CN100517546C - Surface-adhered fuse with bi-circuit construction and its production - Google Patents
Surface-adhered fuse with bi-circuit construction and its production Download PDFInfo
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- CN100517546C CN100517546C CNB2005100840293A CN200510084029A CN100517546C CN 100517546 C CN100517546 C CN 100517546C CN B2005100840293 A CNB2005100840293 A CN B2005100840293A CN 200510084029 A CN200510084029 A CN 200510084029A CN 100517546 C CN100517546 C CN 100517546C
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- fuse
- insulating substrate
- circuit framework
- adhered
- conductive layer
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Abstract
The invention is concerned with the surface sticking fuse setting the melting thread construction and the thermistor resistance circuit construction on the insolated base material; the melting thread construction consists of a meltable chain, the thermistor resistance circuit construction is that sets two inner poles on the one touching end of the macromolecule polymer positive temperature coefficient (PPTC) material and the insolated basic material, sets two outer poles at the other end of them, sets two conductors on the insolated basic material respectively to form two inner poles connecting with the meltable chain, forms the melting thread construction and the thermistor resistance circuit construction to parallel connection. The invention can endure high power and high current.
Description
Technical field
The present invention is relevant a kind of surface-adhered fuse, refers to especially a kind ofly be in parallel by fuse circuit framework and thermosensitive resistor and circuit framework, and can bear the surface-adhered fuse structure of high voltage and high current.
Background technology
Press; general electric device can be set the maximum electric current that uses; when employed electric current surpasses; might make device impaired or burn; the topmost function of fuse is exactly that the electric current that prevents excess passes through electronic circuit; to make its generation high temperature when the electric current that exceeds the quata flows through fuse and cause fusing; avoid coming to harm with protective circuit; in existing information; communication; and electric device such as consumption electronic products; mainly be to utilize printed circuit board (PCB) (Printed Circuit Board; PCB) the electronics spare part is linked together; make its performance allomeric function; along with electric device becomes increasingly complex, the part that needs is more and more, and circuit and part on the printed circuit board (PCB) are also more and more intensive.
At present, the part encapsulation technology of printed circuit board (PCB), mainly be with " plug-in type encapsulation (Through Hole Technology; THT) " and " surface stuck encapsulation (SurfaceMounted Technology; be main SMT); wherein to encapsulate be the one side that part is placed in plank to plug-in type; and pin is welded on the another side; this part can need to take a large amount of spaces, and printed circuit board (PCB) is necessary for every pin boring of part, so will account for the space on printed circuit board (PCB) two sides because of pin, and the solder joint of pin is also bigger; On the other hand, the surface stuck encapsulation is with surface sticking assembly (Surface Mount Device, SMD) be positioned on the printed circuit board (PCB) that speckles with glue or tin cream, and then utilize certain heating technique to make assembly be fixed in the surface of printed circuit board (PCB), itself and traditional plug-in type encapsulate maximum difference, be not rely on the part pin to insert hole-drilled circuit, support the weight of part or keep the direction of part, add that it is that the position is in the one side identical with part that surface sticking assembly and printed circuit board (PCB) constitute the electrode that connects, and be able to all load onto part on printed circuit board (PCB) same position two sides, therefore with the printed circuit board (PCB) of through hole technology by comparison, the part of the printed circuit board (PCB) of use surface mount encapsulation technology can be comparatively intensive, meaning promptly can make more function be placed on the printed circuit board (PCB) of same area, perhaps can keep same function with the littler printed circuit board (PCB) of area.
Also therefore; the fuse that is used in the apparatus overload current protection also possesses the surface mount pattern is arranged; the structure cutaway view of the surface-adhered fuse of in the streets generally commonly seeing at present; this surface-adhered fuse mainly is to be provided with outer electrode at two corresponding positions with the similar insulating substrate of printed circuit board (PCB) material (for example FR4 epoxy resin) bottom surface; these two corresponding outer electrode portions are that the outer side surface along insulating substrate extends to end face; and only connect by the fuesable link that is mainly constituted together by the copper facing film; therefore when the electric current that exceeds the quata passes through fuesable link; to make its generation high temperature and cause fusing, to reach the circuit protection effect of blocking the electric current that exceeds the quata.
