CN100571482C - Electro-optical device and substrate thereof, circuit substrate, assembling structural body and electronic equipment - Google Patents
Electro-optical device and substrate thereof, circuit substrate, assembling structural body and electronic equipment Download PDFInfo
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- CN100571482C CN100571482C CNB2006100018000A CN200610001800A CN100571482C CN 100571482 C CN100571482 C CN 100571482C CN B2006100018000 A CNB2006100018000 A CN B2006100018000A CN 200610001800 A CN200610001800 A CN 200610001800A CN 100571482 C CN100571482 C CN 100571482C
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Abstract
The electric reliability of wiring good electro-optical device, substrate for electrooptic device, assembling structural body are provided and possess the electronic equipment of this electro-optical device.When the manufacturing process of liquid-crystal apparatus (1); though as shown in figure 11; deflection usually can take place near the circuit substrate (3) the electronic unit; but owing to be provided with terminal (24) in the 1st (20a) side of flexible substrate (20); be provided with wiring (27)～(30) that are connected on the terminal (24) respectively the 1st (20a) side; on the 2nd (20b) of the opposition side of the 1st (20a), be provided with respectively by being formed on hole portion (23) on the flexible substrate (20) accordingly and be connected to wiring (31)～(34) on the terminal (24) with terminal (24); so for example when check circuit substrate (3); fracture appears in wiring (27)～(30) of the opposition side of the center of curvature side of circuit substrate (3) even deflection takes place near the circuit substrate (3) the electronic unit; also can keep the state that wiring (31)～(34) of center of curvature side are connected with terminal (24), thereby can guarantee the reliability of the connection of connecting up.
Description
Technical field
The present invention relates to the electronic equipment of personal computer or mobile phone etc. and the electro-optical device that in these electronic equipments, uses, assembling structural body, substrate for electrooptic device.
Technical background
In the past, use the electro-optical device of liquid-crystal apparatus etc. as the display unit of the electronic equipment of personal computer or mobile phone etc.This liquid-crystal apparatus possesses the liquid crystal panel of for example having enclosed liquid crystal between 2 opposing substrates, is connected with the flexible base plate of the electronic unit that has for example assembled semiconductor element etc. on a side substrate.On a side's of flexible base plate face, set up the wiring that is connected with semiconductor chip.Under the situation that for example crooked flexible base plate uses, owing on flexible base plate is wanted crooked part, be formed with the slit, therefore there is the problem of part in the length lengthening slit of flexible base plate in order to make it to be easy to bending.
In order to address this problem, to disclose by the thickness attenuation that makes flexible base plate and flexible base plate is become be easy to bending and do not form the slit and correspondingly realize the technology (for example referring to patent documentation 1) of miniaturization.
Patent documentation 1: the spy open the 2001-284751 communique (paragraph [0022], Fig. 1).
Yet, in the technology of above-mentioned patent documentation 1, for example flexible base plate can be crooked sometimes, and make the wiring that is arranged on the flexible base plate crooked similarly, so position in bending, particularly near electronic unit, produce the broken string of wiring, thereby have the electronic unit of semiconductor element etc. and the such problem of the reliability that is connected reduction of wiring.
In addition, there are the following problems, for example applies undesirable bending stress to flexible base plate in checking operation etc., as its result, tension force affacted be arranged in the wiring on a side the face of substrate, and especially fracture appears near the wiring the electronic unit.
Summary of the invention
The present invention finishes in view of the above-mentioned problems, and its purpose is to provide near the electric reliability of the wiring the electronic unit good electro-optical device, substrate for electrooptic device, assembling structural body and possesses the electronic equipment of this electro-optical device.
In order to achieve the above object, electro-optical device as main points of view of the present invention, be the electro-optical device that possesses electrooptic panel, is connected to the flexible substrate on the above-mentioned electrooptic panel and is assembled to the electronic unit on the above-mentioned flexible substrate, it is characterized in that: above-mentioned electronic unit have be arranged on above-mentioned flexible substrate on the Lead-through terminal that is electrically connected of a plurality of terminals; Above-mentioned a plurality of terminal is arranged on the one side side of above-mentioned flexible substrate; Above-mentioned Lead-through terminal sees that with the plane overlapping mode is connected with above-mentioned a plurality of terminals; Above-mentioned flexible substrate has: the 1st wiring that is arranged on above-mentioned one side side that is connected with above-mentioned a plurality of terminals respectively, with above-mentioned a plurality of terminals among at least one terminal be formed on the hole portion on the above-mentioned flexible substrate accordingly and the opposing face of the above-mentioned one side that is arranged on above-mentioned flexible substrate that is connected with above-mentioned at least one terminal by the link that is arranged on above-mentioned hole portion on the 2nd connect up; Above-mentioned hole portion is to see that with above-mentioned Lead-through terminal and above-mentioned a plurality of terminals plane overlapping mode forms.
In addition, as the alternative electro-optical device of main points of view of the present invention, be the electro-optical device that possesses electrooptic panel, is connected to the flexible substrate on the above-mentioned electrooptic panel and is assembled to the electronic unit on the above-mentioned flexible substrate, it is characterized in that: above-mentioned electronic unit have be arranged on above-mentioned flexible substrate on the solder ball that is electrically connected of a plurality of terminals; Above-mentioned a plurality of terminal is arranged on the one side side of above-mentioned flexible substrate; Above-mentioned solder ball sees that with the plane overlapping mode is connected with above-mentioned a plurality of terminals; Above-mentioned flexible substrate has: the 1st wiring that is arranged on above-mentioned one side side that is connected with above-mentioned a plurality of terminals respectively, with above-mentioned a plurality of terminals among at least one terminal be formed on the hole portion on the above-mentioned flexible substrate accordingly and the opposing face of the above-mentioned one side that is arranged on above-mentioned flexible substrate that is connected with above-mentioned at least one terminal by the link that is arranged on above-mentioned hole portion on the 2nd connect up; Above-mentioned hole portion is to see that with above-mentioned solder ball and above-mentioned a plurality of terminals plane overlapping mode forms.
