CN100568092C - The film build method of mask and method for making thereof, mask manufacturing installation, luminescent material - Google Patents
The film build method of mask and method for making thereof, mask manufacturing installation, luminescent material Download PDFInfo
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- CN100568092C CN100568092C CNB2006100597056A CN200610059705A CN100568092C CN 100568092 C CN100568092 C CN 100568092C CN B2006100597056 A CNB2006100597056 A CN B2006100597056A CN 200610059705 A CN200610059705 A CN 200610059705A CN 100568092 C CN100568092 C CN 100568092C
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Images
Abstract
Film build method, electro-optical device and the electronic device of a kind of mask and manufacture method thereof, manufacturing installation, luminescent material are provided.The manufacture method of mask of the present invention has: the operation of preparing to have formed the matrix material of opening and having formed the mask member of a plurality of through holes; Corresponding to above-mentioned opening, the operation that the aforementioned mask member is engaged with above-mentioned matrix material; Operation with the junction temperature of managing aforementioned mask member and above-mentioned matrix material.
Description
Technical field
The present invention relates to the mask that uses in the vapour deposition method etc. and manufacture method thereof, manufacturing installation, and electro-optical device, electronic device etc.
Background technology
As the self-luminous display of making the display device also thinner, used the OLED display of organic EL (electro luminescence electroluminescence) element (between anode and negative electrode, being provided with the light-emitting component of the structure of the luminescent layer that organism constitutes) to be paid close attention to as next-generation technology than LCD.As the luminescent layer material of organic EL, the known organic material that low-molecular-weight organic material and high molecular are arranged, the wherein luminescent layer that constitutes by low-molecular-weight organic material vapour deposition method film forming.With vapour deposition method film forming luminescent layer the time, (be the mask plate with through hole corresponding with the Thinfilm pattern that forms, metals such as stainless steel are fabricated to main flow to use mask plate.), on by film forming face, directly form the Thinfilm pattern corresponding with pixel.And, because it is corresponding with the requirement of the pixel of high-resolution, use thickness of slab thin and formed mask plate so become with the pattern of narrow spaced apart through hole, distortion such as warpage that produces for the intensity that suppresses to follow this mask plate reduces or deflection, what for example have the spy to open to disclose in the 2001-237073 communique engages mask plate and the technology strengthened with matrix material.
By the requirement of the display of high-resolution pixel, need to form so-called spotless luminescent layer.Therefore, need allow the shape of luminescent layer roughly the same, make mask plate with contiguous as far as possible, so that luminescent material can not make a circulation to the inboard (relatively by the face side of film forming face) of mask plate by film forming face with the shape that is formed at the through hole on the mask.Yet, owing to solidifying, the bonding agent of matrix material and mask plate utilization liquid state is engaged, and it is difficult making the thickness (thickness of engaging zones) of bonding agent constant.Therefore, existence can not be shortened with mask plate and by the distance between the film forming face, and luminescent material makes a circulation to the inboard of mask plate, thereby forms the problem of flecked luminescent layer.
In addition, when making aforementioned mask, usually adopt matrix material is covered on stage apparatus (stage) etc., side makes the mask plate alignment from it, the method that engages by Photocurable adhesive agent, but, Photocurable adhesive agent is solidified from mask plate side irradiates light when light screening material is formed with mask plate.Therefore, need be from matrix material side irradiates light.Yet, for below irradiates light from stage apparatus, there is the problem that stage apparatus is complicated, maximize that makes, in addition, if matrix material and mask plate are moved, from matrix material side irradiates light, then exist because Photocurable adhesive agent does not solidify, so the problem of the position deviation of matrix material and mask plate.
Have again, even mask plate engaged with matrix material and under the situation of reinforced mask having used, when the vapor deposition treatment of luminescent material, also exist the temperature of mask to rise, cause the position deviation of through hole by the thermal expansion of mask, thereby produce the problem of the deviation of the Thinfilm pattern that can not allow.
Summary of the invention
The present invention is in view of this problem, its purpose is, provide a kind of by easily making matrix material and mask plate constant, do not use special device and precision engages mask plate and the matrix material that is made of light screening material goodly, the departing from of the pattern position of mask when reducing vapor deposition treatment, thereby film build method, electro-optical device and the electronic equipment of the manufacturing installation of the manufacture method of the mask of good ground of precision evaporation luminescent layer, mask, mask, luminescent material.
The 1st mode of the present invention is a kind of mask, wherein, possesses: the matrix material that has formed opening; Be formed with a plurality of through holes, the mask member that engages with above-mentioned matrix material corresponding to above-mentioned opening simultaneously; With separaant (spacer) with decided to keep at interval above-mentioned matrix material and aforementioned mask member.
According to this mode and since the relative matrix material of mask member with fixed interval engage, so when the use mask makes the luminescent material film forming on by filmogen, the mask vicinity can be disposed by filmogen.
In addition, separaant is the member in bonding agent is disposed at the engaging zones of matrix material and mask member, by separaant is mixed with bonding agent, can easily separaant balancedly be disposed at whole engaging zones.Therefore, can positively make the relative matrix material of mask member with decided joint at interval.
Have again, separaant is by the member that constitutes of a plurality of spheroids that has with the roughly the same diameter in decide interval, because can be easily mix separaant and bonding agent are balanced, separaant can not overlap in addition, so can be easily and mask member is engaged with matrix material with decided interval.
