CN205944811U - External high -efficient semiconductor constant temperature dehumidifier - Google Patents
External high -efficient semiconductor constant temperature dehumidifier Download PDFInfo
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- CN205944811U CN205944811U CN201620765652.9U CN201620765652U CN205944811U CN 205944811 U CN205944811 U CN 205944811U CN 201620765652 U CN201620765652 U CN 201620765652U CN 205944811 U CN205944811 U CN 205944811U
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- 239000004065 semiconductor Substances 0.000 title claims abstract description 46
- 238000009833 condensation Methods 0.000 claims abstract description 35
- 230000005494 condensation Effects 0.000 claims abstract description 35
- 238000007791 dehumidification Methods 0.000 claims abstract description 21
- 235000012149 noodles Nutrition 0.000 claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims abstract description 9
- 239000000463 material Substances 0.000 claims description 11
- 238000009413 insulation Methods 0.000 claims description 10
- 238000001816 cooling Methods 0.000 claims description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 238000001035 drying Methods 0.000 abstract description 5
- 238000005057 refrigeration Methods 0.000 abstract description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 7
- 238000005516 engineering process Methods 0.000 description 5
- 201000004792 malaria Diseases 0.000 description 5
- 238000000034 method Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 230000001186 cumulative effect Effects 0.000 description 2
- 239000004615 ingredient Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
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Abstract
The utility model discloses an external high -efficient semiconductor constant temperature dehumidifier. This external high -efficient semiconductor constant temperature dehumidifier includes: shell, its inner chamber pass through the insulating layer and separate into upper portion heat dissipation chamber and lower part condensation chamber, and air outlet and air intake have been offered respectively to the bottom both sides in this lower part condensation chamber, corresponding air intake fan and the air outlet fan of being provided with respectively in this air intake and the air outlet, upper portion heat dissipation intracavity still is provided with atmospheric control ware, switching power supply and hot side fan, high -efficient semiconductor refrigeration components is with atmospheric control ware control connection, the hot side radiator is located high -efficient semiconductor refrigeration components's hot junction, and huyashi -chuuka (cold chinese -style noodles) condensation ware, be located high -efficient semiconductor refrigeration components's cold junction. This external high -efficient semiconductor constant temperature dehumidifier realizes dehumidification, homothermal purpose, the inside low temperature of assurance equipment, drying, and the equipment long -time running is reliable and stable.
Description
Technical field
This utility model is related to casing constant temperature dehumidification field, particularly to a kind of external high efficiency semiconductor constant temperature dehumidification
Device.
Background technology
The control chamber of China's power high voltage cabinet, indoor and outdoor switch and plug-in strip and headstock etc. are filled with respectively in case at present
Plant the accessory of Electrical and Electronic element, these accessories carry the various functions of controlling and execute respectively, these accessories require flat
When moistureproof, damp proof, work in a dry environment.
These power high voltage cabinets existing, indoor and outdoor control chamber and headstock etc. devote oneself to work after in damp-proof treatment
On, all adopt built-in, humidity controller is matched with heater use, after heater is devoted oneself to work, be only humid air plus
Heat, makes the damp-heat air after heating naturally rise, and after damp-heat air rises, meets with the electrical equipment in case, damp-heat air is anti-
And easily can produce the condensation to electrical equipment, the actual dehumidifying that can not fundamentally solve the problems, such as in case, cabinet, because case, cabinet
Moisture in interior humid air do not discharge case, in cabinet, otherwise so that dielectric level is lowered, increase the probability of accident.
The information being disclosed in this background section is merely intended to increase the understanding to general background of the present utility model, and
It is not construed as recognizing or imply in any form that this information structure has been existing well known to persons skilled in the art
Technology.
