CN100539811C - Fastly recovering circuit board, clamping and cutting circuit board block method and circuit substrate - Google Patents
Fastly recovering circuit board, clamping and cutting circuit board block method and circuit substrate Download PDFInfo
- Publication number
- CN100539811C CN100539811C CNB2005101070854A CN200510107085A CN100539811C CN 100539811 C CN100539811 C CN 100539811C CN B2005101070854 A CNB2005101070854 A CN B2005101070854A CN 200510107085 A CN200510107085 A CN 200510107085A CN 100539811 C CN100539811 C CN 100539811C
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- Prior art keywords
- circuit board
- circuit
- circuit substrate
- board block
- substrate
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Abstract
The invention provides a kind of fastly recovering circuit board, be not only applicable to general as square regular shape circuit board, more can be used in as circle, parabolic shape, the irregular circuit board that waits special shape, and by simple and easy cutting mode that the present invention used, can be with circuit board by taking out apace in the circuit substrate, so can save the work board because of the complex distributions of brace repeatedly to search and to locate the spent time, and can effectively avoid distribution because of brace to cause error on cutting or engaging, and then the yield when significantly promoting circuit board and reclaiming processing procedure.
Description
Technical field
The present invention applies to the recovery processing procedure of circuit board, particularly can carry out fly-cutting and engage at having special formed circuit board, to reach the purpose that reclaims the non-defective unit circuit board.
Background technology
Contain several circuit boards in the common circuit substrate (panel) of industry, if when in the circuit substrate processing procedure, recording the circuit board that includes defective products being arranged, then this circuit substrate is scrapped, cause the waste of other non-defective unit circuit board on this circuit substrate, for to refill the quantity of scrapping circuit substrate, then need produce circuit substrate again simultaneously to reach target output.In order not cause waste and to save time and the cost produce circuit substrate institute palpus again, existing at present many relevant invention cases are disclosed, for example in " manufacture method of circuit board " of TW patent announcement number No. 443081, disclose a kind of manufacture method of circuit board, this method comprises: the sub-circuit board that (a) is manufactured with a plurality of homotypes on a large-area substrate simultaneously, and go out the profile of sub-circuit board with the shaping punch die, or drag for bed with CNC and pull the profile of sub-circuit board out, and make that articulating has a plurality of braces between this sub-circuit board and the substrate; (b) each sub-circuit board with above-mentioned substrate passes through circuit test; (c) if on substrate, there is a sub-circuit board to damage, then cut off module the sub-circuit board of damage and the brace between the substrate are thrust with one, take off with the sub-circuit board that will damage, make this substrate stay the same hole; (d) dash with a refine module again and repair brace; (e) sweep away the non-defective unit sub-circuit board of repairing usefulness at a standby substrate with a shearing die piece in addition; (f) the non-defective unit sub-circuit board that will repair usefulness again guides to it in sample hole of substrate with a fixture, and the non-defective unit sub-circuit board of this repairing usefulness must be positioned in the sample hole, so that its gluing is fixed in the sample hole of substrate, so that the substrate that Replacement and Repair damage.
But because electronic now popularizing, make electronic product become more diversified, also therefore, important core device--the circuit board of electronic product, to be made into shape miscellaneous according to the kenel of electronic product, for example circle, polygon, parabola shaped, streamlined etc., more very have many irregularly shaped, cause dealer's difficulty during fabrication, therefore the situation of defective products appearred in the circuit board of the special appearance of tool on circuit substrate more easily, and then the volume of goods flow that makes this type of circuit board need reclaim processing procedure again heightens.
Yet just therefore the appearance of class circuit board is special, improves the degree of difficulty that circuit board reclaims more, and causes the dealer can't utilize regular circuit board recovery method as above-mentioned " manufacture method of circuit board " easily.This is when being placed in the circuit substrate because of circuit board, be to join by several braces and circuit substrate, and in fastly recovering circuit board, no matter be that this type of circuit board is taken out by circuit substrate, or this type of circuit board put in the telegram in reply base board, all need earlier a plurality of braces to irregular distribution to cut or bonding.
