CN100533734C - Active element array base plate - Google Patents
Active element array base plate Download PDFInfo
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- CN100533734C CN100533734C CNB2006101693313A CN200610169331A CN100533734C CN 100533734 C CN100533734 C CN 100533734C CN B2006101693313 A CNB2006101693313 A CN B2006101693313A CN 200610169331 A CN200610169331 A CN 200610169331A CN 100533734 C CN100533734 C CN 100533734C
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Abstract
The invention discloses an active component array substrate, comprising a substrate, a plurality of pixel units, a plurality of first conducting lines, a plurality of second conducting lines, a lead line, at least one first electrostatic discharge protective circuit and at least one second electrostatic discharge protective circuit; wherein, the pixel units are arranged on the substrate; besides, the first and the second conducting lines are also arranged on the substrate, and are electrically connected with the pixel units respectively. The lead line crosses the first conducting line, the first electrostatic discharge protective circuit is arranged at one side of the lead line and the second electrostatic discharge protective circuit corresponding to the first electrostatic discharge protective circuit is arranged at the other side of the lead line.
Description
Technical field
The present invention is relevant for a kind of active component array base board, and is particularly to a kind of have static discharge (electro static discharge, ESD) active component array base board of protection effect.
Background technology
In the manufacture process of LCD, operating personnel, board or detecting instrument all may have static, and above-mentioned electrified body (operating personnel, board or detecting instrument) may cause element and circuit in the display panels destroyed by static discharge (electro static discharge) when touching display panels.Therefore, generally can in the perimeter circuit district of display panels, design ESD protection circuit.With the initiative matrix liquid crystal display floater, normally in the process of making active cell array, in the lump ESD protection circuit is formed on the substrate, and active cell array and these ESD protection circuits are electrically connected.Thus, when display panels was impacted by static discharge, ESD protection circuit can be with electrostatic dispersion, weaken, and directly impacted the element and the circuit of inside, viewing area to avoid static.
Fig. 1 is the schematic diagram of existing active component array base board.Please refer to Fig. 1; active component array base board 110 has a viewing area A and a perimeter circuit district B, and active component array base board 110 mainly is by a substrate 112, multi-strip scanning line 114, many data wires 116, a plurality of pixel cell 118, a lead-in wire 120, a plurality of electric static discharge protector 122 and 124 formations of a plurality of connection pads (Pad).Wherein, scan line 114 is disposed on the substrate 112 with data wire 116, and pixel cell 118 is disposed in the A of viewing area.Particularly, scan line 114 is electrically connected to pixel cell 118 with data wire 116, and voltage signal can be passed in the pixel cell 118 by scan line 114 and data wire 116.In addition, scan line 114 and data wire 116 electrically connect with corresponding connection pad 124 respectively.
As shown in Figure 1, lead-in wire 120 is disposed in the perimeter circuit district B, and electrically connects with an end of electric static discharge protector 122.The other end of electric static discharge protector 122 can electrically connect with corresponding scanning line 114 and data wire 116 respectively.Particularly, when the static discharge phenomenon took place on substrate 112, electrostatic charge can be disperseed by lead-in wire 120, to avoid electrostatic charges accumulated.On the other hand, electric static discharge protector 122 can consume the energy of electrostatic charge to lower the impact of static discharge.
It should be noted that lead-in wire 120 can stride across scan line 114 and data wire 116.When the static discharge phenomenon betided connection pad 124 ends, the static C of cross-line place that can directly flow through was easy to lure into static in the C of cross-line place discharge, and then caused going between and 120 with scan line 114 (data wire 116) phenomenon of short circuit is arranged.This can cause produces yield decline, and manufacturing cost also can rise jointly, and improved necessity is arranged in fact.
Summary of the invention
In view of this, the purpose of this invention is to provide a kind of active component array base board, destroy the problem that line short is arranged because of static discharge easily to solve existing active component array base board.
