CN100573128C - A kind of on-the-spot ice chest that detects of building enclosure structure heat transfer coefficient that is used for - Google Patents

A kind of on-the-spot ice chest that detects of building enclosure structure heat transfer coefficient that is used for Download PDF

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Publication number
CN100573128C
CN100573128C CNB2006101228379A CN200610122837A CN100573128C CN 100573128 C CN100573128 C CN 100573128C CN B2006101228379 A CNB2006101228379 A CN B2006101228379A CN 200610122837 A CN200610122837 A CN 200610122837A CN 100573128 C CN100573128 C CN 100573128C
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CN
China
Prior art keywords
semiconductor chilling
chilling plate
ice chest
heat transfer
air chamber
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006101228379A
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Chinese (zh)
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CN1945299A (en
Inventor
吴培浩
杨仕超
阎松
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Guangdong Provincial Academy of Building Research Group Co Ltd
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GUANGDONG PROV INST OF BUILDING SCIENCE
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Priority to CNB2006101228379A priority Critical patent/CN100573128C/en
Publication of CN1945299A publication Critical patent/CN1945299A/en
Application granted granted Critical
Publication of CN100573128C publication Critical patent/CN100573128C/en
Expired - Fee Related legal-status Critical Current
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Abstract

The invention discloses a kind of on-the-spot ice chest that detects of building enclosure structure heat transfer coefficient that is used for, comprise temperature sensor, semiconductor chilling plate, heat conductor and insulation material, insulation material forms the casing of ice chest, one end of casing is an opening end, opening end is lobed edge structure all around, and the confined space of air chamber is arranged in opening end and architectural exterior-protecting construction surface form; The huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate contacts with air chamber, and the hot side of semiconductor chilling plate is connected with the heat conductor of high heat conduction, and semiconductor chilling plate and heat conductor are arranged in the insulation material; Described temperature sensor is positioned over the architectural exterior-protecting construction surface of air chamber correspondence, and is connected with data acquiring control circuit.Compare with the existing on-site detecting device that is used for building enclosure structure heat transfer coefficient, the present invention has characteristics such as price is low, temperature control is accurate, simple in structure, can conveniently carry out the scene of enclosure structure heat transfer coefficients such as building masonry wall or roofing and detect.

