CN100527414C - LED lamp and LED lamp apparatus - Google Patents
LED lamp and LED lamp apparatus Download PDFInfo
- Publication number
- CN100527414C CN100527414C CNB2006100810019A CN200610081001A CN100527414C CN 100527414 C CN100527414 C CN 100527414C CN B2006100810019 A CNB2006100810019 A CN B2006100810019A CN 200610081001 A CN200610081001 A CN 200610081001A CN 100527414 C CN100527414 C CN 100527414C
- Authority
- CN
- China
- Prior art keywords
- lead
- wire
- led lamp
- led chip
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Abstract
An LED lamp has: a sealing member; first, second and third leads, a part of the first, second and third leads being surrounded by the sealing member; an LED chip mounted on the first lead; and a wire disposed connecting the second lead and the LED chip. The third lead is connected through an electrical path to the first or second lead.
Description
The application is based on Japanese patent application No.2005-146280 and 2005-379514, and the full content of described application is incorporated among the application by reference.
Background of invention
The LED lamp device that the present invention relates to a kind of LED lamp and use this LED lamp.
Technical field
JP-A-2003-258314 discloses a kind of LED lamp device.As shown in fig. 1, LED lamp device 101 comprises LED lamp 102, circuit part 105, terminal 107 and cover portion 108,109.LED lamp 102 comprises pair of lead wires 103,103, and the containment member 104 that surrounds the bullet shape of lead-in wire base end part.Led chip is embedded in the containment member 104.Circuit part 105 is formed by metallic plate and is fastening by inner cover 108, and resistance 106 is attached to this circuit part.The 107th, be connected to the terminal of control appliance (not shown).It is the magnitude of current of supplying with LED lamp 102 in order to control that resistance 106 is provided.
Because metallic plate has replaced expensive printed circuit board (PCB), so the LED lamp device of being formed thus 101 is not expensive on manufacturing cost.
JP-A-5-62059 (utility model) also relates to the present invention.
Yet the structure of LED lamp device is simplified in hope, with convenient its manufacturing.
Summary of the invention
An object of the present invention is to provide a kind of LED lamp that can easily make with low production cost.
Another object of the present invention provides a kind of LED lamp device that is equipped with described LED lamp.
(1) according to an aspect of the present invention, a kind of LED lamp comprises:
Containment member;
First, second and the 3rd lead-in wire, described first, second part with the 3rd lead-in wire is surrounded by containment member;
Be installed in the led chip on described first lead-in wire; And
Setting is used for connecting the line of described second lead-in wire and described led chip,
Wherein said the 3rd lead-in wire is connected to described first or second lead-in wire by power path.
In foregoing invention (1), can carry out following modifications and variations:
(i) by described the 3rd the lead-in wire an end and not by power path be connected to described the 3rd the lead-in wire first or second the lead-in wire an end form terminal.
(ii) described power path comprises resistive element, and described resistive element is provided for described first or second lead-in wire is connected with described the 3rd lead-in wire.
(iii) described first lead-in wire comprises that it is surrounded and be arranged on the end at described LED lamp center by described containment member.
(2) according to a further aspect in the invention, a kind of LED lamp device comprises:
The LED lamp of invention defined in (1) as described; And
Hold described first, second and the 3rd the lead-in wire cover portion,
Wherein said terminal is outstanding from described cover portion.
In foregoing invention (2), can carry out following modifications and variations:
(iv) described first, second and the 3rd lead-in wire form the circuit part in the described cover portion.
＜advantage of the present invention 〉
In the present invention, the LED lamp is provided with three lead-in wires, so that circuit part can be formed by described three lead-in wires.Especially, the 3rd lead-in wire is not directly connected to led chip, but so that the degree of freedom of intensifier circuit portion design.In addition, owing to circuit part is only formed by three lead-in wires, so do not need to use plate or the metallic plate that is commonly used to form circuit part.Thereby, can easily make and can low cost provide LED lamp device.