The 2nd mode of the present invention is a kind of manufacture method of mask, wherein, has: preparation has formed the matrix material of opening and formed the operation of the mask member of a plurality of through holes on light screening material; The operation of coating Photocurable adhesive agent on above-mentioned matrix material or aforementioned mask member; The operation that the aforementioned mask member is engaged corresponding to above-mentioned opening with above-mentioned matrix material; Above-mentioned matrix material and aforementioned mask member are connected airtight, the operation that above-mentioned Photocurable adhesive agent is spilt from the engaging zones of above-mentioned matrix material and aforementioned mask member; From aforementioned mask member side irradiates light, make the operation of the part curing of above-mentioned Photocurable adhesive agent; With from above-mentioned matrix material side at least by above-mentioned opening irradiates light, the operation that above-mentioned Photocurable adhesive agent is solidified.
According to this mode, because in alignment matrix material and mask member and make under its state that connects airtight the part of curing Photocurable adhesive agent, carry out temporary fixed, even so in engaging operation, carry matrix material and mask member, the position of matrix material and mask member can not departed from yet, Photocurable adhesive agent is solidified, thereby engage matrix material and mask member.Therefore, can make the high-precision mask of the position deviation that does not have matrix material and mask member.
In addition, when matrix material is made of the photopermeability material, by from matrix material side irradiates light, with Photocurable adhesive agent, the Photocurable adhesive agent that just spills from the engaging zones of matrix material and mask member, even the Photocurable adhesive agent that has been coated on the engaging zones also solidifies, so can make matrix material reliable with engaging of mask member.
Have again, allow Photocurable adhesive agent from the engaging zones of matrix material and mask member only when the outer circumferential side of mask member spills, owing to can prevent the pattern that the formed a plurality of through holes of the Photocurable adhesive agent coverage mask member that spills constitute, so can suppress the bad generation of mask.
Also have, be included in matrix material and mask member are connected airtight after, apply the operation of Photocurable adhesive agent at the outer circumferential side of mask member, owing to can form the state that allows Photocurable adhesive agent only spill reliably, so can under the state of matrix material and mask member that aligns, carry out temporary fixed reliably to the outer circumferential side of mask member from the engaging zones of matrix material and mask member.
The 3rd mode of the present invention is a kind of manufacture method of mask, wherein, has: preparation has formed the matrix material of opening and formed the operation of the mask member of a plurality of through holes on light screening material; The operation that the aforementioned mask member is engaged corresponding to above-mentioned opening with above-mentioned matrix material; Operation with the junction temperature of managing aforementioned mask member and above-mentioned matrix material; The temperature of aforementioned mask member and the above-mentioned matrix material aforementioned mask when having used the vapor deposition treatment of aforementioned mask is engaged.
According to this mode, can under the temperature identical, make mask, the temperature variation in the time of can suppressing to follow mask to use and the warpage or the deflection that produce with the serviceability temperature of mask.Therefore can make the display of high-resolution pixel etc.In addition, carry out temperature treatment, also can obtain good joint by characteristic according to the bonding agent that uses etc.
Have again, mask is to form a plurality of openings on matrix material, and it is corresponding with each opening, engage the mask that a plurality of mask member form, managing in the temperature of joint, for example at a plurality of mask member respectively, when mask uses, produce under the situation of Temperature Distribution on the mask, by in each configuration that engages a plurality of mask member, temperature variation being engaged, thereby when the use of mask, can in whole mask, suppress warpage or deflection.
Also have, make mask member and matrix material become institute's fixed temperature and engage, since the maintenance of mask member and matrix material fixed temperature, under the state of mask expansion or contraction, engage, even so use mask under the fixed temperature, also can reduce the influence that thermal deformation caused of mask, can suppress the deviation of pattern.
And then, the mask temperature of fixed temperature when being to use the vapor deposition treatment of mask owing to make mask under the temperature when using the vapor deposition treatment of mask, so even the use mask carries out vapor deposition treatment, also can reduce the influence that thermal deformation caused of mask, suppress the deviation of pattern.
The 4th mode of the present invention is a kind of manufacture method of mask, wherein, has: preparation has formed the matrix material of opening and formed the operation of the mask member of a plurality of through holes on light screening material; The operation of in making the Photocurable adhesive agent of above-mentioned matrix material and aforementioned mask member engages, mixing separaant; The operation of coating Photocurable adhesive agent on above-mentioned matrix material or aforementioned mask member; The operation that the aforementioned mask member is engaged corresponding to above-mentioned opening with above-mentioned matrix material; Above-mentioned matrix material and aforementioned mask member are connected airtight, the operation that above-mentioned Photocurable adhesive agent is spilt from the engaging zones of above-mentioned matrix material and aforementioned mask member; From aforementioned mask member side irradiates light, make the precuring operation of the part curing of above-mentioned Photocurable adhesive agent; With from above-mentioned matrix material side at least by above-mentioned opening irradiates light, the main curing process that above-mentioned Photocurable adhesive agent is solidified.
According to this mode, owing to carry out temporary fixed making the matrix material part of curing Photocurable adhesive agent of aliging with mask member under the state that connects airtight, even so in engaging operation, carry matrix material and mask member, the position of matrix material and mask member can not departed from yet, Photocurable adhesive agent is solidified, thereby engage matrix material and mask member.In addition, by in Photocurable adhesive agent, mix at large decide the separaant of particle diameter, thereby can be easily and allow the interval of mask member and matrix material even reliably.