In other words, the electric circuit that uses surface-adhered fuse promptly can't normal operation after fuesable link fusion fracture, but in fact many electric circuits are the operating states that are in high voltage and high current for a long time, the entire circuit framework will heat up because of the hindrance function of assembly in the case, this unexpected temperature rises to react and will speed up fuesable link fusing, but not the electric current that exceeds the quata causes fuesable link fusing, causes the whole electric device can't normal operation.
So that, a kind of surface-adhered fuse that is combined with the thermosensitive resistor and circuit framework is as shown in Figure 1 in the streets arranged in addition, this surface-adhered fuse is to be provided with a fuse circuit framework 20 that is made of fuesable link 21 at the surface insulation layer 10a of an insulating substrate 10, on this fuesable link 21, cover one deck end face insulating barrier 10b again, and be provided with a high molecular polymer positive-temperature-coefficient material 31 in the inside of insulating substrate 10, and the avris at insulating substrate 10 is provided with two corresponding outer electrodes 41, one of them outer electrode 41 is to link with fuesable link 21, be provided with tin point 50 in addition high molecular polymer positive-temperature-coefficient material 31 and fuesable link 21 are formed series circuit configuration, and then become a kind of surface-adhered fuse structure with thermosensitive resistor and circuit framework; Yet, structural design so, after the electric current factor that exceeds the quata caused fuesable link 21 fusions fracture, even if after the electric current factor that exceeds the quata disappears, forever open circuit can't normal operation because of whole electric circuit forms.
Summary of the invention
In view of this, the present invention promptly is that two plate faces at an insulating substrate are respectively equipped with fuse circuit framework and thermosensitive resistor and circuit framework; Wherein, the fuse circuit framework mainly is to be made of a fuesable link, the thermosensitive resistor and circuit framework then is to be provided with two outer electrodes individually at the two ends of a high molecular polymer positive-temperature-coefficient (PPTC) material, and two internal electrodes, two internal electrodes are provided in a side of an end that contacts with insulating substrate, and on insulating substrate, be provided with the binding that two conductors constitute two internal electrodes and fuesable link respectively, constitute and a kind ofly form the parallel circuits structure mutually, and can bear the surface-adhered fuse structure of high voltage and high current by fuse circuit framework and thermosensitive resistor and circuit framework.
Description of drawings
Fig. 1 is a kind of known surface-adhered fuse structure cutaway view with thermosensitive resistor and circuit framework;
Fig. 2 is surface-adhered fuse STRUCTURE DECOMPOSITION figure of the present invention;
Fig. 3 is a surface-adhered fuse structure cutaway view of the present invention;
Fig. 4 is the main processing and manufacturing flow chart of surface-adhered fuse of the present invention.
[figure number explanation]
10 insulating substrates
The 10a surface insulation layer
10b end face insulating barrier
20 fuse circuit frameworks
21 fuesable link
30 thermosensitive resistor and circuit frameworks
31 high molecular polymer positive-temperature-coefficient materials
41 outer electrodes
42 internal electrodes
50 tin point
60 conductors
61 perforation
62 conductive layers
70 protective layers
Embodiment
For making your auditor know composition of the present invention, and execution mode, cooperate graphic being described as follows now:
The present invention's " surface-adhered fuse and method for making thereof " with double circuit framework, the basic structure of its whole surface-adhered fuse is formed as shown in Figures 2 and 3, be on an insulating substrate 10, to be provided with a fuse circuit framework 20 and a thermosensitive resistor and circuit framework 30, when implementing, fuse circuit framework 20 and thermosensitive resistor and circuit framework 30 are to be located at two plate faces of insulating substrate 10 respectively, and fuse circuit framework 20 is to be main body by one by the fuesable link 21 that the copper facing film constituted.
