CN100516630C - High-density light-emitting diode array lamp board - Google Patents
High-density light-emitting diode array lamp board Download PDFInfo
- Publication number
- CN100516630C CN100516630C CNB2004100540006A CN200410054000A CN100516630C CN 100516630 C CN100516630 C CN 100516630C CN B2004100540006 A CNB2004100540006 A CN B2004100540006A CN 200410054000 A CN200410054000 A CN 200410054000A CN 100516630 C CN100516630 C CN 100516630C
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- array
- printed circuit
- circuit board
- aluminum
- port
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
The present invention provides an array lamp board for high-density light-emitting diodes, which comprises an aluminum-based printed circuit board, wherein one face of the aluminum-based printed circuThe invention provides a kind of high-density light-emitting diode array lamp panel. It includes aluminum-base printed circuit board at one side of the aluminum base printed circuit board; at least onit board is provided with at least one layer of printed circuit, and the other face of the aluminum-based printed circuit board is provided with an aluminum-based heat-dispersing face connected a heate layer printed circuit is set at another side. Aluminum-base radiating surface is connected with radiating device. N line xM row mounting positions are arranged orderly on one side of aluminum-base p radiator. One face of the aluminum-based printed circuit board is regularly provided with N rows* M columns installing positions, and at least one red light-emitting diode wafer, at least one green lrinted circuit board. At least one red luminous diode wafer, at least one green luminous diode wafer are implanting into each mounting position. The same color light-emitting diode wafers of the same ight-emitting diode wafer and at least one blue light-emitting diode are implanted in each installing position. Light-emitting diode wafers which are positioned on the installing positions of the samerow mounting position on printed circuit board are sequentially connected in series; each row the same color luminous diode wafers are mutually connected in parallel, separately composing red light ar column on the printed circuit board and have the same color are orderly connected in series, and light-emitting diode wafers with the same color of each column are mutually connected in parallel to rray, green light array and blue light array. Red light array, green light array and blue light array electrical connected positive and negative pole ports set on printed circuit board. espectively form a red light array, a green light array and a blue light array. The printed circuit board is provided with positive and negative pole ports electrically connected with the red light array, the green light array and the blue light array. The present invention has the advantages of compact structure of array arrangement, small size of the lamp board, rapid heat radiation, controllable color temperature and luminance of the lamp board, high systemic luminance and high utilization rate of light.
Description
Technical field
The present invention relates to a kind of luminescence component that adopts light emitting diode as light-emitting component, particularly a kind of high density LED array lamp plate.
Background technology
Light emitting diode has significant advantage as light source.The first life-span is long, can reach several ten thousand hours; It two is sound constructions, and the parts that do not have tungsten filament, glass bulb etc. to damage easily have high anti-seismic performance; It three is that response speed is fast, and the logical rise time of light is short; It four is low to a lamp driver requirement, easily realizes light modulation and Based Intelligent Control; It five is anti-switching surges, is applicable to the occasion of frequent switch; It six is energy-efficient; It seven is harmful substances such as not mercurous, lead, does not pollute.Therefore, light emitting diode is widely used in illumination, electronics shows curtain wall, LCD back of the body irradiation source, automobile lamp, traffic lights, instrument and meter lighting source etc.
A kind of super bright LED light lamp of prior art as shown in Figure 1.It comprises light-emitting diode chip for backlight unit 101, cathode rod 102, anode rod 103, support 104, epoxy encapsulation 105 and goes between 106.Working current density is big because the surface area of light-emitting diode chip for backlight unit is little for this super bright LED light lamp, and the diode internal heat generation is serious.The another kind of super bright LED light lamp of prior art as shown in Figure 2.It is the light emitting diode matrix lamp plate 202 that is combined by a plurality of LED light lamps 201, its volume is bigger, heat is higher, as be applied to that luminous energy is concentrated, in the system of form of light source points of proximity light source or little area source, the light energy of light emitting diode can not make full use of, and system brightness does not reach instructions for use.
Summary of the invention
Purpose of the present invention is to overcome existing the problems referred to above of light emitting diode matrix lamp plate of prior art, and a kind of high density LED array lamp plate is provided.Can effectively improve light utilization efficiency, and have good heat sinking function.
To achieve these goals, the present invention has adopted following technical scheme: a kind of high density LED array lamp plate, be characterized in, comprise aluminum-base printed circuit board, one side at aluminum-base printed circuit board is provided with a layer printed circuit at least, another side is that aluminium base radiating surface is connected with radiator, the wherein one side of aluminum-base printed circuit board regularly arranged have N capable * a M row installation position, each installation position is implanted at least one red light emitting diodes wafer, at least one green LED wafer and at least one blue LED wafer; The LED wafer that is positioned at the same color of same row installation position on the printed circuit board is connected in series in proper order, and ruddiness array, green glow array and blue light array are formed in the connection parallel with one another of the LED wafer of each row same color respectively; Described printed circuit board is provided with the both positive and negative polarity port that is electrically connected with ruddiness array, green glow array and blue light array.