For reaching above-mentioned or other purposes, the present invention proposes a kind of active component array base board, and it has a viewing area and is positioned at a perimeter circuit district outside the viewing area.Active component array base board of the present invention comprises a substrate, a plurality of pixel cell, many first leads, many second leads, a lead-in wire, at least one first ESD protection circuit and at least one second ESD protection circuits.Wherein, pixel unit array is arranged on the substrate, and is positioned at the viewing area.In addition, first lead and second lead all are disposed on the substrate, and are positioned at the perimeter circuit district, and first lead and second lead also electrically connect with pixel cell respectively by extending in the perimeter circuit district.Above-mentioned lead-line configuration and across crossing first lead, and marks off both sides in the perimeter circuit district.In addition, first ESD protection circuit is disposed at a side of lead-in wire, and is electrically connected between arbitrary first lead and the lead-in wire.Corresponding first ESD protection circuit of above-mentioned second ESD protection circuit and be disposed at the opposite side of lead-in wire, and second ESD protection circuit is electrically connected to the first identical lead with first ESD protection circuit.Second ESD protection circuit sees through lead-in wire and electrically connects with first ESD protection circuit.And first ESD protection circuit is electrically connected between two adjacent first leads.
In one embodiment of this invention, first ESD protection circuit comprises one first active member, one second active member and one the 3rd active member.Wherein, first active member comprises one first source electrode, one first drain electrode and a first grid.Above-mentioned first source electrode and first grid are electrically connected to first lead.Second active member comprises one second source electrode, one second drain electrode and a second grid.Above-mentioned second source electrode and second grid are electrically connected to first drain electrode, and second drain electrode is electrically connected to lead-in wire.The 3rd active member comprises one the 3rd source electrode, one the 3rd drain electrode and one the 3rd grid.Above-mentioned the 3rd drain electrode is electrically connected to second grid, and the 3rd source electrode and the 3rd grid are electrically connected to next bar first lead.
In one embodiment of this invention, above-mentioned second ESD protection circuit is electrically connected between two adjacent first leads, and second ESD protection circuit comprises one the 4th active member, one the 5th active member and one the 6th active member.Wherein, the 4th active member comprises one the 4th source electrode, one the 4th drain electrode and one the 4th grid.Above-mentioned the 4th drain electrode is electrically connected to first lead.The 5th active member comprises one the 5th source electrode, one the 5th drain electrode and one the 5th grid.Above-mentioned the 4th source electrode and the 4th grid are electrically connected to the 5th drain electrode, and the 5th source electrode and the 5th grid are electrically connected to lead-in wire.The 6th active member comprises one the 6th source electrode, one the 6th drain electrode and one the 6th grid.Above-mentioned the 6th source electrode and the 6th grid are electrically connected to the 5th drain electrode, and the 6th drain electrode is electrically connected to next bar first lead.
In one embodiment of this invention, above-mentioned first lead can be data wire for scan line and second lead.
In one embodiment of this invention, first source electrode of above-mentioned first active member extends and strides across first lead, to form one first cross-line portion.
In one embodiment of this invention, the 3rd source electrode of above-mentioned the 3rd active member extends and strides across next bar first lead, to form one second cross-line portion.
In one embodiment of this invention, above-mentioned first lead can be scan line for data wire and second lead.
In one embodiment of this invention, the first grid of above-mentioned first active member extends and is striden across by first lead, to form one the 3rd cross-line portion.
In one embodiment of this invention, the 3rd grid of above-mentioned the 3rd active member extends and is striden across by next bar first lead, to form one the 4th cross-line portion.
Active component array base board of the present invention in the lead-in wire both sides dispose first ESD protection circuit and second ESD protection circuit respectively, and make lead-in wire across the first lead place between first ESD protection circuit and second ESD protection circuit.Therefore, when the static discharge phenomenon takes place, electrostatic charge can flow through earlier first ESD protection circuit or second ESD protection circuit, the lead-in wire of just having an opportunity to flow through is across the first lead place.Can effectively avoid like this going between and directly be subjected to the situation generation that static discharge destroyed and had short circuit across the first lead place.
For above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, preferred embodiment cited below particularly, and conjunction with figs. is described in detail below.
Description of drawings
Fig. 1 is the schematic diagram of existing active component array base board.
Fig. 2 is the schematic diagram of the active component array base board of first embodiment of the invention.
Fig. 3 is the circuit diagram of the ESD protection circuit of first embodiment of the invention.
Fig. 4 is the schematic diagram of the active component array base board of second embodiment of the invention.
