CN100554198C - A kind of quick bonding pressurizing mold of normal temperature that is used for quartzy micro-fluidic chip - Google Patents
A kind of quick bonding pressurizing mold of normal temperature that is used for quartzy micro-fluidic chip Download PDFInfo
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- CN100554198C CN100554198C CNB2005100468351A CN200510046835A CN100554198C CN 100554198 C CN100554198 C CN 100554198C CN B2005100468351 A CNB2005100468351 A CN B2005100468351A CN 200510046835 A CN200510046835 A CN 200510046835A CN 100554198 C CN100554198 C CN 100554198C
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Abstract
The present invention relates to the micro-fluidic chip manufacturing technology, a kind of die bonding method and pressurizing mold of making quartzy micro-fluidic chip normal temperature fast sealing that be specifically designed to is provided especially.Through rare HF acid treatment, rare HF acid mass percent concentration scope is with two quartz chip for the treatment of sealing-in: 0.1-1%, and the treatment time is 2-5 minute; By pressurizing mold pressurization, pressure range: 0.5MPa-2MPa; Simultaneously heat for some time temperature range in baking oven: 50-150 ℃, be 1-2 hour heat-up time, can realize the fast sealing than large-area chips; Described pressurizing mold comprises increased pressure board, following increased pressure board and lifting screw, and upper and lower increased pressure board is relative, be arranged in parallel, places two quartz chip for the treatment of sealing-in on the following increased pressure board, and the lifting screw corresponding with quartz chip is equipped with in last increased pressure board bottom surface.Adopt chip of the present invention to need not to be polished to especially light and hand over, environment cleanliness is had no special requirements, reduced cost of manufacture, simple and practical, be particularly suitable for common lab and make use.
Description
Technical field
The present invention relates to the micro-fluidic chip manufacturing technology, a kind of die bonding method and pressurizing mold of making quartzy micro-fluidic chip normal temperature fast sealing that be specifically designed to is provided especially.
Background technology
Micro-total analysis system (Micro Total Analysis Systems, μ-TAS) is a frontier interdisciplinary, its final purpose is by the microminiaturization of chemical device and integrated, to greatest extent the function of assay laboratory is transferred to (as all kinds of chips) in the portable Analytical equipment, realize " microminiaturization " of Analytical equipment, therefore micro-total analysis system also generically is called " chip lab " (Lab-on-a-chip), can be divided into two big classes again according to chip structure and working mechanism: micro-array chip (Microarray chip), be called " biochip " again, and micro-fluidic chip (Microfluidic chip), the former development is quite ripe, abroad with degree of depth industrialization; The latter is mainly based on analytical chemistry and biological chemistry, utilize micro electronmechanical processing technology (MEMS), process the microchannel network of 10-100 micron at silicon, glass, quartz, frosting, electroosmotic flow and electrophoresis are flowed as motivating force, by changing driving voltage, flow direction and the speed of control fluid in the network of microchannel, thereby realize to target analytes sampling, dilute, add steps such as reagent, enrichment, extraction, mixing, reaction, separation, detection, be the emphasis of current research.In the micro-fluidic chip of numerous base materials, because quartz has electric osmose and good in optical property, have good ultraviolet light transmission, surface properties is stable, is easy to realize characteristics such as surface modification, so it should be the optimal body material of micro-fluidic chip.Particularly in the ultraviolet micro-fluidic chip system, because most of chip materials all can not see through UV-light, so chip material is very restricted, and because quartz has ultraviolet light transmission preferably, so it is the indispensable chip material of ultraviolet micro-fluidic chip system.And quartz chip is because its softening temperature height, common retort furnace is difficult to reach so high temperature, even if adopt the high temperature retort furnace, in experiment, find the quartzy potteryization that takes place, the surface is opaque, therefore be difficult to adopt the simple glass chip to carry out high intermediate temperature sealing like that, thus quartz chip use and popularization is very restricted.Developing fast and effectively, chip normal temperature sealing technology is the best choice that solves quartz chip sealing-in bottleneck problem.Present normal temperature sealing technology or the polishing degree of chip is required very high need reach or hands near light; The sealing-in time is long, and needs complicated press device, and these have all greatly increased the cost of manufacture of quartz chip undoubtedly.Existing method can't realize the sealing-in than large-area chips, and harsh more because the existing method of the big more employing of area then requires surface finish, this has limited the use of quartz chip undoubtedly.
