CN100552516C - Electronic installation with fan-out block of uniform impedance value - Google Patents
Electronic installation with fan-out block of uniform impedance value Download PDFInfo
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- CN100552516C CN100552516C CNB2006100680227A CN200610068022A CN100552516C CN 100552516 C CN100552516 C CN 100552516C CN B2006100680227 A CNB2006100680227 A CN B2006100680227A CN 200610068022 A CN200610068022 A CN 200610068022A CN 100552516 C CN100552516 C CN 100552516C
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- 238000009434 installation Methods 0.000 title claims abstract description 28
- 238000004519 manufacturing process Methods 0.000 claims abstract description 13
- 101100272667 Xenopus laevis ripply2.2 gene Proteins 0.000 claims description 6
- 239000000758 substrate Substances 0.000 claims 2
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000000034 method Methods 0.000 description 9
- 239000010409 thin film Substances 0.000 description 4
- 239000004020 conductor Substances 0.000 description 3
- 239000004973 liquid crystal related substance Substances 0.000 description 3
- 239000011159 matrix material Substances 0.000 description 2
- 230000009193 crawling Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
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Abstract
The present invention proposes a kind of electronic installation and production method thereof, and wherein the outside of adjacent fan-out block connects the bonding pad intercept that lead is positioned at the active area side and differs from one another.By this, make the outboard wire of adjacent fan-out block junction have resistance value about equally; Thereby make the integrated wire of crossing over adjacent fan-out block have uniform resistance value, to guarantee the operation quality of electronic installation.
Description
Technical field
The present invention relates to a kind of electronic installation, particularly relate to a kind of liquid crystal display panel of thin film transistor (thin film transistor LCD panel or TFT LCD panel) with fan-out block (fan-out blocks) of uniform impedance value with fan-out block (fan-out blocks) of uniform impedance value.
Background technology
Fig. 1 shows the infrabasal plate 1 of general active-matrix liquid crystal display panel of thin film transistor, and it mainly comprises an active area (active area) 10.Have data line (data lines) 12 and gate line (gatelines) 14 in the active area 10, in order to oxide-semiconductor control transistors switch (not being shown among the figure) with video picture in each pixel (pixel).In this manual, data line 12 and gate line 14 are commonly referred to as control line again.The peripheral of active area 10 partly is called outer lead bonding land (outer-lead bondingarea or OLB area) 16, which is provided with a plurality of engaging zones (bonding area) 20; Have some joint sheets (bonding pads) in each engaging zones 20, in order to engages drive integrated circuit (driver).Also be provided with a plurality of fan-out blocks (fan-out blocks) 15 on the outer lead bonding land 16, it is connected between control line (12,14) and the engaging zones 20; Each fan-out block 15 contains a plurality of connection leads, and the one end is connected to control line (12,14), and the other end then is electrically connected to the drive integrated circult of engaging zones 20.
Usually the connection wire pitch (pitch) of drive integrated circult side is much smaller than the connection wire pitch of control line (12,14) side, thereby causes each length that connects lead to differ from one another; Particularly Wai Ce connection conductor length can be much larger than the connection conductor length of inboard.Be proportional to its length scale owing to connect the resistance value of lead, so it is quite big respectively to connect the resistance value difference of lead in the fan-out block 15.The difference of this resistance value can influence from the time delay of the control signal of drive integrated circult and quality, thus the whole image display quality of influence.In order to overcome this problem, the someone proposes certain methods and makes to have resistance value comparatively uniformly between connection lead in the fan-out block; For example, United States Patent (USP) the 6th, 104, No. 465, the 5th, 757, No. 450, the 6th, 683, No. 669 and the 6th, 842, No. 200.In general, these methods can be improved to obtain uniform resistance value; That is, make that fan-out block 15 interior adjacent connection lead resistance value differences each other are not too large.