Description of drawings
Below with reference to the accompanying drawings to being explained according to a preferred embodiment of the invention, wherein:
Fig. 1 is the schematic exploded view that traditional LED lamp device is shown;
Fig. 2 is the front schematic view of the LED lamp in illustrating according to a first advantageous embodiment of the invention;
Fig. 3 is the top view that the LED lamp among Fig. 1 is shown;
Fig. 4 is the circuit diagram that the circuit composition of LED lamp is shown;
Fig. 5 is the front schematic view that the method for making the LED lamp is shown;
Fig. 6 A is the top view of the LED lamp device in illustrating according to a preferred embodiment of the present invention;
Fig. 6 B is the cross sectional view that LED lamp device among Fig. 6 A is shown;
Fig. 7 is the front schematic view that illustrates according to the LED lamp device in second preferred embodiment of the present invention; And
Fig. 8 is the circuit diagram that the circuit composition of LED lamp among Fig. 7 is shown.
Embodiment
To explain element of the present invention below.
Led chip
Led chip type used in this invention is unrestricted.Led chip can be that electrode is formed on type on its top and the bottom, two electrodes and is formed on type (facing up) on its top and two electrodes and is formed on flip-chip (flip chip) type on its bottom.In addition, led chip can be directly installed on first the lead-in wire cup-shaped portion on, and Submount (submount) can between place between it.
The emission color of led chip can at random be selected.Although the blue led chip is used for the following examples, can use to have visible region emission wavelength such as other white, red, orange and green etc. led chip.In addition, the led chip of variety classes and/or emission color can be made up.
Containment member
Containment member is used for covering led chip, and it can be by being formed according to the transparent material that uses and purpose is suitably selected.Containment member suitably comprises the part of lens shape, so that focus on the light that sends from led chip.
Containment member can have the fluorophor that is blended in wherein.Replacedly, comprise fluorophor the layer can be formed on the surface of containment member.
According to the use and the purpose of LED lamp,, can suitably select the kind of fluorophor in conjunction with the emission light of led chip.For example, utilize blue led chip, by using fluorophor to produce gold-tinted by blue light, the emission color of LED lamp can be white.Equally, utilize the ultraviolet LED chip,, can make the fluorescence LED lamp by using fluorophor to produce fluorescence by ultraviolet light.
Lead-in wire
At least three lead-in wires have been used in the present invention.The base portion of lead-in wire is surrounded by containment member.Therefore, though be provided with as cantilever, each lead-in wire can be in the mechanically stable state that is supported by containment member.As long as they conduct electricity, then Yin Xian shape and material can at random be selected.Consider mass productivity and production cost, described lead-in wire is preferably formed by metallic plate.
First lead-in wire is provided with led chip mounted thereto.Be set to the light source on the LED optical axis (center) owing to wish led chip, so preferably the base portion of first lead-in wire also is arranged on the center of LED lamp.
Second lead-in wire is provided with the engaging zones (joint sheet) that is used for line, and described line is arranged to connect this engaging zones and led chip.Thus, power supply can be supplied to led chip.
The 3rd lead-in wire is not directly connected on the led chip.In other words, the 3rd lead-in wire separates with the led chip electricity.By using the 3rd lead-in wire, form circuit part with first and second lead-in wires that are connected to led chip.The 3rd lead-in wire can be made up of a plurality of lead-in wires.By using a plurality of the 3rd lead-in wires, the further degree of freedom of intensifier circuit design.
Preferably in one plane with the base portion setting of at least three lead-in wires that containment member surrounded.This is because when containment member uses plug-in unit molded, can be provided as the base portion of plug-in unit.Equally, when by a metallic plate punching press (punch) being formed three whens lead-in wire, after being stamped, they can directly be used as plug-in unit, and the while is fixedly to bring maintenance.
