CN100533675C - Baffle and wafer grinding appts. - Google Patents
Baffle and wafer grinding appts. Download PDFInfo
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- CN100533675C CN100533675C CNB2004100557882A CN200410055788A CN100533675C CN 100533675 C CN100533675 C CN 100533675C CN B2004100557882 A CNB2004100557882 A CN B2004100557882A CN 200410055788 A CN200410055788 A CN 200410055788A CN 100533675 C CN100533675 C CN 100533675C
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Abstract
When pushing wafer to rotating grinding pad to carry out grinding for surface of wafer, the retaining ring retains circumference part of wafer not being disengaged. The retaining ring possesses first ring and second ring. The first ring closes round circumference part of wafer, and bunts to the grinding pad. Being setup outside first ring along radial direction, the second ring bunts to the grinding pad. Abrasion resistance of the second ring is higher than abrasion resistance of the first ring. The disclosed retaining ring with long service life can prevent collapse on circumference happened on circumference of wafer.
Description
Technical field
The present invention relates to wafer polishing apparatus that the surface of wafer is ground, relate in particular to the structure of the back-up ring that the circumference to wafer keeps.
Background technology
In wafer manufacturing process, there is the surface of pair wafer to carry out the accurately machined polishing operation of minute surface.In this operation, use be the wafer polishing apparatus that wafer is pushed, the surface of above-mentioned wafer is ground to the surface of grinding pad of rotation.
Wafer polishing apparatus has the grinding table that utilizes driving shaft to be rotated.Be provided with grinding pad on grinding table, also side is equipped with wafer is kept and rotating wafer keeps head in the above.
Wafer keeps head to have driving mechanism up and down, the wafer that keeps can be pushed with the surface of required contact pressure to grinding pad.To the surface of the wafer of grinding pad pushing,, minute surface is carried out fine finishining by grinding with the friction of grinding pad.
On the wafer in grinding since with the friction of grinding pad of rotation, keep the radial outside effect of head big power to wafer.Therefore, keep the lower outside of head to dispose back-up ring, the circumference of wafer kept by utilizing this back-up ring at wafer, can prevent rotating wafer from wafer keep head below deviate from outside the side direction.
But grinding pad utilizes viscoelastic material to form usually.Viscoelastic material, owing to have the adhesive region that stress is directly proportional with deformation velocity, so as shown in Figure 8, below moving direction the other side's of wafer W grinding pad 101 (not compressed part) enters wafer W during side, the big pressure that the compression because of grinding pad 101 causes in the circumference effect of wafer W.Thus, as shown in figure 10, exist the circumference of wafer W to produce than the collapse problem at angle of polished more, the so-called periphery of the central portion of wafer W.
Therefore, recently, as shown in Figure 9, by with above-mentioned back-up ring 102 to grinding pad 101 pushing, just can make moving direction the other side's of wafer W grinding pad 101 be the state of compression in advance.
Like this, below grinding pad 101 enters wafer W during side, owing to above-mentioned big pressure can not arranged, so can prevent the collapse situation at angle of on wafer W generation periphery in the circumference effect of wafer W.
Figure 11 represents that this wafer keeps the structure of head.
Keep owing on wafer W and back-up ring 102, apply load, making wafer W and back-up ring 102 and grinding pad 101 butts in 103 at this wafer by 1 flat board 104.
In such structure, can make simplifying the structure of device, on the other hand, owing to make the following surface wear of back-up ring 102, so existence is along with the process of time applies problem less than required load on grinding pad 101 with the friction of grinding pad 101.
When the load that applies to grinding pad 101 when back-up ring 102 reduced, the thickness thickening of the grinding pad 101 of side below back-up ring 102 will form the gap with respect to the thickness of the grinding pad 101 of side below the wafer W.
Therefore, at the circumference of wafer W, often the periphery angle of collapsing takes place in the stress that causes because of the compression of grinding pad 101.
Therefore, in order to solve such problem, used the wafer that the load that applies on the load that applies on the wafer W and the back-up ring 102 is controlled respectively independently to keep head.Figure 12 represents that this wafer keeps the structure of head.
By making such structure, even, also can push grinding pad 101 with identical load all the time because of the friction with grinding pad 101 makes back-up ring 102 wearing and tearing.
But, as mentioned above, because back-up ring 102 plays the effect that the circumference to wafer W keeps, so need closely set with the periphery of wafer W, by 102 pairs of grinding pads 101 of back-up ring push, formed protrusion 110 is interfered with the circumference of wafer W on the grinding pad 101, and the periphery angle of collapsing often takes place.
