CN100524706C - Semiconductor device manufacturing method - Google Patents
Semiconductor device manufacturing method Download PDFInfo
- Publication number
- CN100524706C CN100524706C CNB2007101619466A CN200710161946A CN100524706C CN 100524706 C CN100524706 C CN 100524706C CN B2007101619466 A CNB2007101619466 A CN B2007101619466A CN 200710161946 A CN200710161946 A CN 200710161946A CN 100524706 C CN100524706 C CN 100524706C
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- resin bed
- semiconductor element
- semiconductor device
- semiconductor
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- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/1515—Shape
- H01L2924/15153—Shape the die mounting substrate comprising a recess for hosting the device
- H01L2924/15155—Shape the die mounting substrate comprising a recess for hosting the device the shape of the recess being other than a cuboid
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
- H01L2924/1815—Shape
- H01L2924/1816—Exposing the passive side of the semiconductor or solid-state body
- H01L2924/18162—Exposing the passive side of the semiconductor or solid-state body of a chip with build-up interconnect
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
Description
Claims (17)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002158997 | 2002-05-31 | ||
JP158997/2002 | 2002-05-31 | ||
JP316076/2002 | 2002-10-30 | ||
JP127344/2003 | 2003-05-02 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB03138174XA Division CN100435334C (en) | 2002-05-31 | 2003-05-30 | Semiconductor device and its mfg. method |
Publications (2)
Publication Number | Publication Date |
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CN101131970A CN101131970A (en) | 2008-02-27 |
CN100524706C true CN100524706C (en) | 2009-08-05 |
Family
ID=39129163
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CNB2007101619466A Expired - Fee Related CN100524706C (en) | 2002-05-31 | 2003-05-30 | Semiconductor device manufacturing method |
Country Status (1)
Country | Link |
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CN (1) | CN100524706C (en) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US9613931B2 (en) * | 2015-04-30 | 2017-04-04 | Taiwan Semiconductor Manufacturing Company, Ltd. | Fan-out stacked system in package (SIP) having dummy dies and methods of making the same |
DE112017001101T5 (en) * | 2016-03-01 | 2018-11-29 | Sony Corporation | Semiconductor device, electronic module, electronic device and semiconductor device manufacturing method |
US10714402B2 (en) * | 2016-06-20 | 2020-07-14 | Sony Corporation | Semiconductor chip package for improving freedom of arrangement of external terminals |
CN111370327B (en) * | 2018-12-26 | 2021-12-24 | 中芯集成电路(宁波)有限公司 | Fan-in wafer level packaging method |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1300180A (en) * | 1999-11-24 | 2001-06-20 | 欧姆龙株式会社 | Chip mounting, circuit board, data carrier and mfg. method thereof and electronic element assembly |
US6313521B1 (en) * | 1998-11-04 | 2001-11-06 | Nec Corporation | Semiconductor device and method of manufacturing the same |
US6348728B1 (en) * | 2000-01-28 | 2002-02-19 | Fujitsu Limited | Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer |
-
2003
- 2003-05-30 CN CNB2007101619466A patent/CN100524706C/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6313521B1 (en) * | 1998-11-04 | 2001-11-06 | Nec Corporation | Semiconductor device and method of manufacturing the same |
CN1300180A (en) * | 1999-11-24 | 2001-06-20 | 欧姆龙株式会社 | Chip mounting, circuit board, data carrier and mfg. method thereof and electronic element assembly |
US6348728B1 (en) * | 2000-01-28 | 2002-02-19 | Fujitsu Limited | Semiconductor device having a plurality of semiconductor elements interconnected by a redistribution layer |
Also Published As
Publication number | Publication date |
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CN101131970A (en) | 2008-02-27 |
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