Description

A kind of on-the-spot ice chest that detects of building enclosure structure heat transfer coefficient that is used for
Technical field
The present invention relates to a kind of on-the-spot device that detects of building enclosure structure heat transfer coefficient that is used for, relate in particular to a kind of semiconductor that adopts as ice chest low-temperature receiver, that be used for the on-the-spot detection of building enclosure structure heat transfer coefficient.
Background technology
It is one of on-the-spot main contents that detect assessment technique of building energy conservation that the scene of building enclosure structure heat transfer coefficient is detected.When the scene of carrying out enclosure structure heat transfer coefficient is detected, need form stable temperature difference in the both sides at tested position; This temperature difference can utilize natural conditions to form, and also can form by artificial the manufacturing.Cold junction is generally by carrying out air-conditioning or adopt the ice chest by mechanical heat pump refrigerating to form indoor at present.And it is realize that by air-conditioning cold junction temperature is not easy accurate control, and unstable; Employing is bigger by the ice chest equipment volume and the weight of mechanical heat pump refrigerating, is used for on-the-spot test and has inconvenience.
And adopt semiconductor refrigerating to have following advantage and characteristics: (1) does not have slide unit, can be applied in some spaces to be restricted reliability requirement height, the occasion that can not have cold-producing medium to pollute; (2) work of semiconductor chilling plate running is to use DC current, and the refrigerating capacity size is by the size decision of electric current, control easily; (3) refrigerating speed is fast, and temperature range is big.
Summary of the invention
The object of the present invention is to provide a kind of on-the-spot ice chest that detects of building enclosure structure heat transfer coefficient that is used for, this device can utilize the semiconductor chilling plate refrigeration to make stable artificial environment, make instrument can adapt to measurement under most of weather, drop to minimum outside environment requirement.
Purpose of the present invention can be achieved by the following technical programs:
A kind of on-the-spot ice chest that detects of building enclosure structure heat transfer coefficient that is used for, comprise temperature sensor, semiconductor chilling plate, heat conductor and insulation material, described insulation material forms the casing of ice chest, one end of casing is an opening end, opening end is lobed edge structure all around, and the confined space of air chamber is arranged in opening end and architectural exterior-protecting construction surface form; The huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate contacts with air chamber, and the hot side of semiconductor chilling plate is connected with the heat conductor of high heat conduction, and semiconductor chilling plate and heat conductor are arranged in the insulation material; Described temperature sensor is positioned over the architectural exterior-protecting construction surface of air chamber correspondence, and is connected with data acquiring control circuit; Described semiconductor chilling plate also is connected with data acquiring control circuit.
As of the present invention further perfect, be provided with the panel of high heat conduction between described semiconductor chilling plate and the air chamber, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate closely contacts with panel.The effect of high heat conduction panel mainly is in order to strengthen heat interchange and to improve the homogeneity of temperature in the ice chest, is not the necessary condition of this device; Can also adopt other method (as air flow) to improve the homogeneity of ice chest air.
As of the present invention further perfect, be provided with the radiation panel of high heat conduction between described heat conductor and the casing outside air.The effect of the radiation panel of high heat conduction mainly is in order to increase area of dissipation, is not the necessary condition of this device; Also can strengthen the heat radiation of radiation panel by modes such as air-cooled and water-cooleds.
Principle of work of the present invention is, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate is attached on the panel of the high heat conduction of interior lastblock, and this panel and body of wall or roofing carry out heat interchange by radiation and thermal convection; The hot side of semiconductor chilling plate is connected with the heat conductor of high heat conduction, and this heat conductor closely contacts with the radiation panel of the high heat conduction of box outer surface lastblock again and dispels the heat; Except that opening end, all surround around the ice chest with insulation material; The low-temperature receiver of ice chest is from the refrigeration of one or more semiconductor chilling plates, regulates the refrigerating capacity by the Current Control ice chest of semiconductor chilling plate, thereby sets up stable temperature field in the enclosure space of a side of body of wall or roofing and casing formation.During practical operation, comprise following step:
(1) selectes the representative position of architectural exterior-protecting construction as the measured position;
(2) temperature sensor and heat flow meter etc. is fixed to the measured position;
(3) opening end with ice chest abuts against the measured position and takes reliable measure to fix, and guarantees that enclosure space is airtight good;
(4) each temperature sensor and heat flow meter are connected also power-on with data acquisition controller;
(5) utilize the software kit of exploitation to test automatically and data processing, generate report automatically; Manually check at last.
Compare with the existing on-site detecting device that is used for building enclosure structure heat transfer coefficient, the present invention has characteristics such as price is low, temperature control is accurate, simple in structure, can conveniently carry out the scene of enclosure structure heat transfer coefficients such as building masonry wall or roofing and detect.
Description of drawings
Fig. 1 is the structural representation of the embodiment of the invention.
Embodiment
As shown in Figure 1, the ice chest that is used for the on-the-spot detection of building enclosure structure heat transfer coefficient of the embodiment of the invention, comprise temperature sensor 4, semiconductor chilling plate 6, heat conductor 7 and insulation material 5, insulation material 5 forms the casing of ice chest, one end of casing is an opening end, opening end is lobed edge structure all around, and the confined space of air chamber 2 is arranged in opening end and architectural exterior-protecting construction 1 surface form; The huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 6 contacts with air chamber 2, and the hot side of semiconductor chilling plate 6 is connected with the heat conductor of high heat conduction 7, and semiconductor chilling plate 6 and heat conductor 7 are arranged in the insulation material 5; Temperature sensor 4 is positioned over architectural exterior-protecting construction 1 surface of air chamber 2 correspondences, and is connected with data acquiring control circuit; Semiconductor chilling plate 6 also is connected with data acquiring control circuit.
One embodiment of the present invention are, the panel 3 of a high heat conduction is set between semiconductor chilling plate 6 and air chamber 2, and the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate 6 closely contacts with panel 3.The effect of high heat conduction panel 3 mainly is in order to strengthen heat interchange and to improve the homogeneity of temperature in the ice chest, is not the necessary condition of this device; Can also adopt other method (as air flow) to improve the homogeneity of ice chest air.
Another embodiment of the invention is that the radiation panel 8 of a high heat conduction is set between heat conductor 7 and casing outside air.The effect of the radiation panel 8 of high heat conduction mainly is in order to increase area of dissipation, is not the necessary condition of this device; Also can strengthen the heat radiation of radiation panel by modes such as air-cooled and water-cooleds.