Therefore, radially inner side being provided with of back-up ring 102 dodge protrusion 110 usefulness slot part 107, developed the wafer that the pushing part that makes 23 pairs of grinding pads 101 of back-up ring separates with the retaining part of wafer W and kept 108 (for example with reference to a patent documentation 1).This wafer keeps a structural table of 108 to be shown in Figure 13.
Keep in 108 at this wafer, owing to can control independently the load that applies on the load that applies on the wafer W and the back-up ring 102, so can push grinding pad 101 with certain load all the time.And, owing to the circumference of wafer W is not interfered, so the periphery angle of collapsing can not take place at the formed protrusion 110 of the radially inner side of back-up ring 102.
[patent documentation 1] Japan Patent spy opens the 2002-18709 communique
But, be formed with in the wafer polishing apparatus 106 of slot part 107 at the radially inner side of back-up ring 102 since with the friction of grinding pad 101, back-up ring 102 little by little weares and teares with the contact portion of grinding pad 101.Its result, formed slot part 107 little by little shoals below back-up ring 102, and slot part 107 finally can disappear.
Like this, as mentioned above, the following integral body of back-up ring 102 pushes grinding pad 101, will because of the formed protrusion 110 of the radially inner side of back-up ring 102 at the circumference generation periphery of the wafer W angle of collapsing.
Summary of the invention
The present invention In view of the foregoing makes, and its purpose is, provides can prevent at the circumference generation periphery of wafer W collapse the back-up ring angle, long-life and wafer polishing apparatus.
In order to address the above problem and to achieve the goal, back-up ring of the present invention and wafer polishing apparatus make following structures.
(1) a kind of back-up ring, when wafer is ground to the grinding pad pushing of rotating and to the surface of above-mentioned wafer, above-mentioned wafer is kept its circumference with breaking away from, it is characterized in that having: with surround around the above-mentioned wafer and with the 1st member of ring-type of the above-mentioned grinding pad butt of rotation; The radial outside, mar proof that is configured in the 1st member than with the 2nd member of the smooth ring-type of high, relative with the grinding pad face of above-mentioned the 1st member of above-mentioned grinding pad butt of rotation.
As (1) described back-up ring, it is characterized in that (2) above-mentioned the 2nd member is made of the member according to a plurality of ring-types that form disposed that increase successively to its radial outside mar proof.
(3) a kind of back-up ring, when wafer is ground to the grinding pad pushing of rotating and to the surface of above-mentioned wafer, above-mentioned wafer is kept its circumference with breaking away from, it is characterized in that, back-up ring is single annular component, and utilizes along with forming to the radial outside of described wafer, the gradient characteristic material that mar proof increases gradually.
(4) a kind of back-up ring, when wafer is ground to the grinding pad pushing of rotating and to the surface of above-mentioned wafer, above-mentioned wafer is kept its circumference with breaking away from, it is characterized in that having: with surround around the above-mentioned wafer and with the 1st member of ring-type of the above-mentioned grinding pad butt of rotation; The radial outside of the 1st member, than with above-mentioned the 1st member of the above-mentioned grinding pad butt of rotation more to the 2nd member of the ring-type that above-mentioned grinding pad disposes, the face relative with grinding pad is smooth side-prominently; The adjusting device that the overhang of above-mentioned relatively the 1st member of above-mentioned the 2nd member is adjusted.
As (4) described back-up ring, it is characterized in that (5) above-mentioned the 1st member is fixed on the installation component, above-mentioned adjusting device is to load and unload the adjustment plate that is installed in freely between this installation component and above-mentioned the 1st member.
As (4) described back-up ring, it is characterized in that (6) above-mentioned the 2nd member is fixed on the installation component, above-mentioned adjusting device is to load and unload the adjustment plate that is installed in freely between this installation component and above-mentioned the 2nd member.
(7) a kind of wafer polishing apparatus, with wafer to the grinding pad pushing of rotation and, it is characterized in that having grinding on the surface of above-mentioned wafer: the carrier that keeps above-mentioned wafer and this wafer is pushed to above-mentioned grinding pad; Be configured in this carrier outer circumferential side, with the back-up ring of above-mentioned grinding pad butt, above-mentioned back-up ring comprises: thus with surround around the above-mentioned wafer to its circumference keep and with the 1st member of the ring-type of the above-mentioned grinding pad butt of rotation; The radial outside, mar proof that is configured in the 1st member than with the 2nd member of above-mentioned the 1st member height of the above-mentioned grinding pad butt of rotation, ring-type that the face relative with grinding pad is smooth.
