CN100542816C - 堆栈式喷墨头芯片结构 - Google Patents
堆栈式喷墨头芯片结构 Download PDFInfo
- Publication number
- CN100542816C CN100542816C CNB2003101171610A CN200310117161A CN100542816C CN 100542816 C CN100542816 C CN 100542816C CN B2003101171610 A CNB2003101171610 A CN B2003101171610A CN 200310117161 A CN200310117161 A CN 200310117161A CN 100542816 C CN100542816 C CN 100542816C
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- CN
- China
- Prior art keywords
- hole
- chip structure
- stacked
- fluid
- head chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012530 fluid Substances 0.000 claims abstract description 22
- 238000005530 etching Methods 0.000 claims abstract description 14
- 239000000853 adhesive Substances 0.000 claims abstract 4
- 230000001070 adhesive effect Effects 0.000 claims abstract 4
- 239000007921 spray Substances 0.000 claims description 25
- 239000000919 ceramic Substances 0.000 claims description 4
- 239000011248 coating agent Substances 0.000 claims description 4
- 238000000576 coating method Methods 0.000 claims description 4
- 239000000758 substrate Substances 0.000 claims description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical group [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 claims description 2
- 239000010703 silicon Substances 0.000 claims description 2
- 238000004806 packaging method and process Methods 0.000 claims 1
- 230000000149 penetrating effect Effects 0.000 claims 1
- 238000001039 wet etching Methods 0.000 claims 1
- 239000000463 material Substances 0.000 description 37
- 239000007767 bonding agent Substances 0.000 description 13
- 239000000203 mixture Substances 0.000 description 10
- 238000013461 design Methods 0.000 description 7
- 238000000034 method Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 210000001161 mammalian embryo Anatomy 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 230000035882 stress Effects 0.000 description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 3
- 206010003497 Asphyxia Diseases 0.000 description 2
- 238000002309 gasification Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 239000012190 activator Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 230000009916 joint effect Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000012797 qualification Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000008646 thermal stress Effects 0.000 description 1
Images
Landscapes
- Particle Formation And Scattering Control In Inkjet Printers (AREA)
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2003101171610A CN100542816C (zh) | 2003-12-02 | 2003-12-02 | 堆栈式喷墨头芯片结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2003101171610A CN100542816C (zh) | 2003-12-02 | 2003-12-02 | 堆栈式喷墨头芯片结构 |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1623783A CN1623783A (zh) | 2005-06-08 |
CN100542816C true CN100542816C (zh) | 2009-09-23 |
Family
ID=34760916
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2003101171610A Expired - Fee Related CN100542816C (zh) | 2003-12-02 | 2003-12-02 | 堆栈式喷墨头芯片结构 |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100542816C (zh) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN111016432A (zh) * | 2019-12-19 | 2020-04-17 | 西安增材制造国家研究院有限公司 | 一种压电式打印头及其制作方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5855713A (en) * | 1993-10-22 | 1999-01-05 | Xaar Technology Limited | Method of making a multi-channel droplet deposition apparatus |
US6134761A (en) * | 1994-10-17 | 2000-10-24 | Seiko Epson Corporation | method of manufacturing multi-layer type ink jet recording head |
US6536879B2 (en) * | 2000-09-22 | 2003-03-25 | Brother Kogyo Kabushiki Kaisha | Laminated and bonded construction of thin plate parts |
-
2003
- 2003-12-02 CN CNB2003101171610A patent/CN100542816C/zh not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5855713A (en) * | 1993-10-22 | 1999-01-05 | Xaar Technology Limited | Method of making a multi-channel droplet deposition apparatus |
US6134761A (en) * | 1994-10-17 | 2000-10-24 | Seiko Epson Corporation | method of manufacturing multi-layer type ink jet recording head |
US6536879B2 (en) * | 2000-09-22 | 2003-03-25 | Brother Kogyo Kabushiki Kaisha | Laminated and bonded construction of thin plate parts |
Also Published As
Publication number | Publication date |
---|---|
CN1623783A (zh) | 2005-06-08 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: YULIN TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: CORPORATE BODY INDUSTRY TECHNOLOGY RESEARCH INSTITUTE Effective date: 20100510 |
|
C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: HSINCHU COUNTY, TAIWAN PROVINCE TO: TAIPEI CITY, TAIWAN PROVINCE, CHINA |
|
TR01 | Transfer of patent right |
Effective date of registration: 20100510 Address after: Taipei City, Taiwan, China Patentee after: Institute for Information Industry Address before: Hsinchu County of Taiwan Province Patentee before: Industrial Technology Research Institute |
|
C17 | Cessation of patent right | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090923 Termination date: 20121202 |