Aforesaid thermosensitive resistor and circuit framework 30 is to be provided with two outer electrodes 41 in the bottom of a high molecular polymer positive-temperature-coefficient material 31, and establish two internal electrodes 42 at its end that contacts with insulating substrate 10, and on insulating substrate 10, be provided with the binding that two conductors 60 constitute two internal electrodes 42 and fuesable link 21 respectively, promptly constitute a kind of according to this by fuse circuit framework 20 and the thermosensitive resistor and circuit framework 30 mutual parallel circuits structures that form, and then the surface-adhered fuse that can bear high voltage and high current is constructed, even if that is after having the electric current of exceeding the quata factor to cause fuesable link 21 fusions fracture, whole surface-adhered fuse still can be made of the circuit turn-on of two outer electrodes 41 thermosensitive resistor and circuit framework 30 after the electric current factor that exceeds the quata disappears, make the whole electric circuit still can normal operation.
In the specific implementation, conductor 60 is through insulating substrate 10, fuesable link 21 and internal electrode 42 by a perforation 61, being coated with conductive layer 62 in the inside of perforation 61 again constitutes, so can constitute contacting of fuesable link 21 and internal electrode 42, make the purpose that reaches that fuse circuit framework 20 and thermosensitive resistor and circuit framework 30 is in parallel by conductive layer 62; Moreover, whole surface-adhered fuse also can the centre position of fuesable link 21 be provided with a tin point 50, this tin point 50 is different from the copper metal of fuesable link 21, with when tin point 50 melts because of the overcurrent load, can allow fuesable link 21 become gun-metal, so that fuesable link 21 has more independent tin or the lower fusing point of copper, the operative temperature of these fuesable link 21 devices is reduced, to improve the performance of whole fuse.
Please cooperate simultaneously with reference to shown in Figure 4, the present invention in the specific implementation, it is the conductive layer that set thickness is arranged in the upper and lower surface coverage of insulating substrate 10 earlier, this conductive layer is that the mode with printing, plating or deposited copper metal is constituted, and utilizes the mode of this conductive layer thickness of control to set the current limit value of fuse line architecture; Then with exposure imaging; etched mode will go up respectively; the part conductive layer of lower surface removes; make insulating substrate on; lower surface becomes conductive layer framework and the internal electrode framework that is connected the both sides electrode district by a melting chain part respectively; in the middle of this work flow; it is surface coverage photoresistance material at conductive layer; again with light shield or egative film contraposition mode with the non-shading part pattern covers in the pre-zone that keeps conductive layer; and impose ultraviolet irradiation; the photoresistance material of non-shading part pattern covers is solidified; then will keep uncured photoresistance material to rinse out, not removed by the conductive layer etching of photoresistance material protection with ferric chloride solution again.
After fuse line architecture organizational system is finished; utilize mode of printing a kind of heat cured insulation material to be covered the melting chain part of fuse line architecture again; and heating makes the heat cured insulation material be solidified into the protective layer of protection melting chain part; impose electroplating processes at last; the electrode district that exposes the protective layer outside at the fuse line architecture covers conduction material (for example nickel, tin or terne metal); make two corresponding avris of insulating substrate upper surface form electrode part, the lower surface of insulating substrate then forms an internal electrode.
Again in insulating substrate; fuesable link and internal electrode are drilled with two perforation; be coated with conductive layer in perforated interior again; other has a thermosensitive resistor and circuit framework, and it mainly is made of the high molecular polymer positive-temperature-coefficient material; it is and the pressing and locating mutually of the internal electrode of insulating substrate lower surface; utilize cobalt 60 irradiations to make the typing of high molecular polymer positive-temperature-coefficient hardened material; at last again in high molecular polymer positive-temperature-coefficient material bottom surface with the printing; the mode of plating or deposited copper metal constitutes conductive layer; then with exposure imaging; etched mode removes the part conductive layer respectively; utilize mode of printing that a kind of heat cured insulation material is covered conductive layer again and remove the position; and heating makes the heat cured insulation material be solidified into the protective layer of protection conductive layer; impose electroplating processes at last, cover conduction material (nickel for example at the electrode district that exposes the protective layer outside; tin or terne metal) to form outer electrode.
