CN2844651Y - High-radiant luminescent LED light-source module and light thereof - Google Patents
High-radiant luminescent LED light-source module and light thereof Download PDFInfo
- Publication number
- CN2844651Y CN2844651Y CNU2005201220518U CN200520122051U CN2844651Y CN 2844651 Y CN2844651 Y CN 2844651Y CN U2005201220518 U CNU2005201220518 U CN U2005201220518U CN 200520122051 U CN200520122051 U CN 200520122051U CN 2844651 Y CN2844651 Y CN 2844651Y
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- circuit board
- printed circuit
- pcb
- light
- source module
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Abstract
The utility model relates to a high-radiant luminescent LED light-source module and light thereof. It is mainly to place LED array formed by a plurality of LED on the printed circuit board with less than 400 mu m thickness. The LED is light source with high power and high lighteness. In this way, the design of the thin sheet of this printed circuit board shortens the conducting path so as to obtain good radiation effect. And also, the printed circuit board with this thickness is provided with flexing and bent characteristics so the circuit board can be used to attach to the outer wall of the lamp so as to improve radiation effect further and this is easier to make more lamps with different moldings.
Description
Technical field
The utility model relates to a kind of heat dissipation type high LED light-source module and light fixture thereof, particularly a kind of being applied to high power, high brightness LED as designed structure of light source and made light fixture.
Background technology
It is in the sixties in last century that light emitting diode is applied the earliest, and they are used to indicate wireless open/close state at that time.In the last few years, engineers had been applied to various fields gradually with them, and signal lamp, automobile tail light, indicator screen can both be seen their figure everywhere.Compare with traditional bulb, the energy that LED light lamp consumed is very little, and not flicker.Making us most mysterious is, its life-span can be for many decades.This is because they are by durable semiconductor delivered current, rather than as traditional bulb, the filament that relies on fragility, Gao Re and will soon damage.But when light emitting diode uses for illumination, there is a sizable obstacle to need to solve, must brightness heal when high, just must adopt the power high light emitting diode of healing, and the heat that is produced is bigger, when for example using as street lamp, must adopt the formed array of several light emitting diodes, the heat that is produced is high, if the good radiator structure of neither one, this lifetime of LED will significantly be shortened, and influence the reliability of entire product.
Please refer to Fig. 1, the traditional printing circuit board 1 that light emitting diode road lamp 10 uses in the prior art is metal such as the heat radiating type circuit boards of considering such as aluminium or copper for general FR4 printed circuit board (PCB) commonly used or with the heat radiation.When considering general street lamp styling or other, outer cover of lamp holder 4 can be made the shape of camber or other curved surface usually as the demand in the vision design.But since the fuel factor of High Power LED street lamp 10 can make the lost of life of light emitting diode and its luminous efficiency also can be with this fuel factor deterioration, so the design of general light emitting diode road lamp 10 can fit tightly in order to make outer cover of lamp holder 4 and traditional printing circuit board 1, to improve radiating efficiency, necessary additional designs one planar metal pedestal 3, fit with traditional printing circuit board 1 and outer cover of lamp holder 4 respectively in its two ends, light emitting diode array 2 promptly conducts heat to outer cover of lamp holder 4 by this metal base 3, looses in atmosphere again.But the hot efficient atmosphere that conducts to that the design of this kenel still can't be produced light emitting diode array 2 on the traditional printing circuit board 1.
The utility model content
Therefore, the purpose of this utility model is to provide a kind of used thickness less than 400 μ m, the heat dissipation type high LED light-source module of preferable printed circuit board (PCB) less than 200 μ m, and it can be applied in the light fixture, at the lamp socket of different geometries, printed circuit board (PCB) and outer cover of lamp holder profile are combined closely, make outer cover of lamp holder directly become a heat abstractor, and do thermal cycle by outer cover of lamp holder and atmosphere, to reach large-area radiating effect.Simultaneously, because this printed circuit board (PCB) is a technology commonly used at present, need not to make on cost, equipment and the manufacturing technology significantly and revise, simultaneously the thickness of this printed circuit board (PCB) is made less than 400 μ m, preferable less than 200 μ m, so so thin printed circuit board (PCB) more can fit in outer cover of lamp holder at flexural buckling on the one hand, more can quicken the transmission of heat on the other hand, to obtain splendid radiating effect.