In the present invention, because when having applied undesirable bending stress for example in checking operation etc., near the electronic unit flexible substrate, even for example tension force affacts near the 1st wiring the electronic unit of opposition side of center of curvature side of flexible substrate and fracture occurs, also can keep the 2nd state that connects up and be connected of center of curvature side with terminal, thereby can guarantee the electric reliability that connects up, and, for the terminal of the one side side of flexible substrate and the 2nd wiring of opposing face side are electrically connected, do not need as prior art, on the position different, forming the hole on the flexible substrate, so can realize save spaceization with terminal.
According to a kind of mode of the present invention, it is characterized in that: above-mentioned a plurality of terminals are configured to clathrate, and above-mentioned at least one terminal is set on the above-mentioned cancellate corner.Thus, because a plurality of terminals are set to clathrate, the terminal of at least one is set on the cancellate corner, even so when for example checking flexible substrate, because the external force that is applied on the flexible substrate bends the bight of flexible substrate, and tension force affacts and is connected to the 1st on the terminal that is arranged on cancellate corner wiring or the 2nd wiring and goes up and fracture occurs, also can utilize wherein one wiring to guarantee conducting.Therefore, can improve with in the past owing to big power easily the result of effect be easy to produce the electric reliability of the wiring that the terminal of the cancellate corner of fracture is connected.
According to a kind of mode of the present invention, it is characterized in that: above-mentioned the 2nd wiring is connected respectively on all above-mentioned a plurality of terminals by above-mentioned link.Thus, because the 2nd wiring is connected respectively on all a plurality of terminals by link, so except can prevent with because the bending of flexible substrate and easily the fracture of the wiring that is connected of the terminal of the cancellate corner of fracture, also can prevent the fracture of the 1st wiring or the 2nd wiring for the terminal different, thereby can guarantee the reliability that connects with the terminal of corner.
According to a kind of mode of the present invention, it is characterized in that: from above-mentioned the 1st wiring of above-mentioned at least one terminal draw direction be connected to by above-mentioned link that the above-mentioned the 2nd on this terminal connect up to draw direction different.Thus, since from the 1st wiring of above-mentioned at least one terminal draw direction be connected to by link that the 2nd on the terminal connect up to draw direction different, even so for example in checking operation etc. flexible substrate produce bending, different tension force is affacted in the 1st wiring and the 2nd wiring, thereby for example can prevent the 2nd fracture of connecting up and the electric reliability guaranteeing to connect up.
According to a kind of mode of the present invention, it is characterized in that: from above-mentioned the 1st wiring of above-mentioned at least one terminal draw direction, be connected to above-mentioned the 2nd wiring on this terminal by above-mentioned link draw the direction quadrature.Thus, since from the 1st wiring of at least one terminal draw direction be connected to the 2nd on this terminal wiring by link draw the direction quadrature, so when flexible substrate bends in for example checking operation etc., although is different directions with the 1st wiring with the 2nd wiring, but to roughly the same direction draw around situation etc. relatively, can make the tension force that affacts in the 1st wiring different reliably, thereby for example can prevent the 2nd fracture of connecting up and the electric reliability guaranteeing to connect up with the tension force on affacting the 2nd wiring.
According to a kind of mode of the present invention, it is characterized in that: be connected with above-mentioned at least one terminal above-mentioned the 1st the wiring with by above-mentioned connecting portion be connected on this terminal above-mentioned the 2nd the wiring, to same direction draw and halfway to different directions draw around.Thus, be connected to the wiring of the 2nd on this terminal owing to the 1st wiring that is connected with at least one terminal and by link, to same direction drawn and halfway to different directions draw around, so by for example drawing the 1st wiring and the 2nd wiring to same direction, can make the length of the 1st wiring and the 2nd wiring become the shortest, and, draw the 1st wiring and the 2nd wiring by the crooked part place that is easy to different directions at flexible substrate, can be little with the power that the position that is easy to crooked flexible substrate make the force rate that affacts in the 2nd wiring affact in the 1st wiring accordingly, thus the fracture of the 2nd wiring can be prevented and the reliability guaranteeing to connect.
The substrate for electrooptic device of another viewpoint of the present invention is the substrate for electrooptic device of the terminal that possesses flexible substrate, be connected with the Lead-through terminal of electronic unit on being assembled to above-mentioned flexible substrate, it is characterized in that:
Above-mentioned terminal is arranged on the one side side of above-mentioned flexible substrate and sees on the position overlapped with above-mentioned Lead-through terminal plane; Above-mentioned flexible substrate has: the 1st wiring that is arranged on above-mentioned one side side that is connected with above-mentioned terminal respectively, be formed on the hole portion on the above-mentioned flexible substrate accordingly with above-mentioned terminal and the opposing face of the above-mentioned one side that is arranged on above-mentioned flexible substrate that is connected with above-mentioned terminal by the link that is arranged on above-mentioned hole portion on the 2nd connect up; Above-mentioned hole portion is formed sees overlapping with above-mentioned terminal plane.
In addition, the circuit substrate of another viewpoint of the present invention, be the circuit substrate of the terminal that possesses flexible substrate, be connected with the Lead-through terminal of electronic unit on being assembled to above-mentioned flexible substrate, it is characterized in that: above-mentioned terminal is arranged on the one side side of above-mentioned flexible substrate and sees on the position overlapped with above-mentioned Lead-through terminal plane; Above-mentioned flexible substrate has: the 1st wiring that is arranged on above-mentioned one side side that is connected with above-mentioned terminal respectively, be formed on the hole portion on the above-mentioned flexible substrate accordingly with above-mentioned terminal and the opposing face of the above-mentioned one side that is arranged on above-mentioned flexible substrate that is connected with above-mentioned terminal by the link that is arranged on above-mentioned hole portion on the 2nd connect up; Above-mentioned hole portion is formed sees overlapping with above-mentioned terminal plane.
In the present invention, under the situation that near the flexible substrate the terminal is bent, even owing near the 1st cloth thread breakage the electronic unit of for example opposition side of the center of curvature side of flexible substrate, also can keep the 2nd state that is connected with terminal of wiring of center of curvature side and can guarantee the reliability of the connection of terminal, and, for the terminal of the one side side of flexible substrate and the 2nd wiring of opposing face side are electrically connected, do not need as prior art, on the position different, forming the hole on the flexible substrate, so can realize save spaceization with terminal.