Utility model content
The purpose of this utility model is to provide a kind of simple and reasonable external high efficiency semiconductor constant temperature dehumidification device,
This external high efficiency semiconductor constant temperature dehumidification device adopts semiconductor refrigerating technology, and malaria in casing is freezed, and condensation is cold
Solidifying water device for transferring casing, the purpose realizing dehumidifying, constant temperature it is ensured that device interior low temperature, drying, stably may be used by equipment longtime running
Lean on.
For achieving the above object, this utility model provides a kind of external high efficiency semiconductor constant temperature dehumidification device, including：Outward
Shell, its inner chamber is separated into top heat dissipation cavity and bottom condensation chamber by thermal insulation layer, and the top of this top heat dissipation cavity and both sides are respectively
Offer air intlet and air outlet slit, the two bottom sides of this bottom condensation chamber offer air outlet and air inlet respectively, and this enters
It is correspondingly provided with air inlet fan and air outlet fan respectively in air port and air outlet；Described top radiating intracavity is additionally provided with temperature
Humidity controller, Switching Power Supply and hot face fan；High-efficient semiconductor refrigerating assembly, it is arranged in described thermal insulation layer, and with temperature
Humidity controller controls connection；Hot face radiator, it is arranged on described top radiating intracavity, and is located at described high efficiency semiconductor system
The hot junction of cold assembly；And huyashi-chuuka (cold chinese-style noodles) condensation device, it is arranged on described bottom condensation intracavity, and is located at described high-efficient semiconductor refrigerating
The cold end of assembly；The lower section of described huyashi-chuuka (cold chinese-style noodles) condensation device is provided with condensate draining and outlet.
Preferably, in technique scheme, high-efficient semiconductor refrigerating assembly adopts Tellurobismuthite. material, makes PN galvanic couple pair,
Combined with ceramic plate weld.
Preferably, in technique scheme, hot face radiator, huyashi-chuuka (cold chinese-style noodles) condensation device are all using copper or aluminum material.
Preferably, in technique scheme, hot face fan, air inlet fan and air outlet fan are all using drip-proof fan.
Preferably, in technique scheme, thermal insulation layer adopts PE material.
Compared with prior art, this utility model has the advantages that：This external high efficiency semiconductor constant temperature dehumidification
Device adopts semiconductor refrigerating technology, and malaria in casing is freezed, condensation, condensed water device for transferring casing, realization dehumidifying,
It is ensured that device interior low temperature, drying, equipment longtime running is reliable and stable for the purpose of constant temperature.
Brief description
Fig. 1 is the main structure diagram of external high efficiency semiconductor constant temperature dehumidification device of the present utility model.
Fig. 2 is the side structure schematic view of external high efficiency semiconductor constant temperature dehumidification device of the present utility model.
Fig. 3 is the present invention looks up structural representation of external high efficiency semiconductor constant temperature dehumidification device of the present utility model.
Fig. 4 is the use state structural representation of external high efficiency semiconductor constant temperature dehumidification device of the present utility model.
Specific embodiment
Below in conjunction with the accompanying drawings, specific embodiment of the present utility model is described in detail, it is to be understood that this practicality
New protection domain is not limited by specific embodiment.
Explicitly indicate that unless otherwise other, otherwise in entire disclosure and claims, term " inclusion " or its change
Change such as "comprising" or " including " etc. and will be understood to comprise stated element or ingredient, and do not exclude other units
Part or other ingredient.
As shown in Figure 1 to Figure 3, the concrete structure bag according to external high efficiency semiconductor constant temperature dehumidification device of the present utility model
Include：Shell 1, temperature and humidity controller 2, Switching Power Supply 3, hot face radiator 4, hot face fan 5, huyashi-chuuka (cold chinese-style noodles) condensation device 6, high efficiency semiconductor
Cooling assembly 7, thermal insulation layer 8, condensate draining 9, outlet 10, air inlet fan 11 and air outlet fan 12.Open Switching Power Supply
3, high-efficient semiconductor refrigerating assembly 7 is started working, and huyashi-chuuka (cold chinese-style noodles) condensation device 6 temperature begins to decline, and is gradually dropped to dew point temperature, air inlet
The inner malaria of 11 electric boxs 13 of fan delivers to huyashi-chuuka (cold chinese-style noodles) condensation device 6, and the moisture in air will condense in huyashi-chuuka (cold chinese-style noodles) condensation device
On, water is cumulative, flows to, with action of gravity, the outside flowing to electric box in condensate draining 9 eventually through outlet 10, and
Air cooling after is dried blown back in electric box 13 by air outlet fan 12, through circulation work after a while, electric box again
In air moisture be excluded outside casing, after reaching design temperature and humidity, equipment can be automatically stopped work.