Above-specified high density light emitting diode matrix lamp plate, wherein, described both positive and negative polarity port comprises three anodal ports and three negative pole ports, described ruddiness array, green glow array and blue light array are electrically connected with an anodal port and a negative pole port respectively.
Above-specified high density light emitting diode matrix lamp plate, wherein, described both positive and negative polarity port comprises an anodal port and three negative pole ports, and described ruddiness array, green glow array and blue light array are electrically connected with an anodal port altogether, are electrically connected with a negative pole port respectively.
Above-specified high density light emitting diode matrix lamp plate, wherein, described both positive and negative polarity port comprises three anodal ports and a negative pole port, and described ruddiness array, green glow array and blue light array are electrically connected with a negative pole port altogether, are electrically connected with an anodal port respectively.
Above-specified high density light emitting diode matrix lamp plate wherein, is respectively implanted three red light emitting diodes wafers, a green LED wafer and a blue LED wafer in each installation position of described aluminum-base printed circuit board.
Above-specified high density light emitting diode matrix lamp plate wherein, is respectively implanted a red light emitting diodes wafer, two green LED wafers and a blue LED wafer in each installation position of described aluminum-base printed circuit board.
High density LED array lamp plate arrayed compact conformation of the present invention, the lamp plate volume is little, adopts the aluminum-base printed circuit board rapid heat dissipation, and colour temperature, the brightness of lamp plate are controlled.LED wafer can directly be implanted in each installation position, has saved welding procedure, and the arrangement of lamp is more regular.The brightness of system is higher, and the utilization rate of light is higher.
Description of drawings
Specific performance of the present invention, feature are further described by following embodiment and accompanying drawing thereof.
Fig. 1 is the structural representation of the super bright LED light lamp of prior art;
Fig. 2 is the structural representation of prior art light emitting diode matrix lamp plate;
Fig. 3 is the structural representation of high density LED array lamp plate one embodiment of the present invention;
Fig. 4 is the enlarged diagram of middle A part embodiment illustrated in fig. 3;
Fig. 5 is the structural representation of another embodiment of high density LED array lamp plate of the present invention;
Fig. 6 is the enlarged diagram of middle B part embodiment illustrated in fig. 5.
The specific embodiment
See also Fig. 3.Fig. 3 is the structural representation of high density LED array lamp plate one embodiment of the present invention.High density LED array lamp plate of the present invention comprises the both positive and negative polarity port 306 of aluminum-base printed circuit board 301, printed circuit 302, red light emitting diodes wafer 303, green LED wafer 304, blue LED wafer 305, ruddiness array, the both positive and negative polarity port 307 of green glow array, the both positive and negative polarity port 308 and the installation position 309 of blue light array.Printed circuit 302 is arranged on the wherein one side (can be individual layer or two-layer above printed circuit) of aluminum-base printed circuit board, each installation position 309 press N capable * the regularly arranged wherein one side of M row at aluminum-base printed circuit board, respectively implant at least one red light emitting diodes wafer 303, at least one green LED wafer 304 and at least one blue LED wafer 305 in each installation position.The LED wafer that is positioned at the same color of same row installation position on the printed circuit board is connected in series in proper order, and ruddiness array, green glow array and blue light array are formed in the connection parallel with one another of the LED wafer of each row same color respectively.Embodiment illustrated in fig. 3 is the light source that is used for the colored digital film processor, the film speed of considering ruddiness is slower than green glow and blue light, require the ruddiness brightness must be stronger than green glow, blue light, so in the present embodiment, respectively implant three red light emitting diodes wafers, a green LED wafer and a blue LED wafer in each installation position of aluminum-base printed circuit board.Please cooperate referring to Fig. 4, three red light emitting diodes wafers are implanted the two ends, the left and right sides of an installation position respectively, wherein an end is implanted two red light emitting diodes wafers, the other end is implanted a red light emitting diodes wafer, green LED wafer and blue LED wafer are then implanted the middle part of installation position respectively, and with the adjacent installation position of above-mentioned installation position same column in, the red light emitting diodes wafer number exchange of implanting two ends, the left and right sides is provided with.Be connected into two row by lead about three red light emitting diodes wafers in each row installation position divide, each the row red light emitting diodes wafer on the whole printed circuit board is connected in parallel and forms the ruddiness array; A green LED wafer in each row installation position is cascaded by lead, and each the row green LED wafer on the whole printed circuit board is connected in parallel and forms the green glow array; A blue LED wafer in each row installation position is cascaded by lead, and each the row blue LED wafer on the whole printed circuit board is connected in parallel and forms the blue light array.