Fig. 5 is the circuit diagram of the ESD protection circuit of second embodiment of the invention.
Fig. 6 is the schematic diagram of the cross-line portion of third embodiment of the invention.
Fig. 7 is the schematic diagram of another cross-line portion of third embodiment of the invention.
Embodiment
First embodiment
Fig. 2 is the schematic diagram of the active component array base board of first embodiment of the invention.Please refer to Fig. 2, active component array base board 200 of the present invention has a viewing area A and is positioned at the outer perimeter circuit district B of viewing area A.Particularly, active component array base board 200 of the present invention comprises a substrate 210, a plurality of pixel cell 212, many first leads 214, many second leads 216, a lead-in wire 218, at least one first ESD protection circuit 220 and at least one second ESD protection circuit 230.Wherein, pixel cell 212 arrayed are on substrate 210 and be positioned at viewing area A, and first lead 214 and second lead 216 can mark off the position of pixel cell 212.
In general, each pixel cell 212 can comprise an at least one active member 212a and a pixel electrode 212b, and wherein active member 212a is electrically connected to pixel electrode 212b.Here the number that is noted that active member 212a is looked closely the design of pixel cell 212 and is decided, and the pixel cell 212 that for example has precharge (Pre-charge) design may just need plural active member 212a.So, also be not intended to limit to the number of active member 212a in each pixel cell 212 at this.
In detail, an end that is positioned at first lead 214 of perimeter circuit district B and second lead 216 can extend to viewing area A respectively and electrically connect with pixel cell 212.On the other hand, the other end of first lead 214 and second lead 216 can be connected to the first connection pad 214a and the second connection pad 216a respectively.Be to be scan line (scan line) in the present embodiment, and second lead 216 is made example for data wire (data line), so that explanation with first lead 214.Wherein, first lead 214 is electrically connected to the grid of active member 212a, and second lead 216 is electrically connected to the source electrode of active member 212a.On the practice, switching signal can be opened active member 212a by the transmission of first lead 214, and active member 212a shows signal after unlatching can be passed among the pixel electrode 212b by second lead 216.
Fig. 3 is the circuit diagram of the ESD protection circuit of first embodiment of the invention.Please also refer to Fig. 2 and Fig. 3, lead-in wire 218 is disposed in the perimeter circuit district B, and across crossing first lead 214 and marking off both sides.First ESD protection circuit 220 of the present invention is disposed at a side of lead-in wire 218, and is electrically connected between first lead 214 and the lead-in wire 218.It should be noted that second ESD protection circuit, 230 corresponding first ESD protection circuits 220 of the present invention and be disposed at lead-in wire 218 opposite side.In other words, first ESD protection circuit 220 and second ESD protection circuit 230 lay respectively at the both sides of lead-in wire 218.In detail; second ESD protection circuit 230 can see through lead-in wire 218 and electrically connect with first ESD protection circuit 220, and first ESD protection circuit 220 is electrically connected to the first identical lead 214 with second ESD protection circuit 230.
Particularly, when C2 place that the static discharge phenomenon betides first lead 214 when (as shown in Figure 3), the partial electrostatic lotus can spread out by first ESD protection circuit 220 earlier, to weaken the impact of static discharge.In addition, after electrostatic charge flows into first ESD protection circuit 220, can 218 spread out by going between, excessive electrostatic charges accumulated to avoid having on the substrate 210.Owing to can be disperseed by first ESD protection circuit 220 earlier and consume from the electrostatic charge that C2 comes.Therefore, the C1 of cross-line place of first lead 214 and lead-in wire 218 can avoid directly being subjected to static discharge to impact, and then can prevent effectively that first lead 214 and lead-in wire 218 are short-circuited in the C1 of cross-line place.
On the other hand, when the static discharge phenomenon betides the C3 place of first lead 214 (the contiguous first connection pad 214a place), the partial electrostatic lotus can spread out by second ESD protection circuit 230 earlier.Electrostatic charge is just had an opportunity by the cross-line place C1 of first lead 214 with lead-in wire 218 afterwards.Because the C1 of cross-line place of first lead 214 and lead-in wire 218 is between first ESD protection circuit 220 and second ESD protection circuit 230.Therefore, first ESD protection circuit 220 and second ESD protection circuit 230 can effectively protect first lead 214 and the C1 of cross-line place of lead-in wire 218 to avoid directly being subjected to the destruction of static discharge.