In order to achieve the above object, the utility model provides a kind of heat dissipation type high LED light-source module, and it comprises a printed circuit board (PCB), and thickness is less than 400 μ m; The light emitting diode array is formed by several light emitting diodes, and it is the light emitting diode of high power, high brightness, is arranged at the printed circuit board (PCB) place, and is electrically connected with this printing electroplax with lead.
Use heat dissipation type high LED light-source module of the present utility model also to can be made into a light fixture in addition, it comprises: an outer cover of lamp holder; One printed circuit board (PCB) is installed on the inside of this outer cover of lamp holder, and thickness has suitable flexibility less than 400 μ m; One light emitting diode array as light source, is installed on above the printed circuit board (PCB), and is electrically connected with this printed circuit board (PCB) with lead; And a lampshade, with the driving fit mutually of this outer cover of lamp holder, wherein, the combining closely of this printed circuit board (PCB) with respect to the another side that connects this light emitting diode array and the inboard of this outer cover of lamp holder.
Because the thickness of printed circuit board (PCB) of the present utility model is preferable less than 200 μ m less than 400 μ m, so printed circuit board (PCB) of the present utility model can bend arbitrarily and itself and outer cover of lamp holder profile are fitted tightly.Therefore, this LED lamp source not only can be widely applied in the existing various lamp sockets and reach on the product of how much external forms of other on-plane surface, and can utilize outer cover of lamp holder directly to become a heat abstractor, and not need to design in addition the used planar metal cooling base of prior art.Simultaneously, the thickness of the utility model printed circuit board (PCB) is less than 400 μ m, and is preferable less than 200 μ m, and the heat of shortening heat bang path, and then raising whereby is passed to the speed of outer cover of lamp holder.Therefore, the made light fixture of heat dissipation type high LED source mould of the present utility model not only can the radiating efficiency of raising own, and light fixture cost volume is reduced and lamp socket diminishes.
By the utility model following embodiment and accompanying drawing, aforementioned and other purpose, feature, viewpoint and advantage of the present utility model will be more clear.
Description of drawings
Fig. 1 is the existing sectional view that uses the light emitting diode road lamp of traditional printing circuit board;
Fig. 2 is a stereogram of the present utility model;
Fig. 3 is a generalized section of the present utility model;
Fig. 4 applies to the sectional view of light emitting diode road lamp for the utility model.
Description of reference numerals
1 traditional printing circuit board, 2 light emitting diode arrays, 3 metal bases
4 outer cover of lamp holder, 5 lampshades, 6 printed circuit board (PCB)s
61 metallic circuits, 7 light emitting diode arrays, 70 light emitting diodes
71 leads, 8 outer cover of lamp holder, 9 lampshades
10,20 light emitting diode road lamps
A heat-conducting layer b metal blocks c heat-conducting layer
The specific embodiment
To in more detailed mode preferred embodiment of the present utility model be described with reference to the accompanying drawings.
As Fig. 2, shown in Figure 3, stereogram and cutaway view for heat dissipation type high LED light-source module of the present utility model, it mainly comprises the light emitting diode array of a printed circuit board (PCB) 6 and 70 shapes of several light emitting diodes, these printed circuit board (PCB) 6 thickness are less than 400 μ m, preferable less than 200 μ m, make its characteristic, and light emitting diode 70 is high power, highlighted light emitting diode with pliability bending, be arranged at printed circuit board (PCB) 6 places, and be electrically connected with this printing electroplax with lead 71.The light source colour that position, number is set and is produced of this light emitting diode 70 is then decided according to user's demand, can freely change, with obtain light source colour, brightness and the colour temperature of palpus.