The assembling structural body of another viewpoint of the present invention, be the assembling structural body that possesses flexible substrate, is assembled to the electronic unit on the above-mentioned flexible substrate, it is characterized in that: above-mentioned electronic unit have be arranged on above-mentioned flexible substrate on the Lead-through terminal that is electrically connected of terminal; Above-mentioned terminal is arranged on the one side side of above-mentioned flexible substrate; Above-mentioned Lead-through terminal sees that with the plane overlapping mode is connected with above-mentioned terminal; Above-mentioned flexible substrate has: the 1st wiring that is arranged on above-mentioned one side side that is connected with above-mentioned terminal respectively, be formed on the hole portion on the above-mentioned flexible substrate accordingly with above-mentioned terminal and the opposing face of the above-mentioned one side that is arranged on above-mentioned flexible substrate that is connected with above-mentioned terminal by the link that is arranged on above-mentioned hole portion on the 2nd connect up; Above-mentioned hole portion is to see that with above-mentioned Lead-through terminal and above-mentioned terminal plane overlapping mode forms.
In the present invention, under the situation that near electronic unit for example flexible substrate is bent, even owing near the 1st cloth thread breakage the electronic unit of for example opposition side of the center of curvature side of flexible substrate, also can keep the 2nd state that is connected with terminal of wiring of center of curvature side and can guarantee the reliability of the connection of terminal, and, for the terminal of the one side side of flexible substrate and the 2nd wiring of opposing face side are electrically connected, do not need as prior art, on the position different, forming the hole on the flexible substrate, so can realize save spaceization with terminal.
The electronic equipment of another viewpoint of the present invention is characterized in that: possess above-mentioned electro-optical device.
In the present invention, owing to possess the good electro-optical device of electric reliability of wiring, so can access the good electronic equipment of display performance.
Description of drawings
Fig. 1 is the summary stereogram of the liquid-crystal apparatus of embodiments of the invention 1.
Fig. 2 is the A-A profile of the circuit substrate of Fig. 1.
Fig. 3 is the plane graph that is assemblied in the semiconductor element on the circuit substrate of the liquid-crystal apparatus of Fig. 1.
Fig. 4 be Fig. 1 liquid-crystal apparatus assembling the bottom view of circuit substrate of part of semiconductor element.
Fig. 5 is the flow chart of manufacturing process of the liquid-crystal apparatus of expression embodiment 1.
Fig. 6 is the profile that is used to illustrate the circuit substrate of the operation (S3) that forms hole portion on substrate.
Fig. 7 is the profile that is used to illustrate the circuit substrate of the operation (S4) that forms terminal and wiring.
Fig. 8 is the profile that is used to illustrate the circuit substrate of the operation (S5) of electroplating.
Fig. 9 is the profile that is used to illustrate the circuit substrate of the operation (S6) that forms dielectric film.
Figure 10 is the plane graph with the circuit substrate of the manufacture method manufacturing of the liquid-crystal apparatus of embodiment 1.
Concise and to the point stereoscopic figure when Figure 11 is the circuit substrate deflection of liquid-crystal apparatus of embodiment 1.
Profile when Figure 12 is the circuit substrate deflection of liquid-crystal apparatus of embodiment 1.
Figure 13 is the bottom view of circuit substrate of the liquid-crystal apparatus of embodiment 2.
Concise and to the point stereoscopic figure when Figure 14 is the circuit substrate deflection of liquid-crystal apparatus of embodiment 2.
Figure 15 is the bottom view of circuit substrate of the liquid-crystal apparatus of variation 1 of the present invention.
Figure 16 is the bottom view of circuit substrate of the liquid-crystal apparatus of variation 2.
Figure 17 is the bottom view of circuit substrate of the liquid-crystal apparatus of variation 3.
Figure 18 is the summary structure chart of display control program of the electronic equipment of embodiments of the invention 3.
Description of symbols
The 1-liquid-crystal apparatus, 2-liquid crystal panel, 3-circuit substrate, 11-driver IC, 20-flexible substrate, the 1st of 20a-, the 2nd of 20b-, 21-conductive part, 22-semiconductor element, 23-hole portion, 24 (24a, 24b)-terminals, 27～34-wiring, 33, the 34-dielectric film, 300-electronic equipment.
Embodiment
Below, embodiments of the invention are described with reference to the accompanying drawings.In addition, below in explanation during embodiment, though be, be not limited to this for as the liquid-crystal apparatus of electro-optical device, specifically to the liquid-crystal apparatus of the active matrix mode of reflection semi-transmission type and use the electronic equipment of this liquid-crystal apparatus to describe.In addition, in following accompanying drawing, each constitutes for easy to understand, and scaling in practical structure and each structure or quantity etc. are different.
(embodiment 1)
Fig. 1 is the summary stereogram of the liquid-crystal apparatus of embodiments of the invention 1, Fig. 2 is the A-A profile of the circuit substrate of Fig. 1, Fig. 3 is the plane graph that is assembled to the semiconductor element on the circuit substrate of the liquid-crystal apparatus of Fig. 1, Fig. 4 be Fig. 1 liquid-crystal apparatus assembling the bottom view of circuit substrate of part of semiconductor element.
The circuit substrate of present embodiment is connected on the liquid-crystal apparatus as substrate for electrooptic device.
Below, as liquid-crystal apparatus 1, be that example describes with TFT (Thin Film Transistor) active array type.
(structure of liquid-crystal apparatus)
Liquid-crystal apparatus 1 possesses liquid crystal panel 2 and the circuit substrate 3 that is connected on the liquid crystal panel 2.In addition, liquid-crystal apparatus 1 is also set up other attendant mechanism of the not shown framework of the omission of supporting liquid crystal panel 2 etc. as required.
Substrate 4 and substrate 5 are the plate-shaped members that for example are made of the material with light transmission of glass or synthetic resin etc.Be formed with gate electrode 7, source electrode 8, thin-film transistor element T and pixel electrode 9 in the inboard of substrate 4 (liquid crystal side), be formed with common electrode 5a in inner surface (liquid crystal) side of substrate 5.
Thin-film transistor element T possesses 3 terminals that are electrically connected to respectively on gate electrode 7, source electrode 8 and the pixel electrode 9.Thin-film transistor element T has been electrically connected on pixel electrode 9, gate electrode 7 and the source electrode 8.Thus, constitute when when being applied with voltage for gate electrode 7, electric current from source electrode 8 to pixel electrode 9 or flow conversely.
