CN100505147C - Pressure equalizing device for micro nano transfer printing - Google Patents

Pressure equalizing device for micro nano transfer printing Download PDF

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Publication number
CN100505147C
CN100505147C CNB2005100699534A CN200510069953A CN100505147C CN 100505147 C CN100505147 C CN 100505147C CN B2005100699534 A CNB2005100699534 A CN B2005100699534A CN 200510069953 A CN200510069953 A CN 200510069953A CN 100505147 C CN100505147 C CN 100505147C
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China
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pressure
transfer printing
mould
keeper
equalizing device
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CN1858896A (en
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陈守仁
陈钏锋
何侑伦
巫震华
王维汉
陈来胜
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Industrial Technology Research Institute ITRI
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Industrial Technology Research Institute ITRI
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Abstract

This invention relates to a uniform pressure device used in micro-nanometer transfer including: a keeping unit adjacent to the uniform pressure unit, a uniform pressure unit contacted with said base board or said die and a loading piece for transferring to figuration, which can overcome shortcomings of non-uniform pressure, partial torsion and distortion of the nanometer structure, centralized stress and difficulty in manufacture and assembly.

Description

The pressure-equalizing device that is used for micro nano transfer printing
Technical field
The invention relates to a kind of pressure-equalizing device, particularly the pressure-equalizing device of using about a kind of micro nano transfer printing.
Background technology
In the conventional semiconductors processing procedure, mostly little shadow (Lithography) processing procedure is to adopt photolithography techniques, and with required conductive trace (Trace) on this technology formation chip or the substrate, but the method is owing to be subjected to the restriction of the light source diffraction limit, therefore realize when the processing live width is difficult to the utilization photolithography when 100 nanometers are following, the development of generation line on live width is restricted.Though someone proposes little shadow technology of future generation (Next-generation lithography), there are problems such as equipment cost height and production capacity be low in this technology.Therefore, little shadow technology (the Nanoimprint Lithography of the nanometer transfer printing that development in recent years goes out, NIL) owing to can break through the limit of live width, and have little shadow resolution height, characteristic such as manufacturing speed is fast and production cost is low, become the most popular now little shadow process technology.
In the field of nanometer transfer technique, it is current technology main flow that hot forming and ultraviolet light photopolymerization are shaped.The hot forming technology is to utilize high temperature, high pressure that mould pattern is transferred to the substrate that is coated with such as macromolecular material, and the ultraviolet light photopolymerization technology then is with UV-irradiation the micro-structural sclerosis to be shaped at normal temperatures and pressures.Yet these two kinds of technology have identical requirement for quality, and that is that transfer pressure must evenly could obtain good transfer printing shaping quality like this.
As shown in Figure 6A, if transfer pressure is inhomogeneous, the transfer printing degree of depth that will cause mould 21 to be applied on the nanostructure 23 differs, and can cause this nanostructure 23 to produce the phenomenon of local torsion's distortion; And for example shown in Fig. 6 B, when the depth of parallelism of 25 of mould 21 and substrates was not good, the nanostructure 23 in the transfer area can present heeling condition, significantly reduces the transfer printing quality.Simultaneously, be example with the hot forming technology, shown in Fig. 7 A, when carrying out transfer printing, it is to utilize the mould 21 that is fixed on cope match-plate pattern 20 in the micro nano transfer printing equipment and has nanostructure 23, and this mould 21 is connected with the driver element 50 of drive power source, moves to the substrate 25 that is fixed on lower bolster 30.But, this existing pressing structure is assembled by many mechanical product storehouses, and should be all rigid body by the machinery product, can't make mould, substrate and bolster reach driving fit completely, so the imprint result shown in Fig. 7 B shows that pressure distribution is quite inhomogeneous.Therefore, the structure of this strength transmission also is difficult to realize evenly exerting pressure, and causes final shaping bad.
For improving the above-mentioned uneven problem of exerting pressure, people such as Puscasu proposed the document of " Comparison of infrared frequency selective surfaces fabricated bydirect-write electron-beam and bilayer nanoimprint lithographies " on December 11st, 2000.As shown in Figure 8, it is respectively to insert plastic gasket 27,29 in upper and lower template 20,30 between mould 21 or 25 of substrates, when being heated to imprint temperature, and the deliquescing of just can being heated of this plastic gasket 27,29.Therefore, when carrying out transfer printing, this plastic gasket 27,29 can make comparatively driving fit between this upper and lower template 20,30 and this mould, the substrate, reaches the function of evenly exerting pressure.