In addition; when the static discharge phenomenon betides the C4 place of lead-in wire 218; the 218 top electrostatic charges that go between can be disperseed by first ESD protection circuit 220 and second ESD protection circuit 230 earlier, can effectively avoid first lead 214 and the C1 of cross-line place of lead-in wire 218 directly to be subjected to static discharge destruction like this.As a complete unit; electrostatic charge on the lead-in wire 218 can be dispersed on first lead 214 by first ESD protection circuit 220 and second ESD protection circuit 230, and the electrostatic charge on first lead 214 also can be dispersed to lead-in wire 218 by first ESD protection circuit 220 and second ESD protection circuit 230.Therefore, first ESD protection circuit 220 of the present invention and second ESD protection circuit 230 also have the effect of two-way admittance except more static dissipation path can be provided.Compared to prior art, active component array base board 200 of the present invention has preferable static discahrge protection effect.
Refer again to Fig. 3, in detail, first ESD protection circuit 220 of the present invention can comprise one first active member 222, one second active member 224, one the 3rd active member 226 and one the 4th active member 228.Above-mentioned each active member can complete in the lump with the active member 212a (as shown in Figure 2) of pixel cell 212, does not therefore need extra photomask processing procedure.On the practice, active member can be selected thin-film transistor for use.Particularly, above-mentioned first active member 222 comprises one first source electrode 222S, one first a drain electrode 222D and a first grid 222G.Wherein, the first source electrode 222S and first grid 222G are electrically connected to first lead 214.In addition, second active member 224 comprises one second source electrode 224S, one second a drain electrode 224D and a second grid 224G.Above-mentioned second source electrode 224S and second grid 224G are electrically connected to the first drain electrode 222D, and the second drain electrode 224D is electrically connected to lead-in wire 218.
When the static discharge phenomenon betided C2 place (contiguous viewing area A an end), the high pressure that static discharge moment is produced can be opened first active member 222, and makes electrostatic charge flow to the first drain electrode 222D by the first source electrode 222S.On the practice, the energy of electrostatic charge can be consumed after opening first active member 222 effectively, and this can make the destructive power of static discharge reduce.If the energy of static discharge is very big, just can lower the destructive power of static discharge once more by second active member 224.Afterwards, electrostatic charge can 218 spread out by going between, further to slow down the impact of static discharge.It should be noted that; first active member 222 or second active member 224 wherein active member if destroy when being short-circuited because of static discharge; but another still normal operation of active member of not damaging, this can make first ESD protection circuit 220 still have the effect of dissipate it can't complete failure.
In addition, the 3rd active member 226 in first ESD protection circuit 220 comprises one the 3rd source electrode 226S, one the 3rd drain electrode 226D and one the 3rd grid 226G.Above-mentioned the 3rd source electrode 226S and the 3rd grid 226G are electrically connected to lead-in wire 218.In addition, the 4th active member 228 comprises one the 4th source electrode 228S, one the 4th drain electrode 228D and one the 4th grid 228G.Above-mentioned the 4th source electrode 228S and the 4th grid 228G are electrically connected to the 3rd drain electrode 226D, and the 4th drain electrode 228D is electrically connected to first lead 214.
When the static discharge phenomenon betides lead-in wire 218 C4 place, partial electrostatic can flow through first ESD protection circuit 220 and second ESD protection circuit 230 (will detailed description) after a while.The electrostatic charge of first ESD protection circuit 220 of flowing through can be opened the 3rd active member 226 and the 4th active member 228 in regular turn, and reaches catabiotic purpose.On the other hand, electrostatic charge can see through the 3rd active member 226 and the 4th active member 228 and dissipate to first lead 214.Similarly, wherein if active member is because of electrostatic breakdown is short-circuited for the 3rd active member 226 or the 4th active member 228, and first ESD protection circuit 220 still has the effect of dissipate it can't complete failure.