In addition, substrate 4 possesses from zone (hereinafter referred to as " the extension ") 4a that the outer peripheral edges of substrate 5 are stretched out.On the face of extension 4a, be equipped with the driver IC 11,12 and 13 that is used to drive liquid crystal.Be set to be electrically connected to splicing ear lead-out wiring 14,15,16 respectively on the not shown projection of driver IC 11,12 and 13 by ACF (Anisotropic Conductive Film).Wiring 14 has been electrically connected on the gate electrode 7, and connecting up 15,16 is electrically connected on the source electrode 8.Be set to from terminal for connecting (not shown) lead-out wiring 17,18 and 19 of the input side of driver IC 11,12 and 13.
On flexible substrate 20, be equipped with as the semiconductor element 22 of the electronic unit that is used for Control Driver IC11 etc. or omit the semiconductor element etc. that not shown power supply is supplied with usefulness.On flexible substrate 20,, for example be formed with to clathrate the hole portion 23 that leads to the 2nd 20b side from the 1st 20a side as Fig. 2, Fig. 3 and shown in Figure 4.
Wherein, so-called clathrate refers to the virtual line that links a plurality of terminals 24 or the apperance of roughly intersecting near the curve of straight line is a clathrate.Therefore, become at this virtual line or roughly approach and have a plurality of terminals 24 on the intersection point of curve of straight line.
The other end of wiring 27, by for example being arranged on the link with the not shown hole portion of hole portion 23 same structure, be electrically connected with the wiring described later 31 shown in Figure 1 that is arranged on the 2nd 20b side by the illustrated link of omission that is arranged in this hole portion, this wiring 31 is electrically connected in the wiring 17 by ACF etc.Wiring the other end of 28～30 then is electrically connected to and omits on the not shown external device (ED) etc.Be electrically connected to wiring 27a, 28a etc. on the terminal 24a by link 35, as shown in Figure 3, be drawn out to the direction that tilts with respect to for example directions X earlier, and then draw in the outside to the terminal 24b of outer circumferential side on directions X again.
Wiring 31～34, Fig. 1, shown in Figure 4 for example is set to the 2nd 20b side of flexible substrate 20 respectively accordingly with wiring 27～30.Specifically, wiring 31,32 as Fig. 1, shown in Figure 4, is provided with for example 6 row accordingly with wiring 27,28 on the Y direction, and wiring 33,34 is provided with for example 2 row accordingly with wiring 29,30 on directions X.As Fig. 2, shown in Figure 4, be arranged on connecting portion 31c, 32c, 33c and the 34c of an end of wiring 31～34, be arranged on the just following of terminal 24 accordingly with terminal 24 respectively.Connecting portion 31c, 32c, 33c and 34c have been electrically connected on the terminal 24 by link shown in Figure 2 35 respectively.For example, as shown in Figure 2, the connecting portion 33c of wiring 32 connecting portion 32c, wiring 33 and 34 the connecting portion 34c of connecting up etc. have been electrically connected to respectively on the different link 35.Wiring the other end of 31～34 is drawn out to the outside of semiconductor element 22, and 31 the other end of for example connecting up is electrically connected with wiring 27 and has been electrically connected to by ACF etc. and connects up on 17.Be electrically connected to wiring 31a, 32a on the terminal 24a by link 35, as shown in Figure 4, be drawn out to the direction that for example tilts earlier, and then draw in the outside to the terminal 24b of outer circumferential side on directions X with respect to directions X.
The 1st 20a of flexible substrate 20, as shown in Figure 2, the dielectric film 37 that for example has been formed the resist system that makes the opening 36 that terminal 24 exposes covers.
The 2nd 20b of flexible substrate 20, as shown in Figure 2, the dielectric film 38 that its whole quilt for example covers the wiring 31～34 and the polyimides system of link 35 etc. covers.In addition, in Fig. 3 and Fig. 4, dielectric film 38 omits not shown.
(manufacture method of liquid-crystal apparatus)
Below, describe referring to the manufacture method of accompanying drawing liquid-crystal apparatus 1.
Fig. 5 is the flow chart of manufacturing process of the liquid-crystal apparatus 1 of expression embodiment 1, Fig. 6 is the profile that is used to illustrate the circuit substrate 3 of the operation that forms hole portion 23 on flexible substrate 20, Fig. 7 is the profile that is used to illustrate the circuit substrate 3 of the operation that forms terminal 24 and wiring, Fig. 8 is the profile that is used to illustrate the circuit substrate 3 of the operation of electroplating, and Fig. 9 is the profile that is used to illustrate the circuit substrate 3 of the operation that forms dielectric film 37,38.In addition, in the present embodiment, for the manufacturing process (S1) of liquid crystal panel 2 and since with well-known technology be same, so omit its explanation, and be that the center describes with the manufacturing process of circuit substrate 3 sides.
At first, as shown in Figure 6, form the 1st conductive layer the 39, the 2nd conductive layer 40 (S2) respectively in the 1st 20a side and the 2nd 20b side of flexible substrate 20.Secondly, for example from the 2nd 20b side irradiating laser, clathrate ground forms the hole portion 23 (S3) that the 2nd conductive layer 40 and flexible substrate 20 are communicated with.At this moment, the mode of remaining the 1st conductive layer 39 forms hole portion 23 according to the showing out of flexible substrate 20 sides of the 1st conductive layer 39 that makes for example opposite with a side of laser incident side.That is, form the hole portion 23 of the concave shape different with through hole.In addition, for example utilize on the 2nd conductive layer 40 of the side be etched in laser incident and form the wiring 31,32,33,34 that for example has connecting portion 31c, 32c, 33c and 34c respectively.In addition, also can become formation wiring 31～34 before forming hole portion 23.
Secondly, as shown in Figure 7, by etching for example the conductive layer 39 of the 1st 20a side at remaining the 1st conductive layer 39 of the part corresponding and clathrate ground forms the terminal 24 of the toroidal of plugging hole portion 23 with hole portion 23, and, form the wiring 27～30 (S4) that is connected on the terminal 24.At this moment, become the diameter d 1 that makes terminal 24 and become bigger than the diameter d 2 of hole cylindraceous portion 23.Therefore, becoming hole portion 23 is set to terminal 24 planes and sees on the position overlapped.