In order to make the better heat-radiation effect of light emitting diode 70, as shown in Figure 3, be provided with a heat-conducting layer a between this light emitting diode 70 and printed circuit board (PCB) 6, its material is thermal grease, conducting strip, or other can make the thermal source of light emitting diode own be passed to the materials and methods of printed circuit board (PCB) fast.And be provided with metal blocks b in printed circuit board (PCB) 6, be provided with on it for light emitting diode 70, material can be gold or copper or the like, and metal blocks b herein only is the usefulness of heat conduction, be different from printed circuit board (PCB) 6 on as the metallic circuit 61 of electrical communication, do not communicate with it yet.The thermal source that light emitting diode 70 of the present utility model is whereby produced in use can through heat-conducting layer a, and metal blocks b be passed to printed circuit board (PCB) 6 places fast, and the utility model utilizes the characteristic of its very narrow thickness can make heat be transmitted to its opposite side fast, and reach the purpose of quick heat radiating, if cooperate auxiliary (as the described outer cover of lamp holder of back segment) of other member in addition, the better heat-radiation effect that it is whole.Thin in addition printed circuit board (PCB) 6 has more flexible flexible, can be widely applied on the product of how much external forms of existing various lamp sockets and other on-plane surface, and is more convenient in the use.
As shown in Figure 4, use structure of the present utility model designed the sectional view of light emitting diode road lamp.Light emitting diode road lamp 20 of the present utility model with several light emitting diodes with the array mode form light emitting diode array 7 be installed on printed circuit board (PCB) 6 above, and be electrically connected with this printed circuit board (PCB) 6 with lead, wherein, the thickness of this printed circuit board (PCB) 6 is less than 400 μ m, preferable less than 200 μ m, it is suitable flexible that it is had, can be crooked arbitrarily, and this light emitting diode array 7 can adopt specific arrangement according to the lampshade 9 and the luminous uniformity, for example the light emitting diode connection in series-parallel by several same colors is one group of array, every group of light emitting diode set of arrays is a circuit, in conjunction with red (R), green (G), blue (B) three groups of light emitting diode arrays form LED lamp source, be responsible for all light emitting diode arrays of control by microcontroller (MPU) and assemble the circuit that forms, utilize PWM (Pulse Width Modulation, PWM) mode is switched the bright of light emitting diode and dark to control the light output intensity of every group of light emitting diode array fast with the frequency more than 1000 times/second, presents the required photochromic effect of user.Then, with this printed circuit board (PCB) 6 and on light emitting diode array 7 be installed on the inside of this outer cover of lamp holder 8, and the pliability of utilizing this printed circuit board (PCB) 6 makes its back side fit in how much external form outer cover of lamp holder 8 of on-plane surface, in the present embodiment outer cover of lamp holder 8 its be waveform, also can be any circular arc camber shape, combine closely with the inboard profile of this outer cover of lamp holder 8 because this printed circuit board (PCB) 6 is flexible, allow this outer cover of lamp holder 8 directly become a heat abstractor, therefore this outer cover of lamp holder 8 is preferably made with the material of excellent in heat dissipation effect, for example is metals such as aluminium, copper.Can form a heat-conducting layer c between this printed circuit board (PCB) 6 and this outer cover of lamp holder 8, its material is a thermal grease, conducting strip, or other can be passed to the printed circuit board (PCB) heat materials and methods of outer cover of lamp holder fast, combines closely each other guaranteeing, and has better heat radiating effect.Then with printing opacity lampshade 9 and this outer cover of lamp holder 8 driving fit mutually.It is the above polycarbonate transparent lampshade that is coated with ultra-violet absorber of 2mm that this lampshade can adopt thickness.
Printed circuit board (PCB) 6 of the present utility model has the pliability bending, be beneficial to itself and fitting tightly of outer cover of lamp holder 8 and make this outer cover of lamp holder 8 directly become a heat abstractor, therefore enlarged area of dissipation, simultaneously, the thickness of the utility model printed circuit board (PCB) 6 is less than 400 μ m, preferable less than 200 μ m, make the transmission of heat more quicken, and then improve the radiating efficiency of led lamp.
For all those skilled in the art, the utility model can be made various modifications and changes significantly and do not broken away from spirit and scope of the present utility model.Therefore, the utility model comprises these modifications and variation, and it all is included in patent application and is equal in the scope of replacement.
Claims (13)
1, a kind of heat dissipation type high LED light-source module is characterized in that comprising:
One printed circuit board (PCB), thickness is less than 400 μ m;
Several high powers, highlighted light emitting diode are arranged on the printed circuit board (PCB) place, and are electrically connected with this printing electroplax with lead.
