CN100543620C - A kind of automatic processing device of semiconductor manufacture process event and method - Google Patents
A kind of automatic processing device of semiconductor manufacture process event and method Download PDFInfo
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- CN100543620C CN100543620C CNB200510126372XA CN200510126372A CN100543620C CN 100543620 C CN100543620 C CN 100543620C CN B200510126372X A CNB200510126372X A CN B200510126372XA CN 200510126372 A CN200510126372 A CN 200510126372A CN 100543620 C CN100543620 C CN 100543620C
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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Abstract
The present invention relates to a kind of automatic processing device and method of semiconductor manufacture process event, this device comprises central incident terminal apparatus, some distributed incident distributors and some event handlers.Central authorities' incident terminal apparatus is responsible for the variety classes semiconductor manufacture process event that comes from dissimilar semiconductor processing equipments is carried out centralized management, and be distributed to corresponding distributed incident distributor, the semiconductor manufacture process event that distributed incident distributor the sends central incident terminal apparatus branch events corresponding processor separately of reallocating, event handler is handled the semiconductor manufacture process event that distributed incident distributor is sent.The present invention takes the mode of " centralized management; distributed treatment " this combination of centralization and decentralization, distributed parallel treatment process incident, can effectively avoid the process event queuing, can improve the efficient of automatic processing semiconductor manufacture process event, thereby further improve the throughput rate of whole semiconductor processing and manufacturing.
Description
Technical field
The present invention relates to semiconductor fabrication process technology, particularly a kind of automatic processing device of semiconductor manufacture process event and method.
Background technology
In field of semiconductor processing, give in the semiconductor standard (SEMI) cluster device (ClusterTool) under definition be: by physically linking together, can be used for handling the integrated manufacturing system of different process module and transport module.Each technical module and transport module are all controlled by corresponding controller, and these module controllers connect into an organic whole by interface module.
Semiconductor cluster device Control Software System comprises three big modules: cluster device controller (CTC, Cluster Tool Controller), technical module controller (PMC, ProcessModule Controller), transport module controller (TMC, Transport ModuleController), link together by the corresponding interface module again between this three big module.Its general structure as shown in Figure 1.
Technical module controller (PMC) and transport module controller (TMC) are in charge of and are coordinated to cluster device controller (CTC), and its major function is to carry out process task (Job), and the maintenance operating process relevant with task.A task is sent into material one or more technological reaction chambers from source film magazine (SourceCassette) exactly, through PROCESS FOR TREATMENT, is sent to the process of purpose film magazine (Destination Cassette) again.
Technical module controller (PMC) mainly is responsible for the associative operation of CONTROL PROCESS module.
Transport module controller (TMC) mainly is responsible for the operation of control transmission module and correlation module thereof.
Technical module controller (PMC) all passes through the control of I/O passage realization to the controlled device that links to each other with transport module controller (TMC).
In the conventional semiconductor manufacturing system, therefore all process event cause the queuing phenomena in the process event processing all by CTC centralized management and processing, have reduced the process event treatment effeciency.
Summary of the invention
The technical matters that solves
Handle queuing phenomena for fear of process event, automatic processing device and the method that a kind of a kind of semiconductor manufacture process event based on " centralized management; distributed treatment " mode is provided of the present invention, the ability of technique for parallel processing incident is provided for semiconductor processing equipment, improve the efficient of handling semiconductor manufacture process event automatically, thereby further improve the throughput rate of whole semiconductor processing and manufacturing.
Technical scheme
In the semiconductor fabrication process process, polytype semiconductor processing equipment can produce the semiconductor manufacture process event of number of different types, these process event itself much can be handled and parallel processing simultaneously by the different event processor, and automatic processing device of the present invention is as follows:
A kind of automatic processing device of semiconductor manufacture process event, comprise central incident terminal apparatus, some distributed incident distributors, some Operation Processors, central authorities' incident terminal apparatus is responsible for the variety classes semiconductor manufacture process event that comes from dissimilar semiconductor processing equipments is carried out centralized management, and be distributed to corresponding distributed incident distributor, distributed incident distributor is the corresponding separately Operation Processor of semiconductor manufacture process event reallocation that central incident terminal apparatus branch sends, and Operation Processor is responsible for handling the semiconductor manufacture process event that distributed incident distributor is sent.
Wherein, distributed incident distributor has technical module (PM) incident distributor and transport module (TM) incident distributor two classes.
Wherein, each distributed incident distributor can corresponding some Operation Processors, process event is distributed to corresponding event handler handles.
A kind of automatic processing method of semiconductor manufacture process event comprises:
The semiconductor manufacture process event that comes from semiconductor processing equipment is managed concentratedly by central incident terminal apparatus;
Central authorities' incident terminal apparatus is distributed to some distributed incident distributors with semiconductor manufacture process event and handles;
Distributed incident distributor is distributed to some Operation Processors with each process event and handles;
The process event that each Operation Processor processing events distributor is sent.
