CN100514396C - Plasma display - Google Patents
Plasma display Download PDFInfo
- Publication number
- CN100514396C CN100514396C CNB2005100807149A CN200510080714A CN100514396C CN 100514396 C CN100514396 C CN 100514396C CN B2005100807149 A CNB2005100807149 A CN B2005100807149A CN 200510080714 A CN200510080714 A CN 200510080714A CN 100514396 C CN100514396 C CN 100514396C
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- chip
- packaging body
- teat
- plasma scope
- driving packaging
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Abstract
A plasma display includes plasma display panel, at least one driving chip package unit, backboard, front frame, radiation fin and metal back cover. Said Driving chip package unit is electrically connected with plasma display panel, backboard set rearward of plasma display panel and connected with driving chip package unit, before frame including main unit and backward extented convex part, driving chip package unit and backboard set main unit rearward and convex part, radiation fin Radiation fin set on convex part and contacting with driving chip package unit, metal back cover assembling with before frame, and radiation fin radiation fin contacting with metal back cover to make driving chip package unit generated heat energy transferring to metal back cover, therefore capable of reducing driving chip package unit temperature in operation.
Description
Technical field
The present invention relates to a kind of plasma scope, and be particularly related to a kind of plasma scope that utilizes the metal backing lid to dispel the heat.
Background technology
Along with the modern video development of technology, video-unit is gradually towards trend development such as in light weight, that size is big and panel is thin.Cooperate the flat-panel screens (FlatPanel Display) that photoelectricity and semiconductor fabrication developed, for example LCD (LCD), organic light emitting display (OLED) or plasma scope (PDP) become the main flow of display product gradually.Wherein, plasma scope since its have high brightness, wide view angle, radiationless, image is not affected by magnetic fields and direct plurality of advantages such as receiving digital signals, so it has splendid development potentiality.
When plasma scope in when operation, need utilize a plurality of chip for driving packaging bodies to come the switching of Control current in the addressing side (addressside) of plasma scope.Therefore, the chip for driving packaging body is constantly switching under the open/close situation fast, and its working temperature reaches 60～70 ℃ high temperature nearly.Thus, will make the lost of life of chip for driving packaging body.Therefore, must dispel the heat to the chip for driving packaging body.
Fig. 1 is the partial schematic diagram of known plasma scope.Please refer to Fig. 1, known plasma scope 100 comprises that preceding frame 110, backboard 120, plasma display 130, heat radiator 140 and the back of the body cover 150.Preceding frame 110 has teat 112, and backboard 120 is arranged on the teat 112 of preceding frame 110.Plasma display 130 is arranged on the backboard 120, and plasma display 130 comprises panel body 132 and at least one chip for driving packaging body 134, and wherein panel body 132 is between preceding frame 110 and backboard 120.In addition, chip for driving packaging body 134 is in order to the operation of control panel body 132.
Along with the development of high resolution plasma display, because high resolution plasma display will adopt the mode of single side scan, so the temperature of chip for driving packaging body 134 when operation can be up to 100 ℃.In order to reduce the running temperature of chip for driving packaging body 134, on heat radiator 140, can make a plurality of fins 142, to increase area of dissipation.Yet not only cost is higher for the heat radiator 140 of this kind shape, and also is not easy to be assembled in the known plasma scope 100.
Summary of the invention
In view of this, purpose of the present invention just provides a kind of plasma scope, and it has preferable heat dissipation, to reduce the temperature of chip for driving packaging body when moving.
Based on above-mentioned purpose or other purpose, the present invention proposes a kind of plasma scope, and it comprises plasma display, at least one chip for driving packaging body, backboard, preceding frame, heat radiator and metal backing lid.The chip for driving packaging body is electrically connected with plasma display.Backboard is arranged on the rear of plasma display and is connected with the chip for driving packaging body.Before frame first teat that includes body and extend back, chip for driving packaging body and backboard are arranged on after the body in the side and first teat.Heat radiator is arranged on first teat, and contacts with the chip for driving packaging body.Metal backing lid and preceding frame assembling, and heat radiator covers with metal backing and contacts, and the thermal energy transfer that the chip for driving packaging body is produced covers to metal backing.