Therefore, when the moulding of circuit board more is special, more to be the taking-up that is difficult to carry out circuit board with general process work bench by accurate localization close with putting to after-tack in the distribution of its brace, so not only cause the error of reclaiming on the processing procedure easily, more can in the brace of a plurality of dispersions of the accurate searching of process work bench, waste many times.If because of the moulding of circuit board special, make when the dealer is reluctant to reclaim because of considering spent time of recovery processing procedure and cost, the bad phenomenon that promptly abandons of this type of circuit board product will be produced once more, so not only waste resource, more the garbage problem that can cause many waste products to abandon causes one in the society to bear greatly.
Be relevant to fastly recovering circuit board in the known technology only at circuit board, but possibly can't provide comprehensively and total solution for the recovery processing procedure of special shape circuit board now with regular shape.Therefore, provide a kind of perfect fastly recovering circuit board to have very active demand.
Summary of the invention
Main purpose of the present invention is to provide a kind of fastly recovering circuit board, no matter be have general as square aspect regular shape or as the circuit board of special shapes such as circle, polygon, parabola shaped, streamlined, all can utilize fastly recovering circuit board of the present invention to put in the telegram in reply base board by circuit substrate taking-up circuit board and with circuit board apace.
Secondary objective of the present invention is to utilize fastly recovering circuit board of the present invention, discard because of reclaiming to avoid a large amount of non-defective unit circuit boards, and then save and produce required time of circuit board and cost again, and can effectively reach the effect that resource reclaims, use promoting whole industrial competitiveness.
Another object of the present invention is to use a clamping and cutting circuit board block method, make circuit substrate and circuit board block increase the convenience that contraposition engages, and the contract density of raising circuit board block when engaging with circuit substrate.
Another purpose of the present invention is to provide a kind of circuit substrate, and the circuit board in the circuit board block can be taken out or insert fast, reclaims processing procedure to finish circuit board fast.
The present invention is relevant for a kind of fastly recovering circuit board, at first the defective products circuit board block in one first circuit substrate is downcut, lack the piece place to form one, wherein, this defective products circuit board block includes a defective products circuit board, a plurality of braces that are connected with this defective products circuit board and part first circuit substrate, again the non-defective unit circuit board block in the second circuit substrate is downcut, wherein, the shape of this non-defective unit circuit board block is similar to this scarce piece place shape of this first circuit substrate, and this non-defective unit circuit board block includes a non-defective unit circuit board, a plurality of braces that are connected with this non-defective unit circuit board and part second circuit substrate, that at last this non-defective unit circuit board block is put back and is engaged in this first circuit substrate should lack the piece place, this first circuit substrate is become be complete first circuit substrate of non-defective unit circuit board entirely.
In addition, the present invention also provides a kind of clamping and cutting circuit board block method, utilization clamping and cutting mode is to cut a tertiary circuit plate square on a circuit substrate, make this tertiary circuit plate square have a public snap-in structure, and allow this circuit substrate have and close structure with the corresponding master card of this public affairs snap-in structure, wherein, this tertiary circuit plate square includes a tertiary circuit plate, a plurality of braces that are connected with this tertiary circuit plate and part circuit substrate.
Be familiar with this skill personage and understand purpose of the present invention, feature and effect for making,, and cooperate appended accompanying drawing, the present invention is illustrated in detail now by following specific embodiment.
Description of drawings
Fig. 1 is the flow chart of a preferred embodiment of the present invention;
Fig. 2 is the schematic perspective view one of a preferred embodiment of the present invention;
Fig. 3 is the schematic perspective view two of a preferred embodiment of the present invention;
Fig. 4 is the schematic perspective view three of a preferred embodiment of the present invention;
Fig. 5 is the schematic perspective view of another preferred embodiment of the present invention;
Fig. 6 is the schematic perspective view of the another preferred embodiment of the present invention.