Adopt the present invention, can prevent, and can prolong the life-span of back-up ring at the circumference generation periphery of the wafer angle of collapsing.
Description of drawings
Fig. 1 is the stereogram of structure of the wafer polishing apparatus of expression the present invention the 1st example.
Fig. 2 is the longitudinal section that the wafer of the same example of expression keeps header structure.
Fig. 3 is illustrated in the back-up ring shape in the operation that forms slot part on the back-up ring of the same example and acts on pressure distribution on the back-up ring, (a) be the skeleton diagram of expression initial condition, (b) be the skeleton diagram of state when representing smooth the grinding, (c) be the skeleton diagram that the smooth grinding of expression finishes the back state.
Fig. 4 is the cutaway view of the 1st variation of the back-up ring of the same example of expression.
Fig. 5 is the cutaway view of the 2nd variation of the back-up ring of the same example of expression.
Fig. 6 is the cutaway view of the 3rd variation of the back-up ring of the same example of expression.
Fig. 7 is the cutaway view of the back-up ring structure of expression the present invention the 2nd example.
Fig. 8 be to use back-up ring not with the generation periphery of the wafer polishing apparatus occasion of the grinding pad butt key diagram that the mechanism at angle describes that collapses.
Fig. 9 be to use back-up ring not with the minimizing periphery of the occasion of the wafer polishing apparatus of the grinding pad butt key diagram that the mechanism at angle describes that collapses.
Figure 10 is the cutaway view of the wafer thickness of expression when using in the past back-up ring that wafer is ground.
Figure 11 is that expression is applied to the skeleton diagram that wafer on wafer and the back-up ring, in the past keeps header structure by 1 flat board with load.
Figure 12 represents respectively independently to being applied to the skeleton diagram of loading on the wafer and being applied to load wafer maintenance that control, in the past the header structure on the back-up ring.
Figure 13 is illustrated in to have below the back-up ring and dodges the skeleton diagram that wafer slot part, in the past that protrusion uses keeps header structure.
Embodiment
Below, with reference to accompanying drawing example of the present invention is described.
Fig. 1 is the stereogram of structure of the wafer polishing apparatus of expression the present invention the 1st example.
This wafer polishing apparatus keeps 20 to constitute by grinding table 10 and wafer.
Grinding table 10 forms discoid, is attaching grinding pad 11 in the above.The material of grinding pad 11 is suitably selected according to the material of the grinding layer of wafer W.
Fixing driving shaft 12 in the bottom of grinding table 10.On this driving shaft 12, connecting the output shaft (not shown) of motor 13, by above-mentioned motor 13 is driven, grinding table 10 is rotated to the arrow A direction.
Above the grinding pad 11 that on grinding table 10, is attached, utilize supply nozzle (not shown) to supply with lapping liquid.As abrasive solution, use the aqueous slkali that contains silica gel.
Wafer keeps 20, and above-below direction moves and is set at freely on the lowering or hoisting gear (not shown).Keep releasably keeping as the wafer W of grinding object below 20 at wafer, make wafer keep 20 to descend, just the wafer W that keeps can be pushed to grinding pad 11 by utilizing above-mentioned lowering or hoisting gear.
On above-mentioned lowering or hoisting gear, connecting control device (not shown).This control device keeps the load on 20 to control to being applied to wafer, and the contact pressure between wafer W and the grinding pad 11 is adjusted to required value.
Again, among Fig. 1, only representing that 1 wafer keeps 20, but be not limited thereto, for example, can be on the circumference at center with driving shaft 12 also, with the interval of regulation many wafer is set and keeps 20.
Fig. 2 is the longitudinal section that the expression wafer keeps a structure of 20.
This wafer keeps 20, is made of a body 21, carrier 22, back-up ring 23 etc.
Back-up ring 23 is by the 1st ring 23a (the 1st member) of the ring-type of the periphery that is configured in wafer W be configured in the 2nd ring 23b (the 2nd member) formation of ring-type of the radial outside of the 1st ring 23a.These the 1st ring 23a and the 2nd ring 23b are fixed with a body 21 coaxially in the lower surface of a body 21.