Because this technology has the precision of nano-scale, therefore certainly will be more stricter in the quality control of transfer process than general hot forming processing procedure, yet this plastic gasket material can cause a large amount of flow deformation when being heated pressurized, can have influence on the transmission of force of impression.
In addition, the displacement mechanism that a transfer printing is shaped is proposed in the Japan Patent 2003-077867 case.As shown in Figure 9, this displacement mechanism is to utilize the fulcrum supporting way, make substrate 25 can be on fulcrum 12 motion freely, and by the two ends of elastic parts 14 these substrates 25 of carrying; Whereby, when mould 21 these substrates 25 of contact, the depth of parallelism that this substrate automatic adjustment of 25 meetings and this mould are 21 reaches the function of evenly exerting pressure.But the device of using this displacement mechanism only is fit to the impression of small size, and not only output is lower, and easily causes base plate deformation when the impression large tracts of land, and substrate is serious more from fulcrum distortion more at a distance.Simultaneously, when force of impression is excessive, causes fulcrum location to cause stress to be concentrated easily and damage, also be difficult to reach the requirement of evenly exerting pressure because of single-point supports.Therefore, though this prior art has the function of evenly exerting pressure, but still be subject to the size that impresses size and force of impression.
A kind of even device for exerting that is used for the nanometer transfer printing is also proposed in United States Patent (USP) the 2004219249th A1 case.As shown in figure 10, this even device for exerting is to utilize the unit 40 of evenly exerting pressure, this unit 40 of evenly exerting pressure comprises elastomeric material sealing adventitia 40a and is filled in the fluid 40b of this elastomeric material sealing adventitia 40a inside, fluid 40b in this sealing adventitia 40a has the character that each point pressure equates, the effect of even power transmission just can be provided, reach the purpose of evenly exerting pressure.
Yet, though this device does not have the above-mentioned prior art inequality of exerting pressure, the distortion of nanostructure local torsion, limited and the stress of output such as concentrates at problem, but this device is to carry out mould holding by part, functions such as heating and cooling, this unit 40 of evenly exerting pressure is not directly put on mould that is shaped or substrate, must pass through such as outer cover, heating, cooling unit, the combination of parts such as load bearing unit could be with strength transmission to the district that is shaped, like this, evenly the transmission of strength can be subjected to piece surface engineering properties (surface roughness for example, the depth of parallelism, machining accuracy) influence.
In other words, use the machine error of necessary accurate each part of control of this method, just can keep the depth of parallelism between mould and substrate, compare difficulty so not only make to go up, and the requirement of assembly precision is also higher.Simultaneously, because the unit 40 of evenly exerting pressure of this prior art is not directly put on mould or substrate, it is by a plurality of part carryings, except causing the problem on making and assembling, also makes the structure more complicated of device, causes manufacturing cost higher.
In sum, the transfer pressure of above-mentioned prior art in transfer process is uneven not to have caused variety of issue with the depth of parallelism is good, and more because of making and the restriction of assembling, difficulty satisfies business demand.Therefore, how to make in the transfer area each point pressure homogeneous phase etc., keep the excellent depth of parallelism between mould and substrate and reduce to minimum to the influence of the depth of parallelism the surperficial engineering properties of other part, so that can transmit uniform transfer printing pressure, obviously be current urgency problem to be solved.
Summary of the invention
For overcoming the shortcoming of above-mentioned prior art, main purpose of the present invention is to provide a kind of pressure-equalizing device that is used for micro nano transfer printing that can simplified structure when evenly transmitting transfer pressure.
Another object of the present invention is to provide a kind of pressure-equalizing device that is used for micro nano transfer printing that reduces installation cost.
A further object of the present invention is to provide a kind of pressure-equalizing device that is used for micro nano transfer printing that can once finish the large tracts of land transfer printing, can improve output.
Another purpose of the present invention is to provide a kind of pressure-equalizing device that is used for micro nano transfer printing that can be applicable to different transfer printing shaping processing procedures, has improved industrial utilization.
For reaching above-mentioned and other purpose, the invention provides a kind of pressure-equalizing device that is used for micro nano transfer printing, this pressure-equalizing device that is used for micro nano transfer printing provides uniform transfer printing pressure for the moulding material layer between substrate and mould, the pressure-equalizing device that is used for micro nano transfer printing comprises at least: keeper is adjacent with equal casting die; All casting die directly contacts this substrate or this mould and load bearing unit, and carrying is provided, and carries out transfer printing and is shaped.