Symbol description among the figure:
S1 downcuts the defective products circuit board block by first circuit substrate
S2 downcuts the non-defective unit circuit board block by the second circuit substrate
S3 is engaged in the non-defective unit circuit board block at the scarce piece place of first circuit substrate
1 first circuit substrate
10 first location holes
12 defective products circuit board blocks
12A lacks the piece place
122 defective products circuit boards
124 first braces
126 parts, first circuit substrate
2 second circuit substrates
20 second location holes
22 non-defective unit circuit board blocks
222 non-defective unit circuit boards
224 second braces
226 part second circuit substrates
3 tertiary circuit substrates
32 tertiary circuit plate squares
322 tertiary circuit plates
323 the 3rd public snap-in structures
324 the 3rd braces
326 part tertiary circuit substrates
343 the 3rd master cards are closed structure
4 the 4th circuit substrates
42 the 4th circuit board blocks
422 the 4th circuit boards
423 the 4th public snap-in structures
424 the 4th braces
426 parts the 4th circuit substrate
443 the 4th master cards are closed structure
Embodiment
See also Fig. 1 and Fig. 2, Fig. 1 is the flow chart of a preferred embodiment of the present invention, and Fig. 2 is the schematic perspective view one of a preferred embodiment of the present invention.The present invention is relevant for a kind of fastly recovering circuit board, at first seek plural number first location hole 10 on one first circuit substrate 1, then position search with the locating module that a cutting device (not shown) is provided by this first location hole 10, wherein, this cutter sweep accurate control system (not shown) of can arranging in pairs or groups, as CNC system (Computer NumericalControl), and configurable at least one phtographic lens (not shown), this phtographic lens can be down one of array apparatus: the CMOS camera lens, the CCD camera lens, Super CCD camera lens or VPS camera lens, so that carry out fast and accurately positioning searching, in addition, this cutter sweep can be down one of array apparatus: the CNC processing machine, laser cutting machine, mould cutter group.Use the cutting module of this cutter sweep the defective products circuit board block 12 in this first circuit substrate 1 to be downcut (S1) subsequently with linear fashion, lack the 12A of piece place and in this first circuit substrate 1, stay one, wherein, this defective products circuit board block 12 includes a defective products circuit board 122, a plurality of first braces 124 that are connected with this defective products circuit board 122 and part first circuit substrate 126.
See also Fig. 3, Fig. 3 is the schematic perspective view two of a preferred embodiment of the present invention.Use this cutter sweep to seek plural number second location hole 20 on the second circuit substrate 2 again, position search by second location hole 20 with the locating module that this cutter sweep is provided, use the cutting module of this cutter sweep the non-defective unit circuit board block 22 in this second circuit substrate 2 to be downcut (S2) (seeing also shown in Figure 1) with linear fashion thereupon, wherein, the shape of this non-defective unit circuit board block 22 is similar to the scarce 12A of the piece place shape of being somebody's turn to do of this first circuit substrate 1, and this non-defective unit circuit board block 22 includes a non-defective unit circuit board 222, a plurality of second braces 224 that are connected with this non-defective unit circuit board 222 and part second circuit substrate 226.
See also Fig. 4, Fig. 4 is the schematic perspective view three of a preferred embodiment of the present invention.Next use a coupling device to seek this first location hole 10 on this first circuit substrate 1, position search by this first location hole 10 with the locating module that this coupling device is provided, use the patch module of this coupling device that this non-defective unit circuit board block 22 is engaged in the scarce 12A of piece place (S3) (seeing also shown in Figure 1) of being somebody's turn to do of this first circuit substrate 1 again, this first circuit substrate 1 is become be complete first circuit substrate 1 of non-defective unit circuit board entirely.
When if this first circuit substrate 1 of the present invention has an above defective products circuit board 122, still can use said method to take out defective products circuit board block 12 and refill non-defective unit circuit board block 22, and then form a complete non-defective unit circuit substrate.
Palpus attention person, it is example that above-mentioned cutter sweep from top to bottom runs through cutting mode with the upper surface direction perpendicular to circuit substrate 1,2, right real make to go up its cutting mode and can arrange in pairs or groups any clamping and cutting method of utilization increasing the contraposition convenience that non-defective unit circuit board block 22 engages with first circuit substrate 1, as double wedge shape, zigzag, parabolic shape, kite shape dentation, cut sth. askew that all do not have into the formed clamping and cutting method such as planar of cutting sth. askew of the upper surface of circuit substrate can not.
