CN100518486C - Quality management system of print substrate - Google Patents
Quality management system of print substrate Download PDFInfo
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- CN100518486C CN100518486C CNB2006100045703A CN200610004570A CN100518486C CN 100518486 C CN100518486 C CN 100518486C CN B2006100045703 A CNB2006100045703 A CN B2006100045703A CN 200610004570 A CN200610004570 A CN 200610004570A CN 100518486 C CN100518486 C CN 100518486C
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Abstract
To provide a quality control system of a printed board for realizing efficient quality control.An imaging means picks up images of a printed board in each process in a series of processes for soldering components on the printed board. An image storage means stores (accumulates) the picked-up images in each of processes so that they may be correlated. An inspection means inspects the solder mounting quality from the picked-up image of the final process. Then, if a failure is detected by inspection, a candidate event selecting means selects one or more events which may be a cause of the failure among the events which may be generated in designing steps or an intermediate processes in manufacturing. An event analyzing means determines the degree of occurrence of each of candidate events by referring to the picked-up images in the intermediate processes. A cause analyzing means estimates the cause of the failure on the basis of combinations of the degree of occurrence of each of the candidate events.
Description
Technical field
(during volume production trial-production) when the present invention relates to a kind of production debugging at printed base plate, be used for the quality control system of quality inspection and management when formally producing.
Background technology
The real dress density of printed base plate is along with the direct surperficial real packing technique (SMT of electronic unit such as welding chip parts on the surface of printed base plate; Surface Mount Technology, the real packing technique of the face that is also referred to as) the appearance and the miniaturization of electronic unit and obtained and developed by leaps and bounds.The raising of the real dress density of printed base plate has very big contribution for the miniaturization of electronic equipment goods.In the real packing technique mode in surface, go up the scolding tin (soldering paste) of silk screen printing paste in the electrode part (pad) of printed base plate, by the parts COG equipmentCOG that is commonly referred to as chip mounters electronic unit is installed on the printed base plate in fact, and, make the soldering paste fusion and electronic unit is welded on the printed base plate surface by in being commonly referred to as the high temperature furnace of reflow ovens, with about 250 ℃, heating.
The base board checking device of the printed base plate after being used for checking backflow can be grasped the quality of welding from the shape of scolding tin leg, promptly can grasp the real dress of the scolding tin quality of each electronic unit.But, check result only from obtaining by base board checking device, as a result of, how can only know the real dress of scolding tin quality, thereby it is on-the-spot in order to be appreciated that what obtains such result in manufacturing, need begin from the process that reaches its result to detect its reason, and all make great efforts to improve the real enforcement of adorning the countermeasure (dealing with method) of quality every day.
But, along with the electronic unit miniaturization, the raising of real dress density and desired technology complexity height, and can not simply say making on-the-spot take place bad and all result from manufacturing.
Thus, as described in patent documentation 1, the design load that will obtain from the CAD device has been proposed, the technology of simulating according to the evaluation result relevant with fraction defective/failure rate.
And in patent documentation 2, disclose the bad item that in base board checking device, takes place, the technology that the pre-prepd information table of reference feeds back to the Interventions Requested relevant with bad item design department.
And in patent documentation 3, following technology is disclosed: the positional information of obtaining the position of centre of gravity that is used to represent pad from the photographed images that original printed base plate is made a video recording, from the photographed images that the printed base plate behind the printing with paste is made a video recording, obtain the positional information of the position of centre of gravity that is used to represent soldering paste, make the lift-launch point of on the mid point of these two positional informations, setting real dress parts and the real dress condition of adjustment component COG equipmentCOG.And following main points are disclosed also in the document: according to the combination of the kind of printed base plate, electronic unit, soldering paste, when the lift-launch point is set in the position of any one position of centre of gravity side of deflection, the relation that to carry position a little in advance and adorn bad occurrence degree in fact can be set in whole realities with the lift-launch point and adorn on the minimum position of bad generation as condition.That is, the just relative soldering paste of the information of extracting from image and the relative depature amount of electronic unit with pad.
Patent documentation 1: the spy opens flat 9-330342 communique
Patent documentation 2: the spy opens flat 11-330784 communique
Patent documentation 3: the spy opens the 2003-229699 communique
As patent documentation 1 disclosed technology, though proposed the method for the design load of a lot of simulate press substrates, but there is the critical defect that can only handle the incident (in other words, can not handle any imagination incident in addition) that can envision by the simulation of computer in this method.Some uncertain factors that always lie dormant at the manufacturing scene, the deviation of the calculating imagination that generation can not be by computer or bad usually.In fact almost there is not only just can improve the example of quality by simulation.Particularly in witnessing the manufacturing scene of these situations, think that simulation is that the consciousness of discommodity is very strong.
And, in patent documentation 2 disclosed technology, though, have in bad to result from make bad and the reason that designs that results to design department feedback and bad relevant inspection item, thereby relative in the manufacturing scene, take place bad, in design, just can not deal with.And, can not deal with every day when only also existing all in the problem at the manufacturing scene that changes with reference to pre-prepd information table.
Say, quality is being made on-the-spot decision substantially, and need determine.Bad for what in manufacturing process, take place, importantly, at first check and whether can deal with at the manufacturing scene, if can deal with,, deal with rapidly by countermeasures of problems completely just to this at the manufacturing scene.
Yet,, just inefficent for can not determine the bad input labour that whether can deal with at the scene of making.This is because for huge creating conditions, the tentative result who adjusts mistakenly when not having the improving of quality, can become the futile and result that finishes of the time and labor that is spent.
That is, in order to realize effective quality management, required is to specify the bad reason that is taken place, and suitably judge whether and can make on-the-spot this bad structure of dealing with.
But, up to the present, bad reason goes out affirmation where, whether can deal with bad affirmation at the scene of making, and depends on intuition and the experience of making on-the-spot skilled person to a great extent, guarantees quality and the stage property (as the system of instrument) of auxiliary this affirmation but be not used in.And, make on-the-spot required be not to show countermeasures of problems suddenly, and importantly, at first confirm the situation of problem, but be not used in the structure of realizing this design according to material object.
Summary of the invention
The present invention makes in view of above-mentioned truth, and its purpose is to provide a kind of quality control system that is used to realize the printed base plate of effective quality management.
It is bad that welding back occurs, and comprises and floating (electrode of parts from scolding tin floats or scolding tin floats from pad situation), build bridge (so that situation that the mode of short circuit is adhered to scolding tin between the electrode of parts), moistening deficiency (electrode of welding and pad or scolding tin and parts engage in-problem situation), departs from (situation that parts, scolding tin depart from from pad), scolding tin is too much, scolding tin is not enough, parts are short of a plurality of kinds such as (situations that does not have parts).And, the incident that becomes these bad reasons is also varied, the inherent incident of the printed base plates such as configuration of the distance of the configuration of existing Wiring pattern, welding wire and pad, pad size, through hole itself for example, have again soldering paste too much with the solder printing operation of the equilibrium of the departing from of not enough, printing position, soldering tin amount etc. in event, the real holding position of parts deviation, lack parts, be pressed into event in the real dress of parts (assembling) operation such as quantity not sufficient.Though can infer that to a certain extent which incident is bad relevant with which, on the contrary, be very difficult from bad its reason incident that specifies that is taken place by experience or theory.This be because, common varying in size of occurrence degree, a plurality of incidents that take place in each operation of making exert an influence mutually and finally become bad and show.
Therefore, in only according to the simulation of CAD information or the existing method of only inferring, be difficult to specify the bad true cause that is taken place, also be difficult to certainly derive exactly and be used to solve these bad effective countermeasures according to the reason of the check result after the welding.
Be conceived to this point, people such as the inventor study with keen determination and have obtained following design.Promptly, when discovery is bad in the inspection after welding, follow the trail of this bad substrate of generation, parts or scolding tin once more and in each operation, be in which type of state, and when whether the correlation and analyzing that comprises combination, the fraction defective of its occurrence degree, incident has taken place with bad relevant incident, can find out bad reason in each operation with very high possibility.And, when specifying bad reason incident exactly, can make specify the generation be used to suppress this incident countermeasure (for example, the adjustment of the condition value of creating conditions, design alteration etc.) thing and to specify the department, the operation that are used to obtain this countermeasure easy, thereby can realize effective quality management.
It is important in this that, the state of bad substrate, parts or scolding tin takes place, promptly Shi Wu state tracking is analyzed to operation in the past.In order to realize this, in the present invention, in a series of operation of welding, in each operation, printed base plate is made a video recording, and the storage photographed images.And, take place by contrasting the photographed images of each operation, to carry out the analysis of reason incident, the decision of countermeasure when bad.
Below, concrete formation of the present invention is described.
The quality control system of first scheme of the present invention comprises image unit, image storage unit, inspection unit, candidate incident selected cell, incident resolution unit, display unit, analysis of causes unit.In this quality control system, image unit in the series of processes of welding assembly, is made a video recording to printed base plate in each operation on printed base plate; Image storage unit is set up the photographed images in each operation related and is stored; Inspection unit is checked the real dress of scolding tin quality from the photographed images of final operation.And, detect when bad by inspection, candidate incident selected cell, from may be the middle operation of design phase or manufacturing in the event, select may become this bad reason the incident more than 1 or 1 as the candidate incident; The incident resolution unit by the photographed images of reference with the operation of described candidate event correlation, is judged the occurrence degree of each candidate incident; Display unit, demonstration and the photographed images of the operation of described candidate event correlation and the occurrence degree of each candidate incident; This bad reason according to the combination of the occurrence degree of each candidate incident, is inferred in analysis of causes unit.
According to this structure, can find out bad reason from the photographed images (that is the image of bad material object, takes place) of each operation of making.Therefore, the specifying of bad reason, with and the research of countermeasure easy, thereby can carry out effective quality management.
Preferably, analysis of causes unit export simultaneously analysis result and according to.
By the basis that prompting is analyzed, help user's (making on-the-spot operator etc.), also to help reliability evaluation, the countermeasure of analysis result to the understanding of poor prognostic cause.
Preferably, analysis of causes unit comprises regularization condition decision unit, and this regularization condition decision unit is according to the combination of the occurrence degree of each candidate incident, and decision is in order to solve this bad former thereby creating conditions of needing to adjust.
Thus, be easy to be used to solve the countermeasure decision of this bad reason.
Preferably, analysis of causes unit also comprises the regularization condition analytic unit, this regularization condition analytic unit, the described decision adjustment of creating conditions that needs to adjust is tested a plurality of condition values of usefulness, check result according to each printed base plate of checking out by described inspection unit that produces according to each condition value, calculate the fraction defective of each condition value, and determine optimal condition value according to the fraction defective of each condition value.
According to this structure, be easy to help to solve the improvement of the bad condition value of creating conditions.
And preferably, the regularization condition analytic unit according to the variation tendency of described fraction defective, judges whether can solve this bad reason by described adjustment of creating conditions.For example, the regularization condition analytic unit when " scope of the condition value of fraction defective below pre-determined reference value be foozle scope or more than it ", is judged to be " can solve by above-mentioned adjustment of creating conditions this is bad "; When " scope of the condition value of fraction defective below pre-determined reference value is littler than foozle scope ", be judged to be " this is bad though can solve by above-mentioned adjustment of creating conditions, and this is bad to be to result from the bad of design "; When " scope that does not have the condition value of fraction defective below pre-determined reference value ", be judged to be " can not solve this is bad " by above-mentioned adjustment of creating conditions.
According to this result of determination, owing to can easily judge whether to solve by the condition of creating conditions that this is bad, thereby can be used for dealing with of quality improving effectively.
Preferably, above-mentioned quality control system, also comprise the analytical information memory cell, it is for detected bad, set up relatedly to the analysis result of the occurrence degree of the photographed images of the information of major general's parts, bad kind, each operation, incident and described analysis of causes unit, and store as analytical information.
Preferably, above-mentioned quality control system also comprises the analytical information output unit, and it selects to solve with this bad reason the terminal of relevant department according to the analysis result of described analysis of causes unit, and exports described analytical information to selected this terminal.For example, result of determination is exported above-mentioned analytical information under the situation of " can solve by above-mentioned adjustment of creating conditions " to the terminal of manufacturing sector; Under the situation of result of determination for " though can solve, this is bad result from design ", export above-mentioned analytical information to the terminal of manufacturing sector and the terminal of design department by above-mentioned adjustment of creating conditions; Result of determination is exported above-mentioned analytical information under the situation of " can not solve by above-mentioned adjustment of creating conditions " to the terminal of design department.And, when all terminal being arranged in each manufacturing process, can be to concerning the terminal output analytical information of operation the most closely.
Thus, relatively with this bad relevant department, the department that promptly is used to solve this bad reason, notifying can be accurately with the bad relevant details that taken place and promptly carry out effective countermeasure.For example, the scope of above-mentioned condition value is than foozle scope hour, is set at fit value even this is created conditions, and also owing to foozle exists bad possibility takes place.Thus, in this case, by to manufacturing sector and the both sides of design department notice and bad relevant details, can be rapidly and be to handle exactly in manufacturing sector (scene), still be the judgement that restudies from design.
Preferably, candidate incident selected cell has the bad classification chart that bad kind is corresponding with becoming this bad event establishment, by deciding the candidate incident with reference to this bad classification chart.
And, preferably, regularization condition decision unit, have with the combination of the occurrence degree of incident and in order to solve these incidents adjustable creating conditions set up related regularization condition table, by with reference to fixed the creating conditions of needing to adjust of this regularization condition voting.