According to preferred embodiment of the present invention, above-mentioned backboard can have second teat, and heat radiator is between second teat and first teat.In addition, above-mentioned chip for driving packaging body also can be to be arranged on second teat of backboard.
According to preferred embodiment of the present invention, above-mentioned plasma scope more can have retaining element, and it is fixed to the metal backing lid on first teat with heat radiator.In addition, retaining element for example is a screw.
According to preferred embodiment of the present invention, above-mentioned metal backing lid can have a plurality of louvres.
According to preferred embodiment of the present invention, the material of above-mentioned metal backing lid is aluminium, aluminium alloy or magnesium alloy.
According to preferred embodiment of the present invention, the material of above-mentioned backboard for example is a metal, and metal is aluminium, aluminium alloy or magnesium alloy.
According to preferred embodiment of the present invention, above-mentioned chip for driving packaging body for example be band carry an encapsulating structure (Tape Carrier Package, TCP).
According to preferred embodiment of the present invention, above-mentioned chip for driving packaging body for example be cover brilliant thin-film packing structure (Chip On Film, COF).
According to preferred embodiment of the present invention, above-mentioned plasma scope for example also comprises radiating gasket, is arranged between heat radiator and the metal backing lid.
Based on above-mentioned, the present invention combines the metal backing lid with heat radiator, so the heat energy that the chip for driving packaging body is produced just can cover via fin conductive to metal backing.Thus, can reduce the temperature of chip for driving packaging body when operation effectively, and then improve the task performance of plasma scope.
For above and other objects of the present invention, feature and advantage can be become apparent, the present invention's cited below particularly preferred embodiment, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is the partial schematic diagram of known plasma scope.
Fig. 2 is the partial schematic diagram of the plasma scope of preferred embodiment of the present invention.
Fig. 3 is the partial schematic diagram according to the plasma scope of another preferred embodiment of the present invention.
The main element description of symbols
100: known plasma scope
110,210: preceding frame
112: teat
120,220: backboard
130,232: plasma display
132: the panel body
134,234,322: the chip for driving packaging body
140,240,310: heat radiator
142: fin
150: back of the body lid
200,300: plasma scope
212: body
214: the first teats
222: the second teats
250: the metal backing lid
252: louvre
260,330: radiating gasket
Embodiment
Fig. 2 is the sectional perspective synoptic diagram according to the plasma scope of preferred embodiment of the present invention.Please refer to Fig. 2, this plasma display 200 comprises plasma display 232, at least one chip for driving packaging body 234, backboard 220, preceding frame 210, heat radiator 240 and metal backing lid 250.Wherein, chip for driving packaging body 234 is electrically connected with plasma display 232.This chip for driving packaging body 234 is in order to the operation of control plasma display 232, and chip for driving packaging body 234 can be band year encapsulating structure (TCP) or cover brilliant thin-film packing structure (COF).
Before frame 210 first teat 214 that includes body 212 and extend back, chip for driving packaging body 234 and backboard 220 are arranged on after the body 212 in the side and first teat 214.In addition, the material of preceding frame 210 can be metal or plastics.
In addition, plasma scope 200 for example also comprises radiating gasket 260, and it is arranged between heat radiator 240 and the metal backing lid 250, with the effect of further enhancement heat radiation.
Because the heat energy that chip for driving packaging body 234 is produced can conduct to metal backing lid 250 via heat radiator 240, therefore whole metal backing lid 240 can be considered as the heat radiator of chip for driving packaging body 234, to reduce the temperature of chip for driving packaging body 234 when moving.In other words, compare with known technology, the present invention not only has preferable radiating efficiency, and cost is also lower.Below will lift several experimental datas, in order to the difference of explanation the present invention and known technology.
Table 1
Table 1 is the temperature comparison sheet of the present invention and known technology.As shown in Table 1, approximately between 80 ℃ to 90 ℃, and the temperature of chip for driving packaging body of the present invention when operation is approximately between 73 ℃ to 80 ℃ in the temperature in when operation for the chip for driving packaging body of known technology.Compare with known technology, the temperature of the chip for driving packaging body 234 of present embodiment when operation can reduce by 6.6～13.75 ℃.