Though the method for above-mentioned disclosure can be improved the problem of fan-out block internal impedance value difference, yet the inventor finds that the resistance value between each fan-out block 15 still has sizable difference on the outer lead bonding land 16; Particularly the change in impedance value that connects lead when the adjacent outside of adjacent fan-out block 15 evenly the time, for example differs more than 10 ohm inadequately, will produce incoherent video picture.Fig. 2 shows adjacent engaging zones (20a, 20b) and two fan-out block (A, B), and demonstrates the junction 5 of adjacent fan-out block.The drive integrated circult of engaging zones (20a, 20b) may be the integrated circuit of different size, and perhaps the drive integrated circult of engaging zones 20b has only used the pin of part; Under these situations, it is quite big to make that the outside of adjacent fan-out block (A, B) connects the resistance value difference of lead.For the resistance value difference problem between each fan-out block, above-mentioned patent documentation is all not mentioned; Moreover if use the disclosed method of above-mentioned patent documentation, the adjacent resistance value of then adjacent fan-out block junction 5 will have difference, still can't head it off.Given this, the fan-out block structure and the method that need to propose a kind of improvement are arranged, to improve the resistance value difference problem between adjacent fan-out block.
Summary of the invention
In view of the resistance value difference problem between adjacent fan-out block in traditional display panels, the objective of the invention is to propose a kind of display panels, the connection lead of its adjacent fan-out block junction has uniform resistance value, to guarantee the image display quality of display panels.
Another object of the present invention is to propose a kind of electronic installation and production method thereof, the connection lead of its adjacent fan-out block junction has uniform resistance value, to guarantee the operation quality of electronic installation.
According to above-mentioned purpose, the present invention proposes a kind of electronic installation and production method thereof with fan-out block of uniform impedance value.Wherein, the connection lead in the fan-out block has the first coiling bonding pad, the second coiling bonding pad at least, reaches the relaying bonding pad; Moreover the intercept that the adjacent outside of adjacent fan-out block connects the second coiling bonding pad of lead differs from one another.By this, it is approximately identical to make that the adjacent outside of above-mentioned fan-out block connects the resistance value of lead.
Description of drawings
Fig. 1 shows the infrabasal plate of general active-matrix liquid crystal display panel of thin film transistor.
Fig. 2 shows adjacent engaging zones, fan-out block, and the junction of adjacent fan-out block.
Fig. 3 shows the inner structure of the fan-out block of the embodiment of the invention.
Fig. 4 A shows adjacent engaging zones, fan-out block, and the junction of adjacent fan-out block.
The junction partial enlarged drawing of Fig. 4 B shows and adopts the designed adjacent fan-out block that goes out of classic method.
Fig. 5 shows the adjacent fan-out block according to a formed display panels of the embodiment of the invention.
Fig. 6 shows the adjacent fan-out block according to the formed display panels of another embodiment of the present invention.
The reference numeral explanation
The infrabasal plate of 1 display panels
5 adjacent fan-out block junctions
10 active area
12 data lines
14 gate lines
15 fan-out blocks
16 outer lead bonding lands
20,20a, 20b engaging zones
A, B fan-out block
The R100 first coiling bonding pad
R101 relaying bonding pad
The R102 second coiling bonding pad
The adjacent fan-out block of 4B junction
L connects lead
The P point of interface
The Q outer contact that winds the line
The virtual boundary line of X
The outer virtual connecting line of contact of Y
H, h intercept
La, La1 connect lead
Lb, Lb1 connect lead
Ha La is in the intercept of the second coiling bonding pad
Hb Lb is in the intercept of the second coiling bonding pad
Ha1 La1 is in the intercept of the second coiling bonding pad
Hb1 Lb1 is in the intercept of the second coiling bonding pad
Embodiment