Specifically, shell 1 does structure using metal or plastic casing by figure and processes；Thermal insulation layer 8 is horizontally installed on
In shell 1, the inner chamber of shell 1 is separated into top heat dissipation cavity and bottom condensation chamber, the top of top heat dissipation cavity and both sides are respectively
Offer air intlet and air outlet slit, the two bottom sides of bottom condensation chamber offer air outlet and air inlet, air inlet respectively
Fan 11 and air outlet fan 12 are arranged in this air inlet and air outlet respectively accordingly.Preferably, thermal insulation layer 8 adopts PE material
Material, has the effect of insulating water-proof.
Temperature and humidity controller 2, Switching Power Supply 3 and hot face fan 5 are arranged on top radiating intracavity, wherein, Temperature and Humidity Control
Device 2 is to have temperature control and the instrument of two kinds of functions of humid control, and the temperature sensor of supporting test and humidity sensor
Device, the temperature and humidity required for can setting as needed.Switching Power Supply 3 is used for converting alternating voltage (380 or 220v)
Become DC voltage (12 or 24v), supply high-efficient semiconductor refrigerating assembly.
High-efficient semiconductor refrigerating assembly 7 is arranged in thermal insulation layer 8, controls with temperature and humidity controller 2 and is connected.High efficiency semiconductor
Cooling assembly 7 adopt Tellurobismuthite. material, make PN galvanic couple pair, combined with ceramic plate weld, can according to different size casing,
From the semiconductor refrigerating assembly of different refrigeration work consumptions, there are energy-conserving and environment-protective, easy for installation, control accurately, stable, reliable
The features such as.Hot face radiator 4 is arranged on top radiating intracavity, and is located at the hot junction of high-efficient semiconductor refrigerating assembly 7；Efficiently partly lead
During body cooling assembly 7 work, the heat transfer in its hot junction gives hot face radiator 4, and hot face fan 5 drives air in top heat dissipation cavity
Interior circulation is lowered the temperature.
Huyashi-chuuka (cold chinese-style noodles) condensation device 6 is arranged on bottom condensation intracavity, and is located at the cold end of high-efficient semiconductor refrigerating assembly 7.Condensed water
Groove 9 is arranged on the lower section of huyashi-chuuka (cold chinese-style noodles) condensation device 6.Temperature and humidity controller 2 sets required temperature and humidity as needed, efficiently partly
Conductor cooling assembly 7 is started working, and huyashi-chuuka (cold chinese-style noodles) condensation device 6 temperature begins to decline, and is gradually dropped to dew point temperature, 11, air inlet fan
The inner malaria of electric box 13 delivers to huyashi-chuuka (cold chinese-style noodles) condensation device 6, and the moisture in air will condense on huyashi-chuuka (cold chinese-style noodles) condensation device, and water is more long-pending
More, flow to, with action of gravity, the outside flowing to electric box in condensate draining 9 eventually through outlet 10, and cooling is dried
Air afterwards is blown back in electric box 13 by air outlet fan 12 again, through circulation work after a while, the air in electric box
Moisture is excluded outside casing, and after reaching design temperature and humidity, equipment can be automatically stopped work.Preferably, condensate draining 9 He
Outlet 10 can select stainless steel material or plastics.