2, heat dissipation type high LED light-source module according to claim 1 is characterized in that, this printed circuit board (PCB) be can flexural buckling printed circuit board (PCB).
3, heat dissipation type high LED light-source module according to claim 1 is characterized in that, the thickness of this printed circuit board (PCB) is less than 200 μ m.
4, heat dissipation type high LED light-source module according to claim 1 is characterized in that, is provided with the heat-conducting layer of a high heat-conducting medium between this printed circuit board (PCB) and the light emitting diode.
5, heat dissipation type high LED light-source module according to claim 1 is characterized in that, is provided with several metal blocks at the printed circuit board (PCB) place, and this metal blocks is the position that is provided with of this light emitting diode.
6, a kind of light fixture of heat dissipation type high LED light-source module is characterized in that comprising:
One outer cover of lamp holder;
One printed circuit board (PCB) is installed on the inside of this outer cover of lamp holder, and thickness is less than 400 μ m;
The one light emitting diode array as light source is installed in this above printed circuit board (PCB), and is electrically connected with this printed circuit board (PCB) with lead; And
One lampshade, with the driving fit mutually of this outer cover of lamp holder,
Wherein, this printed circuit board (PCB) combines closely with respect to the another side that connects this light emitting diode array and the inboard of this outer cover of lamp holder.
7, the light fixture of heat dissipation type high LED light-source module according to claim 6 is characterized in that, the thickness of this printed circuit board (PCB) is less than 200 μ m.
8, the light fixture of heat dissipation type high LED light-source module according to claim 6 is characterized in that, this printed circuit board (PCB) with respect to the heat-conducting layer that is provided with a high heat-conducting medium between the another side that connects this light emitting diode array and this outer cover of lamp holder.
9, the light fixture of heat dissipation type high LED light-source module according to claim 6 is characterized in that, the inboard profile of this outer cover of lamp holder is irregular circular arc camber.
10, the light fixture of heat dissipation type high LED light-source module according to claim 6 is characterized in that, the inboard profile of this outer cover of lamp holder is a waveform.
11, the light fixture of heat dissipation type high LED light-source module according to claim 6 is characterized in that, the material of this outer cover of lamp holder is a metal material.
12, the light fixture of heat dissipation type high LED light-source module according to claim 6 is characterized in that, the material of this outer cover of lamp holder is high heat conduction or heat radiation material.
13, the light fixture of heat dissipation type high LED light-source module according to claim 6 is characterized in that, this light fixture is a light emitting diode road lamp.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005201220518U CN2844651Y (en) | 2005-09-27 | 2005-09-27 | High-radiant luminescent LED light-source module and light thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2005201220518U CN2844651Y (en) | 2005-09-27 | 2005-09-27 | High-radiant luminescent LED light-source module and light thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2844651Y true CN2844651Y (en) | 2006-12-06 |
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ID=37486601
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2005201220518U Expired - Fee Related CN2844651Y (en) | 2005-09-27 | 2005-09-27 | High-radiant luminescent LED light-source module and light thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2844651Y (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101556032B (en) * | 2008-04-09 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Light emitting diode lamp |
| CN102278663A (en) * | 2011-05-13 | 2011-12-14 | 江苏科凌医疗器械有限公司 | Portable LED (Light-Emitting Diode) shadowless lamp |
| CN102305375A (en) * | 2011-06-30 | 2012-01-04 | 康佳集团股份有限公司 | Direct-down light-emitting diode (LED) module and lamp panels |
-
2005
- 2005-09-27 CN CNU2005201220518U patent/CN2844651Y/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101556032B (en) * | 2008-04-09 | 2010-09-29 | 富准精密工业(深圳)有限公司 | Light emitting diode lamp |
| CN102278663A (en) * | 2011-05-13 | 2011-12-14 | 江苏科凌医疗器械有限公司 | Portable LED (Light-Emitting Diode) shadowless lamp |
| CN102305375A (en) * | 2011-06-30 | 2012-01-04 | 康佳集团股份有限公司 | Direct-down light-emitting diode (LED) module and lamp panels |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20061206 Termination date: 20100927 |