See also Fig. 5, Fig. 5 is the schematic perspective view of another preferred embodiment of the present invention.The present invention also provides a kind of clamping and cutting circuit board block method, in a tertiary circuit substrate 3 collocation utilization clamping and cutting modes, upper surface in this tertiary circuit substrate 3 from top to bottom runs through cutting one tertiary circuit plate square 32, make this tertiary circuit substrate 3 have one the 3rd master card and close structure 343, and allow this tertiary circuit plate square 32 have and close structure 343 corresponding one the 3rd public snap-in structures 323 with the 3rd master card, when being engaged with this tertiary circuit plate square 32, this tertiary circuit substrate 3 increases the convenience of this tertiary circuit substrate 3 and these tertiary circuit plate square 32 contrapositions, and the contract density when improving this tertiary circuit plate square 32 and engaging with this tertiary circuit substrate 3, wherein, this tertiary circuit plate square 32 comprises a tertiary circuit plate 322, a plurality of the 3rd braces 324 that are connected with this tertiary circuit plate 322 and part tertiary circuit substrate 326, in addition, the 3rd public snap-in structure 323 and the 3rd master card are closed structure 343 and can be arranged in pairs or groups mutually and be one of following shape: zigzag, parabolic shape, the double wedge shape, kite shape dentation, cut sth. askew into a upper surface of this tertiary circuit substrate 3 formed cut sth. askew planar.
See also Fig. 6, Fig. 6 is the schematic perspective view of the another preferred embodiment of the present invention.The present invention also provides a kind of clamping and cutting circuit board block method, in one the 4th circuit substrate, 4 collocation utilization clamping and cutting modes, end side surface in the 4th circuit substrate 4 penetrates the other end side that is cut to the 4th circuit substrate 4, to take off one the 4th circuit board block 42, make the 4th circuit substrate 4 have one the 4th master card and close structure 443, and allow the 4th circuit board block 42 have and close structure 443 corresponding one the 4th public snap-in structures 423 with this master card, when being engaged with the 4th circuit board block 42, the 4th circuit substrate 4 increases the convenience of the 4th circuit substrate 4 and 42 contrapositions of the 4th circuit board block, and the contract density when improving the 4th circuit board block 42 and engaging with the 4th circuit substrate 4, wherein, the 4th circuit board block 42 comprises one the 4th circuit board 422, a plurality of the 4th braces 424 that are connected with the 4th circuit board 422 and part the 4th circuit substrate 426, in addition, the 4th public snap-in structure 423 closes structure 443 with the 4th master card and can comprise following one of the shape that forms: zigzag, parabolic shape, the double wedge shape, kite shape dentation, cut sth. askew into a upper surface of the 4th circuit substrate 4 formed cut sth. askew planar.
In sum, because fastly recovering circuit board of the present invention reaches associated methods easily with easy regular shape cutting mode, with circuit board by separating in the circuit substrate, so need not be along the shape of circuit board and the brace of circuit board is cut or engages, can save process work bench because of the complex distributions of brace repeatedly to search and to locate the spent time, and can effectively avoid distribution because of brace to cause error on cutting or engaging, and then the yield when significantly promoting circuit board and reclaiming processing procedure.And no matter the shape of the circuit board on the circuit substrate why, and all available this mode is carried out fly-cutting and engaged.And several the indefinite braces that distribute on cutting and the bonded circuitry plate, the fabrication steps that fastly recovering circuit board of the present invention used is all very little with the time that is spent.So circuit board of not only recyclable regular shape of the present invention and special shape, yield when increasing circuit board recovery processing procedure, and required step can reduce circuit board and reclaim processing procedure the time, effectively shorten institute's palpus time that circuit board reclaims processing procedure, significantly improve industrial competitiveness, therefore the present invention has progressive and meets the important document of applying for patent of invention, files an application in accordance with the law.
Below the present invention is described in detail, the above only is a preferred embodiment of the present invention, when not limiting scope of the invention process.Be that all equalizations of doing according to the present patent application scope change and modify etc., all should still belong in the patent covering scope of the present invention.
Claims (12)
1. a fastly recovering circuit board is characterized in that, this step includes:
By in one first circuit substrate defective products circuit board block being taken off, and at this first circuit substrate formation, one scarce piece place, wherein, this defective products circuit board block a plurality of first braces of including a defective products circuit board and being connected with this defective products circuit board; And
One non-defective unit circuit board block is incorporated into being somebody's turn to do of this first circuit substrate lacks the piece place, wherein, a plurality of second braces that this non-defective unit circuit board block includes a non-defective unit circuit board and is connected with this non-defective unit circuit board;
Wherein, the mode by in this first circuit substrate this defective products circuit board block being taken off comprises a cutting method, makes this first circuit substrate form an aspect that engages with this defective products circuit board block.