And, preferably, regularization condition decision unit, the priority sequence table with adjustment order that regulation creates conditions, when a plurality of creating conditions of needing to adjust arranged, the adjustment order of respectively creating conditions according to described priority sequence table decision.
And preferably, the incident resolution unit is extracted meaningful information by image processing from photographed images, according to the occurrence degree of this meaningful information decision incident.
Wherein, also comprise image recognition in the image processing.According to this structure, can automatically extract the occurrence degree of incident from photographed images.
In addition, the occurrence degree of incident also can be judged by user (operator), input, rather than system is automatically judged.For example, preferably, the incident resolution unit when the incident of generation, shows the photographed images that shows its feature with the guide that helps to judge whether the incident that takes place, thereby urges the user to carry out whether taking place in this photographed images the judgement and the input of described incident.The user can be easy to the occurrence degree of decision event by comparing guide and material picture.
Quality control system described above, aid is adjusted in quality management in the time of can being preferred for producing debugging, when volume production is manufactured experimently and manufacturing.
And, the analytical information memory cell, with the image of material object, corresponding each its bad reason incident that is taken place of storage, effective countermeasure etc., thereby as described below, can be with real-time the dealing with of the bad generation of these data (analytical information) when being used for relative volume production.
For example, can on above-mentioned quality control system, be provided with: degree of admission decision unit, according to the analytical information that is stored in the described analytical information memory cell, the incident in the middle operation that decision is made allow occurrence degree; With the middle inspection unit, obtain the occurrence degree of incident from the photographed images of middle operation, whether exceed the described occurrence degree of allowing by judging this occurrence degree, the generation of detection poor prognostic cause in middle the operation of making.Allow that occurrence degree is meant the feasible value of the occurrence degree of incident, that is, can not bring out the occurrence degree of bad degree (can not become the degree of poor prognostic cause).
Because in existing inspection, only investigation bad having or not after welding, thereby the quality management in the middle operation, poor prognostic cause specify very difficult.On the contrary, in structure of the present invention, may in middle operation, become the incident of poor prognostic cause owing to can detect, thereby can pinpoint the problems in advance, and can be corresponding rapidly.And this allows occurrence degree, according to the analytical information of being stored, can corresponding each parts (each position on variety of components, the substrate), each operation, each incident and stipulate, thereby the high inspection of reliability that can the implementation basis material object.
Preferably, above-mentioned quality control system, also comprise: the contrast unit, detect by described middle inspection unit and to surpass when allowing the incident of occurrence degree, select the analytical information that poor prognostic cause, has the incident identical from described analytical information memory cell with this incident; With the countermeasure information output unit, export selected analytical information, as the countermeasure information that is used to solve detected poor prognostic cause.
Because according to this countermeasure information, the detailed content that can know the analogue that takes place in the past (for example, institute's event and degree thereof, by this incident bring out bad, in order to solve this bad creating conditions etc. of needing to adjust), thereby help to formulate the effective countermeasure of the problem of corresponding current generation.
Preferably, above-mentioned countermeasure information output unit according to the analysis result that is included in the selected described analytical information, is selected the terminal of the department relevant with this poor prognostic cause, and is exported described countermeasure information to selected terminal.At this moment, also under the situation that this poor prognostic cause can solve by the adjustment of creating conditions, export countermeasure information to the terminal of relevant manufacturing sector; Though can solve by the adjustment of creating conditions, but should badly result under the situation of design, export countermeasure information to the terminal of manufacturing sector and the terminal of design department; Under the situation that can not solve by above-mentioned adjustment of creating conditions, the terminal output countermeasure information to design department.
Preferably, above-mentioned countermeasure information output unit, the photographed images that detects the substrate that surpasses described incident of allowing occurrence degree is shown as material picture, and will be included in the selected described analytical information photographed images as a comparison image show.
According to this structure, by the reading material picture, can confirm by material object which kind of degree takes place which incident, and by with reference to movement images, can grasp easily that when directly entering next operation which to take place bad.
And the quality control system of alternative plan of the present invention comprises: image unit, on printed base plate, in a series of operation of welding assembly, in each operation, printed base plate is made a video recording; Image storage unit is set up the photographed images in each operation related and is stored; Inspection unit is checked the real dress of scolding tin quality from the photographed images of final operation; Candidate incident selected cell detects when bad parts take place by inspection, from may be the middle operation of design phase or manufacturing in the event, select may become this bad reason the incident more than 1 or 1 as the candidate incident; The incident resolution unit to the parts group of each described parts and identical type, by the photographed images with reference to middle operation, is judged the occurrence degree of each candidate incident; With analysis of causes unit,, infer this bad reason according to the correlation of the occurrence degree of each candidate incident and described parts group's fraction defective.
As described above, when using parts group's the information of identical type, can be clearly in the correlation of middle operation event and final check result (fraction defective), owing to can grasp bad occurrence tendency by incident difference (or combination difference of the incident of pressing), thereby can infer this bad reason with high likelihood.
For example, above-mentioned analysis of causes unit, by the occurrence degree of 1 candidate incident vary in size or by the combination difference of the size of the occurrence degree of a plurality of candidate incidents, described parts heap sort is a plurality of groups, calculate the fraction defective of parts of each group, will be estimated as described bad reason in the candidate incident of the upper group of fraction defective in whole groups or the combination of candidate incident.
Preferably, above-mentioned analysis of causes unit, when the combination of a plurality of candidate incidents that are estimated to be described poor prognostic cause or candidate incident is arranged, the combination of each candidate incident or candidate incident selected creating conditions of the generation that is used to suppress incident, respectively selected a plurality of creating conditions adjusted condition value at least one time, carry out the trial-production of printed base plate, each printed base plate of being manufactured experimently is obtained the correlation of the occurrence degree and the fraction defective of each candidate incident, compare with the printed base plate of before the adjustment of creating conditions, making, and find out the occurrence degree of incident and the candidate incident that fraction defective diminishes or the combination of candidate incident, with it as described bad reason, and decision is used to suppress the creating conditions of generation of the combination of the candidate incident found out or candidate incident, as preferential the creating conditions of adjusting of needs.
By the adjustment of creating conditions make the occurrence degree of incident and fraction defective diminish (that is, showing significantly) by adjusting its effect be meant that the combination of relative incident or incident is the possibility height of this bad true cause.That is,,, the labour of the countermeasures of problems that is used for quality improving can be cut down significantly, effective quality management can be realized by creating conditions of finding out poor prognostic cause rightly and need to adjust according to above-mentioned processing.
And, preferably, alternative plan of the present invention relatively, unit and the processing can appropriate combination in above-mentioned first scheme, described.
And the present invention also can constitute the quality control system of the printed base plate of at least a portion with said units.And the present invention also can constitute the quality control method that comprises the printed base plate of at least a portion in the above-mentioned processing, perhaps is configured for realizing the program of said method.Above-mentioned each unit and processing can be tried one's best combination mutually and be constituted the present invention.
The invention effect
According to the present invention, can realize the effective quality management in the manufacturing of printed base plate.
Description of drawings
Fig. 1 is the figure of summary of processing of the quality control system of expression first execution mode.
Fig. 2 is the figure of the formation of expression quality control system.
Fig. 3 is the block diagram that the function of expression printed base plate receiving system and substrate receiving check device constitutes.
Fig. 4 is the flow chart of the flow process of the expression substrate processing that receives operation.
Fig. 5 is the block diagram that the function of expression soldering paste printing device and apparatus for inspecting solder printing constitutes.
Fig. 6 is the flow chart of flow process of the processing of expression solder printing operation.
Fig. 7 is the block diagram that the function of expression electronic unit COG equipmentCOG and the real dress of parts testing fixture constitutes.
Fig. 8 is the expression flow chart of the flow process of the processing of dress operation in fact.
Fig. 9 is the block diagram that the function of expression reflux and base board checking device constitutes.
Figure 10 is the flow chart of flow process of the processing of expression reflow process.
Figure 11 is the block diagram that the expression and the contrast image of information processor generate processing function associated formation.
Figure 12 is the flow chart of the flow process handled of the generation of expression contrast image.
Figure 13 is the figure that expression is stored in an example of the data in contrast image information DB and the analytical information storage part.
Figure 14 is that expression is handled the block diagram that function associated constitutes with the quality management of information processor.
Figure 15 is the flow chart of the main program of quality management processing.
Figure 16 is the flow chart of the routine analyzer of quality management processing.
Figure 17 is the flow chart of the meaningful information subprogram of the automatic determined type handled of quality management.
Figure 18 is the flow chart of the meaningful information subprogram of user's input type of handling of quality management.
Figure 19 is the figure of an example of the bad classification chart of expression.
Figure 20 is the figure that an example of bad contrast picture is floated in expression.
Figure 21 is the expression figure of an example of the result of determination picture of dress deviation in fact.
Figure 22 is the figure of an example of the instable guide screen of expression pattern.
Figure 23 is the figure that presentation of events is judged an example of the object picture after finishing.
Figure 24 is the figure of an example of expression regularization condition table.
Figure 25 is the figure of an example of expression priority sequence table.
Figure 26 is the figure that the expression reason explains orally an example of picture.
Figure 27 is the figure that the expression countermeasure explains orally an example of picture.
Figure 28 is the figure that expression is stored in an example of the analysis result in the analytical information storage part.
Figure 29 is the figure of the example of presentation of events and bad correspondence mappings figure.
Figure 30 is the figure of summary of processing of the quality control system of expression second execution mode.
Figure 31 is that expression is handled the block diagram that function associated constitutes with the quality management of the information processor of second execution mode.
Figure 32 is the flow chart of the routine analyzer handled of the quality management of second execution mode.
Figure 33 is the figure of an example of the adjustment test pictures of the expression amount of being pressed into adjustment usefulness.
Figure 34 is the figure that expression is pressed into an example of quantitative analysis chart.
Figure 35 is the figure of the variation tendency of expression fraction defective.
Figure 36 is the flow chart of the flow process of expression regularization condition analyzing and processing.
Figure 37 is the figure that expression is stored in an example of the analysis result in the analytical information storage part.
Figure 38 is the block diagram that the expression and the audit program of the quality control system of the 3rd execution mode generate processing function associated formation.
Figure 39 is that audit program generates the flow chart of handling.
Figure 40 is the block diagram that the expression and the real-time QC of the quality control system of the 3rd execution mode handle the function associated formation.
Figure 41 is the flow chart of the flow process of the expression substrate processing that receives operation.
Figure 42 is the flow chart of flow process of the processing of expression solder printing operation.
Figure 43 is the expression flow chart of the flow process of the processing of dress operation in fact.
The flow chart of the flow process of the processing when Figure 44 is the detection of expression poor prognostic cause.
Figure 45 is the flow chart that the output of expression countermeasure information determines the flow process of processing.
Figure 46 is the figure of an example of expression countermeasure information frame.
Figure 47 is the flow chart of the routine analyzer handled of the quality management of the 4th execution mode.
Figure 48 represents the result's of interrelation analysis the figure of an example.
Figure 49 represents the result's of the adjusted interrelation analysis of SMT condition the figure of an example.
Embodiment
With reference to the accompanying drawings, exemplarily describe preferred implementation of the present invention in detail.
(first execution mode)
At first, with reference to Fig. 1, the summary of processing of the quality control system of first execution mode of the present invention is described.Quality management during in the present embodiment, with the trial-production of production debugging/volume production is as object.
Enter production debugging/volume production before the formal production when manufacturing experimently, generally speaking, need carry out the improvement of quality at the scene by manufacturing experimently repeatedly and the adjustment of create conditions (below, as the meaning of creating conditions of pass is housed and is called " SMT condition ") with the surface is real.The quality control system of present embodiment when the real dress of scolding tin quality goes wrong, is inferred decision with its countermeasure by carrying out bad reason, and auxiliary on-the-spot problem solves.
As shown in Figure 1, in native system,, make a video recording for each printed base plate behind reception back, the solder printing, behind the real dress of parts, after the backflow by being configured in the camera head (testing fixture) in each operation.The photographed images of the same parts on the same substrate is interrelated and store as " contrast image ".
For the inspection after refluxing, when finding that certain parts has when bad, carry out and the corresponding routine analyzer of this bad item (bad kind), and select and to become the one or more incident of (being speculated as becomes the possibility of bad reason height) of this bad reason.Wherein, selecteed incident is called " candidate incident ".
Then, in native system,, can carry out the judgement of the occurrence degree of this incident for each selected candidate incident.The incident that occurrence degree is bigger in the candidate incident becomes the possibility height of this bad reason incident.In this determination processing, roughly distinguishing has 2 kinds of methods.A kind of be extract meaningful information (characteristic quantity) by image processing from photographed images thus automatically judge the method for the occurrence degree of candidate incident.Another kind is to show photographed images (also comprising the image after the original image enforcement image processing) thereby method from the occurrence degree of candidate incident to the field operation person that import.Use judgement automatically or user's input according to the kind difference of incident.And also can combination image handle and operator's input and semi-automatically judging.
And, such as bad and corresponding relation, each incident this candidate incident in which operation, take place or can observed events during with reference to the image of which operation item, accumulate as the technical know-how at scene empirically.Native system is with the real knowledge base of dressing up of the technical know-how at such scene.