Have again, at least in precuring operation and this curing process, the junction temperature of management mask member and matrix material, make with matrix material owing under the temperature identical, engage mask member, so the temperature variation can suppress to follow the mask use time and the warpage or the deflection that produce with the serviceability temperature of mask.Also have, carry out temperature treatment, also can access good joint by characteristic according to the bonding agent that uses etc.Therefore, the high-precision mask of the position deviation that does not have matrix material and mask member can be made, the display of high-resolution pixel etc. can be obtained.
The 5th mode of the present invention is a kind of mask manufacturing installation, and it has matrix material that forms opening and the mask member that forms a plurality of through holes and engage corresponding to above-mentioned opening, wherein, possesses: the mask maintaining part that keeps the aforementioned mask member; The mask temperature management department of the temperature of management aforementioned mask member; The matrix material maintaining part that keeps above-mentioned matrix material; Matrix material temperature treatment portion with the above-mentioned matrix material temperature of management relatively moves aforementioned mask maintaining part and above-mentioned matrix material maintaining part, makes the aforementioned mask member connect airtight on above-mentioned matrix material.
According to this mode, engage owing to the matrix material that constitutes mask can be become the temperature identical with the temperature of using mask with mask member, thus the thermal deformation that temperature variation caused can reduce the mask use time, the deviation of inhibition pattern.
In addition, the lamp that possesses the Photocurable adhesive agent curing that makes the engaging zones that is coated on matrix material and mask member, owing under the temperature identical, make mask, the warpage or the deflection that produce so can suppress to follow the temperature variation of mask with the serviceability temperature of mask.
The 6th mode of the present invention is a kind of film build method of luminescent material, and wherein, the mask that uses when making the luminescent material film forming as utilizing evaporation uses aforementioned mask, utilizes mask that above-mentioned manufacture method obtains or the mask that is obtained by above-mentioned manufacturing installation.
According to this mode, owing to be the mask of no position deviation, minimizing is followed the thermal expansion of mask or contraction and the position deviation of the pattern that produces, so even utilize vacuum evaporation to make the luminescent material film forming, also can form agonic luminescent layer.
The 7th mode of the present invention is a kind of electro-optical device, and wherein, what possess as luminescent layer is the luminescent material that utilizes the said method film forming.
According to this mode, because the minimizing of the position deviation of luminescent layer, so can make the electro-optical device of the display lamp of high-resolution pixel.
The 8th mode of the present invention is a kind of electronic equipment, and wherein, what possess as indication mechanism is above-mentioned electro-optical device.
According to this mode, be the display of high-resolution pixel owing to what possess as indication mechanism, the demonstration of indication mechanism is seen easily and the electronic equipment of color clear so can make.
Description of drawings
Figure 1A and Figure 1B are the figure of expression mask.
Fig. 2 A and Fig. 2 B are the enlarged drawings of the engaging zones of expression mask.
Fig. 3 is the figure of expression matrix material.
Fig. 4 is the figure of expression mask member.
Fig. 5 is the synoptic diagram of expression mask manufacturing installation.
Fig. 6 A is the figure of the coating method of expression Photocurable adhesive agent to Fig. 6 C.
Fig. 7 is the figure of expression vacuum deposition apparatus.
Fig. 8 A and Fig. 8 B are the figure of the using method of expression mask.
Fig. 9 A is the figure of the film build method of expression luminescent material to Fig. 9 C.
Figure 10 is the figure of expression electro-optical device.
Figure 11 is the figure of expression electronic equipment.
Among the figure: the 10-matrix material, the 12-opening, the 20-mask member, 22-through hole, 30-mask, 32-Photocurable adhesive agent (bonding agent), the 36-engaging zones, 38-separaant, 60,62, the 64-luminescent layer, 100-mask manufacturing installation, 110-platform (matrix material maintaining part), 116-minisize thermoelectric assembly (matrix material temperature treatment portion), 120-head (mask maintaining part), 126-minisize thermoelectric assembly (mask temperature management department), the 130-lamp, 500-electro-optical device, 600-electronic equipment, 1000-mobile phone (electronic equipment), 1001-display part (electro-optical device).
Embodiment
Below, with reference to accompanying drawing, the embodiment of film build method, electro-optical device and electronic equipment of manufacturing installation, the luminescent material of mask manufacture method of the present invention, mask is described.
Figure 1A and Figure 1B are the figure of expression mask 30.Figure 1B is the A-A line sectional view among Figure 1A.
Fig. 2 A and Fig. 2 B are the enlarged drawings of the engaging zones 36 of expression mask 30.Fig. 2 B is the B-B line sectional view of Fig. 2 A.
The mask 30 that uses in the embodiments of the present invention is made of matrix material 10 and 6 pieces of mask member.On matrix material 10, form 6 place's openings 12, be configured in the mode that covers opening 12 corresponding to 12,1 pieces of mask member 20 of 1 opening.That is, the zone that the end of mask parts 20 is overlapped with the end of the opening 12 of matrix material 10 engages as engaging zones 36.In more detail, complete all ends of mask member 20 (part of square ring shape) overlaps with complete all ends (part of square ring shape) of the opening 12 of matrix material 10, thereby engages.
And, on mask member 20, forming the pattern that constitutes by a plurality of through holes 22, this pattern engages with matrix material 10 in the mode that is disposed at opening 12 inboards.In addition, opening 12 and mask member 20 are not limited to 6 (group) respectively, though can in order to improve the throughput rate of OLED display, shown in present embodiment, a plurality of openings 12 and mask member 20 be set mostly for a plurality of or 1 group yet.Have, follow the requirement of the maximization of OLED display, mask member 20 is the forward large scale development also.