Fig. 3 is the partial schematic diagram according to the plasma scope of another preferred embodiment of the present invention.Please refer to Fig. 3, present embodiment is similar to the aforementioned embodiment, and its difference is: because band carries the design that encapsulating structure is to use the deflection circuit board, so chip for driving packaging body 322 does not limit on second teat 222 that is arranged on backboard 220.In other words, chip for driving packaging body 322 is provided with the position and will has bigger degree of freedom in design.
In addition, cooperate the heat radiator 310 of suitable shape to contact, heat energy can be delivered on the metal backing lid 250 from chip for driving packaging body 322 with chip for driving packaging body 322.In a preferred embodiment, plasma scope 300 for example also comprises radiating gasket 330, and it is arranged between heat radiator 240 and the metal backing lid 250, with the effect of further enhancement heat radiation.
In sum, the present invention's plasma scope has following advantage at least:
One, because the heat that produced of chip for driving packaging body can cover via fin conductive to metal backing, so the temperature of chip for driving packaging body when operation can reduce, to prolong the serviceable life of chip for driving packaging body.In addition, cover because the heat that produced of chip for driving packaging body can conduct to metal backing, the chip for driving packaging body that therefore has higher operation usefulness and travelling speed just can be applied among the present invention, with the raising plasma scope display characteristic.
Two, compare with known technology, the present invention need not use complex-shaped heat radiator, and therefore the temperature in the time of can reducing the operation of chip for driving packaging body can reduce cost of manufacture, and reduces the degree of difficulty when assembling.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; any person of ordinary skill in the field; without departing from the spirit and scope of the present invention; when can doing a little change and improvement, so protection scope of the present invention is as the criterion when looking the claim person of defining.
Claims (12)
1. plasma scope is characterized in that comprising:
Plasma display;
At least one chip for driving packaging body is electrically connected with this plasma display panel;
Backboard is arranged on the rear of this plasma display panel and is connected with this chip for driving packaging body;
Before frame, first teat that includes body and extend back, this chip for driving packaging body and this backboard are arranged on after this body in the side and this first teat;
Heat radiator is arranged on this first teat, and contacts with this chip for driving packaging body; And
Metal backing lid, with this preceding frame assembling, and this heat radiator covers with this metal backing and contacts, and the thermal energy transfer that this chip for driving packaging body is produced covers to this metal backing.
2. plasma scope according to claim 1 is characterized in that this backboard has second teat, and this heat radiator is between this second teat and this first teat.
3. plasma scope according to claim 2 is characterized in that this chip for driving packaging body is arranged on this second teat of this backboard.
4. plasma scope according to claim 1 is characterized in that also comprising retaining element, and this metal backing lid is fixed on this first teat with this heat radiator.
5. plasma scope according to claim 4 is characterized in that this retaining element comprises screw.
6. plasma scope according to claim 1 is characterized in that this metal backing lid has a plurality of louvres.
7. plasma scope according to claim 1, the material that it is characterized in that this metal backing lid is aluminium, aluminium alloy or magnesium alloy.
8. plasma scope according to claim 1 is characterized in that the material of this backboard comprises metal.
9. plasma scope according to claim 8 is characterized in that this metal is aluminium, aluminium alloy or magnesium alloy.
10. plasma scope according to claim 1 is characterized in that this chip for driving packaging body comprises that band carries encapsulating structure.
11. plasma scope according to claim 1, it is characterized in that this chip for driving packaging body comprises covers brilliant thin-film packing structure.
12. plasma scope according to claim 1 is characterized in that also comprising radiating gasket, is arranged between this heat radiator and this metal backing lid.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100807149A CN100514396C (en) | 2005-07-05 | 2005-07-05 | Plasma display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005100807149A CN100514396C (en) | 2005-07-05 | 2005-07-05 | Plasma display |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1892735A CN1892735A (en) | 2007-01-10 |
| CN100514396C true CN100514396C (en) | 2009-07-15 |
Family
ID=37597577
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100807149A Expired - Fee Related CN100514396C (en) | 2005-07-05 | 2005-07-05 | Plasma display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100514396C (en) |
-
2005
- 2005-07-05 CN CNB2005100807149A patent/CN100514396C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1892735A (en) | 2007-01-10 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090715 Termination date: 20130705 |