When lifting an example, when detecting " floating bad ", as with float bad related candidate incident, can select " instability of pattern ", " deviation of solder printing position ", " deviation of the real holding position of parts " etc.The instability of pattern is meant, makes the having or not of the unsettled Wiring pattern of posture of parts and interference part.The instability of pattern is the problem that designs that results from, and can observe by original printed base plate (image after the reception).The deviation of solder printing position is meant the situation that soldering paste departs from from the pad center on the substrate, can arrive by the image observation behind the solder printing.The deviation of the real holding position of parts is meant the situation that parts depart from from the pad center on the substrate, can arrive by the image observation behind the real dress of parts.
Native system is inferred this bad reason according to the combination of the occurrence degree of each incident, and decision needs the SMT condition of adjustment in order to address this problem.At this, the occurrence degree by not only considering incident, also consider combination, thereby can deal with bad that interaction by a plurality of incidents causes.For example, the unsettled occurrence degree of pattern be " greatly ", solder printing position deviation occurrence degree for the occurrence degree of the deviation of the real holding position of " little ", parts for " in " the situation of combination under, with " instability of pattern " and the deviation of holding position " parts real " during, " bias " and " amount of being pressed into " of the COG equipmentCOG in the real dress operation is elected to be creating conditions of needing to adjust as main cause.
By such analysis result is pointed out to user (field operation person or designer) with the basis that derives this analysis result, can carry out confirming based on the situation of material picture, and can alleviate the operation of quality improvement, thereby can carry out quality management efficiently.
Below, describe the concrete formation that the quality management be used to realize present embodiment is handled in detail.
(system's formation)
Fig. 2 is the figure of the formation of expression quality control system.This quality control system on printed base plate in the series of processes (substrate receives operation～solder printing operation～reality and adorns operation～reflow process) of the surface real dress flow process of welding electronic unit, detects badly, analyzes bad reason, and determines its countermeasure.
Quality control system roughly is made of information processor 1, substrate receiving check device 2, apparatus for inspecting solder printing 3, the real dress of parts testing fixture 4, base board checking device 5 and design department's terminal 6.Between these devices, the terminal, connect by LAN electronic communication circuits such as (local AreaNetwork, local area network (LAN)s), mutually transceive data.
Substrate receiving check device 2, apparatus for inspecting solder printing 3, the real dress of parts testing fixture 4 are respectively to receive the device of carrying out middle inspection in operation, solder printing operation, the real dress operation at substrate.Substrate receiving check device 2, be located between printed base plate receiving system (not shown) and the soldering paste printing device 7, mainly have function that the original printed base plate that imports in the soldering paste printing device 7 is made a video recording and the function of checking the problem of printed base plate from this image.Apparatus for inspecting solder printing 3 is located between soldering paste printing device 7 and the electronic unit COG equipmentCOG 8, mainly has function that the printed base plate behind the printing with paste is made a video recording and the function of checking the problem of soldering paste from this image.And the real dress of parts testing fixture 4 is located between electronic unit COG equipmentCOG 8 and the reflux 9, mainly has function that the printed base plate behind the real dress of electronic unit is made a video recording and from the function of the problem of the real dress of this image inspection part.Wherein, describe in the 3rd execution mode with the middle inspection function associated.
Base board checking device 5 is the real inspection units of adorning the final inspection of quality of scolding tin of (welding back) after being used to reflux.Base board checking device 5 is located at the downstream of reflux 9.The base board checking device 5 of present embodiment adopts so-called colored high light mode.Colored high light mode is meant following technology: a plurality of light sources that differ from one another with incidence angle (for example, three coloured light of red, green, blue) irradiated substrate, and its reverberation made a video recording, thereby obtain the 3D shape (leg shape) of scolding tin as the emulation coloured image, and check the having or not of failure welding, the kind that it is bad thus.
Design department's terminal 6 is provided in a side of the computer of design department.Though Fig. 2 has only represented a station terminal, many design department's terminals can be set also as required.
(explanation of surface real dress flow process)
Detailed with reference to accompanying drawing, the manufacturing installation that uses in each operation to surface real dress flow process and the structure of testing fixture and the processing in each operation describe.
(1) receives operation
Fig. 3 represents that the function of printed base plate receiving system and substrate receiving check device 2 constitutes.Thereby the control circuit of each device is according to the function of representing among the various hardware realization of program control Fig. 3.
The printed base plate receiving system is to have the printed base plate transport unit of original printed base plate to import to the real device of adorning the flow process in surface from preparation original printed base plate, as shown in Figure 3, has indication information receiving function 100 and substrate transmitting function 101.And, substrate receiving check device 2, as the function that is used to make a video recording, write down the original printed base plate that is imported, have CAD information read functions 200, XY worktable operating function 201, substrate identification code distribution functions 202, camera function 203, substrate identification code and pay function 204, substrate transmitting function 205, image write-in functions 206, information transfer function 207, receive operation photographed images information D B 208.
Receive the flow process of the processing in the operation according to the flowchart text of Fig. 4.
The indication information receiving function 100 of printed base plate receiving system is to being in wait state (step S100, not, step S101) before input is used in reference to the indication information that the real dress of presentation surface flow process begins.Receive indication information from ancillary equipment (device of manufacturing sector's terminal, a last operation), perhaps during the operation of the information input unit by printed base plate receiving system input indication information, indication information receiving function 100, identification is included in information substrate (model) and quantity in the indication information, and sends substrate transmitting function 101 and substrate receiving check device 2 needed information (step S100, be).
On the other hand, CAD information read functions 202 according to the model with the indication information appointment, reads the CAD information (step S104) corresponding with this printed base plate from the CAD information storage part 103 of information processor 1.
XY worktable operating function 201 obtains the information such as size, shape, configuration of components of substrate from the CAD information that is read, the operation XY worktable so that substrate be positioned on the camera position of camera (step S105).And camera function 203 is synchronously controlled camera and illumination with the operation of XY worktable, to printed base plate make a video recording (step S106).And, in the time of can't once making a video recording, can operate XY worktable several times and make a video recording whole printed base plate.
Then, the substrate identification code is paid function 204 and is paid substrate identification code (step S107) to photographed images.Image write-in functions 206 stores photographed images among the reception operation photographed images information D B 208 (step S108) into substrate identification code and CAD information.Thus, the state in the reception operation of each substrate (state of original printed base plate) is carried out record as image.
Then, information transfer function 207, the information that substrate identification code etc. is relevant with substrate, send in the soldering paste printing device 7 of next operation (step S109) with indication information, substrate transmitting function 205 transmits the printed base plate (step S110) that shooting finishes to soldering paste printing device 7, finishes to receive operation thus.Wherein, when having specified the quantity more than 2 or 2 in indication information, specified quantity is inferior repeatedly with above-mentioned processing.
(2) solder printing operation
Fig. 5 represents that the function of soldering paste printing device 7 and apparatus for inspecting solder printing 3 constitutes.Thereby the control circuit of each device is according to the function of representing among the various hardware realization of program control Fig. 5.
Soldering paste printing device 7 is the devices that print soldering paste by silk screen printing on printed base plate, as shown in Figure 5, has indication information receiving function 700, substrate transmitting function 701, printing condition read functions 702, printing with paste function 703.And, apparatus for inspecting solder printing 3, as the function that is used to make a video recording, write down the printed base plate behind the printing with paste, have CAD information read functions 300, XY worktable operating function 301, camera function 302, substrate identification code and pay function 303, substrate transmitting function 304, image write-in functions 305, information transfer function 306, printing process photographed images information D B 307.
Flow process according to the processing of the flowchart text welding sequence of Fig. 6.
The indication information receiving function 700 of soldering paste printing device 7, from operation with before indication information is imported the information relevant with substrate together, be in wait state (step S200, not, step S201).When substrate receiving check device 2 receives indication informations etc., indication information receiving function 700, identification is included in model and quantity in the indication information, and sends substrate transmitting function 701, printing condition read functions 702 and apparatus for inspecting solder printing 3 needed information (step S200, be).
Printing condition read functions 702 according to the model with the indication information appointment, reads the printing condition corresponding with this printed base plate (step S202) from SMT information storage part 104.Printing condition comprises SMT conditions such as squeegee (ス キ one ジ) speed, squeegee coining, version separating rate.
And SMT information storage part 104 is the memory cell of creating conditions of the various SMT conditions (creating conditions) in each operation of the real dress of storage surface flow process.At this, the SMT condition relevant with the solder printing operation is called " printing condition ", the SMT condition relevant with real dress operation is called " real dress condition ", the SMT condition relevant with reflow process is called " counterflow condition ".In the present embodiment, be provided with SMT information storage part 104 in information processor 1, information processor 1 is managed various SMT conditions uniformly.But, be not limited to this formation, also the SMT information storage part can be set respectively in the manufacturing installation of each operation.
On the other hand, in apparatus for inspecting solder printing 3, CAD information read functions 300 according to the model with the indication information appointment, reads the CAD information (step S205) corresponding with this printed base plate from CAD information storage part 103.
XY worktable operating function 301 obtains the information such as size, shape, configuration of components of substrate from the CAD information that is read, the operation XY worktable so that substrate be positioned on the camera position of camera (step S206).And camera function 302 is synchronously controlled camera and illumination with the operation of XY worktable, and to the printed base plate behind the printing with paste make a video recording (step S207).And, in the time of can't once making a video recording, can operate XY worktable several times and make a video recording whole printed base plate.
Then, the substrate identification code is paid function 303 and is paid substrate identification code (step S208) to photographed images.Image write-in functions 305 stores photographed images among the printing process photographed images information D B 307 (step S209) into substrate identification code and CAD information.Thus, the state in the solder printing operation of each substrate (state behind the printing with paste) is carried out record as image.
Then, information transfer function 306, the information together that substrate identification code etc. is relevant with substrate with indication information sends in the electronic unit COG equipmentCOG 8 of next operation (step S210), substrate transmitting function 304 transmits the printed base plate (step S211) that shooting finishes to electronic unit COG equipmentCOG 8, finishes the solder printing operation thus.Wherein, when having specified the quantity more than 2 or 2 in indication information, specified quantity is inferior repeatedly with above-mentioned processing.
(3) real dress operation
Fig. 7 represents that the function of electronic unit COG equipmentCOG 8 and the real dress of parts testing fixture 4 constitutes.Thereby the control circuit of each device is according to the function of representing among the various hardware realization of program control Fig. 7.
Electronic unit COG equipmentCOG 8, it is device at real dress (electronic unit is set on soldering paste) electronic unit on the printed base plate, as shown in Figure 7, have indication information receiving function 800, substrate transmitting function 801, CAD information read functions 802, XY worktable operating function 803, real dress condition read functions 804, the real dress function 805 of parts.And, the real dress of parts testing fixture 4, as be used to make a video recording, the function of printed base plate behind the real dress of recording-member, have camera function 400, the substrate identification code is paid function 401, substrate transmitting function 402, image write-in functions 403, information transfer function 404, real dress operation photographed images information D B 405.
Flow process according to the processing in the real dress of the flowchart text operation of Fig. 8.
The indication information receiving function 800 of electronic unit COG equipmentCOG 8, from operation with before indication information is imported the information relevant with substrate together, be in wait state (step S300, not, step S301).When apparatus for inspecting solder printing 3 receives indication informations etc., indication information receiving function 800, identification is included in model and the quantity in the indication information, and carries out following processing.
Real dress condition read functions 804 according to the model by the indication information appointment, reads the real dress condition (step S302) corresponding with this printed base plate from SMT information storage part 104.Real dress condition comprises the deviation value of COG equipmentCOG, the amount of being pressed into of parts, the translational speed of COG equipmentCOG etc.
Then, the substrate identification code is paid function 401 and is paid substrate identification code (step S308) to photographed images.Image write-in functions 403 stores photographed images among the real dress operation photographed images information D B 405 (step S309) into substrate identification code and CAD information.Thus, the state in the real dress printing process of each substrate (state behind the real dress of parts) is carried out record as image.
Then, information transfer function 404, the information together that substrate identification code etc. is relevant with substrate with indication information sends in the reflux 9 of next operation (step S310), substrate transmitting function 402 transmits the printed base plate (step S311) that shooting finishes to reflux 9, finishes real dress operation thus.Wherein, when having specified the quantity more than 2 or 2 in indication information, specified quantity is inferior repeatedly with above-mentioned processing.
(4) reflow process
Fig. 9 represents that the function of reflux 9 and base board checking device 5 constitutes.Thereby the control circuit of each device is according to the function of representing among the various hardware realization of program control Fig. 9.
Reflux 9 is the devices that weld electronic unit by the heating and melting soldering paste, as shown in Figure 9, has indication information receiving function 900, substrate transmitting function 901, counterflow condition read functions 902, backflow functionality 903.And, base board checking device 5 has CAD information read functions 500, XY worktable operating function 501, camera function 502, substrate identification code and pays function 503, audit program read functions 504, audit program storage part 505, audit function 506, check result write-in functions 507, inspecting substrate photographed images information D B 508, substrate transmitting function 509.
Flow process according to the processing of the flowchart text reflow process of Figure 10.
The indication information receiving function 900 of reflux 9, from operation with before indication information is imported the information relevant with substrate together, be in wait state (step S400, not, step S401).When the real dress of parts testing fixture 4 receives indication informations etc., indication information receiving function 900, identification is included in model and the quantity in the indication information, and carries out following processing.
Counterflow condition read functions 902 according to the model by the indication information appointment, reads the counterflow condition corresponding with this printed base plate (step S402) from SMT information storage part 104.Counterflow condition comprises heating-up temperature or heating time etc.