Also have, matrix material 10 and mask member 20 utilize the 1st alignment mark (alignment mark) 14 that is formed on the matrix material 10 and the 2nd alignment mark 24 that is formed on the mask member 20 to position.And mask member 20 is installed on the face of the opposite side of face of formation the 1st alignment mark 14 in the matrix material 10.Have again, on matrix material 10, be formed with mask alignment mark 16, use in the alignment of the mask 30 when vapor deposition treatment.
And then, in the engaging of matrix material 10 and mask member 20, for example,, be not limited to this though what use is Photocurable adhesive agent 32 such as ultraviolet curing, also can adopt the joint method of anodic bonding or machinery.In addition, in Photocurable adhesive agent 32, mix the separaant 38 that a plurality of same grains are, make the interval constant of matrix material 10 and mask member 20 thus, thereby engage (with reference to Fig. 6 A～Fig. 6 C).And, will narrate in the back about the detailed content of Photocurable adhesive agent 32 and separaant 38.
Fig. 3 is the figure of expression matrix material 10.
The matrix material 10 that is called framework (frame) is photopermeability substrates, is made of pyrex { for example healthy and free from worry 7740 (pyrex, registered trademark glass) }.Thus,, can use the Photocurable adhesive agent 32 of ultra-violet solidified grade, from the light of matrix material 10 side irradiation ultraviolet radiations etc. as matrix material 10 joint method with mask member 20.On matrix material 10, form the opening 12 of 6 rectangles.Opening 12 forms also forr a short time than mask member 20, so that mask member 20 can be bonded on the edge part of opening 12, and form also greatlyyer, so that the pattern that forms (area of the pattern that is made of a plurality of through holes 22) is not covered by matrix material 10 than area of the pattern.
And, the engaging zones 36 that applies Photocurable adhesive agent 32 is made in the zone that matrix material 10 overlaps with mask member 20.Have, the shape of opening 12 is not limited to rectangle again, can make different shape according to the shape of the OLED display of producing.
In addition, on matrix material 10, form the 1st alignment mark 14.The 1st alignment mark 14 be located at and mask member 20 between the inside side on composition surface, be used for and the aliging of mask member 20.The 1st alignment mark 14 is by the metal film of sputter or evaporation etc., and perhaps etching or machining wait and forms.Have again, form mask alignment mark 16 on the matrix material 10.
Fig. 4 is the figure of expression mask member 20.
The mask member 20 that is called screen board, for example the metal by silicon etc. constitutes, and forms rectangle.Mask member 20 can form from silicon chip (silicon wafer) 26, in this case, and corresponding to mask member 20 assembling silicon chips 26.On mask member 20, form a plurality of through holes 22.The shape of through hole 22 can be square, parallelogram, circular any one, in addition, constitutes pattern (screen) according to shape, arrangement and the number of through hole 22.
Through hole 22 utilizes etching formation such as (anisotropic etchings that for example has crystal plane orientation interdependence).The wall of through hole 22 is the Surface Vertical of mask member 20 relatively, also can make taper.And pattern is not limited to mask member 20 being engaged in the matrix material 10 preformed situation of going forward, and can form behind joint yet.Having, as mask member 20, can use light screening material, for example can be the mask member 20 that is made of the superhigh intensity fiber.
In addition, on mask member 20, form the 2nd alignment mark 24.The 2nd alignment mark 24 is and the 1st alignment mark 14 corresponding components that are formed on the matrix material 10, cooperates with the 2nd alignment mark 24 by making the 1st alignment mark 14, can engage matrix material 10 and mask member 20 with desirable position relation.
And the 2nd alignment mark 24 and the 1st alignment mark 14 etc. are same, are formed by metal film, etching or machining etc.In addition, be not limited to mask alignment mark 16 is located at situation on the matrix material 10, can be formed on the mask member 20 yet.
Fig. 5 is the synoptic diagram that the mask manufacturing installation 100 of mask 30 is made in expression.
120 by along Z direction Z worktable 122 movably; Blocking is to the heat conducting thermal insulation material 124 of Z worktable 122; The minisize thermoelectric assembly (mask temperature management department) 126 of heating or cooling mask member 20; And keep the carriage 128 of mask member 20 to constitute, dispose thermal insulation material 124, minisize thermoelectric assembly 126, carriage 128 successively at Z worktable 112 upsides.
And the temperature information of platform 110,120 positional information and minisize thermoelectric assembly 116,126 is sent to the not shown control part of unified control mask manufacturing installation 100, according to these information Control portions control mask manufacturing installations 100.
Have, 120 are not limited to the situation that keeps 1 piece of mask member 20, can once keep many pieces of mask member 20 yet again.In addition, be not limited to respectively the situation that minisize thermoelectric assembly 116,126 is set on platform 110,120, the minisize thermoelectric assembly that heats, cools off matrix material 10 and mask member 20 also can be set simultaneously.
Then, use mask manufacturing installation 100 to make the method for mask 30 with reference to description of drawings.
Fig. 6 A～Fig. 6 C is the figure of the coating method of expression Photocurable adhesive agent 32, and Fig. 6 A is the figure of the coating method of expression present embodiment, and Fig. 6 B is the figure of the variation of expression coating method, and Fig. 6 C is the figure of the variation of expression separaant.
What use in the engaging of matrix material 10 and mask member 20 is Photocurable adhesive agent 32.So-called Photocurable adhesive agent 32, though ultra-violet solidified bonding agent is representational, also exist in addition utilize electronic beam curing, infrared ray or visible-light curing.Basically by the propenyl oligomer and the monomer of radical polymerization, and constitute with the polymerization initiator of specific light reaction.