Then, as shown in Figure 8, utilize for example electroplate hole portion 23 in and connecting portion 31c, 32c, 33c and the first-class formation of 34c respectively with the links 35 (S5) of the terminal 24 and 31～34 electrical connections of connecting up.Though what link 35 illustrated is the example of drum, also can becomes to utilize and electroplate the copper of in hole portion 23, filling as the constituent material of link 35.Thus, the wiring 31 of the wiring 27 of the 1st 20a side and the 2nd 20b side is electrically connected on the same terminal 24. Wiring 28,32 is electrically connected on the same terminal 24, and wiring 29,33 is electrically connected on the same terminal 24, and wiring 30,34 is electrically connected on the same terminal 24.
Secondly, utilize resist the 1st 20a side to be covered and formation dielectric film 37.At this moment, form opening 36 and terminal 24 is exposed to the technology clathrate as Fig. 9 and shown in Figure 10 making with photoresist.Then, with whole covering with the 2nd 20b side such as polyimides, form dielectric film 38 (S6) as illustrated in fig. 9.
Then, utilize bonding agent etc. that liquid crystal panel 2 is connected with circuit substrate 3 to wait and make liquid-crystal apparatus 1 (S7).
As mentioned above, according to present embodiment, though as Figure 11 and shown in Figure 12, circuit substrate 3 can deflections when undesirable power F affacted near the electronic unit of circuit substrate 3 in for example checking operation etc., but owing to be provided with terminal 24 in the 1st 20a side of flexible substrate 20, be provided with the wiring 27～30 that is connected on the terminal 24 respectively the 1st 20a side, be connected to wiring 31～34 on the terminal 24 being provided with respectively on the 2nd 20b of the opposition side of the 1st 20a by being arranged on link 35 in the hole portion 23 that on flexible substrate 20, forms accordingly with terminal 24, so as shown in figure 12, even tension force S acts on and the appearance fracture the wiring 30 of the opposition side of the center of curvature side of for example flexible substrate 20, also can keep the state that the wiring 34 of center of curvature side is connected with terminal 24, thereby can guarantee to connect up 34 electric reliability.
In addition, in the prior art, under the situation of the conducting of the wiring of the terminal of the 1st the 20a side that realizes flexible substrate 20 and the 2nd 20b side, though on the position on the flexible substrate 20 of other different, form through hole with the position of for example terminal 24, but owing on flexible substrate 20, formed hole portion 23 just down at terminal 24, and utilize the link 35 that is arranged in the hole portion 23 with electrical connections such as terminal 24 and wirings 31, so do not need the space wasted, thereby can realize the save spaceization of assembly space.
And then, because being insulated film 38, wiring 31～34 covers, so can guarantee the insulating properties of each bar wiring 31～34.
(embodiment 2)
Secondly, the liquid-crystal apparatus to embodiments of the invention 2 describes.In addition, in present embodiment later embodiment and variation, omit its explanation, and be that the center describes with the difference for additional identical label such as component parts same as the previously described embodiments.
Figure 13 is the bottom view of circuit substrate of the liquid-crystal apparatus of embodiment 2, the summary stereoscopic figure when Figure 14 is the circuit substrate deflection of liquid-crystal apparatus of embodiment 2.In addition, in Figure 13, omitted the diagram of dielectric film 38.
In the present embodiment, the wiring of the 2nd 20b side of flexible substrate 20 is different with embodiment 1, is provided with wiring 31b, 32b on the terminal 24b of the corner that only is electrically connected to cancellate terminal 24 the 2nd 20b side.That is, the wiring that is electrically connected on terminal 24a different with the terminal 24b of corner among the cancellate terminal 24 etc. is not set the 2nd 20b side.Only the formation just down of the terminal 24b of the corner among cancellate terminal 24 is porose 23, and terminal 24b is electrically connected to respectively on wiring 31b, the 32b by link 35.Do not form hole portion 23 just down at the terminal 24a different etc. with the terminal 24b of corner among the cancellate terminal 24.Be electrically connected to the wiring 31b on the connecting portion 31c, with wiring 27 (along this wiring) setting accordingly of the 1st 20a side.In addition, the wiring 32b that is electrically connected on the connecting portion 32c is provided with the wiring 28 corresponding (along this wiring) (relative) of the 1st 20a side.
As mentioned above, according to present embodiment, because wiring 27b, wiring 31b has been electrically connected to respectively on the terminal 24b on the corner that is arranged among the terminal 24 that clathrate ground is provided with, and wiring 28b, 32b has been electrically connected to respectively on the terminal 24b, though so when for example having check circuit substrate 3, as shown in figure 14 when external force F affacts on the circuit substrate 3, deflections take place and make the wiring 28b etc. of the 1st 20a side of flexible substrate 20 stretch length near the circuit substrate 3 the electronic unit, particularly exist deflection big, and big tension force S plays a role, make the wiring 27b that is connected with the terminal 24b of cancellate corner the possibility of fracture occur, even but wiring 27b fracture also can utilize wiring 31b to guarantee conducting.Like this, utilize few wiring 31b, 32b to prevent to be connected to be easy to the fracture of wiring 32b on the terminal 24b of the corner that produces fracture etc., thereby can guarantee the electric reliability that connects up.
In addition, owing to for example wiring 31b of the 2nd 20b side, be provided with the wiring 27a corresponding (relative) (along this wiring) of the 1st 20a side by flexible substrate 20,, can realize the save spaceization that connects up so compare with not corresponding situation about being provided with (relative).
And then, owing to only be provided with wiring 31b, 32b on the terminal 24b that is electrically connected to cancellate corner the 2nd 20b side, and the terminal 24 different with the 24b of corner do not form hole portion 23 just down, so can reduce the cost of solder material or wiring etc.
(variation 1)
Figure 15 is the bottom view of circuit substrate of the liquid-crystal apparatus of variation 1 of the present invention.In addition, in each following variation, all omitted the diagram of dielectric film 38.