Preferably, all using copper or aluminum material, heat conductivity is very good for hot face radiator 4, huyashi-chuuka (cold chinese-style noodles) condensation device 6.
Preferably, all using direct current 12 or 24v, grade is more than for hot face fan 5, air inlet fan 11 and air outlet fan 12
The drip-proof fan of IP50.
Equipment is installed：As shown in figure 4, according to the air inlet of this external high efficiency semiconductor constant temperature dehumidification device and air outlet
Size, determines the position installing fixing hole, in electric box 13 top drilling, then external high efficiency semiconductor constant temperature dehumidification
Device is fixed on electric box.
During work, first turn on the power switch, the temperature and humidity required for setting as needed, semiconductor refrigerating assembly is opened
Beginning work, condensation device temperature begins to decline, and is gradually dropped to dew point temperature, and malaria in electric box delivered to by air inlet blower fan
Condensation device, the moisture in air will condense on condensation device, and water is cumulative, flows in condensate draining with action of gravity,
Eventually flow to the outside of electric box, and the air being dried after cooling is blown back in electric box by air outlet fan, when one section
Between circulation work, the air moisture in electric box is excluded outside casing, and after reaching design temperature and humidity, equipment can be automatically
Quit work., it is ensured that electric box inner cryogenic, drying, electric equipment part longtime running is stably for the purpose realizing dehumidifying, constant temperature
Reliable.
To sum up, this external high efficiency semiconductor constant temperature dehumidification device adopts semiconductor refrigerating technology, moist sky in casing
Gas freezes, condensation, condensed water device for transferring casing, and the purpose realizing dehumidifying, constant temperature is it is ensured that device interior low temperature, drying, equipment
Longtime running is reliable and stable.
The aforementioned description to specific illustrative embodiment of the present utility model illustrate that and illustration purpose.These
Description is not wishing to for this utility model to be defined to disclosed precise forms, and it will be apparent that according to above-mentioned teaching, can carry out
A lot of changes and change.The purpose of selecting and describing the exemplary embodiment is that explaining certain principles of the present utility model
And its practical application, so that those skilled in the art is capable of and utilizes various different example of the present utility model
Property embodiment and various different selection and change.Scope of the present utility model is intended to by claims and its waits similar shape
Formula is limited.
Claims (5)
1. a kind of external high efficiency semiconductor constant temperature dehumidification device is it is characterised in that include：
Shell, its inner chamber is separated into top heat dissipation cavity and bottom condensation chamber, the top of this top heat dissipation cavity and two by thermal insulation layer
Side offers air intlet and air outlet slit respectively, and the two bottom sides of this bottom condensation chamber offer air outlet and air intake respectively
Mouthful, it is correspondingly provided with air inlet fan and air outlet fan in this air inlet and air outlet respectively；Described top radiating intracavity is also
It is provided with temperature and humidity controller, Switching Power Supply and hot face fan；
High-efficient semiconductor refrigerating assembly, it is arranged in described thermal insulation layer, and is connected with temperature and humidity controller control；
Hot face radiator, it is arranged on described top radiating intracavity, and is located at the hot junction of described high-efficient semiconductor refrigerating assembly；With
And
Huyashi-chuuka (cold chinese-style noodles) condensation device, it is arranged on described bottom condensation intracavity, and is located at the cold end of described high-efficient semiconductor refrigerating assembly；Institute
The lower section stating huyashi-chuuka (cold chinese-style noodles) condensation device is provided with condensate draining and outlet.
2. external high efficiency semiconductor constant temperature dehumidification device according to claim 1 is it is characterised in that described high efficiency semiconductor
Cooling assembly adopts Tellurobismuthite. material, makes PN galvanic couple pair, is combined with ceramic plate weld.
3. external high efficiency semiconductor constant temperature dehumidification device according to claim 1 is it is characterised in that radiate in described hot face
Device, huyashi-chuuka (cold chinese-style noodles) condensation device are all using copper or aluminum material.