Again, in this example, utilize the member of ring-type to form the 1st ring 23a and the 2nd ring 23b, but be not limited to this, also a plurality of members can be made up, make integral body and form ring-type.
The 1st ring 23a owing to circumference being kept around the wafer W, can side not deviate from the wafer W in the grinding with surrounding below carrier 22.On the other hand, the 2nd ring 23b pushes the grinding pad 11 of the outer radial periphery side of the wafer W in grinding.
Again, the 1st ring 23a, utilize the low material of mar proof, for example with formation such as polycarbonate resins, the 2nd ring 23b utilizes the high material of mar proof, for example uses MC nylon resin, polyimides (polyamide), PET, PPS, polyacetal resin formation such as (ジ ユ ラ コ Application, acetal resins).
The bottom of the 2nd ring 23b, more side-prominent than the 1st ring 23a to grinding pad 11.Thus, below back-up ring 23, form the slot part 25 that the protuberance make grinding pad 11 is dodged the ring-type of usefulness at radially inner side.
This slot part 25 utilizes " smooth grinding " described later to form, and keeps a rotary speed of 20, the rotary speed of grinding table 10 etc. to change according to material, the material of the 2nd ring 23b, the material of grinding pad 11, the wafer of the 1st ring 23a.
Then, describe utilizing above-mentioned " smooth grinding " operation of formation slot part 25 below back-up ring 23 with Fig. 3.
Fig. 3 is the skeleton diagram that is illustrated in the shape of the back-up ring 23 in the operation of following formation slot part 25 of back-up ring 23 and acts on the pressure distribution on the back-up ring 23.
At first, shown in Fig. 3 (a1), will there be the back-up ring 23 of ladder difference to be installed on the body 21.And, lowering or hoisting gear (not shown) is driven, with the load of regulation wafer is kept 20 to grinding pad 11 pushings.At this moment, act on the contact pressure on the 1st ring 23a and the 2nd ring 23b, shown in Fig. 3 (a2), become about equally.
Then, shown in Fig. 3 (b1), keep 20 with the grinding of wafer W the time, to drive under the identical condition wafer with grinding table 10.Thus, below the back-up ring 23, utilize with the friction of grinding pad 11 and grind, encircle at different the 1st ring 23a and the 2nd of mar proof that to be formed with ladder between the 23b poor.
This ladder is poor, because along with the carrying out of the grinding of back-up ring 23 little by little enlarges, acts on the 1st ring 23a and the 2nd contact pressure of encircling on the 23b changes so make.And, if the 1st ring 23a becomes and equates with the rate of wear of the 2nd ring 23b, then stop wafer being kept 20 and the driving of grinding table 10, make smooth grinding end.
After the end of smooth grinding, below back-up ring 23, be formed with above-mentioned slot part 25.At this moment, the contact pressure for acting on the 1st ring 23a and the 2nd ring 23b shown in Fig. 3 (b2), produces the poor of regulation.
That is, when the 1st ring 23a and the 2nd ring produced the pressure shown in Fig. 3 (b2) poor on the 23b, the 1st ring 23a and the 2nd difference of encircling the mar proof of 23b averaged out, and their rate of wear becomes about equally.
Then, the effect when the grinding wafers describes to the wafer polishing apparatus that uses said structure.
After above-mentioned " smooth grinding " finishes, make wafer keep 20 rising, supply with as the wafer W of grinding object in its lower section.And, make wafer keep 20 decline, utilize control device back-up ring 23 to be pushed to grinding pad 11 with the load of regulation.Again, this load value, the grinding pad 11 that is configured to the thickness of grinding pad 11 side below wafer W in grinding becomes about equally.
Then, to wafer keep 20 and grinding table 10 drive, utilize the wafer W of 11 pairs of maintenances of grinding pad to grind.At this moment, the 2nd ring 23b of back-up ring 23 is owing to be compressed into roughly the same thickness with the grinding pad 11 of moving direction the other side's of wafer W grinding pad 11 and the following side of wafer W, so the periphery angle of collapsing can not take place.
And, has the 1st ring 23a between 23b and the wafer W by encircling at the 2nd of pushing grinding pad 11, because wafer W can be separated with the such size of the radial thickness of the 1st ring 23a with the 2nd ring 23b, so grinding pad 11 is pushed, can prevent the situation of the circumference of wafer W being ground excessively because of the bump of the radially inner side generation of the 2nd ring 23b by the 2nd ring 23b.