As a kind of form of circuit part, when the 3rd lead-in wire was connected to for first or second when lead-in wire by power path, can form terminal by the end of the 3rd lead-in wire and the end that is not connected to the lead-in wire of the 3rd lead-in wire by the path.
Therefore, the part of terminal is assigned to the 3rd lead-in wire that is not connected to led chip, can form circuit like this, and need not the 3rd lead-in wire is directly connected to led chip.
For example, as the back in an embodiment as described in, first lead-in wire that LED is mounted thereon is connected with the 3rd lead-in wire, so that its its end formation free end (that is, not being connected to other connector) as terminal.Thereby, can prevent from resistive element to being installed in the thermal impact of led chip on first lead-in wire.
In the element of forming led circuit portion, resistive element needs most, and it is arranged to be connected in series to LED.Resistive element is set in order to connect, resistive element be arranged to led chip be installed on it first the lead-in wire with led chip be separated the 3rd the lead-in wire be connected, so that led chip is connected to the 3rd lead-in wire by first lead-in wire, resistive element, so that the 3rd lead-in wire is used as anode (that is positive electrode) terminal.
Preferably Zener diode is arranged to connect first lead-in wire and second lead-in wire, and is parallel to led chip, and second lead-in wire is as negative electrode (negative electrode) terminal.
According to the use and the purpose of LED lamp device, can design the circuit part that is formed by first to the 3rd lead-in wire arbitrarily.Though in an embodiment, the free end of the 3rd lead-in wire is as parts of terminal, and terminal can be formed by the free end that uses first and second lead-in wires.
According to the use and the purpose of LED lamp device, can select the shape and the material of cover portion arbitrarily.Consider mass productivity, weight saving and production cost, preferably it is formed by plastic moulding.
Below preferred embodiments of the present invention will be described.
First embodiment
Fig. 2 is the front schematic view of the LED lamp in illustrating according to a first advantageous embodiment of the invention.
LED lamp 1 among this embodiment comprises led chip 3, containment member 5, first lead-in wire, 11, second lead-in wire the 12 and the 3rd lead-in wire.
Led chip 3 is by the blue LED based on the synthetic semiconductor manufacturing of the III of family nitride.Bullet shape is made and be molded as to containment member 5 by transparent epoxy resin.
Led chip 3 is installed on the top pedestal of first lead-in wire 11.The negative electrode joint sheet of led chip 3 is electrically connected to the top of second lead-in wire 12 by line 7.First lead-in wire 11 is arranged on the central shaft (optical axis) of LED lamp 1, and led chip 3 also is arranged on the central shaft of LED lamp 1 like this.
The 3rd lead-in wire 13 is not directly connected on the led chip 3.In this embodiment, the height of the 3rd lead-in wire 13 is arranged to be lower than lead-in wire 11,12.Yet the degree of depth of lead-in wire 11 to 13 embedding containment members 5 is unrestricted, as long as they are mechanically stables.
Preferably, as shown in Figure 3, lead-in wire 11 to 13 is arranged to row's (and in one plane).
Replacedly, lead-in wire 11-13 can be arranged on empty vertex of a triangle place.
The number of lead-in wire is not restricted to three, and can be more than three.
Resistive element 21 is arranged to connect first lead-in wire the 11 and the 3rd lead-in wire 13.Resistive element 21 is used for controlling the magnitude of current that supplies to led chip 3, and can be according to the use of led chip 3 and purpose and at random selected.Zener diode 23 is arranged to connect first lead-in wire, 11 and second lead-in wire 12.Zener diode 23 is used for protecting led chip 3 to avoid reverse voltage and the superpotential influence of forward direction, and can build in the Submount, is used for installing led chip 3 thereon.
Fig. 4 is the circuit diagram that the circuit composition of LED lamp is shown.
In this embodiment, as shown in Figure 2, by extending lead-in wire 11,12 and 13 and resistive element etc. is arranged at forms circuit part 30 therebetween.