This keeper can be located at this mould top or mould below, and is to be provided with the structure that accommodation space and an end are formed with opening, for ccontaining this equal casting die.This keeper can also be the structure that two ends all are formed with opening, wherein, a this keeper wherein end opening place connects and establishes this mould, other end opening part then is provided with a pressure plate, form accommodation space for ccontaining equal casting die, and can connect by this pressure plate and establish driver element, when this driver element is subjected to the downward feeding of drive power source, make the feeding downwards simultaneously of the equal casting die of this keeper and this, mould contacts and sets up suitable pressure fully with single substrate or continuity substrate, directly presses on this mould by the equal casting die that remains in this keeper.
The fluid that this equal casting die comprises elastic membrane and is filled in this elastic membrane inside.Wherein, this elastic membrane is the structure of being made by the material that can bear high pressure and sealing.A joint portion then can be selected to form in this elastic membrane outside, and a kind of in the group can be formed by cohesive structure, joint type structure and metal latch fixing structure in this joint portion.
This load bearing unit is used to carry this substrate.Wherein, these load bearing unit both sides are provided with transmission component respectively, and this substrate of transmission carries out the continuity transfer printing and is shaped.This transmission component can be a roller.This load bearing unit can for example be the energy delivery part and be provided with at least one energy source in inside, transfers energy to this moulding material layer, this moulding material layer is carried out transfer printing be shaped.
The pressure-equalizing device of micro nano transfer printing that is used for of the present invention is for being installed in the pressure plate that connects driver element, for the moulding material layer between substrate and mould provides uniform transfer printing pressure, the pressure-equalizing device that the present invention is used for micro nano transfer printing comprises at least: elastic membrane, be connected this pressure plate, directly contact this substrate or this mould; Fluid is filled in the inside and the load bearing unit of this elastic membrane, and carrying is provided, and carries out transfer printing and is shaped.
This elastic membrane is the structure made by the material that can bear high pressure and sealing.This load bearing unit is used to carry this substrate.Wherein, load bearing unit is the energy delivery part, and is provided with at least one energy source in inside, transfers energy to this moulding material layer, it is carried out transfer printing be shaped.
Compared with prior art, the present invention can provide direct contact substrate or mould, and the transfer pressure of Chuan Diing makes the nanostructure of mould can evenly be pressed in the formable material layer when transfer printing equably; In addition, because each point pressure homogeneous phase etc. in the transfer area,, improve the shaping quality of nanometer transfer printing so can keep the excellent depth of parallelism between mould and substrate.Simultaneously, what no matter use is single substrate or continuity substrate, all can use pressure-equalizing device of the present invention.Therefore, the present invention not only is fit to large-area impression, more can impress continuously.
The present invention uses equal casting die that even transfer printing power is provided in transfer process, significantly improve the shaping quality of transfer printing, and use the structure of simplifying to solve manufacturing and the packing problem that machine error causes in the prior art, not only make interior each point pressure homogeneous phase of transfer area etc., keep the excellent depth of parallelism between mould and substrate, and the surperficial engineering properties of part is reduced to minimum to the influence of the depth of parallelism, and and can carry out large tracts of land and successional impression, have more market competition advantage.So, pressure-equalizing device of the present invention can solve the inequality of exerting pressure in the prior art, the distortion of nanostructure local torsion, output is limited, stress is concentrated and various shortcoming such as manufacturing and assembling difficulty, simplified the structure of device, reduce installation cost, can be applicable on the transfer device of different configurations, help improving the industrial utilization of device.