The display panels that the embodiment of the invention is disclosed, except fan-out block, all the other are identical with the shown framework of Fig. 1, therefore continue to use this figure at this, and omit the description of respectively forming important document.Fig. 3 shows the inner structure of the fan-out block of the embodiment of the invention, it includes a plurality of connection lead L, each connects lead L and comprises three zones at least, be respectively: the first coiling bonding pad R100, it is connected to the joint sheet of engaging zones 20 (Fig. 1), thereby is electrically connected with drive integrated circult; The second coiling bonding pad R102, it is connected to data line 12 or gate line 14; And relaying bonding pad R101, it is between the first coiling bonding pad R100 and the second coiling bonding pad R102.In this example, the first coiling bonding pad R100 has less connection conductor spacing (pitch) with respect to the second coiling bonding pad R102.The point of interface of the second coiling bonding pad R102 and relaying bonding pad R101 is P, and it is positioned on the virtual boundary line X; The outer contact of the second coiling bonding pad R102 and data line 12, gate line 14 is Q, and it is positioned on the virtual connecting line Y of outer contact; Bee-line H between point of interface P and the outer contact Q (that is the distance between virtual boundary line X and the virtual connecting line Y of outer contact) then is defined as the intercept of the second coiling bonding pad R102.Use the mode of coiling in the second coiling bonding pad R102 or the first coiling bonding pad R100 or first and second coiling bonding pad (R100 and R102), for example adopt straight line, bow line, jaggies, line or its combination of crawling, with effective length or the resistance value that increases this bonding pad.In the present embodiment, though relaying bonding pad R101 does not use coiling (also being skew lines), yet also can wind the line according to demand and in addition.In addition, in the present embodiment each bonding pad in turning point (for example point of interface P) though locate to have obvious angle deviation, yet also may not have obvious deviation between each bonding pad, or or even continuous straight line.Moreover the virtual connecting line Y of outer contact of the second coiling bonding pad R102 and data line 12, gate line 14 is a perpendicular quadrature in the present embodiment, yet also can be the oblique mode.
Fig. 4 A shows adjacent engaging zones, fan-out block, and the junction 4B of adjacent fan-out block.Fig. 4 B show to adopt the junction partial enlarged drawing of the designed adjacent fan-out block that goes out of classic method.Different with the fan-out block of Fig. 3 embodiment of the invention is, adjacent two fan-out blocks that this is traditional, and it is mutually the same that its outside connects the intercept h of the second coiling bonding pad of lead.
Fig. 5 shows the adjacent fan-out block according to a formed display panels of the embodiment of the invention; Here only demonstrate the second coiling bonding pad and local relaying bonding pad, and omitted the first coiling bonding pad.It should be noted that, in the present invention, the intercept (Ha, Hb) of the second coiling bonding pad of two adjacent fan-out blocks is unequal, two particularly adjacent outsides connect the intercept difference of lead, make the resistance value of this adjacent connection lead approximately to equate or evenly, generally be meant to differ below 10 ohm.In the present embodiment method, an at first selected fan-out block (for example left fan-out block among the figure) forms another fan-out block in its adjacent side (for example figure the right) again as the reference fan-out block.In forming adjacent fan-out block process, draw the resistance value and the intercept Ha thereof that connect lead La with reference to the fan-out block outside earlier; When the resistance value of the adjacent connection lead Lb of adjacent fan-out block during less than the adjacent connection lead La of reference fan-out block, then the intercept Hb of adjacent fan-out block just be greater than with reference to fan-out block intercept Ha; Otherwise when the resistance value of the adjacent connection lead Lb of adjacent fan-out block during greater than the adjacent connection lead La of reference fan-out block, then the intercept Hb of adjacent fan-out block just is less than the intercept Ha with reference to fan-out block.After the intercept Hb that determines fan-out block, next then be the coiling design of carrying out this fan-out block inside, make in the fan-out block resistance value of adjacent connection lead reach evenly or resistance value difference each other not too large; Usually, the resistance value of the inner maximum of fan-out block can obtain an acceptable image display quality with the ratio of the resistance value of minimum less than 3 o'clock.During coiling, can wind the line prior to the second coiling bonding pad, when its intercept Hb did not apply use, continuing in the first coiling bonding pad wound the line again.Certainly, also can be earlier around the first coiling bonding pad, again around the second coiling bonding pad.About the coiling design, can adopt the general practice of tradition, for example use bow line, the jaggies or the line that crawls, also can be by changing coiling width, thickness or material to increase and decrease its resistance value.Though present embodiment with display panels as illustration, yet the present invention also goes for other electronic product, with so that the connection lead of adjacent fan-out block junction has uniform resistance value.