2. fastly recovering circuit board as claimed in claim 1 is characterized in that, more includes following step: with this non-defective unit circuit board block by taking off in the second circuit substrate.
3. fastly recovering circuit board as claimed in claim 1 is characterized in that, by the mode of in this first circuit substrate this defective products circuit board block being taken off, the direction that comprises with vertical this first circuit substrate upper surface from top to bottom runs through cutting.
4. fastly recovering circuit board as claimed in claim 1 is characterized in that, the aspect of this engaging comprises one of following shape: parabolic shape, zigzag, double wedge shape, kite shape dentation.
5. clamping and cutting circuit board block method, it is characterized in that, upper surface in a circuit substrate from top to bottom runs through cutting to form a circuit board block, and make this circuit substrate form an aspect that engages with this circuit board block, wherein, this circuit board block a plurality of braces of including a circuit board and being connected with this circuit board.
6. as claim 5 a clamping and cutting circuit board block method of stating, it is characterized in that, this engaging aspect comprise cut sth. askew into a upper surface of this circuit substrate formed cut sth. askew planar.
7. clamping and cutting circuit board block method as claimed in claim 5 is characterized in that, the aspect of this engaging comprises one of the following: parabolic shape, zigzag, double wedge shape, kite shape dentation.
8. clamping and cutting circuit board block method, it is characterized in that, penetrate an another side that is cut to this circuit substrate in a side of a circuit substrate, to take off a circuit board block, and make this circuit substrate form an aspect that engages with this circuit board block, wherein, this circuit board block a plurality of braces of including a circuit board and being connected with this circuit board.
9. clamping and cutting circuit board block method as claimed in claim 8 is characterized in that, the aspect of this engaging comprises one of the following: parabolic shape, zigzag, double wedge shape, kite shape dentation.
10. circuit substrate, include a circuit board block, it is characterized in that, a plurality of braces that this circuit board block includes a circuit board and is connected with this circuit board, wherein, form corresponding one between this circuit board block and this circuit substrate and engage aspect.
11. circuit substrate as claimed in claim 10 is characterized in that, this engaging aspect comprises one of the following: parabolic shape, zigzag, double wedge shape, kite shape dentation.
12. as claim 10 a described circuit substrate, it is characterized in that, this engaging aspect comprise cut sth. askew into a upper surface of this circuit substrate formed cut sth. askew planar.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101070854A CN100539811C (en) | 2005-09-27 | 2005-09-27 | Fastly recovering circuit board, clamping and cutting circuit board block method and circuit substrate |
| HK07109907.6A HK1101956A1 (en) | 2005-09-27 | 2007-09-12 | Method of recycling printed-circuit boards, method of cutting printed- circuit boards from printed-circuit panel, and printed-circuit panel |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101070854A CN100539811C (en) | 2005-09-27 | 2005-09-27 | Fastly recovering circuit board, clamping and cutting circuit board block method and circuit substrate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1942060A CN1942060A (en) | 2007-04-04 |
| CN100539811C true CN100539811C (en) | 2009-09-09 |
Family
ID=37959720
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101070854A Expired - Fee Related CN100539811C (en) | 2005-09-27 | 2005-09-27 | Fastly recovering circuit board, clamping and cutting circuit board block method and circuit substrate |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN100539811C (en) |
| HK (1) | HK1101956A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI451098B (en) * | 2012-07-31 | 2014-09-01 | Unimicron Technology Corp | Method of fabricating printed circuit board product |
-
2005
- 2005-09-27 CN CNB2005101070854A patent/CN100539811C/en not_active Expired - Fee Related
-
2007
- 2007-09-12 HK HK07109907.6A patent/HK1101956A1/en not_active IP Right Cessation
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI451098B (en) * | 2012-07-31 | 2014-09-01 | Unimicron Technology Corp | Method of fabricating printed circuit board product |
Also Published As
| Publication number | Publication date |
|---|---|
| HK1101956A1 (en) | 2007-11-02 |
| CN1942060A (en) | 2007-04-04 |
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