CN100565758C - The joint method of supporting structure of field radiation display component - Google Patents

The joint method of supporting structure of field radiation display component Download PDF

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Publication number
CN100565758C
CN100565758C CNB2007100882030A CN200710088203A CN100565758C CN 100565758 C CN100565758 C CN 100565758C CN B2007100882030 A CNB2007100882030 A CN B2007100882030A CN 200710088203 A CN200710088203 A CN 200710088203A CN 100565758 C CN100565758 C CN 100565758C
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CN
China
Prior art keywords
substrate
supporting
carrier
supporting construction
display component
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Expired - Fee Related
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CNB2007100882030A
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Chinese (zh)
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CN101266901A (en
Inventor
陈国华
杨镇在
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Teco Electric and Machinery Co Ltd
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Teco Electric and Machinery Co Ltd
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Priority to CNB2007100882030A priority Critical patent/CN100565758C/en
Publication of CN101266901A publication Critical patent/CN101266901A/en
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Publication of CN100565758C publication Critical patent/CN100565758C/en
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Abstract

A kind of joint method of supporting structure of field radiation display component is used for fixing the relative position of supporting construction harmonizing yinyang pole plate, comprising: carrier is provided, has the groove that a plurality of parallel interval are arranged on this carrier, be used for placing in advance supporting construction; On the substrate of negative electrode and anode, be provided with the layer of metal composition surface; Carrier and location corresponding with substrate with carrying a plurality of supporting constructions makes these a plurality of supporting constructions and this metal bond face pressing; At last, substrate and carrier sent to simultaneously carry out high temperature sintering in the vacuum furnace, make this supporting construction and substrate form eutectic structure, to fix both relative positions via this metal bond face.

Description

The joint method of supporting structure of field radiation display component
Technical field
The present invention relates to a kind of field emission type flat display, relate in particular to a kind of manufacture method that is used to support the supporting construction of cathode-anode plate.
Background technology
Nowadays, the appearance of flat-panel screens, the status that has not only replaced original conventional picture tube display, and because it has light with thin characteristics, the application of flat-panel screens also is extended on the application product that needs display devices of varying sizes,, big to outdoor common billboard etc. as little to personal mobile phone or digital assistants (PDA).
The kind of flat-panel screens, comprise LCD (LCD), plasma scope (PDP) and organic light emitting diode display (OLED) etc., and the field emission type flat display (FED) that emerges fast becomes one of emerging in recent years flat-panel screens, the field emission type flat display is except the advantage with self-lighting, also has broad visual angle, characteristics such as low power consumption and reaction speed are fast, these are all the advantage that the field emission type flat display is better than other types of display, simultaneously owing to also adopted nanometer technology, so the field emission type flat display certainly will will become the first-selection of following flat-panel screens.
The basic structure of field emission type flat display mainly comprises positive plate and minus plate, be respectively equipped with fluorescence coating and cathode electronics emission source on this positive plate and the minus plate, between described positive plate and minus plate, be provided with supporting construction, to separate out a vacuum area between positive plate and minus plate and as the support between positive plate and minus plate, the electron beam that vacuum area is launched for the cathode electronics emission source provides enough accelerating spaces, and the fluorescence coating on the corresponding impinge anode plate and produce luminescent effect, therefore, supporting construction becomes a considerable ring in the field emission type flat display device structure.
And supporting construction is desired as the supporting component between cathode-anode plate, and its known method is supporting construction must be fixed on the cathode-anode plate, makes correctly contraposition of cathode-anode plate to avoid producing mobile phenomenon, has influence on the position of electronic impact fluorescence coating; Usually, the fixing means of known supporting construction is to utilize snap fit, designed its structure of contraposition mutually before the structure formation of cathode-anode plate and supporting construction, so that this supporting construction and cathode-anode plate are chimeric mutually, but this known method makes that the manufacturing process of cathode-anode plate is complicated more in advance; Another known method then is the mode that adopts interface to fit, utilization is all the material of glass material, it is softened become one with the relative position of fixing this cathode-anode plate and supporting construction, to reduce the loaded down with trivial details formality of aforementioned known manufacturing process, become normal adopted method at present; Yet in the process of high temperature sintering, the low temperature organic solution of glass material inside also changes into gas and pollutes vacuum environment in it, makes this method have suitable important disadvantages.
And No. 5717287 disclosed content of another kind of known technology such as U.S. Patent number, utilize a kind of eutectic joining technique, the interface that the ability metal material engages with cathode-anode plate as supporting construction, under the production environment of 300~500 ℃ of temperature and 500 volts~2000 volts of voltages, finish this connected structure, this method not only can shorten Production Time, also can avoid producing unnecessary gas and influences vacuum environment after the encapsulation; But because the high-tension production environment of high temperature makes the electrode be located on the cathode-anode plate and as the nanometer material generation oxidation of cathode electronics emission source, directly have influence on the effect of the circuit conduction and the emission of cathode electronics emission source of combination back display floater, this is this method a fly in the ointment.
Summary of the invention
At above-mentioned defective, the invention provides a kind of joint method of supporting structure of field radiation display component, be used for fixing the relative position between supporting construction and substrate, its step comprises:
A) provide carrier, be used to carry a plurality of supporting constructions with a plurality of grooves;
B) on the substrate surface of desire and support structure engages, the layer of metal knitting layer is set;
C) described carrier and described substrate are carried out contraposition, so that described supporting construction and the corresponding pressing of described metallic bond layer;
D) at last described carrier and described substrate are sent in the vacuum furnace to avoid making the electrode on positive plate or the minus plate and to produce the required temperature of oxidation and carried out sintering, so that described supporting construction and described substrate are via described metallic bond layer formation eutectic structure as the source material of cathode electronics emission.
Joint method according to supporting structure of field radiation display component provided by the invention, can carry out eutectic by high temperature sintering under vacuum environment makes, utilize vacuum environment to reduce needed sintering temperature, thereby finish the connected structure of this supporting construction and cathode-anode plate, not only operation is simple, and need not needed voltage environment in the prior art, reduced electrode and the oxidized risk of cathode electronics emissive material set on the substrate.
Description of drawings
Fig. 1 is a carrier perspective view of the present invention;
Fig. 2 A, 2B are carrier operation chart of the present invention;
Fig. 3 is a joint schematic diagram of the present invention.
In the accompanying drawing, the list of parts of each label representative is as follows:
Carrier 1 groove 11
Supporting construction 2 positive plates 3
Anode substrate 31 metallic bond layer 32
Loam cake 4
Embodiment
Below in conjunction with accompanying drawing concrete technology contents of the present invention is elaborated:
Referring to Fig. 1 and 2 A, 2B, it is respectively carrier perspective view of the present invention and operation chart.As shown in Figure 1, carrier 1 at first is provided, and carrier 1 is provided with a plurality of grooves that are arranged in parallel 11, is used to carry the supporting construction 2 that separates cathode-anode plate, shown in the cutaway view of the operation diagrammatic top view of Fig. 2 A and Fig. 2 B, with the stand up position of predetermined fixed supporting construction 2.
Referring to Fig. 3, it is a joint schematic diagram of the present invention, and this substrate is an example with the anode substrate in the positive plate in the present embodiment.As shown in the figure, this positive plate 3 comprises anode substrate 31, covers metallic bond layer 32 on the inner surface of anode substrate 31, and metallic bond layer 32 is the evaporation aluminium in the present embodiment, the outer surface of anode substrate 31 then is provided with loam cake 4, is used to protect the another side of this substrate 31; Carrier 1 correspondence that will be equiped with a plurality of supporting constructions 2 again is positioned metallic bond layer 32, makes a plurality of supporting constructions 2 and metallic bond layer 32 pressing mutually; At last, this positive plate 3 and carrier 1 sent to simultaneously carry out vacuum-sintering in the vacuum furnace, make supporting construction 2 and anode substrate 31 form eutectic structures, and the vacuum condition of this vacuum furnace is located at 10 via metallic bond layer 32 -3Torr can maintain below 600 ℃ the maximum temperature of this aluminium, to avoid high temperature too to make the electrode on positive plate or the minus plate and to produce oxidation as the source material of cathode electronics emission; In addition, repeat above-mentioned production process and condition, make supporting construction 2 and cathode base form eutectic structure.
The foregoing description for explanation the present invention's usefulness, and is not a limitation of the present invention only, those skilled in the art under the premise without departing from the spirit and scope of the present invention, the various equivalent structures of being made change all within the scope of the present invention.Protection scope of the present invention is defined by the claims.