Second ESD protection circuit, 230 corresponding first ESD protection circuits 220 of the present invention and be disposed at lead-in wire 218 opposite side.Wherein, second ESD protection circuit 230 comprises one the 5th active member 232, one the 6th active member 234, one the 7th active member 236 and one the 8th active member 238.Above-mentioned each active member can complete in the lump with the active member 212a (as shown in Figure 2) of pixel cell 212, does not therefore need extra photomask processing procedure.
In detail, the 5th active member 232 comprises one the 5th source electrode 232S, one the 5th drain electrode 232D and one the 5th grid 232G.Above-mentioned the 5th source electrode 232S and the 5th grid 232G are electrically connected to first lead 214.In addition, the 6th active member 234 comprises one the 6th source electrode 234S, one the 6th drain electrode 234D and one the 6th grid 234G.Above-mentioned the 6th source electrode 234S and the 6th grid 234G are electrically connected to the 5th drain electrode 232D, and the 6th drain electrode 234D is electrically connected to lead-in wire 218.When the static discharge phenomenon betided the C3 place (end of the contiguous first connection pad 214a) of first lead 214, static can be opened the 5th active member 232 and the 6th active member 234 in regular turn.Afterwards, static can 218 spread out by going between.
In addition, the 7th active member 236 in second ESD protection circuit 230 comprises one the 7th source electrode 236S, one the 7th drain electrode 236D and one the 7th grid 236G.Above-mentioned the 7th source electrode 236S and the 7th grid 236G are electrically connected to lead-in wire 218.In addition, the 8th active member 238 comprises one the 8th source electrode 238S, one the 8th drain electrode 238D and one the 8th grid 238G.Above-mentioned the 8th source electrode 238S and the 8th grid 238G are electrically connected to the 7th drain electrode 236D, and the 8th drain electrode 238D is electrically connected to first lead 214.
When the static discharge phenomenon betided the C4 place of lead-in wire 218, electrostatic charge can be disperseed by first ESD protection circuit 220 and second ESD protection circuit 230 respectively.The partial electrostatic lotus can be opened the 7th active member 236 and the 8th active member 238, in regular turn to reach the purpose that consumes electrostatic energy when flowing through second ESD protection circuit 230.Afterwards, electrostatic charge can dissipate on first lead 214 by the 7th active member 236 and the 8th active member 238, with further dispersion static and the impact that slows down static discharge.
In order further to promote the electro-static discharge protection function of active component array base board 200 of the present invention, first ESD protection circuit 220 and second ESD protection circuit 230 also can be applied to second lead, 216 places (as shown in Figure 2).In detail, first ESD protection circuit 220 at second lead, 216 places and second ESD protection circuit 230 are disposed at the both sides of lead-in wire 218 respectively, and are electrically connected between second lead 216 and the lead-in wire 218.In addition, first ESD protection circuit 220 and second ESD protection circuit 230 can be by going between 218 and be electrical connected each other.Thus, first ESD protection circuit 220 and second ESD protection circuit 230 also can effectively avoid second lead 216 and the cross-line place of lead-in wire 218 directly to be subjected to the impact of static discharge.
Second embodiment
Second embodiment and first embodiment are similar, and both are the main difference part: first ESD protection circuit of present embodiment and second ESD protection circuit are to be electrically connected between two adjacent first leads.
Fig. 4 is the schematic diagram of the active component array base board of second embodiment of the invention, and Fig. 5 is the circuit diagram of the ESD protection circuit of second embodiment of the invention.Please also refer to Fig. 4 and Fig. 5, first ESD protection circuit 240 of the present invention and second ESD protection circuit 250 are electrically connected between two adjacent first leads 214,214 '.It should be noted that; first ESD protection circuit 240 and second ESD protection circuit 250 are electrically connected at lead-in wire 218 both sides respectively, and first ESD protection circuit 240 and second ESD protection circuit 250 can be by going between 218 and be electrical connected each other.