Description of drawings
Figure 1A to Fig. 1 C is the schematic diagram of the embodiment of the invention 1, wherein:
Figure 1A is the schematic diagram that is applied in pressure-equalizing device in the transfer device of transfer printing nanoscale structures;
Figure 1B is that this equal casting die is attached to driver element to be fixed on the schematic diagram in this keeper;
Fig. 1 C is the schematic diagram with the pressure-sensitive paper imprint result;
Fig. 2 is the schematic diagram of the embodiment of the invention 2;
Fig. 3 is the schematic diagram of the embodiment of the invention 3;
Fig. 4 is the schematic diagram of the embodiment of the invention 4;
Fig. 5 is the schematic diagram of the embodiment of the invention 5;
Fig. 6 A and Fig. 6 B are the uneven schematic diagrames of transfer pressure in the prior art, wherein:
The transfer printing degree of depth that shows Fig. 6 A differs and causes nanostructure to produce the phenomenon of bird caging distortion;
Fig. 6 B is the not good phenomenon that causes the nanostructure heeling condition in the transfer area of the depth of parallelism between mould and substrate;
Fig. 7 A is the schematic diagram of the pressing structure of another prior art;
Fig. 7 B is the schematic diagram of prior art with the pressure-sensitive paper imprint result;
Fig. 8 is that people such as Puscasu propose all to be press-fitted in the document schematic diagram of putting;
Fig. 9 is the schematic diagram of Japan Patent 2003-077867 case; And
Figure 10 is the schematic diagram of the even device for exerting of United States Patent (USP) 2004219249 A1 cases.
Embodiment
The pressure-equalizing device that is used for micro nano transfer printing of the present invention is applied in the transfer device of transfer printing nanoscale structures, and it provides uniform transfer printing pressure to the moulding material layer between substrate and mould.Following examples are that example describes but is not as limit can make such as feature structural dimension parameter at the pressure-equalizing device below 100 microns, because existing nanostructure, mould, moulding material layer and substrate etc. all are applicable objects, its structure does not change, so only show and the structure of direct correlation of the present invention that in the accompanying drawings remainder then slightly removes.
Embodiment 1
Figure 1A to Fig. 1 C draws according to the embodiment 1 that is used for the pressure-equalizing device of micro nano transfer printing of the present invention.
Shown in Figure 1A, the pressure-equalizing device that is used for micro nano transfer printing 1 of present embodiment 1 comprises at least: load bearing unit 9, keeper 11 and equal casting die 13.This load bearing unit 9 provides carrying to carry out the transfer printing shaping.This keeper 11 can be located at mould top or mould below, and is adjacent with equal casting die 13, is the structure that an end forms opening, and has accommodation space 111 that this 13 of equal casting die is arranged in this accommodation space 111.The fluid 133 that this equal casting die 13 comprises elastic membrane 131 and is filled in these elastic membrane 131 inside, this elastic membrane 131 is made by the material that can bear high pressure and sealing, and 133 of this fluids are to be made of the liquid with each point pressure equality matter, gas or other equivalent substance.Wherein, this fluid 133 for example can utilize pascal's principle (Pascal ' sprinciple), provide the effect of even strength transmission reaches the purpose of evenly exerting pressure.
Shown in Figure 1B, can this keeper 11 be passed in this joint portion 1311 be attached to driver element 3 for example in these elastic membrane 131 outside joint portions 1311 that form, this equal casting die 13 is fixed in this keeper 11; Certainly, the cohesive structure that also can to make this joint portion 1311 in other embodiments are adhesion coatings, rather than joint type structure utilize the opening bottom surface of bonding this joint portion 1311 to this keeper 11, should be fixed in this keeper 11 by equal casting die 13.In other words, the structure that this equal casting die 13 can be fixed on this keeper 11 is not to exceed so that present embodiment is described, and different variations can be arranged.
In present embodiment 1, the mould 5 that transfer printing is used is located on the substrate 7, and as prior art, the surface coated that this substrate 7 contacts with this mould 5 is the formable material layer 71 of high molecular polymer for example, and can be by load bearing unit 9 these substrates 7 of carrying that transmit energy module.Can select to comprise two energy sources (not marking) as the load bearing unit 9 that transmits energy module, for example be respectively ultraviolet source and heating source, uses required energy source as required.It should be noted,, also can carry this substrate 7 by load bearing unit with other suitable function though be to carry these substrates 7 as the load bearing unit 9 that transmits energy module in the present embodiment by this.
Unlike the prior art be that the below of this equal casting die 13 need not be provided with other load bearing unit again, and can directly contact this mould 5.When this driver element 3 is subjected to the downward feeding of driving of power source (not marking), this keeper 11 and this equal casting die 13 feeding downwards simultaneously, contact and set up suitable pressure fully with formable material layer 71 to mould 5, directly press on this mould 5 by the equal casting die 13 that remains in this keeper 11.
Shown in Fig. 1 C, use the pressure-sensitive paper that this pressure-equalizing device 1 impresses out and can find out significantly that the colour developing of whole imprinting area is quite even, (shown in Fig. 7 B) compares with prior art, the uniformity of the present invention when significantly improvement equipment is exerted pressure.