Wherein, distributed incident distributor is divided into technical module (PM) incident distributor and transport module (TM) incident distributor two classes, central authorities' incident terminal apparatus is divided into technical module (PM) incident and transport module (TM) incident two classes with semiconductor manufacture process event, technical module (PM) incident is distributed to technical module (PM) incident distributor handles, transport module (TM) incident is distributed to transport module (TM) incident distributor handles.
Wherein, for a process event, can reasonably customize " distributed incident distributor " and the number and the mutual relationship of " Operation Processor " of its correspondence according to the actual process needs.Actual process needs and can be proposed by system user such as technologist.
Beneficial effect
Apparatus and method of the present invention, take the mode of " centralized management; distributed treatment " this combination of centralization and decentralization, distributed parallel treatment process incident, can effectively avoid the process event queuing, can improve the efficient of automatic processing semiconductor manufacture process event, thereby further improve the throughput rate of whole semiconductor processing and manufacturing.
Description of drawings
Fig. 1 is a semiconductor cluster device Control Software System overall construction drawing;
Fig. 2 is automatic processing device structure of the present invention and processing flow chart;
Embodiment
Following examples are used to illustrate the present invention; but be not used for limiting the scope of the invention; the those of ordinary skill in relevant technologies field; under the situation that does not break away from the spirit and scope of the present invention; can also make various variations and modification; therefore all technical schemes that are equal to also belong to category of the present invention, and scope of patent protection of the present invention should be limited by every claim.
With reference to figure 2, the automatic processing device for a kind of semiconductor manufacture process event comprises: central incident terminal apparatus, distributed incident distributor, Operation Processor.
Central authorities' incident terminal apparatus: its better function ratio is " tourism collecting and distributing centre ", the variety classes semiconductor manufacture process event that comes from dissimilar semiconductor processing equipments is carried out centralized management, and being distributed to corresponding " distributed incident distributor ", this process mainly is that the two big class process event that will come from PM and TM are separated.
Distributed incident distributor: its major function is a secondary distribution, just, for " central incident terminal apparatus " divides the semiconductor manufacture process event reallocation that sends corresponding separately Operation Processor, an incident can be handled by a plurality of Operation Processors.Distributed incident distributor is divided into PM incident distributor and TM incident distributor two classes, and PM incident distributor is handled the PM incident that central incident terminal apparatus branch is sent, and TM incident distributor is handled the TM incident that central incident terminal apparatus branch is sent.
Operation Processor: handle the semiconductor manufacture process event that " distributed incident distributor " sent.
Among the figure, " X incident N " represents a process event, and wherein, X represents dissimilar semiconductor processing equipments, and N represents dissimilar semiconductor manufacture process events
For a general process event, it mainly triggers three major types operation: 1. interface processing: show or empty the state of relevant process data, control related interfaces element, as the change color of available/unavailable, the animated element of order button and change in location or the like.2. data storage: with certain storage mode (such as text formatting) record related process parameter information.3. feed back to semiconductor equipment: the processing step of indicating next step to carry out.
Therefore, for a general process event, corresponding at least one " distributed incident distributor ", and three " Operation Processor " are to handle each process event.
We can define one " distributed incident distributor ", and three corresponding " Operation Processor "; And, can reasonably customize " distributed incident distributor " and the number and the mutual relationship of " Operation Processor " of its correspondence according to the actual process demand of system user (as the technologist) proposition for other special process event of an example in other words.We can define the quantity and the corresponding relation of its " distributed incident distributor " and " Operation Processor " as one sees fit.In other words, which type of process event which distributed incident distributor central authorities' incident terminal apparatus issue to, and which type of process event which Operation Processor distributed incident distributor distribute to and handle, and all designs according to process requirements.
Be example with " technology End Event " below, describe said apparatus and handle this process event method and process." technology End Event " required operation of carrying out has three parts: 1. interface processing: empty the information such as End Type, Step Time on the main operation interface, and make technological process Abort button unavailable.2. data storage: information such as recording process concluding time.3. feedback indication: indication PM closes the pendulum valve earlier, opens the Bypass valve then, rises pin, indicates TM that the wafer in the reaction chamber is taken out at last, sends back among the Cassette.
" technology End Event " processing procedure is as follows:
Whole technological process in reaction chamber finishes, and PM sends " technology End Event " to CTC, and this is the PM incident, and this incident is caught and handled to central incident terminal apparatus;
Central authorities' incident terminal apparatus is distributed to one " PM incident distributor " with it, respectively corresponding interface processing module, data memory module and feedback indicating module;
" PM incident distributor " finds corresponding " Operation Processor " respectively is that corresponding operational processes function is handled accordingly to this process event.
The contents processing of each Operation Processor is as follows:
Interface processing operation: empty End Type, Step Time information on the main operation interface, make technological process Abort button unavailable.