What will specify here is that next relative position of organizing between first ESD protection circuit 240 ' (as shown in Figure 5) and second ESD protection circuit 250 ' can be opposite with the relative position between first ESD protection circuit 240 and second ESD protection circuit 250.In detail, first ESD protection circuit 240 comprises one first active member 242, one second active member 244 and one the 3rd active member 246.Wherein, first active member 242 comprises one first source electrode 242S, one first a drain electrode 242D and a first grid 242G.Above-mentioned first source electrode 242S and first grid 242G are electrically connected to first lead 214.In addition, second active member 244 comprises one second source electrode 244S, one second a drain electrode 244D and a second grid 244G.Above-mentioned second source electrode 244S and second grid 244G are electrically connected to the first drain electrode 242D, and the second drain electrode 244D is electrically connected to lead-in wire 218.
In addition, the 3rd active member 246 of the present invention comprises one the 3rd source electrode 246S, one the 3rd drain electrode 246D and one the 3rd grid 246G.Above-mentioned the 3rd drain electrode 246D is electrically connected to second grid 244G, and the 3rd source electrode 246S and the 3rd grid 246G are electrically connected to next bar first lead 214 '.
Particularly, when the static discharge phenomenon betided the C6 place (contiguous viewing area A an end) of first lead 214, the high pressure of static discharge moment can be in regular turn with first active member 242 and 244 unlatchings of second active member.Afterwards, electrostatic charge can further be dispersed to by second active member 244 on the lead-in wire 218.What will specify here is, when the static discharge phenomenon betided the C8 place of next bar first lead 214 ', the high pressure of static discharge moment can be opened the 3rd active member 246 and second active member 244 in regular turn.Afterwards, electrostatic charge can further be dispersed on the lead-in wire 218 by second active member 244.
It should be noted that when the static discharge phenomenon betides the C7 place (contiguous the first connection pad 214a an end) of first lead 214 electrostatic charge can be by the first last one group ESD protection circuit 240 " and electrostatic charge is disperseed.In addition, when the static discharge phenomenon betided the C9 place of first lead 214 ', electrostatic charge can be organized first ESD protection circuit 240 ' by next and disperse.
On the other hand, second ESD protection circuit, 250 corresponding first ESD protection circuits 240 of the present invention and be disposed at a lead-in wire side of 218, and second ESD protection circuit 250 is electrically connected between two adjacent first leads 214 and 214 '.Wherein, second ESD protection circuit 250 comprises one the 4th active member 252, one the 5th active member 254 and one the 6th active member 256.The 4th active member 252 comprises one the 4th source electrode 252S, one the 4th drain electrode 252D and one the 4th grid 252G.Above-mentioned the 4th drain electrode 252D is electrically connected to first lead 214.In addition, the 5th active member 254 comprises one the 5th source electrode 254S, one the 5th drain electrode 254D and one the 5th grid 254G.Above-mentioned the 4th source electrode 252S and the 4th grid 252G are electrically connected to the 5th drain electrode 254D, and the 5th source electrode 254S and the 5th grid 254G are electrically connected to lead-in wire 218.
In addition, the 6th active member 256 comprises one the 6th source electrode 256S, one the 6th drain electrode 256D and one the 6th grid 256G.Above-mentioned the 6th source electrode 256S and the 6th grid 256G are electrically connected to the 5th drain electrode 254D, and the 6th drain electrode 256D is electrically connected to next bar first lead 214 '.Particularly, when the static discharge phenomenon betided the C10 place of lead-in wire 218, electrostatic charge can be dispersed to electrostatic charge the 4th active member 252 and the 6th active member 256 respectively by the 5th active member 254.Afterwards, see through the transmission of the 4th active member 252 and the 6th active member 256 again, and electrostatic charge is dispersed to first lead 214 and next bar first lead 214 ' respectively.
Because first ESD protection circuit 240 of the present invention and second ESD protection circuit 250 are connected between two adjacent first leads 214,214 '; so that electrostatic charge can have more static dissipation path, and then can effectively avoid the element on the active component array base board 200a destroyed by static discharge.Specifically, in first ESD protection circuit 240 if there is an active member phenomenon of short circuit to be arranged because of electrostatic breakdown, but another still normal operation of unspoilt active member.First ESD protection circuit 240 can't complete failure.The present invention's second ESD protection circuit 250 also has identical advantage.
Certainly; under have in the technical field and know that usually the knowledgeable should know that first ESD protection circuit 240 and second ESD protection circuit 250 also can be disposed at second lead, 216 places (as shown in Figure 4), with the effect of the electrostatic discharge (ESD) protection of further lifting active component array base board 200a.