Summary of the invention
The object of the present invention is to provide a kind of quick bonding method of normal temperature and pressurizing mold that is used for quartzy micro-fluidic chip, solve the problem of chip normal temperature sealing-in.
Technical scheme of the present invention is:
A kind of quick bonding method of normal temperature that is used for quartzy micro-fluidic chip through rare HF acid treatment, by the pressurizing mold pressurization, heats two quartz chip for the treatment of sealing-in for some time in baking oven simultaneously, realizes the fast sealing than large-area chips; Concrete steps are as follows:
(1) before the sealing-in, two bauerite chips are all through rare HF acid treatment, and rare HF acid mass percent concentration scope is: 0.1-1%, and the treatment time is 2-5 minute;
(2) pressurizing mold carries out whole pressurization or partial points pressurization, pressure range: 0.5MPa-2MPa;
(3) heating, temperature range: 50-150 ℃, be 1-2 hour heat-up time, the type of cooling is a naturally cooling.
Described rare HF acid mass percent concentration scope is preferably: 0.2-1.0%; Pressure range is preferably: 0.8-1.5MPa; Temperature range is preferably: 80-120 ℃.
The quick bonding pressurizing mold of normal temperature that is used for quartzy micro-fluidic chip, described pressurizing mold comprises increased pressure board, following increased pressure board and lifting screw, upper and lower increased pressure board is relative, be arranged in parallel, place two quartz chip for the treatment of sealing-in on the following increased pressure board, the lifting screw corresponding with quartz chip is equipped with in last increased pressure board bottom surface.
Described lifting screw quantity is 4-10, and is uniform.
Compared with prior art, the invention has the beneficial effects as follows:
1, the present invention is used for the normal temperature sealing technology of quartz chip, and two quartz chip for the treatment of sealing-in, heat for some time in a conventional oven by homemade pressurizing mold pressurization through rare HF acid treatment simultaneously, can realize the fast sealing than the big area quartz chip.
2, pressurizing mold adopts multiple spot evenly to pressurize among the present invention, not only can realize the pressurization of whole plane, can realize the partial points pressurization simultaneously, so chip need not special polishing, has reduced cost of manufacture, and is simple and practical, is particularly suitable for the common lab making and uses.
Description of drawings
The quartzy micro-fluidic chip synoptic diagram of Fig. 1 normal temperature sealing-in.
Fig. 2 is the quartz chip synoptic diagram that is carved with passage and grid.
Among the figure, 1 quartz chip; 2 quartz chip; 3 lifting screws; Increased pressure board on 4; 5 times increased pressure boards; 6 nuts; 7 passages; 8 grids.
Embodiment
Quartzy micro-fluidic chip is normally formed by the quartz chip and a bauerite sheet glass sealing-in of a slice tape channel.Shown in Fig. 1-2, the present invention adopts two quartz chip 1,2 for the treatment of bonding, wherein a slice is except that being carved with passage 7, also be carved with grid 8, passage 7 communicated with atmosphere, help to discharge the gas that is sandwiched between quartz chip by grid 8 in the passage outside, thereby significantly improve sealing-in quality and yield rate, for guaranteeing the firm and feasibility of sealing-in, sealing surface (remove and use passage and grid) should account for the 60-98% of entire area, and optimum proportion is 85-95%; Another sheet is a cover plate, cleans up, and after rare HF acid treatment, two knots are incorporated in the even pressurizing mold of multiple spot that designs voluntarily and pressurize, and place baking oven constant temperature for some time simultaneously.Described pressurizing mold comprises increased pressure board 4, following increased pressure board 5 and lifting screw 3, upper and lower increased pressure board 4,5 opposing parallel settings, connect by nut 6, place two quartz chip 1,2 for the treatment of sealing-in on the following increased pressure board 5, the lifting screw 3 corresponding with quartz chip 2 is equipped with in last increased pressure board 4 bottom surfaces, realize multiple spot to the whole uniform plane pressurization of quartz chip by the rotation and lifting screw rod, the while can be realized the partial points pressurization.Chip need not polish (light friendship) especially, and sealing apparatus is simple, and the sealing-in time is short, the success ratio height.