Then, in base board checking device 5, CAD information read functions 500 reads the CAD information (step S405) corresponding with this printed base plate according to model from CAD information storage part 103.And XY worktable operating function 501 is according to CAD information operating XY worktable (step S406), and camera function 502 is synchronously controlled camera and illumination with the operation of XY worktable, to soldered electronic unit make a video recording (step S407).On this photographed images, similarly, pay function 503 by the substrate identification code and pay substrate identification code (step S408).
Then, audit program read functions 504 reads the audit program corresponding with this printed base plate (step S409) according to model from audit program storage part 505.Audit program is used for order and the parameter that regulation is checked, for example, and the characteristic quantity that comprises image processing that photographed images is implemented, extracts from image, with the characteristic quantity that is extracted determinating reference relatively etc.
Then, by substrate transmitting function 509 printed base plate is sent to (step S412) in the assembly process.Wherein, when having specified the quantity more than 2 or 2 in indication information, specified quantity is inferior repeatedly with above-mentioned processing.
(5) generation of contrast image
When above-mentioned a series of processing finished, the information such as check result of the image of making a video recording in each operation, the real dress of scolding tin quality were collected in the information processor 1, carry out the generation of contrast image and analytical information.
As shown in figure 11, information processor 1, as the function that is used to generate the contrast image, have inspecting substrate photographed images read functions 105, real dress operation photographed images read functions 106, printing process photographed images read functions 107, receive operation photographed images read functions 108, contrast image systematic function 109, contrast image write-in functions 110.Thereby the CPU by information processor 1 realizes these functions according to the various hardware of program control.
Shown in the flow chart of Figure 12, inspecting substrate photographed images read functions 105 monitors the renewal (step S500, not, step S501) of inspecting substrate photographed images information D B 508.When knowing that new inspecting substrate photographed images is registered, inspecting substrate image read functions, from inspecting substrate photographed images information D B 508, this image is read with substrate identification code and check result, and these data are sent to contrast image systematic function 109 (step S502).
Then, real dress operation photographed images read functions 106 reads the photographed images of having paid substrate identification code and CAD information from real dress operation photographed images information D B 405, and these data is sent to contrast image systematic function 109 (step S503).Similarly, printing process photographed images read functions 107, read the photographed images of having paid substrate identification code and CAD information from printing process photographed images information D B 307, receive operation photographed images read functions 108, read the photographed images of having paid substrate identification code and CAD information from receiving operation photographed images information D B 208, and be sent to contrast image systematic function 109 (step S504, step S505).
Contrast image systematic function 109 is at first selected the photographed images that is read with basic identification code, and the photographed images that makes same substrate is (step S506) in groups.Then, contrast image systematic function 109 according to each the position component information (coordinate and position ID) that is included in the CAD information, is selected the photographed images (step S507) of same parts from the group of pictures of same substrate.When comprising a plurality of parts in the photographed images, also can suitably carry out image segmentation.
Thus, set up the correspondence that receives each photographed images in operation, solder printing operation, the real dress of parts operation, the reflow process.The group of the photographed images of this same substrate, same parts is called " contrast image ".Contrast image write-in functions 110 is paid contrast image I D to the contrast image that is generated, and will contrast image and its ID and store into and contrast in image information DB (image storage unit) 111 (step S508).And contrast image write-in functions 110 will contrast image I D, position component ID, variety of components, bad item stores in the analytical information storage part 112.Figure 13 represents to be stored in an example of the data in contrast image information DB 111 and the analytical information storage part 112.In contrast image information DB 111, manage the contrast image of each parts uniformly with contrast image I D.In analytical information storage part 112, each parts is provided with a record (this record is called " analytical information ").And, in analytical information, become in the blank zone, handle record data by next quality management.
(quality management processing)
Then, illustrate at aforesaid substrate and check that the quality management of finding in the operation when bad handles.
As shown in figure 14, handle function associated, constitute by main program, routine analyzer, these three kinds of programs of meaningful information subprogram with the quality management of information processor 1.As the function that main program is undertaken, have routine analyzer and carry out function 120, analytical information writing function 121, analytical information output function 122.As the function that routine analyzer is undertaken, have candidate incident selection function 130, contrast image display function 131, meaningful information subprogram execution function 132, result of determination Presentation Function 133, reason estimation function 134, regularization condition decision function 135, analysis result Presentation Function 136.In the meaningful information subprogram, have the type of automatic judgement incident occurrence degree and make the user import the type of (Visual Confirmation), previous type has image processing function 140 and incident decision-making function 141, and a back type has guide display function 142 and input receiving function 143.
Routine analyzer, according to float, each bad item such as bridge formation, moistening deficiency, parts shortcoming prepares to have program separately.These routine analyzers are stored in the routine analyzer storage part 113, call suitable routine analyzer by main program as required.As the knowledge base of routine analyzer reference, be provided with bad classification chart 115, reason table 116, regularization condition table 117, priority sequence table 118.These knowledge bases are made according to the technical know-how of field operation person accumulation.
And the meaningful information subprogram according to the lack of uniformity of soldering tin amount, the size of printing deviation, the size of real dress deviation, the incidents such as unsteadiness of pattern, is prepared program separately.These meaningful information subprograms are stored in the meaningful information subprogram storage part 114, call suitable meaningful information subprogram by routine analyzer as required.
Handling process according to each program of flowchart text of Figure 15～Figure 18.Figure 15 is the flow chart of main program, and Figure 16 is the flow chart of routine analyzer, and Figure 17 is the flow chart that determines the meaningful information subprogram of type automatically, and Figure 18 is the flow chart of the meaningful information subprogram of user's input type.
As shown in figure 15, at first, routine analyzer is carried out function 120 and is read analytical information (step S600) from analytical information storage part 112, and by judging at these parts whether bad (step S601) to have taken place with reference to its bad item.When not having bad (during good merchantable brand) (step S601, not), investigate next analytical information.
Have when bad (step S601, be), routine analyzer is carried out function 120, reads and carry out the routine analyzer corresponding with its bad item (step S602) from routine analyzer storage part 113.Below, illustrate the processing relevant with the 1st analytical information of Figure 13.Because the bad item of this analytical information is " floating ", thereby the routine analyzer of bad usefulness is floated in startup.
As shown in figure 16, in routine analyzer, with reference to bad classification chart 115, selecting to become the candidate incident (step S610) of floating bad reason by candidate incident selection function 130.Bad classification chart 115 is with bad item (bad kind), may becomes the incident of this bad reason and the relevant knowledge bases such as operation that can observe this incident.Figure 19 has represented an example of bad classification chart 115, and in this embodiment, as floating bad candidate incident, registration has " printing deviation of welding, solder printing operation ", " real dress deviation, real dress operation ", " unsteadiness of pattern receives operation " these three.And, enumerate the example that registration has three candidate incidents for convenience of explanation at this, but in fact as floating bad reason incident, have soldering paste too much, the variety of event such as unbalanced of the heat distribution inequality when refluxing, welding capacity, can select the whole candidate incidents that can expect.
Then, contrast image display function 131, according to the contrast image I D of analytical information, read the contrast image from contrast image information DB 111, with the photographed images after refluxing be presented on the contrast picture (step S611) with the photographed images of the operation of candidate event correlation respectively.Figure 20 represents to float an example of bad contrast picture.Contrast shows photographed images 10 after the backflow, bad item 11, candidate incident 12, the operation 13 relevant with the candidate incident and the photographed images 14 of its operation etc. on the picture.User (field operation person) can confirm the surface state of the material object of each operation of dress flow process in fact according to this contrast picture.In addition, Figure 20 is one and shows example, when for example not selecting the candidate incident relevant with real dress operation, can not show the photographed images of real dress operation, on the contrary, when the candidate incident relevant with real dress operation is a plurality of, also can show a plurality of photographed images.
In this contrast picture, when the user pushes any one candidate incident " judgement " button 15, the meaningful information subprogram is carried out function 132, reads and carry out the meaningful information subprogram (step S612) corresponding with this incident from meaningful information subprogram storage part 114.Meaningful information subprogram (following also abbreviate as " subprogram ") by the reference photographed images, is imported the occurrence degree (occurrence degree being called " degree of influence " at this) of judging incident by automatic judgement or user.That is, this subprogram plays the function of event analysis unit.
The processing of the subprogram of automatic determined type at first is described.The subprogram of " printing deviation of welding " and " real dress deviation " is automatic determined type in the above-mentioned candidate incident.
As shown in figure 17, in the subprogram that is used for judging real dress deviation, at first image processing function 140 specifies welding disking area and component area (step S620) from the photographed images of real dress operation.In specifying, this zone can utilize technology such as template matches.When specifying the zone, image processing function 140, according to the relative position relation of welding disking area and component area, the bias (step S621) of the directions X of calculating unit and Y direction.
Then, incident decision-making function 141 is calculated the threshold value (step S622) that is used for judging with " little// big " degree of influence (occurrence degree) of bias according to part dimension.For example, the length of establishing the directions X of parts is the length of 0.3mm, Y direction when being 0.6mm, degree of influence " little " and " in " between threshold value can obtain by following formula:
Directions X: 0.3mm * 6%=0.018mm,
Y direction: 0.6mm * 2%=0.012mm.
And, degree of influence " in " and " greatly " between threshold value can obtain by following formula:
Directions X: 0.3mm * 10%=0.030mm,
Y direction: 0.6mm * 3%=0.018mm.
Wherein, the coefficient " 6%, 2%, 10%, 3% " that uses in order to calculate threshold value (in order to judge degree of influence) is according to the technical know-how that accumulates at the scene and predefined value.
Incident decision-making function 141, the bias of comparing unit and above-mentioned threshold value and judge the degree of influence of real dress deviation, and its result is presented at (step S623) on the result of determination picture.Figure 21 represents an example of the result of determination picture of real dress deviation.Show the photographed images 20 of real dress operation on the result of determination picture, specially appointed welding disking area 21 and component area 22, the bias 23 of being calculated by template matches, the chart 24 etc. of degree of influence that illustrates bias.Be judged to be in this embodiment: the bias of directions X is 0.026mm, and the bias of Y direction is 0.013mm, degree of influence be " in ".The user is according to this result of determination picture, can sense of vision ground grasp that real dress deviation takes place have or not, with and occurrence degree.
When pushing the Close button of result of determination picture, subprogram is closed the result of determination picture, will adorn in fact and finish (step S624) after departure and its degree of influence are sent to routine analyzer.
The processing of the subprogram of user's input type then, is described.The subprogram of " unsteadiness of pattern " is user's input type in the above-mentioned candidate incident.
As shown in figure 18, in this subprogram, at first guide display function 142 shows guide screen (step S630).Figure 22 represents an example of the instable guide screen of pattern.On guide screen, show the photographed images of its feature when showing the generation incident and help to judge whether the guide of the incident that takes place.In the example of Figure 22, show the photographed images 30 that receives operation, be used to illustrate the instable judgment standard of pattern explanatory text 31, cause unsettled pattern sample image (also can be photograph image, diagram image) 32, can not cause the sample image 33 of unsettled pattern etc.The user by compare photographed images 30 and sample image 32,33 on guide screen, can easily judge whether the Wiring pattern of this substrate is unstable with reference to explanatory text 31.
And, when the user pushes " having " button of guide screen or " nothing " button, handle these inputs (step S631) by input receiving function 143.In this embodiment, the decision of degree of influence is " greatly " when pushing " having " button simply, and the decision of degree of influence is " little " when pushing " nothing " button.And subprogram is closed guide screen, and degree of influence is sent to back end (step S632) in the routine analyzer.
When as above the determination processing of candidate incident finishes, as shown in figure 23, result of determination Presentation Function 133, the degree of influence (the step S613 of Figure 16) of each incident of demonstration on the contrast picture.The user can synthetically grasp which incident which kind of degree has taken place by seeing this picture in each operation.
At this moment, when the user pushes " beginning to analyze ", the analysis of causes unit that is made of reason estimation function 134, regularization condition decision function 135 and analysis result Presentation Function 136 floats according to above-mentioned result of determination that bad reason is inferred and the countermeasure decision.
At first, reason estimation function 134 is according to the combination of institute's event and the degree of influence (occurrence degree) of each incident, infers by reference reason table 116 and floats bad reason (step S614).Reason table 116 is the relevant knowledge bases of reason that derive with the degree of influence of the combination of incident, each incident, from the combination of this degree of influence.Reason has reason that is made of independent incident and the reason that is made of a plurality of incidents.In this example, from the degree of influence of " real dress deviation " be " ", the degree of influence of " welding deviation " is in the result of determination of " greatly " for the degree of influence of " little ", " unsteadiness of pattern ", infer out " the compound reason of the unsteadiness of pattern and real dress deviation: because the real dress deviation in the real dress operation; the tension force that welds in reflow process takes place unbalanced; and the posture of parts tilts because of unsettled pattern, an end of parts floats ".
Then, regularization condition decision function 135 according to the combination of institute's event and the degree of influence of each incident, by reference regularization condition table 117, is selected in order to solve above-mentioned former thereby need the SMT condition (step S615) adjusted.Regularization condition table 117 be with the combination of the occurrence degree of incident, in order to solve these incidents the relevant knowledge base of adjustable SMT condition.