The 3rd embodiment
The 3rd embodiment and second embodiment are similar, and both are the main difference part: first source electrode of first active member can extend and stride across first lead to form one first cross-line portion in the present embodiment.Fig. 6 is the schematic diagram of the cross-line portion of third embodiment of the invention.Please refer to Fig. 6, the first source electrode 242S of first active member 242 of the present invention extends and strides across first lead 214, to form one first D1 of cross-line portion.
What will specify here is, be in the present embodiment with first lead 214 as scan line, and active member is the structure of bottom-gate (bottom gate), explains.Scan line is constituted by the first metal layer (metal 1) of general common name, and the first source electrode 242S is constituted by second metal level (metal 2) of general common name.On the practice, first D1 of cross-line portion can extend to the first metal layer (first lead 214) top by second metal level (the first source electrode 242S) and form.Certainly, under have in the technical field and know that usually the knowledgeable should know if active member is top grid (top gate) structure, then first D1 of cross-line portion can form by the below that second metal level (the first source electrode 242S) extends to the first metal layer (first lead 214).
It should be noted that first D1 of cross-line portion is easy to lure into that electrostatic charge discharges herein, and then can reach the purpose that consumes electrostatic energy.Though first lead 214 and the first source electrode 242S have the phenomenon of short circuit probably among first D1 of cross-line portion because of electrostatic breakdown.But the first source electrode 242S just need be electrically connected to first lead 214 (scan line) originally, and therefore the short circuit phenomenon of first lead 214 and the first source electrode 242S can't cause bad influence to active component array base board among first D1 of cross-line portion.
In order further to promote the electrostatic discharge (ESD) protection effect of active component array base board, the 3rd source electrode 246S of the 3rd active member 246 can extend and stride across next bar first lead 214 ', to form one second D2 of cross-line portion.Second D2 of cross-line portion of the present invention has the effect of bringing out static discharge equally, and then can reach the purpose of imitating the consumption electrostatic energy.
Fig. 7 is the schematic diagram of another cross-line portion of third embodiment of the invention.Please refer to Fig. 7, be noted that here cross-line of the present invention portion also can be disposed at the second lead place.Second lead 216 is a data wire in the present embodiment, and data wire is constituted by general second metal (matal 2) that is generally called.Therefore, the 3rd D3 of cross-line portion of the present invention can be striden across the extended part of first grid 242G (the first metal layer) and formed by second lead 216 (second metal level).In addition, next bar second lead 216 ' (second metal level) also can stride across the 3rd extended part of grid 246G (the first metal layer) and form the 4th D4 of cross-line portion.
In sum; active component array base board of the present invention in the lead-in wire both sides dispose first ESD protection circuit and second ESD protection circuit respectively, and make lead-in wire across the first lead place between first ESD protection circuit and second ESD protection circuit.Therefore, when the static discharge phenomenon took place, electrostatic charge can be earlier through first ESD protection circuit or second ESD protection circuit, and the lead-in wire of just having an opportunity to flow through is across the first lead place.Can effectively avoiding like this goes between directly is subjected to the impact of static discharge across the first lead place.Because first ESD protection circuit of the present invention and second ESD protection circuit can be connected between two adjacent first leads; and first ESD protection circuit and second ESD protection circuit can see through lead-in wire and be connected with each other, and then can effectively increase the path of static dissipation on the active component array base board.Because first, second, third and fourth cross-line portion of the present invention can initiatively bring out static in discharge herein, and then can reach the purpose that consumes electrostatic energy, and can't cause harmful effect to active component array base board.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; have in the technical field under any and know the knowledgeable usually; without departing from the spirit and scope of the present invention; when can doing a little change and retouching, so protection scope of the present invention is when with being as the criterion that claim was defined.