In this variation, the wiring of the 2nd 20b side of flexible substrate 20 is different with embodiment 1, be provided with the wiring 45 on the terminal 24b of the corner that only has been electrically connected to cancellate terminal 24 the 2nd 20b side, be connected on the terminal 24b of corner wiring 27b be electrically connected to the terminal 24b identical with it on wiring 45 from terminal 24b draw to draw direction different.For example, wiring 45 is set to than the more past lateral of the profile of semiconductor element 22 Y direction and to drawing with the direction of drawing the direction quadrature of wiring 27b, and according to the mode that forms almost parallel with wiring 27b to directions X draw around.Wiring the other end of 45 is electrically connected on the wiring 27b of the 1st 20a side by the link that is arranged on the not shown hole portion of the hole portion 23 of embodiment 1 same structure, and, be connected on 17 grades that for example connect up by ACF etc.The wiring that is electrically connected on terminal 24a different with the terminal 24b of corner among the cancellate terminal 24 etc. is not set the 2nd 20b side.Only the formation just down of the terminal 24b of the corner among cancellate terminal 24 is porose 23, and the terminal 24b of corner is electrically connected to respectively in the wiring 45 by link 35.Do not form hole portion 23 just down at the terminal 24a different etc. with the terminal 24b of corner among the cancellate terminal 24.
As mentioned above, according to this variation, owing to the wiring 45 on the terminal 24b that is provided with the corner that only is electrically connected to cancellate terminal 24 the 2nd 20b side, be connected on the terminal 24b of corner wiring 28b be electrically connected to identical terminal 24b on wiring 45 from terminal 24b draw to draw direction different, promptly, the wiring 45 be set to ratio such as semiconductor element 22 the more past lateral of profile Y direction and to the wiring 28b the direction of drawing the direction quadrature draw, and according to the mode that forms almost parallel with wiring 28b to directions X draw around, so for example when checking flexible substrate 20, though deflection takes place in flexible substrate 20 near near the wiring 28b the electronic unit, and near wiring 45 during flexible substrate 20 not deflections, the possibility that exists wiring 28b to be easy to rupture, but, the power that affacts in the wiring 45 becomes littler than the power that affacts on the wiring 28b, 45 the fracture so can prevent to connect up, thus can guarantee to connect up 45 electric reliability.
(variation 2)
Figure 16 is the bottom view of circuit substrate of the liquid-crystal apparatus of variation 2.
In this variation, the wiring of the 2nd 20b side of flexible substrate 20 is different with embodiment 1, is provided with the wiring 46 on the terminal 24b of the corner that only is electrically connected to cancellate terminal 24 the 2nd 20b side.Only the formation just down of the terminal 24b of the corner among cancellate terminal 24 is porose 23, and terminal 24b is electrically connected to respectively in the wiring 46 by link 35.One end of wiring 46 is connected on the terminal 24 by link 35.Wiring 46 is set to, according to along with it is drawn than the profile of semiconductor element 22 more laterally with the wide more mode in the interval of wiring 27b, 28b away from directions X more from terminal 24 for example, and according to the mode that forms almost parallel with wiring 27b, 28b to directions X draw around.The other end of wiring 46, be electrically connected on wiring 27b, the 28b of the 1st 20a side with the link of the not shown hole portion of spline structure by being arranged on the hole portion 23 of embodiment 1, and the wiring 46 that is drawn out to liquid crystal panel 2 sides is connected on 17 grades that for example connect up by ACF etc.
As mentioned above, according to present embodiment, owing to the wiring 46 on the terminal 24b that is provided with the corner that only is electrically connected to cancellate terminal 24 the 2nd 20b side, be connected on the terminal 24b wiring 27b be connected to terminal 24b on wiring 46 from terminal 24b draw to draw direction different, promptly, wiring 46 is set to, according to along with from terminal for example 24 more away from directions X its with wiring 27b, the wide more mode in the interval of 28b is drawn more laterally than the profile of semiconductor element 22, and according to the wiring 27b, the mode that 28b forms almost parallel to directions X draw around, so with respect to the such cloth alignment directions X of variation 1 or Y direction by draw around situation under, it is big that wiring space becomes on the Y direction, in this variation, 46 fracture then prevents to connect up in the length of 46 wiring space and wiring that can suppress to connect up, thereby can guarantee to connect up 46 electric reliability, and, can increase the degree of freedom of wiring.
(variation 3)
Figure 17 is the bottom view of circuit substrate of the liquid-crystal apparatus of variation 3.
In this variation, the wiring of the 2nd 20b side of flexible substrate 20 is different with embodiment 1, is provided with the wiring 47 on the terminal 24b of the corner that only is electrically connected to cancellate terminal 24 the 2nd 20b side.Only the formation just down of the terminal 24b of the corner among cancellate terminal 24 is porose 23, and terminal 24b is electrically connected to respectively in the wiring 47 by link 35.Wiring 47 is set to, from terminal 24 for example to the direction of appointment, for example draw laterally from the profile of semiconductor element 22 with wiring 27b, 28b almost parallel ground to the directions X of Figure 17, and halfway to the direction of appointment, for example crooked to the Y of Figure 17 direction almost parallel ground, and then, to the direction of appointment, for example to the directions X of Figure 17 according to the mode that forms almost parallel with wiring 27b, 28b draw around.The other end of wiring 47, be electrically connected on wiring 27b, the 28b of the 1st 20a side with the link of the not shown hole portion of spline structure by being arranged on the hole portion 23 of embodiment 1, and the wiring 47 that is drawn out to liquid crystal panel 2 sides is connected on 17 grades that for example connect up by ACF etc.
As mentioned above, according to such structure, since be connected on the terminal 24b wiring 27b be connected to the terminal 24b identical with it on wiring 47, drawn to directions X, halfway to the Y direction drawn around, and then to directions X drawn around, so draw to same directions X by making wiring 27b and wiring 47, can make the length of wiring 27b and wiring 47 become the shortest, and, since flexible substrate 20 be easy to crooked part place will connect up 27b with connect up 47 to different directions draw around, so when deflection takes place near flexible substrate near the wiring 27b the electronic unit 20, and near wiring 47 during flexible substrate 20 not deflections, the power that affacts in the wiring 47 becomes littler than the power that affacts on the wiring 27b, thereby can prevent to connect up 47 fracture and guarantee to connect up 47 reliability.