Figure 24 represents to float an example of the regularization condition table of bad usefulness.Degree of influence " little "～" greatly " available " 0 "～" 2 " expression according to the combination of the degree of influence of " solder printing deviation ", " real dress deviation ", " unsteadiness of pattern " these three incidents, is set up corresponding with the SMT condition.And in the present example, also can whether result from " design main cause chart " of design corresponding to the generation of these incidents of expression.Under the situation of the combination of degree of influence shown in Figure 23, select " Z: depart from " and " Z: the amount of being pressed into " as the SMT condition.And also there is the design main cause as can be known.And, be labeled in the letter of the beginning of SMT condition, be the mark of the kind of the expression manufacturing installation that utilizes this SMT condition." Z " expression electronic unit COG equipmentCOG 8.The mark of expression soldering paste printing device 7 is " P ", and the mark of expression reflux 9 is " S ".And, use mark " C " for the condition of design phase.
At this, when selecting a plurality of SMT condition, regularization condition decision function 135 is with reference to priority sequence table 118 and the adjustment order (step S616) of decision SMT condition.Priority sequence table 118 is knowledge bases of the adjustment order of regulation SMT condition.The adjustment order is considered to adjust the size of the effect that causes or the easy degree of adjustment and is waited to determine.
Figure 25 represents an example of priority sequence table." depart from ", a plurality of SMT conditions such as " amount of being pressed into ", " translational speed ", " squeegee speed ", " squeegee coining ", " version separating rate ", with priority and change object (expression utilizes the mark of kind of the manufacturing installation of SMT condition) registration.In this example, " departing from " side's priority is higher in two SMT conditions that step S615 selects.Therefore, regularization condition decision function 135 will " depart from " as first regularization condition, will " amount of being pressed into " as second regularization condition.
Inferring when finishing with the decision of regularization condition of reason, analysis result Presentation Function 136 carries out picture with these analysis results and shows (step S617).Figure 26 represents that reason explains orally an example of picture, and Figure 27 represents that countermeasure explains orally an example of picture.Explain orally in the picture in reason, be estimated as incident and its basis (floating bad genesis mechanism) of floating bad reason and represent by graphic mode together.User (field operation person) explains orally picture by checking such reason, can understand exactly bad reason with and genesis mechanism.When pushing the Next button of reason explanation picture, show that countermeasure explains orally picture.Explain orally in the picture in countermeasure, the SMT condition that needs to adjust schematically shows according to (solving the reason of poor prognostic cause) with it.The user explains orally picture by checking such countermeasure, can promptly carry out the content understanding and the decision-making of countermeasure.In addition, in countermeasure explains orally picture, though according to prioritizing countermeasure (need adjust SMT condition), in fact adopt which countermeasure (adjusting which SMT condition) to select with the user entirely.
When the user selected any one of suggested countermeasure, routine analyzer was sent to back end (step S618) in the main program with analysis result.
In main program, analytical information writing function 121 from routine analyzer receiving and analyzing result, and stores analysis result in the corresponding record (analytical information) of analytical information storage part 112 (step S603).Figure 28 represents to be stored in an example of the analysis result in the analytical information storage part 112.In " PAT01,2 " that receive process zone storage representation " unsteadiness, the degree of influence of pattern are big ", in " ZRE01,1 " of real dress process zone storage representation " the component locations deviation is in the degree of influence ".Owing in printing process, do not become the incident of poor prognostic cause, thereby printing process area stores " 00000,0 ".And, improving the information that the subject area storage representation uses the manufacturing installation of the SMT condition that the user selects, the kind of the SMT condition of selecting countermeasure parameter region storage user.Figure 28 represents the example that the user selects the SMT condition " to depart from ".
Then, analytical information output function 122 is selected the terminal (step S604) of the department relevant with floating bad reason solution according to above-mentioned analysis result.At this, owing to set real dress " departing from " as regularization condition, thereby select the terminal (information processor 1 double as manufacturing sector terminal in the present embodiment) of manufacturing sector.And analytical information output function 122 is exported above-mentioned analytical information (step S605) to selected terminal.At this moment, preferably, the recommendation adjusted value that " departs from " from the estimation SMT conditions such as bias of the real holding position of parts, and export this recommendation adjusted value with analytical information.
The user changes the deviation value of electronic unit COG equipmentCOG simultaneously with reference to the analytical information of being exported, and carries out the trial-production of new substrate.And, repeat adjustment, the trial-production of deviation value, up to obtaining the real dress of good scolding tin quality, to carry out the improvement of best SMT condition.The optimum value that departs from is registered in (with reference to Figure 28) in the analytical information storage part 112.
According to the quality control system of present embodiment described above, the research of the specifying of the affirmation of the bad and poor prognostic cause of material picture, poor prognostic cause, countermeasure etc. can be carried out effective quality management easily.
And, in the present embodiment, although understand from the contrast image of parts and carry out the method that reason is inferred, but equally preferably, use the parts of the identical type on the printed base plate the contrast image, carry out reason and infer.
(manufacture method of chart)
Welding back occurs bad have float, bridge formation, moistening deficiency, deviation, a plurality of kinds such as scolding tin is too much, scolding tin is not enough, parts shortcoming.And the incident that may become their poor prognostic cause also has in the inherent incident of printed base plate itself, event in the solder printing operation, the real dress of the parts operation event etc. varied.Generally speaking, each incident that takes place in each operation of making exerts an influence mutually, and as a result of, existing and the bad relevant result of manufacturing on the contrary, also have and cancel out each other and suppress bad result.As mentioned above, bad genesis mechanism is very complicated, is difficult to clear and definite on earth bad relevant with which when how which condition makes up.Therefore, in a simulation, an existing method of inferring, be difficult to specify the bad true cause that is taken place, also be difficult to derivation exactly certainly and be used to solve these bad effective countermeasures according to the reason of the check result after the welding according to CAD information.
This point, in native system, by adopting following method to realize effectively and the high quality management of reliability: grasp which incident of which kind of degree of generation according to the material picture in each operation (contrast image), and infer the method for poor prognostic cause from these (having considered occurrence degree) combinations that incidents take place.And in the present embodiment, infer a unit of processing, utilize bad classification chart or regularization condition table as such reason.These charts, bad reason or its processing method (need adjust SMT condition) can be grasped for according to the generation incident that takes place in operation in the middle of each with and the knowledge base of occurrence degree classification.
Bad classification chart or regularization condition table are made on-the-spot technical know-how by utilization, can be made by manual input, also can utilize native system automatically to make.One example of the method for automatically making these tables is below described.
At first, according to several～tens of substrates of above-mentioned surface real dress flow process trial-production.At this moment, also utilize native system to implement the inspection of the generation of contrast image and the real dress of the scolding tin quality after the backflow.Owing in fact a plurality of parts are housed on the substrate, thereby can access tens of～hundreds of pilot samples by this trial-production.
And, after whenever obtaining the check result of a trial-production substrate or all being manufactured experimently the check result of substrate, with the check result classification of the real dress of scolding tin quality.Particularly, by with the above-mentioned identical method of incident determination processing of having utilized the meaningful information subprogram, to the occurrence degree of each parts, and the check result of these incident result of determination and the real dress of scolding tin quality recorded in the correspondence mappings table according to contrast spectral discrimination each incident.Wherein, for the incident determination processing, preferably, to design phase or contingent whole incident comprehensive surveys of fabrication stage.
Figure 29 represents an example of correspondence mappings table.In this embodiment, adopt with imaginary incident be distributed in vertically, with the imaginary bad horizontal two-dimensional map table that is distributed in.In certain parts, float when bad, in the row of " floating ", mark and draw the incident result of determination of these parts.Also identical for other bad items.For the incident result of determination, the occurrence degree of certain incident is marked and drawed by the mode that adds number of times " 1 " when predetermined value or its are above.When marking and drawing as a result to whole pilot samples, for each bad item, (laying particular stress on) incident that number of times is high is that the candidate incident is extracted as the incident that may become this bad reason.The result generates bad classification chart according to this extraction.
Then, analyze the combination of occurrence degree of candidate incident and the relation of bad incidence.For example, as the candidate incident of bad X, select incident A, B, C, D.At this moment, in when, the situation of incident A, B only taking place and the situation of A, B, C taking place, if bad incidence does not almost have difference, as can be known be that when incident A, B took place simultaneously, having or not of the generation of incident C can't have influence on bad generation.Perhaps, compare with the situation that incident A, B only take place, the bad incidence the when situation of A, B, D takes place is obviously high, as can be known be that the main poor prognostic cause when incident A, B, D take place simultaneously is incident D.A just example of enumerating this moment by carrying out such analysis, can be grasped the correlation of the combination of incident, occurrence degree separately, bad incidence, and can find out bad real (main) occurrence cause with very high possibility.Generate the regularization condition classification chart according to such analysis result.
Preferably, interrelation analysis processing described here is included in the above-mentioned quality management processing.For example, detect in the inspecting substrate after backflow and float when bad, float bad candidate incident for each, occurrence degree from the contrast spectral discrimination incident of these parts, the incident result of determination of floating bad parts of utilizing the incident result of determination of these parts and up to the present storing, carry out interrelation analysis and handle, thereby can infer the bad reason of floating of these parts.According to this method, having does not need the regularization condition table advantage of (that is, not needing to be used to make the working load or the trial-production of regularization condition table).And,, can automatically be used for the study of correlation analysis owing to carry out the storage of the incident result of determination of bad parts simultaneously with manufacturing.By these results of learning, can improve the precision or the reliability of correlation analysis.And, even when occurrence tendency generation deviation bad or variation owing to the variation of manufacturing environment, condition etc., results of learning work and follow the result that these situations are proofreaied and correct correlation analysis closely, thereby have the advantage that can in time deal with the manufacturing scene that all changes every day.According to identical viewpoint, preferably, in the storage of utilization incident result of determination in dynamic(al) correction of regularization condition table and the results of learning of correlation analysis.
(second execution mode)
Figure 30 represents the summary of processing of the quality control system of second execution mode of the present invention.The quality control system of present embodiment is compared with first execution mode, identical point is to carry out inferring of poor prognostic cause and the decision of the SMT condition that needs to adjust, and difference is after this to assist the processing (regularization condition analyzing and processing) of the improvement operation of this condition value.
Particularly, after the SMT condition that determines in the same manner need to adjust with first execution mode, quality control system makes this SMT conditional decision respectively to be worth slightly different a plurality of condition values.These condition values are used for adjusting test.The user adjusts test according to these and uses condition value, changes the SMT condition a little and trial-production repeatedly.Quality control system is adorned bad in fact to each trial-production inspecting substrate scolding tin, and calculates the fraction defective of each condition value.And, according to the fraction defective decision optimal conditions value of each condition value.Be typically, the condition value that fraction defective is minimum is elected to be optimum value.
But, under the indeterminable condition of poor in the adjustment of SMT condition (for example result from design condition of poor), do not reduce even change the condition value fraction defective yet, can not make fraction defective below pre-determined reference value (allowing fraction defective).
Thus, quality control system according to the variation tendency of fraction defective, judges whether can solve poor prognostic cause by the adjustment of SMT condition.For example, each condition value is checked that fraction defective is whether below fiducial value (allowing fraction defective).As can be known be, if the scope of the condition value below fiducial value when to be foozle scope or its above, can solve bad (stoping fraction defective to be lower than fiducial value) by the adjustment of SMT condition.And as can be known be, the scope of the condition value below fiducial value is than foozle scope hour, though exist with the SMT condition enactment be optimum value, because foozle also makes fraction defective may surpass the worry of fiducial value.That is, as can be known be that the adjustment by the SMT condition can roughly solve bad, but preferably must rethink from design.And as can be known be when not having the scope of the following condition value of fiducial value, all can not solve bad (fraction defective surpasses fiducial value) owing to how to adjust the SMT condition, thereby must rethink from design.According to above-mentioned result of determination, select and the terminal that should bad reason solves relevant department (just manufacturing sector/manufacturing sector and the both sides of design department/be design department), and export bad analysis result to this terminal.
According to the quality control system of present embodiment, not only can carry out the decision that specifying of poor prognostic cause maybe needs the SMT condition adjusted effectively, and can reduce the labour of the improvement operation of SMT condition.And, because can be rapidly and carry out definitely being taken place bad be to make the on-the-spot judgement that deal with or must rethink from design, thereby can get rid of futile quality improvement operation, thereby can carry out quality management effectively.
Below, describe the concrete formation that the quality management be used to realize present embodiment is handled in detail.Wherein, the system of quality control system formation, surperficial real dress flow process, contrast image generation processing etc. are identical with first execution mode.
(quality management processing)
As shown in figure 31, handling function associated with the quality management of information processor 1 is made of main program, routine analyzer, meaningful information subprogram.Be that with the difference of the formation (Figure 14) of first execution mode routine analyzer has regularization condition analytic function 137.
Handling process according to each program of flowchart text of Figure 15, Figure 32, Figure 17, Figure 18.Figure 32 is the flow chart of the routine analyzer of present embodiment.
When recognizing bad generation, the routine analyzer of main program is carried out function 120 and is specified the routine analyzer corresponding with bad item (Figure 15, step S601～S602).Below, illustrate " floating bad " identical with first execution mode.
In routine analyzer, select and float bad relevant candidate incident, and show the contrast image (Figure 32, step S610, S611) relevant with these candidate incidents.And, according to the meaningful information subprogram, judge each candidate incident whether take place with and degree of influence (Figure 32, step S612, Figure 17, Figure 18).When the determination processing of whole candidate incidents finishes, show the degree of influence (Figure 32, step S613) of each incident at the contrast picture.When the user pushes " begin analyze " button, infer by reason estimation function 134 and to float bad reason (step S614), need by 135 decisions of regularization condition decision function the SMT condition adjusted with and adjustment order (step S615, S616).At this, " pressing quantity " is elected to be first regularization condition, " bias " is elected to be second regularization condition.