Claims (8)
1. active component array base board has a viewing area and is positioned at a perimeter circuit district outside this viewing area, and this active component array base board comprises:
One substrate;
A plurality of pixel cells, arrayed and are positioned at this viewing area on this substrate;
Many first leads are disposed on this substrate, and are positioned at this perimeter circuit district, and those first leads are by extending in this perimeter circuit district and electrically connecting with those pixel cells;
Many second leads are disposed on this substrate, and are positioned at this perimeter circuit district, and those second leads are by extending in this perimeter circuit district and electrically connecting with those pixel cells;
One lead-in wire is disposed in this perimeter circuit district, and across those first leads of mistake, and mark off both sides;
At least one first ESD protection circuit is disposed at this side that goes between, and is electrically connected between arbitrary first lead and this lead-in wire; And
At least one second ESD protection circuit, to should first ESD protection circuit and be disposed at this lead-in wire opposite side, and be electrically connected to this identical first lead with this first ESD protection circuit, this second ESD protection circuit sees through this lead-in wire and electrically connects with this first ESD protection circuit;
And this first ESD protection circuit is electrically connected between two adjacent first leads.
2. active component array base board as claimed in claim 1 is characterized in that, this first ESD protection circuit comprises:
One first active member comprises one first source electrode, one first drain electrode and a first grid, and wherein this first source electrode and this first grid are electrically connected to this first lead;
One second active member comprises one second source electrode, one second drain electrode and a second grid, and wherein this second source electrode and this second grid are electrically connected to this first drain electrode, and this second drain electrode is electrically connected to this lead-in wire; And
One the 3rd active member comprises one the 3rd source electrode, one the 3rd drain electrode and one the 3rd grid, and wherein the 3rd drain electrode is electrically connected to this second grid, and the 3rd source electrode and the 3rd grid are electrically connected to next bar first lead.
3. active component array base board as claimed in claim 1 is characterized in that, this second ESD protection circuit is electrically connected between two adjacent first leads, and this second ESD protection circuit comprises:
One the 4th active member comprises one the 4th source electrode, one the 4th drain electrode and one the 4th grid, and wherein the 4th drain electrode is electrically connected to this first lead;
One the 5th active member comprises one the 5th source electrode, one the 5th drain electrode and one the 5th grid, and wherein the 4th source electrode and the 4th grid are electrically connected to the 5th drain electrode, and the 5th source electrode and the 5th grid are electrically connected to this lead-in wire; And
One the 6th active member comprises one the 6th source electrode, one the 6th drain electrode and one the 6th grid, and wherein the 6th source electrode and the 6th grid are electrically connected to the 5th drain electrode, and the 6th drain electrode is electrically connected to next bar first lead.
4 active component array base boards as claimed in claim 2 is characterized in that, this first lead is a scan line, and this second lead is a data wire.
5. active component array base board as claimed in claim 4 is characterized in that, this first source electrode of this first active member extends and strides across this first lead, to form one first cross-line portion.
6. active component array base board as claimed in claim 4 is characterized in that, the 3rd source electrode of the 3rd active member extends and strides across next bar first lead, to form one second cross-line portion.
7. active component array base board as claimed in claim 2 is characterized in that, this first lead is a data wire, and this second lead is a scan line.
8. active component array base board as claimed in claim 7 is characterized in that, this first grid of this first active member extends and striden across by this first lead, to form one the 3rd cross-line portion.
9. active component array base board as claimed in claim 7 is characterized in that, the 3rd grid of the 3rd active member extends and striden across by next bar first lead, to form one the 4th cross-line portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101693313A CN100533734C (en) | 2006-12-11 | 2006-12-11 | Active element array base plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006101693313A CN100533734C (en) | 2006-12-11 | 2006-12-11 | Active element array base plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN101202278A CN101202278A (en) | 2008-06-18 |
| CN100533734C true CN100533734C (en) | 2009-08-26 |
Family
ID=39517337
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006101693313A Expired - Fee Related CN100533734C (en) | 2006-12-11 | 2006-12-11 | Active element array base plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100533734C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN207517281U (en) | 2017-11-16 | 2018-06-19 | 京东方科技集团股份有限公司 | A kind of array substrate and display device |
| CN109031827A (en) * | 2018-08-16 | 2018-12-18 | 深圳市华星光电半导体显示技术有限公司 | Static discharge unit, array substrate and liquid crystal display panel |
-
2006
- 2006-12-11 CN CNB2006101693313A patent/CN100533734C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN101202278A (en) | 2008-06-18 |
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