Again, shown in Fig. 3 (c1), in the grinding of wafer W, because following and grinding pad 11 butts of the 2nd ring 23b, the 2nd ring 23b little by little is worn.But in the grinding of wafer W, the bump of being accommodated by the slot part 25 of back-up ring 23 also makes the 1st ring 23a wearing and tearing all the time.
And the 1st ring 23a and the 2nd ring 23b owing to be worn with roughly the same speed, pretend the contact pressure that is used on the 1st ring 23a and the 2nd ring 23b, shown in Fig. 3 (c2), and the difference when keeping above-mentioned smooth grinding and finishing.
Therefore, in the grinding of wafer W, owing to can keep the degree of depth of the following formed slot part 25 of back-up ring 23, so can obtain above-mentioned effect all the time.
Again, as mentioned above, even back-up ring 23 is worn, owing to can keep the degree of depth of slot part 25, so above-mentioned effect can be retained at last.Its result, the size of the above-below direction by strengthening back-up ring 23 in advance can prolong life-span of back-up ring 23 significantly.
Again, owing to can make the shape that meets each processing conditions the best by smooth grinding, so do not need various variations are prepared.
Fig. 4 is the cutaway view of the 1st variation of the back-up ring of the same example of expression.
The back-up ring 23A of this variation has groove 31 along the circumferential direction below the 1st ring 23a.
Like this, by below the 1st ring 23a, being pre-formed groove 31, owing to the contact area that can reduce the 1st ring 23a and grinding pad 11 (not shown among Fig. 4), so can shorten the required time of smooth grinding.
Fig. 5 is the cutaway view of the 2nd variation of the back-up ring of the same example of expression.
The back-up ring 23B of this variation, by according to from its radially inner side (left side Fig. 5) to radial outside strengthen successively mar proof that form set was a plurality of, be that ring 23c～23e of 3 constitutes in this variation.
Even such structure also can obtain and the roughly same effect of above-mentioned the 1st example.
Fig. 6 is the cutaway view of the 3rd variation of the back-up ring of the same example of expression.
The back-up ring 23C of this variation constitutes by strengthening gradient characteristic material mar proof, so-called from its radially inner side gradually to radial outside.
Even such structure also can obtain and the roughly same effect of above-mentioned the 1st example.
Then, with reference to Fig. 7 the 2nd example of the present invention is described.Here,, put on same-sign and omit its explanation for the structure same with the 1st example again.
Fig. 7 is the cutaway view of structure of the back-up ring 32 of expression the present invention the 2nd example.
This back-up ring 32 between a body 21 and the 1st ring 23a, has a plurality of pads of adjusting between a body 21 and the 1st ring 23a 33 apart from usefulness (adjustment plate).
The 1st ring 23a, the thickness with above-below direction forms thinlyyer than the 2nd ring 23b in advance, is formed with slot part 25 according to the 1st ring 23a and the 2nd difference of encircling the thickness of 23b below back-up ring 32.
The degree of depth of this slot part 25 can be adjusted by plug pad 33, and is configured to when the grinding of wafer W, at its circumference the collapse state at angle of periphery does not take place.
Thus can be below back-up ring 32 owing to do not carry out smooth grinding the slot part 25 of formation desired depth, so can prevent in the collapse situation at angle of the circumference generation periphery of wafer W.
And, when the grinding by wafer W shoals slot part 25, owing to only pad 33 is just extracted slot part 25 can be adjusted to proper depth, so can prolong the life-span of back-up ring 23 significantly.
Again, in this example, between a body 21 and the 1st ring 23a, set a plurality of pads 33, along with the wearing and tearing of the 2nd ring 23b above-mentioned pad 33 is extracted, but be not limited thereto, also can encircle between the 23b and in turn insert pad 33 along with the wearing and tearing of the 2nd ring 23b, at a body 21 and the 2nd.
Thus since can be below back-up ring 23 slot part 25 of formation desired depth, so can prevent in the collapse situation at angle of the circumference generation periphery of wafer W.
Again, the invention is not restricted to above-mentioned example, in the stage of implementing, structural element is out of shape and specializes.Carry out appropriate combination by a plurality of structural elements that will be disclosed in the above-mentioned example and can form various inventions again.For example, also can from the total key element shown in the example, remove several structural elements.Again, the structural element that also can will be referred to different examples carries out appropriate combination.