Inferring when finishing with the decision of regularization condition of reason shows that reason explains orally picture and countermeasure explains orally picture, and to the user prompt analysis result with it is according to (step S617).In the first embodiment, explain orally the countermeasure that picture adopts, in the present embodiment, select countermeasure automatically according to adjustment order in step S616 decision though be chosen in countermeasure.
Regularization condition analytic function 137 at first reads current condition value and its adjustable range (step S640) as " amount of being pressed into " of first regularization condition from SMT information storage part 104.At this, current condition value is made as " 0.02mm ", adjustable range is made as " 0.00mm～0.10mm ".
And regularization condition analytic function 137 is according to current condition value, adjustable range etc., and a plurality of condition values (step S641) of test usefulness are adjusted in decision.For example, float badly, consider whether to be necessary to increase the amount of being pressed into,, determine condition value in the mode of the every minimizing of the amount of being pressed into 0.01mm from-0.02mm to-0.10mm in order to solve.That is, setting-0.03mm ,-0.04mm ... ,-0.09mm ,-these 8 condition values of 0.10mm.
When the condition value of test usefulness was adjusted in decision, regularization condition analytic function 137 was presented at initial condition value " 0.03mm " and adjusts on the test pictures (step S642).Figure 33 represents an example of the adjustment test pictures of the amount of being pressed into adjustment usefulness.Adjusting the photographed images 40 that shows real dress operation on the test pictures, the condition value 41 of adjusting test usefulness, analysis diagram 42 etc.As photographed images 40, also can show the image of the operation of the adjustment that can reflect the SMT condition.Analysis diagram 42 is charts of the relation of expression condition value and fraction defective, and transverse axis is a fraction defective for the amount of being pressed into, the longitudinal axis in this example.And state in the early stage can what show in analysis diagram 42 yet.
According to being presented at the condition value of adjusting in the test pictures 41, when the user sets the SMT condition of electronic unit COG equipmentCOG, after this,, and carry out the inspection (step S643) of the real dress of scolding tin quality by base board checking device according to the new substrate of this condition value trial-production.This check result is collected in the regularization condition analytic function 137.
Regularization condition analytic function 137, the check result of the trial-production substrate under the identical conditions is calculated the fraction defective (=rejection number/trial-production number of packages) (step S644) of this condition value.The reliability of the many more fraction defectives of sample number of packages is high more, thereby preferably, many substrates of trial-production under identical conditions.And, generally speaking, on substrate, have the parts of a plurality of same kinds, and think that the bad occurrence tendency of these parts is similar, thereby also can compile the check result of the parts of handling same kind and calculate fraction defective.The fraction defective of being calculated is marked and drawed in the analysis diagram 42 of adjusting test pictures (step S645).
Regularization condition analytic function 137, the processing of repeating step S642～S645 when changing condition value is calculated the fraction defective of each condition value, and is marked and drawed in analysis diagram 42 (step S646, S647).When the processing of full terms value is finished (step S646 is), enter next procedure.
At step S648, regularization condition analytic function 137 is according to the best amount of being pressed into of fraction defective decision of each condition value.For example, when obtaining analysis diagram shown in Figure 34, the condition value of fraction defective minimum " 0.06mm " is selected as optimum value.Perhaps, the central value of the scope of condition value that also can fiducial value (allowing fraction defective) is following is elected to be optimum value.
Then, regularization condition analytic function 137 carries out the analysis of the variation tendency of fraction defective.Particularly, regularization condition analytic function 137 is obtained scope (the being fit to scope) RA of the condition value of fraction defective below fiducial value, and obtains the foozle scope RB (deviation of be pressed into amount that foozle cause) (step S649) of optimum value as central value.Fiducial value or foozle etc. are known.Then, regularization condition analytic function 137, by relatively being fit to scope RA and foozle scope RB, judging that can adjustment by the amount of being pressed into solve floats bad (step S650).At this, shown in Figure 35 (a), do not exist when being fit to scope RA, be judged to be " [A] is by the adjustment of SMT condition; can not solve bad (design existing problems) ", shown in Figure 35 (b), be fit to scope RA than foozle scope RB hour, be judged to be " [B] is though can solve bad by the SMT condition; might surpass fiducial value (design is existing problems also) owing to the change fraction defective of device ", shown in Figure 35 (c), be fit to scope Ra when foozle scope RB or its are above, be judged to be " [C] can solve bad (design does not have problems) by the SMT condition ".Figure with this determination processing of flowcharting is Figure 36.
If do not obtain " [C] can solve bad by the SMT condition " this result of determination (step S651, not), regularization condition analytic function 137 will be replaced by " departing from " (step S652) as the SMT condition of adjusting object, and repeat the processing of above-mentioned steps S640～S652.At this moment, the condition value of the amount of being pressed into is set at optimum value.And, as when handling the SMT condition that is made of these two parameters of X, Y departing from, analysis diagram becomes three-dimensional chart.When obtaining result of determination [C] or whole regularization conditions having been carried out processing, enter next handle (step S651 is).In addition, in the example of Figure 34, as can be known be that the adjustment by the amount of being pressed into can solve bad.
When the analyzing and processing of regularization condition finished, routine analyzer was sent to back end (step S653) in the main program with analysis result.
In main program, analytical information writing function 121 from routine analyzer receiving and analyzing result, and stores analysis result in the corresponding record (analytical information) of analytical information storage part 112 (Figure 15, step S603).Figure 37 represents to be stored in an example of the analysis result in the analytical information storage part 112.Improving the information that the subject area storage representation uses the manufacturing installation of SMT condition " amount of being pressed into "; In the SMT condition " be pressed into amount " of countermeasure parameter region storage as the adjustment object; In the optimum value " 0.06mm " of optimum value area stores by 137 decisions of regularization condition analytic function; The upper limit and the lower limit that are fit to scope in the adjusting range area stores.And, in the result of determination " C " of countermeasure area stores regularization condition analytic function 137.In addition, when having adjusted a plurality of SMT condition, these information are all stored in the analytical information.
Then, analytical information output function 122 according to above-mentioned analysis result, is selected the terminal (step S604) of the department relevant with floating bad reason solution.At this, when being [A], result of determination selects the terminal of design department; When being [B], result of determination selects the terminal of design department and manufacturing sector; When being [C], result of determination selects the terminal of manufacturing sector.And analytical information output function 122 is exported above-mentioned analytical information (step S605) to selected terminal.
When analytical information outputs to manufacturing sector's terminal, suitably become optimum value to get final product the SMT condition enactment of manufacturing installation when making on-the-spot user with reference to this analytical information.Study when on the other hand, analytical information outputs to design department's terminal.And only when design department's terminal output analytical information (, result of determination be the situation of [A]) can show the message of the adjustment termination of following this indication SMT condition to manufacturing sector's terminal: " this bad can not solving by the adjustment of SMT condition.Need rethink from design.Therefore notify this bad analytical information to design department.”
Quality control system according to present embodiment described above, with first execution mode in the same manner, utilize material picture to carry out the specifying of affirmation, poor prognostic cause of bad and poor prognostic cause, the research of countermeasure etc. easily, thereby can carry out effective quality management.And can reduce the labour of the improvement operation of SMT condition.And, because can be rapidly and carry out definitely being taken place bad be to make the on-the-spot judgement that deal with or must rethink from design, thereby can get rid of futile quality improvement operation, thereby can carry out quality management effectively.
(the 3rd execution mode)
At present, Ri Ben manufacturing industry is being groped the survival method as the grown place.Because the shorteningization in commodity useful life, the minimizing of shipment amount, grown place are to main causes such as China's transfer, around the more and more sternness of domestic manufacturing environment.So Japan has begun the challenge with the new mode of production (needing synchronous production) that needs synchronous production in order to survive as the grown place.Need synchronous production to be meant and the mode of the synchronous production of needs and quality, help a small amount of many variety production.
Need in the synchronous production this, need control simultaneously to produce and quality, production in time must be consistent with quality.This be because, under the situation of existing batch process mode, in make 10000 predetermined have several bad, this bad processing is put together investigation afterwards and analyzes just, on the contrary, making 10 with regard to 10 of shipment, make 1 with regard to the needing in the synchronous production of 1 of shipment, even seldom bad also can very big influence take place to cost or production system.That is, also we can say the failure that bad generation can cause needs synchronous production.
In order to address this problem, not only carry out the quality inspection in final operation, also in middle operation, also monitor in real time, check, thereby find in early days to bring out the high incident of bad possibility (poor prognostic cause) and handle.
According to above-mentioned first or second execution mode, quality management during by the trial-production of production debugging/volume production is handled, bad according to what taken place, with the incident in the middle operation having or not of taking place, bad reason incident, effectively countermeasure etc. stores in the analytical information storage part 112 with the image (contrast image) of material object.Can consider that also during change method, these data (analytical information) provide following information: when which incident of which kind of degree took place in the middle operation, it is bad which brings out, and, can solve this bad or poor prognostic cause when taking which kind of measure.
The quality control system of the 3rd execution mode of the present invention is conceived to this point and makes, and is stored in analytical information in the analytical information storage part 112 by utilization, and the bad generation during for volume production realizes real-time processing.At this, the method for this quality management is called real-time QC (Quality Control, quality management).
Below, describe formation and the processing relevant in detail with the real-time QC of quality control system.
(generation of audit program)
Figure 38 represents to generate processing function associated formation with the audit program of quality control system.Quality control system has: according to CAD information generate the standard determination benchmark standard determination benchmark systematic function 150, generate indivedual determinating reference systematic functions 151 of indivedual determinating references, generate the audit program systematic function 152 of audit programs from standard determination benchmark and indivedual determinating reference according to analytical information.
In receiving centre operations such as operation, solder printing operation, real dress operation, check when whether bringing out bad incident, use alleged audit program here.Particularly, audit program is used for order or the parameter that regulation is checked, the characteristic quantity (occurrence degree that is equivalent to incident) that for example comprises image processing (binaryzation, edge extracting, template matches etc.) that relative photographed images implements, extracts from image, with the characteristic quantity that is extracted determinating reference (threshold value etc.) relatively.
Usually on substrate, dispose the parts of a plurality of identical type.Basically, even the position difference can both used identical determinating reference under a lot of situations on the parts of identical type.But, because position component, with the influence of correlation, Wiring pattern or the through hole of miscellaneous part etc., the incident that may make an exception.Therefore, in the present embodiment, use standard determination benchmark that the parts for identical type are suitable for simultaneously and the indivedual determinating references that are applied in individual component for the incident of correspondence exception, realize the high middle inspection of reliability.
Flowchart text audit program according to Figure 39 generates the flow process of handling.
Making when indication (step S700 is) of audit program is arranged, and standard determination benchmark systematic function 150 reads the CAD information (step S701) of corresponding printed base plate from CAD information storage part 103.
Standard determination benchmark systematic function 150 obtains information such as variety of components, part dimension, component shape, bond pad shapes from CAD information, and generates standard determination benchmark (step S702) according to these information.Decide the standard determination benchmark according to making on-the-spot operation or work standard.That is, making on-the-spotly, for example have " the parts deviation in real dress operation allow occurrence degree be parts electrode amplitude 1/3 " storage of such technical know-how, according to the operation or work standard of these technical know-hows regulation operations.Standard determination benchmark systematic function 150 has this operation or work standard as knowledge base, the degree of admission of calculating the parts deviation from the parts electrode amplitude that obtains according to CAD information.For each variety of components, consider to become whole incidents of checking object and the production standard determinating reference.
Then, indivedual determinating reference systematic functions 151 read the analytical information (step S703) of relevant variety of components from analytical information storage part 112.At analytical information storage part 112, because each bad parts the time have been taken place in trial-production, inventory analysis information, thereby the situation of the analytical information that has a plurality of above-mentioned variety of components is arranged, the situation of neither one analytical information is also arranged.
About there being the parts of analytical information, indivedual determinating reference systematic functions 151 generate the indivedual determinating references (step S704) relevant with these parts according to analytical information.Particularly, indivedual determinating reference systematic functions 151, by analytical information is analyzed, whether the occurrence degree that investigation is included in each incident in the analytical information satisfies the standard determination benchmark of obtaining at step S703.For example, the parts of representing with Figure 23 are as an example the time, and whether the degree of the parts deviation in the real dress of the investigation operation is in below 1/3 or 1/3 of parts electrode amplitude.The parts deviation is 1/3 or 1/3 when following, for these parts, even the parts deviation satisfies the standard determination benchmark, and also may be because the influence of the unsteadiness of pattern etc. is floated bad.That is, as can be known be, in the inspection of the parts deviation of these parts, determinating reference that need be stricter than standard determination benchmark.Therefore, when finding to satisfy the incident of standard determination benchmark, indivedual determinating reference systematic functions 151 generate the indivedual determinating references of allowing occurrence degree that are used to stipulate this incident.Indivedual determinating references can generate the standard determination benchmark (for example as the basis, the standard determination benchmark dwindles with predetermined ratio etc.), also can generate (for example, with this incident occurrence degree itself as indivedual determinating references etc.) as the basis with being included in incident occurrence degree in the analytical information.