Therefore, the design of this pressure-equalizing device 1 need not must be considered the restriction of machine error as prior art.The present invention directly transmits transfer pressure in the district that is shaped, so can transmit pressure with the even structure ground of simplifying, makes transfer pressure this mould 5 of exerting pressure equably.Like this, the unit of just can avoiding exerting pressure in the prior art connects the bang path that is located at transfer pressure, makes the transmission of strength be subjected to the influence of piece surface engineering properties.So the present invention can provide uniform transfer printing pressure.
Will be appreciated that, be apply high pressure and (or) the normal pressure power source that carries out even transfer printing all can use the present invention.When for example carrying out the ultraviolet light photopolymerization processing procedure, make to produce behind the suitable pressure just feed-disabling immediately between this mould 5 and this moulding material layer 71, and maintain packing stage; When for example carrying out the hot forming processing procedure, then equally can be after producing the suitable pressure pressure of ultraviolet light photopolymerization processing procedure (normally greater than) between this mould 5 and this moulding material layer 71 just feed-disabling immediately, and maintain packing stage.In other words, be that the normal temperature and pressure process conditions of ultraviolet light photopolymerization processing procedure utilization or the HTHP process conditions of hot forming processing procedure utilization all can be used pressure-equalizing device of the present invention, and be not as limit.Simultaneously, the fixed structure (being joint portion 1311) that this keeper 11 and this equal casting die are 13 is applied metal lock solid structure (not marking) for example also, rather than exceeds with joint type structure or the adhesion coating described in the present embodiment.
Problems such as the distortion of the inequality of exerting pressure of the prior art, nanostructure local torsion, output is limited, stress is concentrated, machine error, manufacturing difficulty, assembly precision requirement height, apparatus structure complexity and manufacturing cost height, all by equal casting die transfer pressure being directly delivered to Mould design is in the present invention solved, when transmitting even transfer pressure, reached the effect of simplified structure.
Simultaneously, because the pressure-equalizing device that is used for micro nano transfer printing of the present invention is by equal casting die transfer pressure to be directly delivered to mould, can omit in the prior art by strength transmission being distinguished required number of spare parts to being shaped such as parts such as outer cover, heating, cooling unit, load bearing units, except the problem on not having manufacturing and assembling, also make structure more simplify, reduced installation cost.
In addition, the present invention not only can be applicable to the impression of small size, since impression during large tracts of land the present invention do not have base plate deformation, fulcrum location stress and problem such as concentrate, so can be used for once finishing the pressure-equalizing device of the micro nano transfer printing of large tracts of land transfer printing, help the raising of output.
Because the pressure-equalizing device that is used for micro nano transfer printing of the present invention can be applicable to different transfer printing shaping processing procedures, make the present invention can adopt the structure of simplification and have the function of different transfer printing processing procedures concurrently, improved industrial utilization.
Can when transmitting uniform transfer printing pressure, reach the effect of simplified structure so use the present invention, solve the variety of problems that prior art causes, more can reduce installation cost, improve output.
Embodiment 2
Fig. 2 is that the embodiment 2 that is used for the pressure-equalizing device of micro nano transfer printing according to the present invention draws.Wherein, the assembly identical or approximate with embodiment 1 is identical or approximate symbolic representation, and omits and be described in detail.
Embodiment 2 is with the difference of embodiment 1 maximum, the pressure-equalizing device that is used for micro nano transfer printing 1 of embodiment 1 connects and is located at driver element 3 times, the equal casting die 13 of this pressure-equalizing device 1 is directly to contact mould 5,2 of embodiment are located at substrate 7 times with this pressure-equalizing device 1, this load bearing unit 9 is located at the top of this mould 5, makes the equal casting die 13 of this pressure-equalizing device 1 directly contact this substrate 7.
As shown in Figure 2, the equal casting die 13 that present embodiment 2 is used for the pressure-equalizing device 1 of micro nano transfer printing places keeper 11 inside, and be used to carry the substrate 7 and mould 5 that has been coated with formable material layer 71,3 of driver elements connect load bearing unit 9 and drive and feed downwardly into this mould 5 and contact fully with this formable material layer 71 and set up suitable pressure, and even transfer pressure is provided in transfer process.
In embodiment 1 these load bearing unit 9 these substrates 7 of carrying, at 2 pressure-equalizing device 1 these substrates 7 of carrying that can be used for micro nano transfer printing of embodiment by this, the load bearing unit 9 that is connected with this driver element 3 can be the bearing assembly such as board, need not to limit the position that is provided with, and can obtain the quality of the even transfer printing shown in Fig. 1 C equally such as transmitting energy module.
