CN100511674C - A side-lighting LED illumination lamp, illuminating method of backlight source and mobile phone - Google Patents
A side-lighting LED illumination lamp, illuminating method of backlight source and mobile phone Download PDFInfo
- Publication number
- CN100511674C CN100511674C CNB2005100221734A CN200510022173A CN100511674C CN 100511674 C CN100511674 C CN 100511674C CN B2005100221734 A CNB2005100221734 A CN B2005100221734A CN 200510022173 A CN200510022173 A CN 200510022173A CN 100511674 C CN100511674 C CN 100511674C
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- 238000005286 illumination Methods 0.000 title claims description 6
- 238000000034 method Methods 0.000 title description 6
- 239000013078 crystal Substances 0.000 claims description 104
- 238000006243 chemical reaction Methods 0.000 claims description 5
- 239000002245 particle Substances 0.000 abstract 6
- 239000004065 semiconductor Substances 0.000 description 5
- 239000000843 powder Substances 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- 230000007812 deficiency Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000007598 dipping method Methods 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 230000000284 resting effect Effects 0.000 description 2
- 241000218202 Coptis Species 0.000 description 1
- 235000002991 Coptis groenlandica Nutrition 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000008186 active pharmaceutical agent Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 230000001934 delay Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 230000036632 reaction speed Effects 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
Abstract
Description
Claims (6)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100221734A CN100511674C (en) | 2005-11-25 | 2005-11-25 | A side-lighting LED illumination lamp, illuminating method of backlight source and mobile phone |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2005100221734A CN100511674C (en) | 2005-11-25 | 2005-11-25 | A side-lighting LED illumination lamp, illuminating method of backlight source and mobile phone |
Publications (2)
Publication Number | Publication Date |
---|---|
CN1971907A CN1971907A (en) | 2007-05-30 |
CN100511674C true CN100511674C (en) | 2009-07-08 |
Family
ID=38112618
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2005100221734A Active CN100511674C (en) | 2005-11-25 | 2005-11-25 | A side-lighting LED illumination lamp, illuminating method of backlight source and mobile phone |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN100511674C (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE102011103786A1 (en) | 2011-06-09 | 2012-12-13 | Osram Opto Semiconductors Gmbh | Optoelectronic semiconductor chip, display with such a semiconductor chip and use of such a semiconductor chip or a display |
CN105782821A (en) * | 2016-04-29 | 2016-07-20 | 京东方科技集团股份有限公司 | LED (Light-Emitting diode), backlight module and display device |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5837995A (en) * | 1996-11-25 | 1998-11-17 | Alan Y. Chow | Wavelength-controllable voltage-phase photodiode optoelectronic switch ("opsistor") |
CN1399347A (en) * | 2002-08-04 | 2003-02-26 | 叶关荣 | Long-life integrated LED device |
CN1458700A (en) * | 2002-05-13 | 2003-11-26 | 诠兴开发科技股份有限公司 | Purple red light-emitting diode |
-
2005
- 2005-11-25 CN CNB2005100221734A patent/CN100511674C/en active Active
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5837995A (en) * | 1996-11-25 | 1998-11-17 | Alan Y. Chow | Wavelength-controllable voltage-phase photodiode optoelectronic switch ("opsistor") |
CN1458700A (en) * | 2002-05-13 | 2003-11-26 | 诠兴开发科技股份有限公司 | Purple red light-emitting diode |
CN1399347A (en) * | 2002-08-04 | 2003-02-26 | 叶关荣 | Long-life integrated LED device |
Also Published As
Publication number | Publication date |
---|---|
CN1971907A (en) | 2007-05-30 |
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Legal Events
Date | Code | Title | Description |
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C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160830 Address after: 516083 Guangdong city of Huizhou province Dayawan xiangshuihe Patentee after: HUIZHOU BYD INDUSTRIAL Co.,Ltd. Address before: Kwai Chung town Yanan Road, BYD Industrial Park in Longgang District of Shenzhen City, Guangdong province 518119 Patentee before: BYD Co.,Ltd. |
|
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20191125 Address after: 518119 No.1 Yan'an Road, Kuiyong, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. Address before: 516083 Guangdong city of Huizhou province Dayawan xiangshuihe Patentee before: HUIZHOU BYD INDUSTRIAL Co.,Ltd. |
|
CP01 | Change in the name or title of a patent holder | ||
CP01 | Change in the name or title of a patent holder |
Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: BYD Semiconductor Co.,Ltd. |
|
CP03 | Change of name, title or address | ||
CP03 | Change of name, title or address |
Address after: 518119 No.1 Yan'an Road, Kuiyong street, Dapeng New District, Shenzhen City, Guangdong Province Patentee after: BYD Semiconductor Co.,Ltd. Address before: 518119 No.1 Yan'an Road, Kwai Chung street, Dapeng New District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN BYD MICROELECTRONICS Co.,Ltd. |