Data storage operations: recording process concluding time information.
Feedback indication operation: indication PM closes the pendulum valve earlier, opens the Bypass valve then, rises pin, indicates TM that the wafer in the reaction chamber is taken out at last, sends back among the Cassette.
An equipment has a plurality of technical modules (being reaction chamber), and the process event that top " technology End Event " example is only sent with regard to one of them technical module is an example.Each technical module all can send this incident when the reaction chamber technological process finishes, if a plurality of technical modules are carrying out technological process simultaneously, the parallel processing process of a plurality of identical or different process event (not merely being this process event) of different process module will appear coming from.On the whole, its flow process is just as Fig. 2.
For all process event, all according to above-mentioned processing procedure, managing and be distributed to distributed incident distributor concentratedly by central incident terminal apparatus handles, the mode of this " centralized management; distributed treatment " this combination of centralization and decentralization, for semiconductor processing equipment provides a kind of ability of technique for parallel processing incident, can effectively improve the efficient of automatic processing semiconductor manufacture process event, thereby further improve the throughput rate of whole semiconductor processing and manufacturing.
" distributed treatment " then can effectively avoid the queuing in the process event processing to take place, and " Operation Processor " of number of different types can be handled the process event of number of different types simultaneously.
For same incident, can trigger a plurality of treatment schemees simultaneously, and these a plurality of treatment schemees can executed in parallel.
Secondary distribution also can improve the treatment effeciency of process event, and is corresponding because each module burden of being responsible for distribute work has alleviated, and will accelerate the processing speed of process event.
Therefore, the treatment effeciency of semiconductor manufacture process event can be greatly improved.
Claims (6)
1, a kind of automatic processing device of semiconductor manufacture process event, comprise: central incident terminal apparatus, some distributed incident distributors, some Operation Processors, central authorities' incident terminal apparatus is responsible for the variety classes semiconductor manufacture process event that comes from dissimilar semiconductor processing equipments is carried out centralized management, and be distributed to corresponding distributed incident distributor, distributed incident distributor is the corresponding separately Operation Processor of semiconductor manufacture process event reallocation that central incident terminal apparatus branch sends, and Operation Processor is responsible for handling the semiconductor manufacture process event that distributed incident distributor is sent.
2, the automatic processing device of semiconductor manufacture process event as claimed in claim 1 is characterized in that, described distributed incident distributor has technical module incident distributor and transport module incident distributor two classes.
3, the automatic processing device of semiconductor manufacture process event as claimed in claim 1 is characterized in that, each distributed incident distributor can corresponding some event handlers, and process event is distributed to the respective operations processor processing.
4, a kind of automatic processing method of semiconductor manufacture process event of the arbitrary described automatic processing device that uses claim 1 to 3 comprises:
The semiconductor manufacture process event that comes from semiconductor processing equipment is managed concentratedly by central incident terminal apparatus;
Central authorities' incident terminal apparatus is distributed to some distributed incident distributors with semiconductor manufacture process event and handles;
Distributed incident distributor is distributed to some Operation Processors with each process event;
The process event that each Operation Processor processing events distributor is sent.
5, the automatic processing method of semiconductor manufacture process event as claimed in claim 4, it is characterized in that, distributed incident distributor is divided into technical module incident distributor and transport module incident distributor two classes, central authorities' incident terminal apparatus is divided into technical module incident and transport module incident two classes with semiconductor manufacture process event, the technical module incident is distributed to technical module incident distributor, the transport module incident is distributed to transport module incident distributor.
6, the automatic processing method of semiconductor manufacture process event as claimed in claim 4, it is characterized in that, for a process event,, customize " distributed incident distributor " and the number and the mutual relationship of " Operation Processor " of its correspondence according to the actual process requirement.
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| Application Number | Priority Date | Filing Date | Title |
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| CNB200510126372XA CN100543620C (en) | 2005-12-08 | 2005-12-08 | A kind of automatic processing device of semiconductor manufacture process event and method |
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| CNB200510126372XA CN100543620C (en) | 2005-12-08 | 2005-12-08 | A kind of automatic processing device of semiconductor manufacture process event and method |
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| CN100543620C true CN100543620C (en) | 2009-09-23 |
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| CN102566521A (en) * | 2010-12-23 | 2012-07-11 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Factory automation system and automation message processing method and device |
| CN104811416A (en) * | 2014-01-23 | 2015-07-29 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Method and system for processing FA system message |
| CN103941674B (en) * | 2014-03-27 | 2016-06-15 | 上海华力微电子有限公司 | A kind of method for designing of multichannel management and control technological process |
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Address after: 100176 8 Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Beijing North China microelectronics equipment Co Ltd Address before: 100016 Jiuxianqiao East Road, Chaoyang District, Chaoyang District, Beijing Patentee before: Beifang Microelectronic Base Equipment Proces Research Center Co., Ltd., Beijing |
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