Then, audit program systematic function 152 utilizes above-mentioned determinating reference, generates to receive each audit program (step S705) that process inspection is used, the solder printing process inspection is used, real dress process inspection is used.At this moment, to having generated the indivedual determinating references of incident utilization of indivedual determinating references, incident is in addition utilized the standard determination benchmark.As described above, in the present embodiment, standard determination benchmark systematic function 150, indivedual determinating reference systematic function 151 and audit program systematic function 152 constitute degree of admission determination device of the present invention.
At step S706, will receive the process inspection procedure stores in the reception process inspection program storage part 210 of substrate receiving check device 2, be used to receive the middle inspection processing of operation.And in the solder printing process inspection program storage part 310 of apparatus for inspecting solder printing 3, the middle inspection that is used for the solder printing operation is handled with solder printing process inspection procedure stores.And in the real dress process inspection program storage part 410 of the real dress of parts testing fixture 4, the middle inspection that is used for real dress operation is handled with real dress process inspection procedure stores.
At this, although understand the processing of the audit program of using according to analytical information generation middle inspection, but also can generate or upgrade the audit program of base board checking device 5 according to analytical information.That is, owing to store simultaneously and bad relevant details and photographed images in the analytical information, thereby these can be improved the reliability of the audit program of the real dress of scolding tin quality inspection usefulness when teacher's information.
(QC handles in real time)
Figure 40 represents to handle the function associated formation with the real-time QC of quality control system.
Substrate receiving check device 2 has: the back-off function 212 that receives the reception process inspection function (middle inspection device) 211 of the generation that detects poor prognostic cause in the operation and substrate that poor prognostic cause takes place is kept out of the way at substrate.Apparatus for inspecting solder printing 3, the back-off function 312 that has in the solder printing operation solder printing process inspection function (middle inspection device) 311 of the generation that detects poor prognostic cause and substrate that poor prognostic cause takes place is kept out of the way.The real dress of parts testing fixture 4, the back-off function 412 that has the real dress process inspection function (middle inspection device) 411 of the generation that in real dress operation, detects poor prognostic cause and substrate that poor prognostic cause takes place is kept out of the way.
And information processor 1 has monitoring function 160, contrast function 161, countermeasure decision function 162, output decision function 163, countermeasure output function 164.Among these functions, countermeasure decision function 162, output decision function 163 and countermeasure output function 164 constitute countermeasure information output apparatus of the present invention.
The flow process of the processing in the middle operation of making (reception, solder printing, real dress) at first is described.
(1) receives operation
Receive the flow process of the processing of operation according to the flowchart text of Figure 41.And in Figure 41, the processing mark identical number of steps identical with Fig. 4, and omit its detailed description.
Input is during indication information, one by one transmits original printed base plate (step S100～S102) from the printed base plate transport unit.And, make a video recording by 203 pairs of substrates of camera function, and pay substrate identification code (step S103～S107) to photographed images.
Then, receive process inspection function 211, read the audit program (step S120) that this substrate is used from receiving process inspection program storage part 210, and judge substrate quality (step S121) according to this audit program.Particularly, receive process inspection function 211,, cut out the parts of images that disposes each position component according to information such as variety of components that obtains from CAD information or position component.And, according to audit program, extract the characteristic quantity of the occurrence degree of presentation of events from parts of images, judge whether this characteristic quantity (occurrence degree) exceeds determinating reference (allowing occurrence degree).To the whole parts (disposing position component) on the substrate and to receiving operation, carry out this determination processing respectively as whole incidents of checking object.In addition, the each several part image stores into component information (variety of components and position ID) and receives among the operation photographed images information D B 208 (step S122).
When not detecting the incident that exceeds determinating reference, that is, (step S123, not), the information that printed base plate is relevant with indication information or substrate was sent to the soldering paste printing device 7 (step S109, S110) of next operation together when the substrate quality was good.
On the other hand, when detecting at least one incident that exceeds determinating reference, that is, when detecting any one poor prognostic cause (step S123 is), back-off function 212 makes this substrate keep out of the way retreating position (step S124).And, receive process inspection function 211, notify (step S125) with component information to the monitoring function 160 of information processor 1 with check result.At this moment, the substrate that has replaced keeping out of the way can the next substrate of additional input.
By above processing, in receiving operation, can detect the incident that may become poor prognostic cause in advance.And, can prevent that so bad substrate from flowing in the next operation.
(2) solder printing operation
Flow process according to the processing of the flowchart text welding sequence of Figure 42.And in Figure 42, the processing mark identical number of steps identical with Fig. 6, and omit its detailed description.
From a last operation, when receiving the information relevant together, on printed base plate, print soldering paste (step S200～S204) according to the SMT condition with substrate with indication information.And, make a video recording by 302 pairs of substrates of camera function, and pay substrate identification code (step S205～S208) to photographed images.
Then, solder printing process inspection function 311 reads the audit program (step S220) that this substrate is used from solder printing process inspection program storage part 310, and judges the soldering paste quality (step S221) of substrate according to this audit program.Concrete processing is identical with the reception process inspection.In addition, the parts of images with each parts (disposing the place of parts) stores among the printing process photographed images information D B 307 (step S222) with component information (variety of components and position ID).
When not detecting the incident that exceeds determinating reference, that is, (step S223, not), the information that printed base plate is relevant with indication information or substrate was sent to the electronic unit COG equipmentCOG 8 (step S210, S211) of next operation together when the soldering paste quality was good.
On the other hand, when detecting at least one incident that exceeds determinating reference, that is, when detecting any one poor prognostic cause (step S223 is), back-off function 312 makes this substrate keep out of the way retreating position (step S224).And solder printing process inspection function 311 is notified (step S225) with component information to the monitoring function 160 of information processor 1 with check result.At this moment, the substrate that has replaced keeping out of the way can the next substrate of additional input.
By above processing, in the solder printing operation, can detect the incident that may become poor prognostic cause in advance.And, can prevent that so bad substrate from flowing in the next operation.
(3) real dress operation
According to the real flow process of adorning the processing of operation of the flowchart text of Figure 43.And in Figure 43, the processing mark identical number of steps identical with Fig. 8, and omit its detailed description.
From a last operation, when receiving the information relevant together, according to SMT condition real electronic parts (step S300～S306) on printed base plate with substrate with indication information.And, make a video recording by 400 pairs of substrates of camera function, and pay substrate identification code (step S307, S308) to photographed images.Then, real dress process inspection function 411 reads the audit program (step S320) that this substrate is used from real dress process inspection program storage part 410, and judges the real dress quality (step S321) of substrate according to this audit program.Concrete processing is identical with the reception process inspection.In addition, the parts of images with each parts (disposing the place of parts) stores among the real dress operation photographed images information D B 405 (step S322) with component information (variety of components and position ID).
When not detecting the incident that exceeds determinating reference, that is, and (step S323 when real dress quality is good; Not), the information that printed base plate is relevant with indication information or substrate is sent to the reflux 9 (step S310, S311) of next operation together.
On the other hand, when detecting at least one incident that exceeds determinating reference, that is, and (step S323 when detecting any one poor prognostic cause; Be), back-off function 412 makes this substrate keep out of the way retreating position (step S324).And real dress process inspection function 411 is notified (step S325) with component information to the monitoring function 160 of information processor 1 with check result.At this moment, the substrate that has replaced keeping out of the way can the next substrate of additional input.
By above processing, in real dress operation, can detect the incident that may become poor prognostic cause in advance.And, can prevent that so bad substrate from flowing in the next operation.
In addition, the processing in the reflow process is identical with Figure 10.
(processing when poor prognostic cause detects)
When detecting poor prognostic cause in any one operation in receiving operation, solder printing operation, real dress operation, information processor 1 carries out the decision of countermeasure of the analysis of poor prognostic cause.Below, as an example, utilize the example that detects as the parts deviation of the poor prognostic cause in the real dress operation, describe.
By the middle inspection of real dress operation, when certain parts on substrate detect the parts deviation that exceeds determinating reference, notify this check result and component information to monitoring function 160.
As shown in figure 44, when monitoring function 160 receives check result and component information (step S800), read the photographed images relevant (step S801) with these parts from the photographed images information D B of each testing fixture.As this example, when real dress operation detects poor prognostic cause, receive operation, solder printing operation, real these three photographed images of dress operation though read, if but receiving the photographed images that only reads the reception operation when operation detects poor prognostic cause, when the solder printing operation detects poor prognostic cause, only read the photographed images that receives operation and solder printing operation.
Then, contrast function 161, among the analytical information from be stored in analytical information storage part 112, retrieval and the similar example of this example, and read this analytical information (step S802).And contrast function 161 is from contrasting the contrast image (step S803) that image information DB 111 reads similarity.
Can whether similarly judge according to the kind of the variety of components and the incident of generation.For example, when establishing " SOP14 " of variety of components of this example,
Variety of components: SOP14
Receive the degree of influence of operation: 0
The degree of influence of solder printing operation: 0
The bad kind of real dress operation: ZRE01
The degree of influence of real dress operation: 1 or 2
Can regard the analytical information that satisfies above-mentioned condition as similarity.In Figure 37, eligible from the analytical information of last several the 3rd (contrast image I D:0408140944).
Then, countermeasure decision function 162, the value in the countermeasure zone by the reference analytical information judges whether to carry out the processing (step S804) of the adjustment of the analysis of poor prognostic cause and SMT condition.Particularly, when the value in countermeasure zone is [A], be judged as " not being the poor prognostic cause that results from manufacturing, can not handle " at the scene of making; When the value in countermeasure zone is [B], be judged as " though be not result from manufacturing, making on-the-spot treatable poor prognostic cause "; When the value in countermeasure zone is [C], be judged as " result from manufacturing, making on-the-spot treatable poor prognostic cause ".And countermeasure determines function 162, reads the value (step S805) of current SMT condition from SMT information storage part 104.
Then, output determines function 163, determines the output (step S806) of the judged result decision game information of function 162 according to countermeasure.At output, select the terminal of the department relevant with this poor prognostic cause.
The flow process that the flowcharting output decision of Figure 45 is handled.That is, can not when making the in-situ processing poor prognostic cause (step S900 denys), select to be located at the terminal of design department as information output (step S901).Though can make the in-situ processing poor prognostic cause, (step S900 is when whether resulting from manufacturing; S903 not), selects to be estimated as the terminal that is provided with in the manufacturing process that can handle this poor prognostic cause and to be located at the terminal of design department as information output (step S902, S901).And, can make the in-situ processing poor prognostic cause, and result from that (step S900 is when making; S903 is), select to be estimated as the terminal that is provided with in the manufacturing process that can handle this poor prognostic cause and be estimated as the terminal that is provided with in the manufacturing process in generation source of poor prognostic cause as information output (step S902, S904).
In this example,, thereby be judged as " result from manufacturing, at the on-the-spot treatable poor prognostic cause of manufacturing " because the value in the countermeasure zone of analytical information be [C] (with reference to Figure 37).And, be " real dress " owing to improve subject area, thus select " terminal of real dress operation " but as the terminal of the operation of processing unit deviation.And,, thereby similarly, also can select " terminal of real dress operation " terminal as the operation in the generation source of poor prognostic cause because the parts deviation occurs in real dress operation.
During the decision output, 164 pairs of this output output of countermeasure output function countermeasure information (step S807).Figure 46 represents an example of countermeasure information frame.In this example,, show material picture 50, movement images, countermeasure example 52 as countermeasure information.Material picture 50 is photographed images of adorning operation from the reception operation of the parts that detect the parts deviation to reality.By reading material picture 50, can confirm to have taken place which incident of which kind of degree according to material object in which operation.And movement images 51 is the contrast images from the reception operation of the parts of similarity to reflow process.Relatively when material picture 50 and movement images 51, can confirm to occur in how many degree event has similar on earth in the incident on the forepiece and in the past similarity.And, can also understand and cause the parts deviation and bad relevant with which when flowing directly into next operation.In countermeasure example 52, expression has the content of the countermeasure (analytical information) that the parts of the judged result of countermeasure decision function 162 and relative similarity take.This countermeasure example 52 helps the place of the problem of grasping or the establishment of countermeasure.
According to the structure of present embodiment described above, in middle operation, detect the incident that may become poor prognostic cause owing to can detect, thereby can pinpoint the problems in advance, and can handle rapidly.And, according to the analytical information of being stored, can be to each parts (not having on variety of components or the substrate position), each operation, each incident regulation judgment standard, thereby the high inspection of reliability that can the implementation basis material object.Thus, can realize effectively QC in real time.
(the 4th execution mode)
In the 4th execution mode of the present invention, utilization is present in the parts group's of the identical type on the printed base plate information, the clear and definite correlation between middle operation event and final check result (fraction defective), by grasping bad occurrence tendency, infer bad reason by incident difference (or combination difference of the incident of pressing).And, because system constitutes, function constitutes and above-mentioned execution mode is roughly the same, thereby in this detailed.
Handling process according to flowchart text the 4th execution mode of Figure 47.Figure 47 is the flow chart of the routine analyzer of present embodiment.
Inspection by after refluxing detects when bad parts have taken place, and the routine analyzer of main program is carried out function 120 and carried out the routine analyzer corresponding with bad item.Below, illustrate " floating bad ".
In routine analyzer, at first select and float bad relevant candidate incident (step S1000) from bad classification chart 115.Then, from contrast image information DB 111, read the contrast image (step S1001) of the parts of the identical type on the printed base plate.And,,, judge the occurrence degree (degree of influence) (step S1002) of each candidate incident according to the contrast image of each parts by the meaningful information subprogram.With above-mentioned execution mode in the same manner, extract meaningful information by each image and judge the incident occurrence degree from middle operation.At this, whether big by occurrence degree than predetermined threshold value, with these two ranks of occurrence degree " greatly "/occurrence degree " little ", the output result of determination.