(embodiment 3 electronic equipments)
Below, the embodiments of the invention 3 relevant electronic equipments that possess above-mentioned liquid-crystal apparatus 1 are described.
Figure 18 is the integrally-built summary structure chart of display control program of the electronic equipment of embodiments of the invention 3.
In addition, in liquid crystal panel 2, has the drive circuit 361 that comprises the driver IC 11 that drives viewing area I.
Display message output source 391 possesses: by the memory of formations such as ROM (Read Only Memory) or RAM (Random Access Memory); The memory cell that constitutes by magnetic recording disk or optical recording; And the tuning circuit of tuning data image signal.In addition, display message output source 391 constitutes, and according to the various clock signals that generated by timing generator 394, supplies with display message with the form of the picture signal of specified format etc. to display message treatment circuit 392.
In addition, display message treatment circuit 392, possess string-and the well-known various circuit of translation circuit, amplification circuit for reversing, rotation circuit, gamma-corrected circuit, clamp circuit etc., it carries out the processing of the display message of being imported, and with clock signal clk this image information is supplied with to drive circuit 361.In addition, power circuit 393 is supplied with the voltage of appointment respectively to each above-mentioned inscape.
As mentioned above, according to present embodiment, owing to possess the good liquid-crystal apparatus 1 of reliability of wiring, so can access the good electronic equipment of display performance.
As concrete electronic equipment, except mobile phone or personal computer etc., can also enumerate touch panel, projector, the liquid crystal TV set that has loaded liquid-crystal apparatus or video tape recorder, automobile navigation apparatus, pager, electronic notebook, calculator, word processor, work station, video telephone and the POS terminal etc. of find a view type and monitor direct viewing type.And,, certainly be suitable for above-mentioned for example liquid-crystal apparatus 1 as the display part of these various electronic equipments.
Though more than enumerate preferred embodiment and variation describes the present invention, the present invention is not limited to above-mentioned any one embodiment and variation, what can suit in the scope that does not depart from technological thought of the present invention changing and making up.
For example, in embodiment 1 grade, though explanation is the liquid-crystal apparatus 1 of TFT type, being not limited to this, for example, also can be the liquid-crystal apparatus of TFD (Thin Film Diode) active array type, passive matrix.And then, be not limited to semi-transmission type, also can be reflection-type, infiltration type.In addition, also can apply the present invention on the various electro-optical devices of device (Field Emission Display and Surface-ConductionElectron-Emitter Display etc.) etc. of plasm display device, electrophoretic display apparatus, use electronic emission element.
In addition, in the foregoing description and variation, expression be with the wiring 27～30 of circuit substrate 3 according on the Y direction be 6 row and on directions X be the modes of 2 row draw around example.But, also can become a plurality of terminals 24 adjacent on directions X each other, draw (draw around) with being connected to cloth alignment Y direction on the terminal 24a, on directions X, become 4 row, and on the Y direction, become 4 row.In addition, though expression is that terminal 24 is that 4 row, 4 row are provided with 16 example altogether, be not limited to these quantity.
And then, in the foregoing description and variation, though as shown in Figure 5, expression be to form the example that operations (S4) are implemented electroplating work procedure (S5) afterwards at terminal 24, but be not limited to this, for example also can become at for example electroplating work procedure (S5) and implement terminal 24 formation operations (S4) afterwards.
In addition, in the foregoing description and variation, though expression is to apply the present invention to the example that the two sides is provided with the flexible substrate 20 of the 1st conductive layer the 39, the 2nd conductive layer 40, but be not limited thereto, for example, also can become and apply the present invention to conductive layer and be set at flexible substrate in the base material.
Claims (12)
1. an electro-optical device is the electro-optical device that possesses electrooptic panel, is connected to the flexible substrate on the above-mentioned electrooptic panel and is assembled to the electronic unit on the above-mentioned flexible substrate, it is characterized in that:
Above-mentioned electronic unit have be arranged on above-mentioned flexible substrate on the Lead-through terminal that is electrically connected of a plurality of terminals,
Above-mentioned a plurality of terminal is arranged on the one side side of above-mentioned flexible substrate,
Above-mentioned Lead-through terminal sees that with the plane overlapping mode is connected with above-mentioned a plurality of terminals,
Above-mentioned flexible substrate has: the 1st wiring that is arranged on above-mentioned one side side that is connected with above-mentioned a plurality of terminals respectively, be formed on the 1st hole portion on the above-mentioned flexible substrate accordingly with at least one terminal among above-mentioned a plurality of terminals, the 2nd on the opposing face of the above-mentioned one side that is arranged on above-mentioned flexible substrate that is connected with above-mentioned at least one terminal by the link that is arranged on above-mentioned the 1st hole portion connect up and the 2nd hole portion
Above-mentioned the 1st wiring and the above-mentioned the 2nd that above-mentioned link by above-mentioned the 1st hole portion connects is connected up, further is electrically connected by the link that is arranged on above-mentioned the 2nd hole portion,
Above-mentioned the 1st hole portion is to see that with above-mentioned a plurality of terminals plane overlapping mode is connected with above-mentioned Lead-through terminal.
2. an electro-optical device is the electro-optical device that possesses electrooptic panel, is connected to the flexible substrate on the above-mentioned electrooptic panel and is assembled to the electronic unit on the above-mentioned flexible substrate, it is characterized in that:
Above-mentioned electronic unit have be arranged on above-mentioned flexible substrate on the solder ball that is electrically connected of a plurality of terminals,
Above-mentioned a plurality of terminal is arranged on the one side side of above-mentioned flexible substrate,
Above-mentioned solder ball sees that with the plane overlapping mode is connected with above-mentioned a plurality of terminals,
Above-mentioned flexible substrate has: the 1st wiring that is arranged on above-mentioned one side side that is connected with above-mentioned a plurality of terminals respectively, be formed on the 1st hole portion on the above-mentioned flexible substrate accordingly with at least one terminal among above-mentioned a plurality of terminals, the 2nd on the opposing face of the above-mentioned one side that is arranged on above-mentioned flexible substrate that is connected with above-mentioned at least one terminal by the link that is arranged on above-mentioned the 1st hole portion connect up and the 2nd hole portion
Above-mentioned the 1st wiring and the above-mentioned the 2nd that above-mentioned link by above-mentioned the 1st hole portion connects is connected up, further is electrically connected by the link that is arranged on above-mentioned the 2nd hole portion,
Above-mentioned the 1st hole portion is to see that with above-mentioned solder ball and above-mentioned a plurality of terminals plane overlapping mode forms.