Among the embodiment shown in Figure 5, the intercept of inner each the connection lead of its fan-out block all equates each other, that is (left side) all equates with reference to all intercept Ha in the fan-out block, and all intercept Hb also equate in (right side) adjacent fan-out block; Yet the present invention also can design the connection lead of different intercepts, another embodiment as shown in Figure 6 according to demand in indivedual fan-out blocks.In this embodiment, except meeting the rule that the outside that the intercept Ha1 that connects lead La1 with reference to the outside of fan-out block is not equal to adjacent fan-out block connects the intercept Hb1 of lead Lb1, each intercept of indivedual fan-out block inside is also unequal, and its virtual boundary line presents a curve form.Same, this embodiment also can be so that the connection lead of adjacent fan-out block has the overall uniform resistance value to guarantee preferable image display quality.
The above is preferred embodiment of the present invention only, is not in order to limit claim of the present invention; All other do not break away from the equivalence of being finished under the spirit that invention discloses and change or modify, and all should be included in the claim of the present invention.
Claims (20)
1. electronic installation comprises:
One substrate, it comprises:
One active area has many control lines on it; And
Many engaging zones have many joint sheets on it;
At least two fan-out blocks, adjacent one another are and be connected between this control line and this joint sheet, each this fan-out block comprises many and connects leads, and each this connection lead comprises:
One first coiling bonding pad, it is connected to this joint sheet;
One second coiling bonding pad, it is connected to this control line; And
One relaying bonding pad, it is an intercept by wind the line point of interface to the distance of this active area of bonding pad of this relaying bonding pad and this second wherein between this first coiling bonding pad and this second coiling bonding pad;
The intercept that the adjacent outside of above-mentioned adjacent fan-out block connects the second coiling bonding pad of lead differs from one another, and by this, makes the adjacent outside of above-mentioned adjacent fan-out block connect the resistance value difference of lead less than 10 ohm.
2. many second coiling bonding pads that connect lead in the electronic installation as claimed in claim 1, wherein above-mentioned each fan-out block have identical intercept.
3. many second coiling bonding pads that connect lead in the electronic installation as claimed in claim 1, wherein above-mentioned each fan-out block have different intercepts.
4. electronic installation as claimed in claim 1, the second coiling bonding pad of wherein above-mentioned connection lead be shaped as straight line, bow line, sawtooth, crawl line or its combination.
5. electronic installation as claimed in claim 1, the first coiling bonding pad of wherein above-mentioned connection lead be shaped as straight line, bow line, sawtooth, crawl line or its combination.
6. electronic installation as claimed in claim 1, wherein above-mentioned control line are the data line of display panels.
7. electronic installation as claimed in claim 1, wherein above-mentioned control line are the gate line of display panels.
8. electronic installation as claimed in claim 1, wherein the resistance value of the adjacent connection lead of above-mentioned adjacent fan-out block is identical.
9. many in the electronic installation as claimed in claim 1, wherein above-mentioned each fan-out block connect lead and have the uniform impedance value.
10. many resistance values that connect lead in the electronic installation as claimed in claim 9, wherein above-mentioned each fan-out block, the ratio of its maximal value and minimum value is less than 3.
11. the production method such as impedance line such as grade of an electronic installation comprises:
One substrate is provided, and it comprises:
One active area has many control lines on it; And
Many engaging zones have many joint sheets on it;
Form one first fan-out block, be connected between this control line and this joint sheet, this first fan-out block comprises many and connects lead, and each this connection lead comprises:
One first coiling bonding pad, it is connected to this joint sheet;
One second coiling bonding pad, it is connected to this control line; And
One relaying bonding pad, it is an intercept by wind the line point of interface to the distance of this active area of bonding pad of this relaying bonding pad and this second wherein between this first coiling bonding pad and this second coiling bonding pad;
Form one second fan-out block, adjacent to this first fan-out block, wherein, this second fan-out block is connected the second coiling bonding pad of lead with the adjacent outside of this first fan-out block intercept differs from one another, by this, make the adjacent outside of above-mentioned first and second fan-out blocks connect the resistance value difference of lead less than 10 ohm; And
Formation winds the line in the second coiling bonding pad of this second fan-out block or the first coiling bonding pad.