And, can in several seconds, solidify by light such as irradiation ultraviolet radiations, thereby obtain having the solidfied material of various characteristicses such as flexible (flexibility), connecting airtight property, chemical resistance, electrology characteristic as required.
Have again, in mask manufacturing process, at first a plurality of spherical separaants 38 are blended in (separaant mixed processes) in the Photocurable adhesive agent 32.
Then, keep matrix material 10, by 120 a maintenance mask member 20 by platform 110.And, coating photocuring shape bonding agent 32 (adhesive applicating operations) on the engaging zones 36 of matrix material 10 or mask member 20.Photocuring shape bonding agent 32 is coated in the amount of the degree that spills from engaging zones 36 when matrix material 10 and mask member 20 are connected airtight.This amount waits with experiment in advance and tries to achieve.
Then, heating minisize thermoelectric assembly 116,126 makes the temperature of matrix material 10 and mask member 20 rise to about 50 ℃.
And, make matrix material 10 and mask member 20 thermal expansions, and applied under the state of bonding agent, drive platform 110, the 2nd alignment mark 124 of mask member 20 is alignd with the 1st alignment mark 114 of matrix material 10, make 120 to move again, be pressed in mask member 20 on the matrix material 10 and connect airtight to platform 110.Thus, can form the state (connecting airtight operation) that Photocurable adhesive agent 32 spills from the both sides (interior all sides of the outer circumferential side of mask member 20 and opening 12) of the engaging zones 36 shown in Fig. 6 A.
And then, under this state by from lamp 130 to mask member 20 irradiates lights, thereby make the Photocurable adhesive agent 32 (that is the part of Photocurable adhesive agent 32) that escapes to mask member 20 outer circumferential sides solidify (precuring operation).
Then, discharge mask 30 (matrix material 10 and mask member 20), be transported to the outside of mask manufacturing installation 100 from carriage 118,128.At this moment, owing to solidifying from the Photocurable adhesive agent 32 that escapes to mask member 20 outer circumferential sides, matrix material 10 can not depart from the position of mask member 20.That is, matrix material 10 is temporary fixed state with mask member 20.
And, be matrix material 10 side irradiates lights from a side opposite with a last operation, make the Photocurable adhesive agent 32 that escapes to all sides in the opening 12 solidify (main curing process).
Have again, under the situation that matrix material 10 is made of the photopermeability material, when the Photocurable adhesive agent 32 of all sides solidifies in escaping to opening 12, the Photocurable adhesive agent 32 of engaging zones 36 is solidified.
Also have,, also preferably make matrix material 10 and mask member 20 temperature rise thermal expansion even in this main curing process.
By carrying out above operation repeatedly, engage 6 pieces of mask member 20 on the matrix material 10, make mask 30.And, when disposing 6 pieces of mask member 20 in mutual nonoverlapping mode, 6 pieces of mask member 20 of configuration on a side's of matrix material 10 face.
Like this, by in Photocurable adhesive agent 32, mixing separaant 38, can be with the constant height of mask member 20.That is, by mixing the separaant 38 that is made of a plurality of spheroids equably in Photocurable adhesive agent 32, thereby separaant 38 spreads all over whole engaging zones 38.In addition, when matrix material 10 and mask member 20 are connected airtight,, can make between the separaant 38 with mutual nonoverlapping mode common configuration in engaging zones 36 by supercharging is provided.And, even, also accept this power,, be difficult to make the change of shape or the breakage of spheroid so power is disperseed by a plurality of spheroids because mask member 20 is pressed on the matrix material 10.Therefore, as shown in Figure 6A, can make the constant height of mask member 20.
In addition, for example, shown in Fig. 6 C, can on complete all ends of the opening 12 of matrix material 10, form protuberance 18, by mask member 20 is covered on protuberance 18, thereby make protuberance 18 become separaant 38 performance functions, perhaps can on mask member 20, protuberance be set.
In addition, owing to by from mask member 20 irradiates lights, the Photocurable adhesive agent 32 that escapes to mask member 20 outer circumferential sides is solidified, 10 are temporarily fixed with mask member 20 in the matrix village, so can carry mask 30 (matrix material 10 and mask member 20), or turn over.And, in mask manufacturing installation 100, owing to there is no need to be provided with the lamp of below (matrix material 10 sides) irradiates light from XY worktable 112, so can not make complicated, the maximization of device, matrix material 10 is engaged with mask member 20, mask 30 can be made, mask manufacturing installation 100 in the past can be suitable for.
And, from the operation of matrix material 10 side irradiates lights, also can make mask 30 counter-rotatings, return mask manufacturing installation 100 and come irradiates light, also can come irradiates light with being located at mask manufacturing installation 100 outer not shown lamps.Have again, be not limited to the situation that every piece of mask member 20 is carried out from the operation of matrix material 10 side irradiates lights, also can make many pieces of mask member 20 be bonded on matrix material 10 (temporary fixed) go up after together from matrix material 10 side irradiates lights.
Also have, in the manufacturing process of above-mentioned mask 30, when preferably irradiates light solidifies it on Photocurable adhesive agent 32 at least, make the temperature of matrix material 10 and mask member 20 rise about 50 ℃.But, need the time because temperature rises, so can in the whole manufacturing process of mask 30, heat matrix material 10 and mask member 20.