3. electro-optical device according to claim 1 is characterized in that: above-mentioned a plurality of terminals are configured to clathrate, and above-mentioned at least one terminal is set on the above-mentioned cancellate corner.
4. electro-optical device according to claim 2 is characterized in that: above-mentioned a plurality of terminals are configured to clathrate, and above-mentioned at least one terminal is set on the above-mentioned cancellate corner.
5. according to claim 3 or 4 described electro-optical devices, it is characterized in that: above-mentioned the 1st hole portion, the only formation just down that is arranged on the terminal on the corner in above-mentioned a plurality of terminals of clathrate setting.
6. according to any described electro-optical device in the claim 1～4, it is characterized in that: from above-mentioned the 1st wiring of above-mentioned at least one terminal draw direction, be connected to by above-mentioned link above-mentioned the 2nd wiring on this terminal to draw direction different.
7. according to any described electro-optical device in the claim 1～4, it is characterized in that: from above-mentioned the 1st wiring of above-mentioned at least one terminal draw direction, be connected to above-mentioned the 2nd wiring on this terminal by above-mentioned link draw the direction quadrature.
8. according to any described electro-optical device in the claim 1～4, it is characterized in that: be connected with above-mentioned at least one terminal above-mentioned the 1st the wiring with by above-mentioned link be connected on this terminal above-mentioned the 2nd the wiring, to same direction draw and halfway to different directions draw around.
9. substrate for electrooptic device is the substrate for electrooptic device of the terminal that possesses flexible substrate, be connected with the Lead-through terminal of electronic unit on being assembled to above-mentioned flexible substrate, it is characterized in that:
Above-mentioned terminal is arranged on the one side side of above-mentioned flexible substrate and sees on the position overlapped with above-mentioned Lead-through terminal plane,
Above-mentioned flexible substrate has: the 1st wiring that is arranged on above-mentioned one side side that is connected with above-mentioned terminal respectively, be formed on the 1st hole portion on the above-mentioned flexible substrate accordingly with above-mentioned terminal, the 2nd on the opposing face of the above-mentioned one side that is arranged on above-mentioned flexible substrate that is connected with above-mentioned terminal by the link that is arranged on above-mentioned the 1st hole portion connect up and the 2nd hole portion
Above-mentioned the 1st wiring and the above-mentioned the 2nd that above-mentioned link by above-mentioned the 1st hole portion connects is connected up, further is electrically connected by the link that is arranged on above-mentioned the 2nd hole portion,
Above-mentioned the 1st hole portion is formed sees overlapping with above-mentioned terminal plane.
10. circuit substrate is the circuit substrate of the terminal that possesses flexible substrate, be connected with the Lead-through terminal of electronic unit on being assembled to above-mentioned flexible substrate, it is characterized in that:
Above-mentioned terminal is arranged on the one side side of above-mentioned flexible substrate and sees on the position overlapped with above-mentioned Lead-through terminal plane,
Above-mentioned flexible substrate has: the 1st wiring that is arranged on above-mentioned one side side that is connected with above-mentioned terminal respectively, be formed on the 1st hole portion on the above-mentioned flexible substrate accordingly with above-mentioned terminal, the 2nd on the opposing face of the above-mentioned one side that is arranged on above-mentioned flexible substrate that is connected with above-mentioned terminal by the link that is arranged on above-mentioned the 1st hole portion connect up and the 2nd hole portion
Above-mentioned the 1st wiring and the above-mentioned the 2nd that above-mentioned link by above-mentioned the 1st hole portion connects is connected up, further is electrically connected by the link that is arranged on above-mentioned the 2nd hole portion,
Above-mentioned the 1st hole portion is formed sees overlapping with above-mentioned terminal plane.
11. an assembling structural body is the assembling structural body that possesses flexible substrate, is assembled to the electronic unit on the above-mentioned flexible substrate, it is characterized in that:
Above-mentioned electronic unit have be arranged on above-mentioned flexible substrate on the Lead-through terminal that is electrically connected of terminal,
Above-mentioned terminal is arranged on the one side side of above-mentioned flexible substrate,
Above-mentioned Lead-through terminal sees that with the plane overlapping mode is connected with above-mentioned terminal,
Above-mentioned flexible substrate has: the 1st wiring that is arranged on above-mentioned one side side that is connected with above-mentioned terminal, be formed on the 1st hole portion on the above-mentioned flexible substrate accordingly with above-mentioned terminal, the 2nd on the opposing face of the above-mentioned one side that is arranged on above-mentioned flexible substrate that is connected with above-mentioned terminal by the link that is arranged on above-mentioned the 1st hole portion connect up and the 2nd hole portion
Above-mentioned the 1st wiring and the above-mentioned the 2nd that above-mentioned link by above-mentioned the 1st hole portion connects is connected up, further is electrically connected by the link that is arranged on above-mentioned the 2nd hole portion,
Above-mentioned the 1st hole portion is formed sees overlapping with above-mentioned Lead-through terminal and above-mentioned terminal plane.
12. an electronic equipment is characterized in that: possess any described electro-optical device in claim 1～claim 4.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP015449/2005 | 2005-01-24 | ||
| JP2005015449 | 2005-01-24 | ||
| JP009991/2006 | 2006-01-18 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1819740A CN1819740A (en) | 2006-08-16 |
| CN100571482C true CN100571482C (en) | 2009-12-16 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100018000A Expired - Fee Related CN100571482C (en) | 2005-01-24 | 2006-01-24 | Electro-optical device and substrate thereof, circuit substrate, assembling structural body and electronic equipment |
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| CN (1) | CN100571482C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104994690A (en) * | 2015-07-29 | 2015-10-21 | 武汉华星光电技术有限公司 | Liquid crystal panel element arranging method and liquid crystal panel |
| US10133133B1 (en) * | 2017-06-28 | 2018-11-20 | Advanced Optoelectronic Technology, Inc | Liquid crystal display base |
| CN112289810B (en) * | 2020-01-14 | 2023-09-08 | 友达光电股份有限公司 | Pixel array substrate |
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