Claims (3)

1. the joint method of a supporting structure of field radiation display component is used for fixing the relative position between supporting construction and substrate, and its step comprises:
A) provide carrier, be used to carry a plurality of supporting constructions with a plurality of grooves;
B) in addition, on the substrate surface of desire and support structure engages, the layer of metal knitting layer is set;
C) described carrier and described substrate are carried out contraposition, so that described supporting construction and the corresponding pressing of described metallic bond layer;
D) at last described carrier and described substrate are sent in the vacuum furnace to avoid making the electrode on positive plate or the minus plate and to produce the required temperature of oxidation and carried out sintering, so that described supporting construction and described substrate are via described metallic bond layer formation eutectic structure as the source material of cathode electronics emission.
2. the joint method of supporting structure of field radiation display component as claimed in claim 1, wherein, described metallic bond layer is an aluminium.
3. the joint method of supporting structure of field radiation display component as claimed in claim 1, wherein, the vacuum condition of described vacuum furnace is 10 -3Torr.
CNB2007100882030A 2007-03-15 2007-03-15 The joint method of supporting structure of field radiation display component Expired - Fee Related CN100565758C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB2007100882030A CN100565758C (en) 2007-03-15 2007-03-15 The joint method of supporting structure of field radiation display component

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2007100882030A CN100565758C (en) 2007-03-15 2007-03-15 The joint method of supporting structure of field radiation display component

Publications (2)

Publication Number Publication Date
CN101266901A CN101266901A (en) 2008-09-17
CN100565758C true CN100565758C (en) 2009-12-02

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Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2007100882030A Expired - Fee Related CN100565758C (en) 2007-03-15 2007-03-15 The joint method of supporting structure of field radiation display component

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Granted publication date: 20091202

Termination date: 20110315