In addition, follow mask member 20 lightening, wish the distance of pattern and opening 12 near the time, can not make Photocurable adhesive agent 32 escape to the inboard of opening 12.That is, this is not allow make Photocurable adhesive agent 32 cover the cause of the through hole 22 that forms pattern.
Therefore, under the situation that matrix material 10 is made of the permeability material, shown in Fig. 6 B, apply to the mode that interior all side leakages of opening 12 go out not make Photocurable adhesive agent 32.For example, the close outside coating in engaging zones 36 etc. wait with experiment in advance and try to achieve the coating scope.
In addition, because Photocurable adhesive agent 32 is a low viscosity, so the amount that spills or scope can not be defined as when constant, with the degree of Photocurable adhesive agent 32 coatings for not spilling from engaging zones 36, after matrix material 10 and mask member 20 were connected airtight, the outer circumferential side in mask member 20 applied Photocurable adhesive agent 32 again.Like this, can form the state (with reference to Fig. 6 B) that Photocurable adhesive agent 32 spills from mask member 20 reliably.And, from mask member 20 side irradiates lights, make Photocurable adhesive agent 32 solidify (temporary fixed) after, by from matrix material 10 side irradiates lights, light transmission matrix material 10 solidifies remaining Photocurable adhesive agent 32.
And then, after being connected airtight, matrix material 10 and mask member 20 apply Photocurable adhesive agent 32 again, so that the method that Photocurable adhesive agent 32 does not spill from engaging zones 36, not being limited to and only making Photocurable adhesive agent 32 to the situation that the outer circumferential side of mask member 20 spills, also is effective method under situation about spilling to both sides (interior all sides of the outer circumferential side of mask member 20 and opening 12).
Yet, the temperature of matrix material 10 and mask member 20 is risen about 50 ℃ engage, be because under the condition identical, make the cause of mask 30 with service condition.That is, be if use mask 30, utilize vacuum evaporation to make the luminescent material film forming, then the temperature of mask 30 50 ℃ the cause that rises approximately.That is, by under the condition identical, making mask 30, can be suppressed at vacuum evaporation when handling deviation by the pattern that thermal expansion caused of mask 30 with the condition of using mask 30 during vacuum evaporation is handled.
If more elaborate, then the thermal expansivity of matrix material 10 is about 3.2 * 10
-6/ ℃, the thermal expansivity that constitutes the silicon of mask member 20 is about 2.6～3.6 * 10
-6/ ℃.Thus, because matrix material 10 and the thermal expansivity that mask member 20 has roughly the same degree expand to same degree or contraction, so can suppress the warpage of the mask that difference caused 30 (mask member 20) of thermal expansivity, the generation of deflection.On the other hand, the thermal expansivity that becomes the glass substrate (for example lithium tantalate substrate etc.) 50 of the substrate of OLED display is about 3.8 * 10
-6/ ℃.Therefore, when under uniform temp, using mask 30,,, ought to not can produce the deviation of pattern so same degree ground expands or shrinks because mask 30 has the thermal expansivity of degree much at one with glass substrate 50 with glass substrate 50.
, if use mask 30 vacuum evaporation luminescent material on glass substrate 50, then between the temperature of the glass substrate 50 of the shade that becomes mask 30 near mask 30 of thermal source (vapor deposition source) and relative thermal source, produce temperature difference (with reference to Fig. 7).Cause the thermal expansion of mask 30 different by this temperature difference, thereby produce the position deviation of pattern with the thermal expansion of glass substrate 50.
Specifically, if the temperature of the mask 30 during vacuum evaporation is about 50 ℃, the temperature of glass substrate 50 is about 35 ℃, and outside temperature is 20 ℃, and then have an appointment respectively 30 ℃, about 15 ℃ temperature rise.And, when the size of mask 30 and glass substrate 50 is 400mm * 500mm, the variation of the distance from its center to four jiaos (angles) (about 320mm), mask 30 is about 34.6～25.0 μ m, glass substrate 50 is 18.3 μ m, and mask 30 is about 16.3～6.7 μ m with poor (position deviation of pattern) of the thermal expansion of glass substrate 50.
Therefore, because by under the identical temperature of the temperature (about 50 ℃) of the mask of handling with vacuum evaporation 30, engaging matrix material 10 and mask member 20, make mask 30, thereby under the state that the deviation of above-mentioned pattern produces in advance, make mask 30, owing under the situation of reality use mask 30, do not produce the position deviation of the pattern that causes because of thermal expansion, so can suppress the deviation of pattern.In addition, owing under condition identical when using, make, so the generation that also can prevent to follow the warpage of mask 30 of temperature variation or deflection etc. to be out of shape.
And, by under the identical temperature of the temperature of the mask of handling with vacuum evaporation 30, being formed on the pattern (a plurality of through hole 22) that forms on the mask member 20, can further suppress the deviation of pattern.Like this, the mask 30 of present embodiment is best suited for vacuum evaporation.
Next, using method of the mask 30 that produces with reference to description of drawings etc.
Fig. 7 is the figure that the vacuum deposition apparatus 200 of mask 30 is used in expression.
Fig. 8 A and Fig. 8 B are the figure of the using method of expression mask 30, and Fig. 8 A is the mask 30 of Fig. 7 and the enlarged drawing of glass substrate 50.