Printed circuit board among the present invention is provided with the both positive and negative polarity port that is electrically connected with printed circuit and connects power supply for ruddiness array, green glow array and blue light array, this both positive and negative polarity port can be arranged to three anodal ports and three negative pole ports, by ruddiness array, green glow array and blue light array each with an anodal port and a negative pole port.Also can be arranged to an anodal port and three negative pole ports, by the shared anodal port of ruddiness array, green glow array and blue light array, respectively with a negative pole port.Can also be arranged to three anodal ports and a negative pole port, by the shared negative pole port of ruddiness array, green glow array and blue light array, respectively with an anodal port.What present embodiment adopted is that three anodal ports and three negative pole ports are set, and ruddiness array, green glow array and blue light array are respectively with an anodal port and a negative pole port.Shown in the figure, 306 is the both positive and negative polarity port of ruddiness array, and 307 is the both positive and negative polarity port of green glow array, and 308 is the both positive and negative polarity port of blue light array.
When the present invention works, add forward voltage to the both positive and negative polarity port 306 of ruddiness array, electric current flows to negative electrode from the anode of light emitting diode, and each red light emitting diodes sends ruddiness in the ruddiness array.Equally, add forward voltage to the both positive and negative polarity port 307 of green glow array, electric current flows to negative electrode from the anode of light emitting diode, and each green LED sends green glow in the green glow array.Both positive and negative polarity port 308 to the blue light array adds forward voltage, and electric current flows to negative electrode from the anode of light emitting diode, and each blue LED sends blue light in the blue light array.
See also Fig. 5, Fig. 6.Fig. 5 is the structural representation of another embodiment of high density LED array lamp plate of the present invention, and Fig. 6 is the B enlarged diagram among Fig. 5.High density LED array lamp plate of the present invention comprises the both positive and negative polarity port 407 of aluminum-base printed circuit board 401, printed circuit 402, red light emitting diodes wafer 403, green LED wafer 404, blue LED wafer 405, ruddiness array, the both positive and negative polarity port 406 of green glow array, the both positive and negative polarity port 408 and the installation position 409 of blue light array.Printed circuit 402 is arranged on the wherein one side (can be individual layer or two-layer above printed circuit) of aluminum-base printed circuit board, a plurality of installation positions 409 are arranged in the wherein one side of aluminum-base printed circuit board in length and breadth, respectively implant at least one red light emitting diodes wafer 403, at least one green LED wafer 404 and at least one blue LED wafer 405 in each installation position.The LED wafer that is positioned at the same color of same row installation position on the printed circuit board is connected in proper order, and the LED wafer of each row same color is parallel with one another, forms ruddiness array, green glow array and blue light array respectively.Present embodiment is the light source that is used for projector equipment, consider the photobehavior pipe of eyes, green glow brightness must be stronger than ruddiness, blue light, so in the present embodiment, respectively implant a red light emitting diodes wafer 403, two green LED wafers 404 and blue LED wafers 405 in each installation position of aluminum-base printed circuit board.Two green LED wafers 404 are implanted two ends, 409 left and right sides, installation position respectively, a red light emitting diodes wafer 403 and 405 middle parts of implanting installation position 409 respectively of a blue LED wafer, two red light emitting diodes wafers in each row installation position 409 were connected into two row by lead about 403 minutes, and each the row green LED wafer 404 on the whole printed circuit board is connected in parallel and forms the green glow array; The red light emitting diodes wafer 403 of each row in installation position is cascaded by lead, the composition ruddiness array that is connected in parallel of each the row red light emitting diodes wafer 403 on the whole printed circuit board; The blue LED wafer 405 of each row in installation position is cascaded by lead, the composition blue light array that is connected in parallel of each the row blue LED wafer 405 on the whole printed circuit board.
Printed circuit board among the present invention is provided with the both positive and negative polarity port that is electrically connected with printed circuit and connects power supply for ruddiness array, green glow array and blue light array, this both positive and negative polarity port can be arranged to three anodal ports and three negative pole ports, by ruddiness array, green glow array and blue light array each with an anodal port and a negative pole port.Also can be arranged to an anodal port and three negative pole ports, by the shared anodal port of ruddiness array, green glow array and blue light array, respectively with a negative pole port.Can also be arranged to three anodal ports and a negative pole port, by the shared negative pole port of ruddiness array, green glow array and blue light array, respectively with an anodal port.What present embodiment adopted is that three anodal ports and three negative pole ports are set, and ruddiness array, green glow array and blue light array are respectively with an anodal port and a negative pole port.Shown in the figure, 407 is the both positive and negative polarity port of ruddiness array, and 406 is the both positive and negative polarity port of green glow array, and 408 is the both positive and negative polarity port of blue light array.