Form first to the 3rd lead-in wire 11,12,13 by the metallic plate with electrical conductance being carried out punching press.At this moment, as shown in Figure 5, at the end formation retainer 16,17 of terminal 14,15.The frame section 41 of the metallic plate of retainer 16,17 and conduct lead-in wire 11,12,13 base materials forms continuously.Equally, lead-in wire 11,12,13 base end part forms continuously with junction surface 43 as a metallic plate part.
Led chip 3 is installed on first lead-in wire 11, and going between simultaneously 11,12,13 is engaged.Then, closing line 7 is arranged to connect the led chip 3 and second lead-in wire 12.These place the chamber of bullet shape as plug-in unit, and the material of containment member 5 injects this chamber.Then, resistive element 21 is arranged to connect first lead-in wire the 11 and the 3rd lead-in wire 13, and Zener diode 23 is arranged to connect first lead-in wire, 11 and second lead-in wire 12.
Finally, remove retainer 16,17 and junction surface 43, to obtain LED lamp as shown in Figure 2 by punching press.
Replacedly, by using fixed band rather than the continuous junction surface 43 that forms lead-in wire 11,12,13, lead-in wire 11,12,13 can be fixed on its base end part.
As shown in Figure 6, the LED lamp 1 that is obtained thus is arranged in the cover portion 50.LED lamp 1 and cover portion 50 form LED lamp device 100.
By partition wall 60, main part 51 and junction surface 61 form one.Partition wall 60 is provided with through hole 63,64, and by described through hole, terminal 14,15 is inserted into and is outstanding from main part 51.
The 70th, be connected to for example another connector of vehicle electrical system.Insert the connector 70 from main part 51 outstanding terminals 14,15.
Second embodiment
Fig. 7 is the front schematic view according to the LED lamp 10 in second preferred embodiment of the present invention.Similar parts by the same sequence number that is used for LED lamp 1 represented and following omission to its explanation.
Fig. 8 is the circuit diagram that the circuit of LED lamp among Fig. 7 is formed.
Except led chip 3, containment member 5, first lead-in wire, 11 and second lead-in wire 12, LED lamp 10 also comprises two lead-in wires 130,131 as the 3rd lead-in wire.First to the 3rd lead-in wire 11,12,130,131 is arranged to row's (in one plane).Rectifier diode 24 is arranged to connect the 3rd lead-in wire 130 and 131.Rectifier diode 24 is used for protecting led chip 3 to avoid the influence of reverse current.By means of rectifier diode 24, when the LED lamp was reversed incorrect link, led chip 3 can be protected and avoid damaging.The 3rd lead-in wire 130 does not form anode terminal 15 with the end of containment member 5 sealings.On the other hand, the 3rd lead-in wire 131 is not lacked and the formation free ends than anode terminal 15 with the ends of containment member 5 sealings.Be similar to LED lamp 10, Zener diode 23 is arranged to connect the 3rd lead-in wire 131 and first lead-in wire 11.LED lamp 10 manufactures formation circuit as shown in Figure 8.As carrying out in the LED lamp 1,, form first to the 3rd lead-in wire 11,12,130 and 131 by the metallic plate that punching press has conductivity.
In LED lamp 10, rectifier diode 24 is arranged to connect two the 3rd lead-in wires.Therefore, when employed the 3rd number of leads increases, can increase the component number that is arranged at therebetween.Therefore, the further degree of freedom of intensifier circuit design.Utilize LED lamp 10, use as the cover portion 50 in LED lamp 1, also can form LED lamp device.
Though for complete and clearly openly the present invention has been described about specific embodiment, but appended claim is not limited to by this, comprises all modifications and interchangeable structure in the scope that falls within this illustrated basic teaching fully, that those of ordinary skills expected but should be construed to.