On mask 30 (for example mask member 20), be pre-formed the magnetic film 34 that the strong magnetic material by iron, cobalt, nickel etc. constitutes.Perhaps, also can utilize nickel, cobalt, iron or contain the magnetic metal materials such as stainless steel alloy of ferrous components, or the engaging of magnetic metal material and nonmagnetic material, magnetic film 34 formed.Glass substrate 50 is the matrix materials that form a plurality of electro-optical devices (for example organic El device) 500, is pre-formed electrode (for example transparency electrode that is made of ITO etc.) 54 or hole transporting layer 56 (with reference to Fig. 9 A).And, also can form electron supplying layer.In addition, mask 30 is configured to put mask member 20 so that be sidelong at glass substrate 50.At the carriage 210 that the configuration of the behind of glass substrate 50 is made of magnet, go up the magnetic film 34 that forms to attract mask 30 (mask member 20).Thus, produce warpage, also it can be corrected even mask 30 (mask member 20) is gone up.
Fig. 8 B is the figure of the alignment schemes of explanation mask.
Be pre-formed in mask alignment mark on the matrix material 10 16 and the telltale mark 52 that is pre-formed on glass substrate 50 with camera 212 (with reference to Fig. 7) supervision, by making mask alignment mark 16 consistent, matrix material 10 is alignd with glass substrate 50 with telltale mark 52.And matrix material 10 and glass substrate 50 are with the maintenance that is spaced apart of (implication of " following " for smaller or equal to) below about 50 μ m.
Fig. 9 A～Fig. 9 C is the figure of the film build method of expression luminescent material.
Luminescent material for example is an organic material, as low molecular organic material hydroxyquinoline aluminum coordination compound (Alq is arranged
3), as high molecular organic material poly-phenylene vinylene (ppv) support (PPV) is arranged then.The film forming of luminescent material can utilize evaporation to carry out.For example, shown in Fig. 9 A, form red luminescent material by mask 30 one side patterns, on one side film forming, red luminescent layer 60 formed.And, shown in Fig. 9 B, move mask 30, on one side pattern form green luminescent material, film forming forms green luminescent layer 62 on one side.Have again, shown in Fig. 9 C, move mask 30 once more, on one side pattern form blue luminescent material, film forming forms blue luminescent layer 64 on one side.The warpage of mask member 20, deflection also have, become the mask member 20 of screen, so can not produce the repeatability height of selection evaporation, throughput rate height owing to utilize matrix material 10 to strengthen.In addition, in mask 30, form a plurality of openings 12 on matrix material 10, place mask member 20 corresponding to each opening 12, each mask member 20 is corresponding with 1 EL device.That is a plurality of EL devices that can use mask 30 to make integrated.And then, cut off glass substrate 50, can obtain EL device one by one.
And,,, also can use mask evaporation electron supplying layer of the present invention, electron injecting layer, hole transporting layer, hole injection layer here though for example understand luminescent layer.That is, when between electrode, forming hole injection layer/hole transporting layer/luminescent layer/electron supplying layer/electron injecting layer, can use each layer of mask evaporation of the present invention.
The figure of Figure 10 electro-optical device 500 that to be expression manufacture via the film build method of above-mentioned luminescent material.
Electro-optical device 500 (for example organic El device) has glass substrate 50, electrode 54, hole transporting layer 56, luminescent layer 60,62,64 etc.Be formed with electrode 66 on the luminescent layer 60,62,64.Electrode 66 for example is a cathode electrode.And electro-optical device 500 utilizes as display device (display).
Figure 11 is the figure of the embodiment of expression electronic equipment 600 of the present invention.
Mobile phone 1000 (electronic equipment 600) possesses the display part 1001 that is made of electro-optical device 500.As other application examples, the situation that possesses electro-optical device 500 in the watch style electronic equipment as display part is arranged, or in portable information processing devices such as word processor, personal computer, possess situation of electro-optical device 500 etc. as display part.Like this, electronic equipment 600 is owing to possess electro-optical device 500 as indication mechanism, thus can realize showing the contrast height, and superior in quality demonstration.
In addition, as the material of above-mentioned glass substrate, except glass, also can adopt plastics class transparent materials such as polyolefin, polyester, polyacrylate, polycarbonate, polyethersulfone, polyetherketone.
In addition, material as above-mentioned electrode (anode), except ITO (Indium Tin Oxide), can adopt aluminium (Al), gold (Au), silver (Ag), magnesium (Mg), nickel (Ni), vanadium zinc (ZnV), indium (In), tin monomers such as (Sn), perhaps these compound or potpourri perhaps contain the conductive adhesive of metal charge (metal filler) etc.The formation of electrode preferably utilizes sputtering method, ion plating (ion plating), vacuum vapour deposition to carry out.Perhaps can utilize printing that spin coating machine (spin coater), gravure formula coating machine (gravure coater), scraper plate coating machine (knifecoater) etc. carry out or screen printing, flexopress to wait and form pixel electrode.
Also have, as the formation method of above-mentioned hole transporting layer, for example with carbazole polymkeric substance and TPD: terphenyl compound is evaporation altogether, forms 10～1000nm (thickness of preferred 100～700nm).As other formation method, for example also can utilize ink-jet method after the composition China ink that will contain hole injection, transfer layer material sprays on substrate, carry out dried and thermal treatment and form.And, as the composition China ink, for example can use potpourri with polythiofuran derivatives such as tygon dihydroxy thiophene and sulfonated polystyrene etc. to be dissolved in solution in the water isopolarity solvent.