Then, corresponding each candidate incident, the correlation of analysis incident occurrence degree and fraction defective.For example, when selecting incident A, B, C, D, at first, the parts heap sort is become a plurality of groups (step S1003) by the varying in size of the occurrence degree of incident A as the candidate incident.At this, be " greatly " or " little " according to the occurrence degree of incident A, be categorized as two groups of A1, A2 (group echo of the occurrence degree of incident X " greatly " is X1, and the group echo of occurrence degree " little " is X2).And, calculate the parts group who is categorized into group A1 and be categorized into group A2 the parts group separately float bad incidence (fraction defective) (step S1004).For incident B～D, also carry out identical processing.Figure 48 represents the result's of interrelation analysis a example.At Figure 48, expression has the number and the fraction defective of the parts that are categorized into group A1～D2 respectively.
Then, reason estimation function 134 is inferred bad reason (step S1005) according to the result of above-mentioned interrelation analysis.Particularly, among whole groups, select occurrence degree " greatly " and the high group of fraction defective, and the selection candidate incident relevant with selected group is as poor prognostic cause.At this moment, preferably, also consider the component count of occurrence degree " greatly ".This is because when component count was very few, the reliability of fraction defective was little, and also little as the possibility of poor prognostic cause.In addition, when selecting the high group of fraction defective, can select fraction defective than the big group of predetermined threshold value (for example 50%), also can be according to the statistics such as average, dispersion of the fraction defective of group A1, B1, C1, D1, select the high relatively group of fraction defective, also can select the group of predetermined number successively from the high group of fraction defective.
When the candidate incident that is estimated as poor prognostic cause has only 1 (for example, when only selecting the incident D of the highest group D1 of fraction defective), this incident D is specified to floating bad reason, to be used to suppress the SMT condition of the generation of incident D, decision becomes bad and the SMT condition that need to adjust of floating of this printed base plate of improving (step S1006, not, S1007).The decision of SMT condition, for example can with reference to incident and SMT condition one to one regularization condition table (knowledge base) get final product.
The candidate incident (below, be called " reason incident ") that is estimated as poor prognostic cause has (for example, when incident D, the A of selection group D1, these three groups of A1, C1, C) when a plurality of, the processing that further ascertains the reason.This be because, reason incident number is many more, the adjustment operation of SMT condition is miscellaneous more.
Particularly, at first select the SMT condition (step S1008) of the generation that is used to suppress reason incident D.And, the trial-production (step S1009) of adjusting 1 time this SMT condition being carried out printed base plate.And, be not limited to 1 trial-production, also preferably adjust repeatedly the SMT condition and trial-production repeatedly.For each parts of new trial-production substrate, handle in the same manner with above-mentioned quality management, carry out the generation of contrast image and the inspection (step S1010) of the real dress of scolding tin quality.Then, with step S1001～S1004 in the same manner, the parts group of trial-production substrate is obtained occurrence degree and the correlation between the fraction defective (step S1011) of incident D.For other reasons incident A, C, the also processing of repeating step S1008～S1011.The result that expression obtains like this in Figure 49.
When obtaining as a result at whole reason incidents, whether investigation changes at the adjustment front and back of SMT condition, the occurrence degree and the fraction defective of incident.That is, as can be known be that even adjust the SMT condition, when the occurrence degree of incident and fraction defective did not almost change yet, this incident was not bad occurrence cause just, even and adjust this SMT condition, bad also can not be enhanced (with reference to the group D1 of Figure 48, Figure 49).On the other hand, we can say, by the adjustment of SMT condition, when the occurrence degree of incident and fraction defective diminish, this incident promptly is bad occurrence cause, and the adjustment of this SMT condition helps the possibility height (with reference to the group A1 of Figure 48, Figure 49) of bad improvement.And, change irrespectively with the occurrence degree of incident, when fraction defective did not almost change, can regard this incident as was not bad occurrence cause (with reference to the group C1 of Figure 48, Figure 49).And, as can be known be, though the occurrence degree of incident almost do not change, but when fraction defective diminishes,, have the adjustment that helps this SMT condition at least though this incident is not direct poor prognostic cause.
In the present embodiment, compare with the printed base plate of making before adjustment SMT condition, the incident that the occurrence degree of incident and fraction defective diminish promptly is poor prognostic cause (step S1012).And decision is used for preferential create conditions (the step S1013) that adjusts the SMT condition that suppresses investigated this incident.In the example of Figure 48 and Figure 49, the incident A of the minimizing amplitude maximum of selection incident occurrence degree and fraction defective is as first candidate of poor prognostic cause, and create conditions (first regularization condition) of the SMT condition enactment relevant with incident A for originally adjusting.And, select incident D as second candidate, and be second second regularization condition that will adjust the SMT condition enactment relevant with incident D.Decision is during regularization condition, with second execution mode (with reference to Figure 32) in the same manner, can carry out dwindling of condition value.
According to present embodiment described above, can be clearly correlation between middle operation event and final check result (fraction defective), owing to can not grasp bad generation area by incident, thereby can infer this bad reason with high likelihood.And, by the SMT condition of suitably finding out poor prognostic cause and needing to adjust, can cut down the labour of the countermeasures of problems that is used for quality improving significantly, can realize effective quality management.
And, in the 4th execution mode, though investigate the occurrence degree of an incident and the correlation between the fraction defective and infer poor prognostic cause, further preferably, infer poor prognostic cause from the combination of the occurrence degree of a plurality of incidents and the correlation between the fraction defective.For example, for four candidate incident A, B, C, D, occurrence degree is divided into " greatly "/" little " these two ranks, and when considering two incidents of combination, the group number is 2
2* 4C2=24.As described above, when considering the combination of incident, can handle bad that the effect that multiplies each other by a plurality of incidents causes, improve the reliability of quality management.
In addition, above-mentioned first to fourth execution mode is an illustration concrete example of the present invention.Scope of the present invention is not limited to above-mentioned execution mode, can carry out various distortion in the scope of this technological thought.
Claims (14)
1. the quality control system of a printed base plate is characterized in that, comprising:
Image unit in the series of processes of welding assembly, is made a video recording to printed base plate in each operation on printed base plate;
Image storage unit is set up the photographed images in each operation related and is stored;
Inspection unit is checked the real dress of scolding tin quality from the photographed images of final operation;
Candidate incident selected cell detects when bad by inspection, from may be the middle operation of design phase or manufacturing in the event, select may become this bad reason the incident more than 1 or 1 as the candidate incident;
The incident resolution unit by the photographed images of reference with the operation of described candidate event correlation, is judged the occurrence degree of each candidate incident;
Display unit, demonstration and the photographed images of the operation of described candidate event correlation and the occurrence degree of each candidate incident; With
This bad reason according to the combination of the occurrence degree of each candidate incident, is inferred in analysis of causes unit,
Described analysis of causes unit comprises:
Regularization condition decision unit, according to the combination of the occurrence degree of each candidate incident, decision is in order to solve this bad former thereby creating conditions of needing to adjust; With
The regularization condition analytic unit, the described decision adjustment of creating conditions that needs to adjust is tested a plurality of condition values of usefulness, check result according to each printed base plate of checking out by described inspection unit that produces according to each condition value, calculate the fraction defective of each condition value, and determine optimal condition value according to the fraction defective of each condition value.
2. the quality control system of printed base plate according to claim 1, wherein, described regularization condition analytic unit according to the variation tendency of described fraction defective, judges whether can solve this bad reason by described adjustment of creating conditions.
3. the quality control system of printed base plate according to claim 2, wherein,
Described regularization condition analytic unit,
When the scope of the condition value of fraction defective below pre-determined reference value is foozle scope when above, is judged to be and solves by described adjustment of creating conditions that this is bad;
When the scope of the condition value of fraction defective below pre-determined reference value than foozle scope hour, can solve by described adjustment of creating conditions that this is bad though be judged to be, this is bad to be to result from design;
When the scope of the condition value that does not exist fraction defective below pre-determined reference value, be judged to be and solve by described adjustment of creating conditions that this is bad.
4. according to the quality control system of each described printed base plate in the claim 1～3, wherein, also comprise the analytical information memory cell, it is for detected bad, set up relatedly to the analysis result of the occurrence degree of the photographed images of the information of major general's parts, bad kind, each operation, incident and described analysis of causes unit, and store as analytical information.
5. the quality control system of printed base plate according to claim 4, wherein, also comprise the analytical information output unit, it is according to the analysis result of described analysis of causes unit, select to solve the terminal of relevant department, and export described analytical information to selected this terminal with this bad reason.
6. the quality control system of printed base plate according to claim 1, wherein, described candidate incident selected cell has the bad classification chart that bad kind is corresponding with the event establishment that becomes this bad reason, by deciding the candidate incident with reference to this bad classification chart.
7. the quality control system of printed base plate according to claim 1, wherein, described regularization condition decision unit, have with the combination of the occurrence degree of incident and in order to solve these incidents adjustable creating conditions set up related regularization condition table, by with reference to fixed the creating conditions of needing to adjust of this regularization condition voting.
8. the quality control system of printed base plate according to claim 7, wherein, described regularization condition decision unit, has the adjustment priority sequence table in proper order that regulation is created conditions, when a plurality of creating conditions of need adjusting arranged, the adjustment order of respectively creating conditions according to described priority sequence table decision.
9. the quality control system of printed base plate according to claim 1, wherein, described incident resolution unit is extracted meaningful information by image processing from photographed images, according to the occurrence degree of this meaningful information decision incident.
10. the quality control system of printed base plate according to claim 1, wherein, described incident resolution unit, when the incident of generation, the photographed images of its feature of performance is shown with the guide that helps to judge whether the incident that takes place, thereby urge the user to carry out whether taking place in this photographed images the judgement and the input of described incident.
11. the quality control system of printed base plate according to claim 4 wherein, comprising:
Degree of admission decision unit, according to the analytical information that is stored in the described analytical information memory cell, the incident in the middle operation that decision is made allow occurrence degree; With
The occurrence degree of incident is obtained from the photographed images of middle operation in the middle inspection unit, whether exceeds the described occurrence degree of allowing by judging this occurrence degree, the generation of detection poor prognostic cause in middle the operation of making.
12. the quality control system of printed base plate according to claim 11 wherein, comprising:
The contrast unit detects by described middle inspection unit and to surpass when allowing the incident of occurrence degree, selects the analytical information that has the incident identical with this incident poor prognostic cause from described analytical information memory cell; With
The countermeasure information output unit is exported selected analytical information, as the countermeasure information that is used to solve detected poor prognostic cause.
13. the quality control system of printed base plate according to claim 12, wherein, described countermeasure information output unit, according to the analysis result that is included in the selected described analytical information, select the terminal of the department relevant, and export described countermeasure information to selected terminal with this poor prognostic cause.
14. quality control system according to claim 12 or 13 described printed base plates, wherein, described countermeasure information output unit, the photographed images that detects the substrate that surpasses described incident of allowing occurrence degree is shown as material picture, and will be included in the selected described analytical information photographed images as a comparison image show.
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| Application Number | Priority Date | Filing Date | Title |
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| JP2005024925A JP3818308B2 (en) | 2005-02-01 | 2005-02-01 | Printed circuit board quality control system |
| JP2005024925 | 2005-02-01 |
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| CN100518486C true CN100518486C (en) | 2009-07-22 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103650657A (en) * | 2011-09-27 | 2014-03-19 | 松下电器产业株式会社 | Electronic component mounting system |
Families Citing this family (39)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
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| JP4896655B2 (en) * | 2006-10-17 | 2012-03-14 | ヤマハ発動機株式会社 | Mounting fault cause identification method and mounting board manufacturing apparatus |
| JP5064812B2 (en) * | 2007-01-15 | 2012-10-31 | ヤマハ発動機株式会社 | Information collection method, information collection system, and information collection program |
| JP2009175031A (en) * | 2008-01-25 | 2009-08-06 | A & T Corp | Substrate type reagent, apparatus, method, and program for manufacturing inspection, apparatus, method, and program for analysis, server, method, and program for management, and recording medium |
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| US10041991B2 (en) * | 2012-11-06 | 2018-08-07 | Koh Young Technology Inc. | Board inspection apparatus system and board inspection method |
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| US11428644B2 (en) | 2018-11-27 | 2022-08-30 | Koh Young Technology Inc. | Method and electronic apparatus for displaying inspection result of board |
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| JP7323316B2 (en) * | 2019-03-28 | 2023-08-08 | Juki株式会社 | Production system and production method |
| JP7285403B2 (en) * | 2019-03-28 | 2023-06-02 | パナソニックＩｐマネジメント株式会社 | Information processing equipment |
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| WO2023037410A1 (en) * | 2021-09-07 | 2023-03-16 | ヤマハ発動機株式会社 | Component mounting system |
-
2005
- 2005-02-01 JP JP2005024925A patent/JP3818308B2/en active Active
-
2006
- 2006-01-28 CN CNB2006100045703A patent/CN100518486C/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN103650657B (en) * | 2011-09-27 | 2016-05-25 | 松下知识产权经营株式会社 | Electronic component mounting system |
Also Published As
| Publication number | Publication date |
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| JP2006216589A (en) | 2006-08-17 |
| CN1816275A (en) | 2006-08-09 |
| JP3818308B2 (en) | 2006-09-06 |
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