If its surface-adhered fuse is desired further when the organizational system tin layer of the middle part of fuesable link; whole surface-adhered fuse is to finish in fuse line architecture organizational system; and do not carry out as yet before the protective layer organizational system work flow; carry out the organizational system work flow of tin layer; in the middle of this tin layer work flow; be to cover the photoresistance material at the upper surface of whole insulating substrate; again with light shield or egative film contraposition mode with the predeterminable area of shading light part pattern covers at the tin layer; and impose ultraviolet irradiation; the photoresistance material that is not subjected to the shading light part pattern covers is solidified; then will keep uncured photoresistance material to rinse out; only expose tin layer predeterminable area, and promptly finish this work flow in the zone (that is the default zone of tin layer) that is not subjected to the protection of photoresistance material with the mode organizational system of plating or deposit tin metal.
What deserves to be mentioned is; can further cover a protective layer 70 in the zone of fuesable link 21; this protective layer 70 is to utilize mode of printing a kind of heat cured insulation material to be covered the fuesable link 21 of fuse circuit framework 20; and heating is solidified the heat cured insulation material and is constituted; with prevent fuesable link 21 and on tin put 50 oxidations, and produce and to prevent the shield effectiveness that metal melting spills.
As mentioned above, the invention provides a kind of surface-adhered fuse, even if after the electric current factor that exceeds the quata causes fuesable link fusion fracture, after the electric current factor that exceeds the quata disappears with double circuit framework, still be maintained the normal operation of electric circuit, so offer the application of patent of invention in accordance with the law; Yet, above implementation and graphic shown in, be preferred embodiment of the present invention, be not to limit to the present invention with this, be with, approximate with structure of the present invention, device, feature etc. such as, identical person all should belong to of the present invention founding within purpose and the claim.
Claims (9)
1, a kind of surface-adhered fuse with double circuit framework is to be provided with a fuse circuit framework and a thermosensitive resistor and circuit framework on an insulating substrate; Wherein, this fuse circuit framework comprises a fuesable link, this thermosensitive resistor and circuit framework is to be provided with two internal electrodes at the end that a high molecular polymer positive-temperature-coefficient material contacts with insulating substrate, end then is provided with two outer electrodes in addition, and on this insulating substrate, be provided with the binding that two conductors constitute two internal electrodes and fuesable link respectively, constitute a kind of surface-adhered fuse structure that is in parallel by fuse circuit framework and thermosensitive resistor and circuit framework; Wherein respectively this conductor be by a perforation through insulating substrate, fuesable link and internal electrode, be coated with conductive layer in perforated interior again and constitute;
Wherein the zone of this fuesable link covers one protective layer used this protective layer is to utilize mode of printing that a kind of heat cured insulation material is covered the fuesable link surface to prevent that melt metal from spilling, and heating is solidified the heat cured insulation material and constituted.
2, the surface-adhered fuse with double circuit framework as claimed in claim 1, wherein this fuse circuit framework and this thermosensitive resistor and circuit framework are two plate faces that are located at insulating substrate respectively.
3, the surface-adhered fuse with double circuit framework as claimed in claim 1, wherein this fuesable link is made of the copper facing film, and is provided with a tin point in the centre position on this fuesable link surface.