In addition, as above-mentioned electron supplying layer, for example can use to become 10～1000nm (mode of preferred 100～700nm) thickness, the metal complex that will form by metal and organic coordination, preferably Alq3 (three (8-quinoline ester) aluminium coordination compound), Znq2 (two (8-quinoline ester) zine coordination compound), Bebq2 (two (8-quinoline ester) beryllium coordination compound), Zn-BT2 (evaporation such as 2-(O-hydroxy phenyl) benzothiazole zinc), perylene derivant and the material that is laminated.
Also have, above-mentioned electrode (negative electrode) for example is made of stepped construction, as the cathode layer of bottom, adopts the work function metal also lower than the cathode layer on top, and for example calcium etc. injects electronics so that can carry out effectively to electron supplying layer or luminescent layer.Have, upper cathode layer is the part of protection bottom cathode layer, preferably is made of the big metal of the relative bottom of work function cathode layer, for example adopts aluminium etc. again.These bottom cathode layer and upper cathode layer are for example preferably utilized formation such as vapour deposition method, sputtering method, CVD method, particularly by forming with vapour deposition method, can prevent that the damage aspect that ultraviolet ray, electronics line, plasma are caused from being preferred.
Though more than with reference to accompanying drawing preferred forms of the present invention is illustrated, the present invention is not limited to these examples.All shapes of each member of formation shown in the above-mentioned example or combination etc. are examples wherein, without departing from the spirit and scope of the present invention, can carry out various changes according to designing requirement etc.
Claims (2)
1. the manufacture method of a mask wherein, has:
The operation of preparing to have formed the matrix material of opening and having formed the mask member of a plurality of through holes;
Corresponding to above-mentioned opening, the operation that the aforementioned mask member is engaged with above-mentioned matrix material; With
The operation of the junction temperature of management aforementioned mask member and above-mentioned matrix material;
The temperature of aforementioned mask member and the above-mentioned matrix material aforementioned mask when having used the vapor deposition treatment of aforementioned mask is engaged.
2. the manufacture method of mask according to claim 1, wherein,
Aforementioned mask is to form a plurality of above-mentioned openings on above-mentioned matrix material, and corresponding with each above-mentioned opening, engages the mask that a plurality of aforementioned mask members form,
The temperature of managing joint respectively at above-mentioned a plurality of mask member.
Applications Claiming Priority (5)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003061355 | 2003-03-07 | ||
| JP2003061356 | 2003-03-07 | ||
| JP2003061355 | 2003-03-07 | ||
| JP2003061357 | 2003-03-07 | ||
| JP2004036621 | 2004-02-13 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB200410007838XA Division CN100393908C (en) | 2003-03-07 | 2004-03-04 | Mask and producing process thereof, mask producing apparatus and film forming method for luminous material |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100908784A Division CN1874629A (en) | 2003-03-07 | 2004-03-04 | Mask, method of manufacturing mask, device for manufacturing mask, and method of manufacturing film of luminescent material |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1828410A CN1828410A (en) | 2006-09-06 |
| CN100568092C true CN100568092C (en) | 2009-12-09 |
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ID=36946869
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100908784A Pending CN1874629A (en) | 2003-03-07 | 2004-03-04 | Mask, method of manufacturing mask, device for manufacturing mask, and method of manufacturing film of luminescent material |
| CNA2007101626879A Pending CN101158025A (en) | 2003-03-07 | 2004-03-04 | Mask, manufacturing method for mask, manufacturing apparatus for mask |
| CNB2006100597056A Expired - Lifetime CN100568092C (en) | 2003-03-07 | 2004-03-04 | The film build method of mask and method for making thereof, mask manufacturing installation, luminescent material |
Family Applications Before (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2006100908784A Pending CN1874629A (en) | 2003-03-07 | 2004-03-04 | Mask, method of manufacturing mask, device for manufacturing mask, and method of manufacturing film of luminescent material |
| CNA2007101626879A Pending CN101158025A (en) | 2003-03-07 | 2004-03-04 | Mask, manufacturing method for mask, manufacturing apparatus for mask |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102560337B (en) * | 2012-02-27 | 2014-01-08 | 中国科学院近代物理研究所 | Metal mask process plate and use method |
| JP5382259B1 (en) * | 2013-01-10 | 2014-01-08 | 大日本印刷株式会社 | Metal plate, method for producing metal plate, and method for producing vapor deposition mask using metal plate |
| CN103484818A (en) * | 2013-09-25 | 2014-01-01 | 京东方科技集团股份有限公司 | Vapor deposition method, vapor deposition device and light-emitting device |
| JP5516816B1 (en) | 2013-10-15 | 2014-06-11 | 大日本印刷株式会社 | Metal plate, method for producing metal plate, and method for producing vapor deposition mask using metal plate |
| JP5641462B1 (en) | 2014-05-13 | 2014-12-17 | 大日本印刷株式会社 | Metal plate, metal plate manufacturing method, and mask manufacturing method using metal plate |
| CN106569386B (en) * | 2015-10-08 | 2019-12-10 | 无锡华润上华科技有限公司 | Photomask and method for simultaneously preparing multiple chips by using photomask |
| CN109136835A (en) * | 2018-09-20 | 2019-01-04 | 武汉华星光电半导体显示技术有限公司 | A kind of OLED display panel and preparation method thereof, vapor deposition use mask plate |
-
2004
- 2004-03-04 CN CNA2006100908784A patent/CN1874629A/en active Pending
- 2004-03-04 CN CNA2007101626879A patent/CN101158025A/en active Pending
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| CN101158025A (en) | 2008-04-09 |
| CN1874629A (en) | 2006-12-06 |
| CN1828410A (en) | 2006-09-06 |
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