Claims (6)
1. LED lamp comprises:
Containment member;
First, second and the 3rd lead-in wire, described first, second part with the 3rd lead-in wire is surrounded by described containment member;
Be installed in the led chip on described first lead-in wire;
Be arranged to connect the line of described second lead-in wire and described led chip,
Wherein said the 3rd lead-in wire is connected to described first or second lead-in wire by power path,
By an end of described the 3rd lead-in wire and form terminal with described first or second end that goes between that described the 3rd lead-in wire is connected by described power path,
Described power path comprises the resistive element that is configured to connect described the 3rd lead-in wire and described first or second lead-in wire, and
Described the 3rd lead-in wire separates on electric with described led chip.
2. LED lamp according to claim 1, wherein:
Described resistive element is arranged on the part place that is not surrounded by described containment member of described the 3rd lead-in wire and described first or second lead-in wire.
3. LED lamp according to claim 2, wherein:
The part place that is not surrounded by described containment member at described first lead-in wire and described second lead-in wire is provided with the Zener diode that is connected described first lead-in wire and described second lead-in wire.
4. LED lamp according to claim 1, wherein:
Described the 3rd lead-in wire comprises many lead-in wires.
5. LED lamp device comprises:
As the LED lamp defined in the claim 1, and
The cover portion that holds the described the first, the second and the 3rd lead-in wire,
Wherein said terminal is outstanding from described cover portion.
6. LED lamp device according to claim 5, wherein:
Circuit part in the described cover of the described the first, the second and the 3rd lead-in wire formation portion.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2005146280 | 2005-05-19 | ||
| JP2005146280 | 2005-05-19 | ||
| JP2005379514 | 2005-12-28 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1866516A CN1866516A (en) | 2006-11-22 |
| CN100527414C true CN100527414C (en) | 2009-08-12 |
Family
ID=37425483
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100810019A Expired - Fee Related CN100527414C (en) | 2005-05-19 | 2006-05-19 | LED lamp and LED lamp apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100527414C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2008031281A1 (en) * | 2006-09-13 | 2008-03-20 | Helio Optoelectronics Corporation | A plugin, combined with a cooler, and thermoelectric separate led bulb |
-
2006
- 2006-05-19 CN CNB2006100810019A patent/CN100527414C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1866516A (en) | 2006-11-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100828891B1 (en) | LED Package | |
| CN102182939B (en) | Lighting device | |
| JP3150812U (en) | LED lighting device | |
| CN202852493U (en) | Lamp device and illuminator | |
| US20130229802A1 (en) | Planar light-emitting illumination device | |
| US20060262533A1 (en) | Modular light emitting diode | |
| KR100727791B1 (en) | Led lighting device of bar type | |
| CN101459162B (en) | Solid illuminating device | |
| CN100563002C (en) | The encapsulating structure of light-emitting diode chip for backlight unit and method thereof | |
| US20060261362A1 (en) | LED lamp and LED lamp apparatus | |
| JP2007526630A (en) | Optical display structure | |
| CN104517947A (en) | Light emitting diode assembly and manufacturing method thereof | |
| MXPA03007573A (en) | High power led. | |
| CN102934228A (en) | Miniature surface mount device | |
| CN103791286A (en) | Linear LED light source, linear LED lamp and manufacturing method for linear LED light source | |
| CN101889355A (en) | Light emitting device and method of fabricating the same | |
| CN102652240A (en) | LED socket assembly | |
| KR100643919B1 (en) | Light emitting diode package with lens | |
| CN202093756U (en) | LED (light-emitting diode) display | |
| CN100527414C (en) | LED lamp and LED lamp apparatus | |
| EP2276077A2 (en) | Press forged metal housing for leds and an led metal package using the metal housing | |
| CN101789422B (en) | Light-emitting diode (LED) module | |
| CN101994925A (en) | Surface adhesion type light-emitting component structure and making method thereof | |
| JP2013203373A (en) | Indoor lighting device for vehicle | |
| KR20070040856A (en) | Light emitting diode package with variable resistance |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090812 Termination date: 20100519 |