Embodiment 1
Two quartz chip for the treatment of sealing-in through rare HF acid treatment, by the pressurizing mold pressurization, are heated for some time in baking oven simultaneously, realize fast sealing than large-area chips; Concrete steps are as follows:
(1) before the sealing-in, two bauerite chips are all through rare HF acid treatment, and rare HF acid mass percent concentration is: 0.1%, and the treatment time is 5 minutes;
(2) pressurizing mold pressurization, pressurizing mold not only can be realized whole pressurization, can realize the partial points pressurization simultaneously, pressure: 1MPa;
(3) heating, temperature: 100 ℃, be 1.5 hours heat-up time, and the type of cooling is a naturally cooling, has realized the fast sealing than the big area quartz chip.
Embodiment 2
Difference from Example 1 is:
(1) rare HF acid mass percent concentration is: 0.3%, and the treatment time is 5 minutes;
(2) pressurizing mold pressurization, pressure: 0.5MPa;
(3) heating, temperature: 150 ℃, be 1 hour heat-up time, and the type of cooling is a naturally cooling, has realized the fast sealing than the big area quartz chip.
Difference from Example 1 is:
(1) rare HF acid mass percent concentration is: 0.5%, and the treatment time is 4 minutes;
(2) pressurizing mold pressurization, pressure: 2MPa;
(3) heating, temperature: 50 ℃, be 2 hours heat-up time, and the type of cooling is a naturally cooling, has realized the fast sealing than the big area quartz chip.
Embodiment 4
Difference from Example 1 is:
(1) rare HF acid mass percent concentration is: 0.8%, and the treatment time is 3 minutes;
(2) pressurizing mold pressurization, pressure: 0.8MPa;
(3) heating, temperature: 80 ℃, be 1.5 hours heat-up time, and the type of cooling is a naturally cooling, has realized the fast sealing than the big area quartz chip.
Difference from Example 1 is:
(1) rare HF acid mass percent concentration: 1%, the treatment time is 2 minutes;
(2) pressurizing mold pressurization, pressure: 1.5MPa;
(3) heating, temperature: 120 ℃, be 1.5 hours heat-up time, and the type of cooling is a naturally cooling, has realized the fast sealing than the big area quartz chip.
Claims (2)
1, a kind of quick bonding pressurizing mold of normal temperature that is used for quartzy micro-fluidic chip, it is characterized in that: described pressurizing mold comprises increased pressure board (4), following increased pressure board (5) and lifting screw (3), last increased pressure board (4), following increased pressure board (5) are relatively, be arranged in parallel, following increased pressure board (5) is gone up and is placed two quartz chip (1,2) for the treatment of sealing-in, and the lifting screw corresponding with quartz chip (3) is equipped with in last increased pressure board (4) bottom surface.
2, according to the described quick bonding pressurizing mold of normal temperature that is used for quartzy micro-fluidic chip of claim 1, it is characterized in that: described lifting screw (3) quantity is 4-10, and is uniform.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100468351A CN100554198C (en) | 2005-07-08 | 2005-07-08 | A kind of quick bonding pressurizing mold of normal temperature that is used for quartzy micro-fluidic chip |
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2005100468351A CN100554198C (en) | 2005-07-08 | 2005-07-08 | A kind of quick bonding pressurizing mold of normal temperature that is used for quartzy micro-fluidic chip |
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| CN1891646A CN1891646A (en) | 2007-01-10 |
| CN100554198C true CN100554198C (en) | 2009-10-28 |
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| CNB2005100468351A Expired - Fee Related CN100554198C (en) | 2005-07-08 | 2005-07-08 | A kind of quick bonding pressurizing mold of normal temperature that is used for quartzy micro-fluidic chip |
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| CN104777274B (en) * | 2015-04-20 | 2017-04-19 | 浙江大学 | Fixing hold-down device for PDMS micro flow cell |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2447172Y (en) * | 2000-10-20 | 2001-09-12 | 中国科学院光电技术研究所 | High-precision bonding device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2447172Y (en) * | 2000-10-20 | 2001-09-12 | 中国科学院光电技术研究所 | High-precision bonding device |
Non-Patent Citations (3)
| Title |
|---|
| condition optimization, reliability evaluation ofSiO2-SiO2 HFbonding and its application for UVdetectionmicro flow cell. H. Nakanishi, et al.SENSORS AND ACTUATORS A-PHYSICAL,Vol.83. 2000 * |
| Studies on SiO2-SiO2 bonding with hydrofluoric acid. Roomtemperature and low stress bonding technique forMEMS. H.Nakanishi,et al.SENSORS AND ACTUATORS A-PHYSICAL,Vol.79. 2000 * |
| 塑料微流控芯片热压及键合设备结构设计研究. 王钧，王晓东，刘冲.机械设计与制造. 2004 * |
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