When the present invention works, add forward voltage to the both positive and negative polarity port 407 of ruddiness array, electric current flows to negative electrode from the anode of light emitting diode, and each red light emitting diodes sends ruddiness in the ruddiness array.Equally, add forward voltage to the both positive and negative polarity port 406 of green glow array, electric current flows to negative electrode from the anode of light emitting diode, and each green LED sends green glow in the green glow array.Both positive and negative polarity port 408 to the blue light array adds forward voltage, and electric current flows to negative electrode from the anode of light emitting diode, and each blue LED sends blue light in the blue light array.
How many colour temperature decisions of lamp optical system regulation as required of the red light emitting diodes wafer that uses in each installation position of the present invention, green LED wafer and blue LED wafer, the luminous intensity decision that the size of wafer needs according to optical system.And luminous intensity, the ON/OFF of ruddiness array, green glow array and blue light array are controlled respectively.
Claims (6)
1, a kind of high density LED array lamp plate, it is characterized in that: comprise aluminum-base printed circuit board, one side at aluminum-base printed circuit board is provided with a layer printed circuit at least, another side is that aluminium base radiating surface is connected with radiator, the printed circuit of aluminum-base printed circuit board one side regularly arranged have N capable * a M row installation position, respectively implant at least one red light emitting diodes wafer, at least one green LED wafer and at least one blue LED wafer in each installation position; The LED wafer that is positioned at the same color of same row installation position on the printed circuit board is connected in proper order, and the LED wafer of each row same color is parallel with one another, forms ruddiness array, green glow array and blue light array respectively; Described printed circuit board is provided with the both positive and negative polarity port that is electrically connected with ruddiness array, green glow array and blue light array.
2, high density LED array lamp plate according to claim 1, it is characterized in that: described both positive and negative polarity port comprises three anodal ports and three negative pole ports, and described ruddiness array, green glow array and blue light array are electrically connected with an anodal port and a negative pole port respectively.
3, high density LED array lamp plate according to claim 1, it is characterized in that: described both positive and negative polarity port comprises an anodal port and three negative pole ports, described ruddiness array, green glow array and blue light array are electrically connected with an anodal port altogether, are electrically connected with a negative pole port respectively.
4, high density LED array lamp plate according to claim 1, it is characterized in that: described both positive and negative polarity port comprises three anodal ports and a negative pole port, described ruddiness array, green glow array and blue light array are electrically connected with a negative pole port altogether, are electrically connected with an anodal port respectively.
5, high density LED array lamp plate according to claim 1 is characterized in that: respectively implant three red light emitting diodes wafers, a green LED wafer and a blue LED wafer in each installation position of described aluminum-base printed circuit board.
6, high density LED array lamp plate according to claim 1 is characterized in that: respectively implant a red light emitting diodes wafer, two green LED wafers and a blue LED wafer in each installation position of described aluminum-base printed circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100540006A CN100516630C (en) | 2004-08-25 | 2004-08-25 | High-density light-emitting diode array lamp board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100540006A CN100516630C (en) | 2004-08-25 | 2004-08-25 | High-density light-emitting diode array lamp board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1740630A CN1740630A (en) | 2006-03-01 |
| CN100516630C true CN100516630C (en) | 2009-07-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100540006A Expired - Fee Related CN100516630C (en) | 2004-08-25 | 2004-08-25 | High-density light-emitting diode array lamp board |
Country Status (1)
| Country | Link |
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| CN (1) | CN100516630C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101398157B (en) * | 2007-09-28 | 2011-09-21 | 东莞市精航科技有限公司 | Lamp panel structure process of LED lamp |
| CN101493214B (en) * | 2008-01-23 | 2011-02-02 | 环隆电气股份有限公司 | Multi-wavelength luminous module with high-density electrical connection |
| CN105333329A (en) * | 2014-08-08 | 2016-02-17 | 常州欧密格光电科技有限公司 | Ultra-small and ultra-thin red, green and blue light emitting module |
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2004
- 2004-08-25 CN CNB2004100540006A patent/CN100516630C/en not_active Expired - Fee Related
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| Publication number | Publication date |
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| CN1740630A (en) | 2006-03-01 |
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Granted publication date: 20090722 Termination date: 20120825 |