015-12-17 | 2016-06-01 | 北京航空航天大学 | Contact thermal resistance type test equipment with stable heating system |
| CN105628730B (en) * | 2015-12-17 | 2019-01-18 | 北京航空航天大学 | With the thermal contact resistance test equipment for stablizing heating system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1928538A (en) | 2007-03-14 |
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