4, a kind of method for making with surface-adhered fuse of double circuit framework is characterized in that: include the following step:
A, at the upper and lower surface coverage conductive layer of an insulating substrate;
B, the part conductive layer with upper and lower surface removes respectively, makes the upper and lower surface of insulating substrate become conductive layer framework and the internal electrode framework that is connected the both sides electrode district by a melting chain part respectively;
C, utilize mode of printing that a kind of heat cured insulation material is covered the melting chain part of fuse line architecture, and heating make the heat cured insulation material be solidified into the protective layer of protection melting chain part;
The electrode district that d, fuse line architecture expose the insulating barrier outside covers the conduction material, makes two corresponding avris of insulating substrate upper surface form electrode part, and the insulating substrate lower surface then forms an internal electrode;
E, be drilled with two perforation, be coated with conductive layer in perforated interior again in insulating substrate, fuesable link and internal electrode;
F, provide another thermosensitive resistor and circuit framework, this thermosensitive resistor and circuit framework is made of the high molecular polymer positive-temperature-coefficient material, and it is fixedly arranged on the internal electrode of insulating substrate lower surface;
G, form outer electrode in high molecular polymer positive-temperature-coefficient material bottom surface again.
5, the method for making of surface-adhered fuse as claimed in claim 4, wherein this conductive layer is the surface that the copper metal covers insulating substrate to be made of the mode of printing, plating or heavy base; Or can be by electroplating or the mode of heavy base covers nickel or tin metal or terne metal on the surface of electrode district.
6, the method for making of surface-adhered fuse as claimed in claim 4, wherein the part conductive layer of insulating substrate upper surface or lower surface be can exposure imaging, etched mode removes.
7, the method for making of surface-adhered fuse as claimed in claim 4 is wherein finished in fuse line architecture organizational system, and does not carry out as yet before the protective layer organizational system work flow, in advance at the surperficial middle part of melting chain part organizational system one tin layer.
8, the method for making of surface-adhered fuse as claimed in claim 4, wherein, it comprises the high molecular polymer positive-temperature-coefficient material this thermosensitive resistor and circuit framework, and it is and the pressing and locating mutually of the internal electrode of insulating substrate lower surface.
9, the method for making of surface-adhered fuse as claimed in claim 8, wherein, this high molecular polymer positive-temperature-coefficient material is to utilize cobalt 60 irradiations to make the typing of high molecular polymer positive-temperature-coefficient hardened material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100840293A CN100517546C (en) | 2005-07-14 | 2005-07-14 | Surface-adhered fuse with bi-circuit construction and its production |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100840293A CN100517546C (en) | 2005-07-14 | 2005-07-14 | Surface-adhered fuse with bi-circuit construction and its production |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1897203A CN1897203A (en) | 2007-01-17 |
| CN100517546C true CN100517546C (en) | 2009-07-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100840293A Expired - Fee Related CN100517546C (en) | 2005-07-14 | 2005-07-14 | Surface-adhered fuse with bi-circuit construction and its production |
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|---|---|
| CN (1) | CN100517546C (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8076751B2 (en) * | 2008-04-21 | 2011-12-13 | Littelfuse, Inc. | Circuit protection device including resistor and fuse element |
| JP5351860B2 (en) | 2009-09-04 | 2013-11-27 | 乾坤科技股▲ふん▼有限公司 | Protective device |
| US9025295B2 (en) | 2009-09-04 | 2015-05-05 | Cyntec Co., Ltd. | Protective device and protective module |
| JP5192524B2 (en) | 2009-09-04 | 2013-05-08 | 乾坤科技股▲ふん▼有限公司 | Protective device |
| CN102237674B (en) * | 2010-04-20 | 2013-12-11 | 乾坤科技股份有限公司 | Protection element and electronic apparatus |
| JP6782122B2 (en) * | 2016-08-24 | 2020-11-11 | デクセリアルズ株式会社 | Manufacturing method of protective element, circuit module and protective element |
| CN109427452B (en) * | 2017-08-21 | 2021-01-29 | 富致科技股份有限公司 | Positive temperature coefficient circuit protection device and manufacturing method thereof |
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2005
- 2005-07-14 CN CNB2005100840293A patent/CN100517546C/en not_active Expired - Fee Related
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| Publication number | Publication date |
|---|---|
| CN1897203A (en) | 2007-01-17 |
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