Claims (3)

1, a kind of on-the-spot ice chest that detects of building enclosure structure heat transfer coefficient that is used for, it is characterized in that comprising temperature sensor (4), semiconductor chilling plate (6), heat conductor (7) and insulation material (5), described insulation material (5) forms the casing of ice chest, one end of casing is an opening end, opening end is lobed edge structure all around, and the confined space of air chamber (2) is arranged in opening end and architectural exterior-protecting construction (1) surface forms; The huyashi-chuuka (cold chinese-style noodles) of described semiconductor chilling plate (6) contacts with air chamber (2), and the hot side of semiconductor chilling plate (6) is connected with the heat conductor (7) of high heat conduction, and semiconductor chilling plate (6) and heat conductor (7) are arranged in the insulation material (5); Described temperature sensor (4) is positioned over corresponding architectural exterior-protecting construction (1) surface of air chamber (2), and is connected with data acquiring control circuit; Described semiconductor chilling plate (6) also is connected with data acquiring control circuit.
2, the on-the-spot ice chest that detects of building enclosure structure heat transfer coefficient that is used for according to claim 1, it is characterized in that being provided with between described semiconductor chilling plate (6) and the air chamber (2) panel (3) of high heat conduction, the huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate (6) closely contacts with panel (3).
3, the on-the-spot ice chest that detects of building enclosure structure heat transfer coefficient that is used for according to claim 1 and 2 is characterized in that being provided with between described heat conductor (7) and the casing outside air radiation panel (8) of high heat conduction.
CNB2006101228379A 2006-10-19 2006-10-19 A kind of on-the-spot ice chest that detects of building enclosure structure heat transfer coefficient that is used for Expired - Fee Related CN100573128C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2006101228379A CN100573128C (en) 2006-10-19 2006-10-19 A kind of on-the-spot ice chest that detects of building enclosure structure heat transfer coefficient that is used for

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2006101228379A CN100573128C (en) 2006-10-19 2006-10-19 A kind of on-the-spot ice chest that detects of building enclosure structure heat transfer coefficient that is used for

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CN1945299A CN1945299A (en) 2007-04-11
CN100573128C true CN100573128C (en) 2009-12-23

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Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101126728B (en) * 2007-09-11 2011-04-20 安徽省产品质量监督检验研究院 Building heat preservation weather-resistant tester
CN101782540B (en) * 2009-12-30 2011-07-20 宁波工程学院 On-site detection device and detection method for heat transfer coefficients of building enclosure structures

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
用冷箱控温检测墙体传热系数的探索. 张镛,田斌守.墙材革新与建筑节能,第7期. 2006
用冷箱控温检测墙体传热系数的探索. 张镛,田斌守.墙材革新与建筑节能,第7期. 2006 *

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Address after: 510500 No. 121 martyrs East Road, Guangzhou, Guangdong, Tianhe District

Patentee after: Guangdong Construction Academy Group Plc

Address before: 510500 martyrs East Road, Guangdong, Guangzhou No. 121

Patentee before: Guangdong Prov. Inst. of Building Science

CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20091223

Termination date: 20151019

EXPY Termination of patent right or utility model