4. external high efficiency semiconductor constant temperature dehumidification device according to claim 1 it is characterised in that described hot face fan,
Air inlet fan and air outlet fan are all using drip-proof fan.
5. external high efficiency semiconductor constant temperature dehumidification device according to claim 1 is it is characterised in that described thermal insulation layer adopts
PE material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620765652.9U CN205944811U (en) | 2016-07-20 | 2016-07-20 | External high -efficient semiconductor constant temperature dehumidifier |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620765652.9U CN205944811U (en) | 2016-07-20 | 2016-07-20 | External high -efficient semiconductor constant temperature dehumidifier |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205944811U true CN205944811U (en) | 2017-02-08 |
Family
ID=57925814
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620765652.9U Active CN205944811U (en) | 2016-07-20 | 2016-07-20 | External high -efficient semiconductor constant temperature dehumidifier |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205944811U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106921118A (en) * | 2017-03-24 | 2017-07-04 | 合肥羿振电力设备有限公司 | A kind of Moisture-proof switch cabinet |
| CN107577263A (en) * | 2017-09-27 | 2018-01-12 | 成都理工大学 | Local temp and humidity regulator inside radon chamber |
| CN108180575A (en) * | 2017-12-27 | 2018-06-19 | 上海交通大学 | A kind of renewable semiconductor humidity regulation device and its operation method |
| CN108429170A (en) * | 2017-05-28 | 2018-08-21 | 杭州力谱科技有限公司 | A kind of outdoor dustproof power distribution cabinet |
| CN108916817A (en) * | 2017-03-21 | 2018-11-30 | 嘉兴海拉灯具有限公司 | A kind of lamp body |
| CN108916821A (en) * | 2017-03-21 | 2018-11-30 | 嘉兴海拉灯具有限公司 | A kind of lamp body, the vehicle with the lamp body and car light defogging method |
| CN111564780A (en) * | 2020-06-16 | 2020-08-21 | 杭州锐石电子科技有限公司 | Electric wire netting monitor protector |
-
2016
- 2016-07-20 CN CN201620765652.9U patent/CN205944811U/en active Active
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108916817A (en) * | 2017-03-21 | 2018-11-30 | 嘉兴海拉灯具有限公司 | A kind of lamp body |
| CN108916821A (en) * | 2017-03-21 | 2018-11-30 | 嘉兴海拉灯具有限公司 | A kind of lamp body, the vehicle with the lamp body and car light defogging method |
| CN106921118A (en) * | 2017-03-24 | 2017-07-04 | 合肥羿振电力设备有限公司 | A kind of Moisture-proof switch cabinet |
| CN108429170A (en) * | 2017-05-28 | 2018-08-21 | 杭州力谱科技有限公司 | A kind of outdoor dustproof power distribution cabinet |
| CN107577263A (en) * | 2017-09-27 | 2018-01-12 | 成都理工大学 | Local temp and humidity regulator inside radon chamber |
| CN108180575A (en) * | 2017-12-27 | 2018-06-19 | 上海交通大学 | A kind of renewable semiconductor humidity regulation device and its operation method |
| CN111564780A (en) * | 2020-06-16 | 2020-08-21 | 杭州锐石电子科技有限公司 | Electric wire netting monitor protector |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: External high-efficiency semiconductor thermostatic dehumidifier Effective date of registration: 20221008 Granted publication date: 20170208 Pledgee: Cangzhou Bank Co.,Ltd. Xianghe Sub branch Pledgor: XIANGHE DONGFANG ELECTRONIC Co.,Ltd. Registration number: Y2022980017656 |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PC01 | Cancellation of the registration of the contract for pledge of patent right |
Granted publication date: 20170208 Pledgee: Cangzhou Bank Co.,Ltd. Xianghe Sub branch Pledgor: XIANGHE DONGFANG ELECTRONIC Co.,Ltd. Registration number: Y2022980017656 |
|
| PC01 | Cancellation of the registration of the contract for pledge of patent right |