12. as electronic installation as described in the claim 11 wait the impedance line production method, many second coiling bonding pads that connect leads of wherein above-mentioned first fan-out block or second fan-out block have identical intercept.
13. as electronic installation as described in the claim 11 wait the impedance line production method, many second coiling bonding pads that connect leads of wherein above-mentioned first fan-out block or second fan-out block have different intercepts.
14. as electronic installation as described in the claim 11 wait the impedance line production method, the coiling of the wherein above-mentioned second coiling bonding pad is shaped as straight line, bow line, sawtooth, crawl line or its combination.
15. as electronic installation as described in the claim 11 wait the impedance line production method, the coiling of the wherein above-mentioned first coiling bonding pad is shaped as straight line, bow line, sawtooth, crawl line or its combination.
16. as electronic installation as described in the claim 11 wait the impedance line production method, wherein above-mentioned coiling system at first forms coiling in the second coiling bonding pad, form coiling again in the first coiling bonding pad.
17. as electronic installation as described in the claim 11 wait the impedance line production method, wherein above-mentioned coiling system at first forms coiling in the first coiling bonding pad, form coiling again in the second coiling bonding pad.
18. as electronic installation as described in the claim 11 wait the impedance line production method, wherein above-mentioned first fan-out block is identical with the resistance value of the adjacent connection lead of this second fan-out block.
19. as electronic installation as described in the claim 11 wait the impedance line production method, many in each fan-out block of wherein above-mentioned first fan-out block or this second fan-out block connect leads and have the uniform impedance value.
20. as electronic installation as described in the claim 19 wait the impedance line production method, the connection lead resistance value in each fan-out block of wherein above-mentioned first fan-out block or this second fan-out block, the ratio of its maximal value and minimum value is less than 3.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100680227A CN100552516C (en) | 2006-03-23 | 2006-03-23 | Electronic installation with fan-out block of uniform impedance value |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100680227A CN100552516C (en) | 2006-03-23 | 2006-03-23 | Electronic installation with fan-out block of uniform impedance value |
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| Publication Number | Publication Date |
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| CN1847965A CN1847965A (en) | 2006-10-18 |
| CN100552516C true CN100552516C (en) | 2009-10-21 |
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| CNB2006100680227A Expired - Fee Related CN100552516C (en) | 2006-03-23 | 2006-03-23 | Electronic installation with fan-out block of uniform impedance value |
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Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101923258B (en) * | 2009-06-11 | 2012-02-01 | 华映视讯（吴江）有限公司 | liquid crystal display device and display panel thereof |
| CN102798994B (en) * | 2011-05-25 | 2016-05-18 | 上海中航光电子有限公司 | LCD (Liquid Crystal Display) array substrate distribution structure |
| CN103325331A (en) * | 2011-07-23 | 2013-09-25 | 华映光电股份有限公司 | Array substrate of flat display panel |
| CN102402963B (en) * | 2011-12-02 | 2013-06-05 | 深圳市华星光电技术有限公司 | Drive circuit and drive method for liquid crystal display |
| CN104062789A (en) * | 2014-07-21 | 2014-09-24 | 深圳市华星光电技术有限公司 | Display device |
| CN107393415B (en) * | 2017-08-08 | 2020-03-31 | 惠科股份有限公司 | Display panel and display device |
| CN110109302A (en) * | 2019-04-02 | 2019-08-09 | 滁州惠科光电科技有限公司 | Array substrate, display panel and display device |
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| CN1847965A (en) | 2006-10-18 |
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