Claims (7)
1, a kind of back-up ring when on the grinding pad that wafer is pressed to rotation the surface of described wafer being ground, does not make described wafer its circumference not kept with breaking away from, it is characterized in that having:
With surrounded around the described wafer and with the 1st member of ring-type of the described grinding pad butt of rotation;
The radial outside, mar proof that is configured in the 1st member than with the 2nd member of described the 1st member height of the described grinding pad butt of rotation, ring-type that the face relative with grinding pad is smooth.
2, back-up ring as claimed in claim 1 is characterized in that, described the 2nd member is made of the member of a plurality of ring-types, and this annular component is configured to mar proof along with increasing successively to its radial outside.
3, a kind of back-up ring when on the grinding pad that wafer is pressed to rotation the surface of described wafer being ground, does not make described wafer its circumference not kept with breaking away from, it is characterized in that,
Described back-up ring is single annular component, and utilizes along with forming to the radial outside of described wafer, the gradient characteristic material that mar proof increases gradually.
4, a kind of back-up ring when wafer is ground to the grinding pad pushing of rotating and to the surface of described wafer, does not keep described wafer with not breaking away to its circumference, it is characterized in that having:
With surround around the described wafer and with the 1st member of ring-type of the described grinding pad butt of rotation;
The radial outside of the 1st member, than with described the 1st member of the described grinding pad butt of rotation more to the 2nd member of the ring-type that described grinding pad disposes, the face relative with grinding pad is smooth side-prominently;
The adjusting device that the overhang of described relatively the 1st member of described the 2nd member is adjusted.
5, back-up ring as claimed in claim 4 is characterized in that, described the 1st member is fixed on the installation component, and described adjusting device is to load and unload the adjustment plate that is installed in freely between this installation component and described the 1st member.
6, back-up ring as claimed in claim 4 is characterized in that, described the 2nd member is fixed on the installation component, and described adjusting device is the adjustment plate that loading and unloading are clamped freely between this installation component and described the 2nd member.
7, a kind of wafer polishing apparatus, with wafer to the grinding pad pushing of rotation and, it is characterized in that having grinding on the surface of described wafer:
The carrier that keeps described wafer and this wafer is pushed to described grinding pad;
Be configured in this carrier outer circumferential side, with the back-up ring of described grinding pad butt,
Described back-up ring comprises:
Thereby with surround around the described wafer to its circumference keep and with the 1st member of ring-type of the described grinding pad butt of rotation;
Be configured in and the radial outside of the 1st member of the described grinding pad butt that rotates, mar proof the 2nd member than described the 1st member height, ring-type that the face relative with grinding pad is smooth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100557882A CN100533675C (en) | 2004-07-30 | 2004-07-30 | Baffle and wafer grinding appts. |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100557882A CN100533675C (en) | 2004-07-30 | 2004-07-30 | Baffle and wafer grinding appts. |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1728343A CN1728343A (en) | 2006-02-01 |
| CN100533675C true CN100533675C (en) | 2009-08-26 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100557882A Expired - Fee Related CN100533675C (en) | 2004-07-30 | 2004-07-30 | Baffle and wafer grinding appts. |
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| CN (1) | CN100533675C (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110434756A (en) * | 2014-03-31 | 2019-11-12 | 株式会社荏原制作所 | Grinding device |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4374370B2 (en) * | 2006-10-27 | 2009-12-02 | 信越半導体株式会社 | Polishing head and polishing apparatus |
| JP6344950B2 (en) * | 2014-03-31 | 2018-06-20 | 株式会社荏原製作所 | Polishing apparatus and polishing method |
| CN108000245B (en) * | 2017-11-30 | 2019-05-10 | 东莞长盈精密技术有限公司 | Hole polishing turned-down edge means of defence |
| JP7178259B2 (en) | 2018-12-27 | 2022-11-25 | 株式会社荏原製作所 | Polishing device and polishing method |
| CN112388506A (en) * | 2019-08-19 | 2021-02-23 | 联芯集成电路制造(厦门)有限公司 | Grinding device |
| CN114290250A (en) * | 2021-12-07 | 2022-04-08 | 河南中光学集团有限公司 | Ultrathin gasket grinding device and using method thereof |
-
2004
- 2004-07-30 CN CNB2004100557882A patent/CN100533675C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110434756A (en) * | 2014-03-31 | 2019-11-12 | 株式会社荏原制作所 | Grinding device |
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| CN1728343A (en) | 2006-02-01 |
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