Certainly, the position is set also can exchanges of this mould 5 and this substrate 7, as long as transfer pressure can be delivered to this moulding material layer 71, this moulding material layer 71 is carried out the structure that transfer printing is shaped all be applicable to the present invention, and belong to that technical staff in the art thinks and variation.
Therefore, no matter of the present invention pressure-equalizing device 1 utilize this equal casting die 13 directly to contact mould 5 or substrate 7, all can evenly transmit transfer pressure, and keep the depth of parallelism of 7 on this mould 5 and this substrate in the transfer process, effectively improves the shaping quality of nanometer transfer printing.
Embodiment 3
Fig. 3 be the pressure-equalizing device 1 that is used for micro nano transfer printing according to the present invention ' embodiment 3 draw.Wherein, same as the previously described embodiments or approximate assembly is to represent with identical or approximate element numbers, and omits detailed narration.
Embodiment 3 is with the maximum difference of the foregoing description, embodiment 3 be with mould 5 connect be set to this pressure-equalizing device 1 ' keeper 11 '.
As shown in Figure 3, this keeper 11 ' be the structure that two ends all are formed with opening, present embodiment 3 are equal casting die 13 is placed this keeper 11 ' inside and to be connected with pressure plate 9 " that are located at these keeper 11 ' one ends, and this pressure plate 9 " then connect and establish driver element 3.Mould 5 one side joints are set to this keeper 11 ' away from the other end opening part that connects this pressure plate 9 " one end.Such as the continuity substrate 7 of banded sheet material ' then carried, transmission component 101 " such as conveyer belt or roller wherein can be set, this substrate 7 of transmission ' carry out the continuity transfer printing to be shaped respectively in these load bearing unit 9 both sides by load bearing unit 9.
Like this, when this driver element 3 of drive power source, just can be with this pressure plate 9 ", all casting die 13, keeper 11 ' and mould 5 feedings downwards simultaneously, the suitable pressure of this mould 5 and this substrate 7 ' contact fully and set up, directly press on this mould 5 by this equal casting die 13, thereby uniform transfer printing pressure is provided.After transfer printing is finished, then can by this transmission component 101 " drive this substrate 7 ', and the transfer printing processing procedure of lasting next stage.
This load bearing unit 9 also can be the energy delivery part simultaneously, and is provided with for example two energy sources in inside, transfers energy to this moulding material layer, this moulding material layer is carried out transfer printing be shaped.
Embodiment 4
Fig. 4 be the pressure-equalizing device 1 that is used for micro nano transfer printing according to the present invention ' embodiment 4 draw.Wherein, same as the previously described embodiments or approximate assembly is to represent with identical or approximate element numbers, and omits detailed narration.
Embodiment 4 is with the maximum difference of the foregoing description, embodiment 4 be with equal casting die 13 ' fluid 133 be filled in the accommodation space 111 of this keeper 11, this equal casting die 13 ' elastic membrane 131 ' then be arranged on the opening part of this keeper 11, this fluid 133 is sealed in this keeper 11.
As shown in Figure 4, identical with embodiment 1 is that this keeper 11 also is the structure that an end is formed with opening, and has this accommodation space 111; But as different from Example 1, the elastic membrane 131 that this equal casting die 13 ' comprise seals these keeper 11 openings ' and the fluid 133 that is filled in these accommodation space 111 inside, and this keeper 11 has the function as embodiment 3 pressure plate 9 " concurrently, can connect driver element 3 and keep this equal casting die 13 '.Certainly, this elastic membrane 131 also can be selected the structure made by the material that can bear high pressure and sealing, and 133 of this fluids can be liquid, gas or other equivalent substance with each point pressure equality matter.
Like this, when this driver element 3 is subjected to the downward feeding of drive power source, this pressure-equalizing device 1 ' promptly feed downwardly into mould 5 to contact and set up suitable pressure fully with formable material layer 71.At this moment, can directly press on this mould 5 by this elastic membrane 131.
In addition, as embodiment 1, it also can be by load bearing unit 9 these substrates 7 of carrying.Wherein, this load bearing unit 9 can certainly be general bearing assembly as embodiment 1 as transmitting energy module.
Embodiment 5
Fig. 5 is that the embodiment 5 that is used for the pressure-equalizing device of micro nano transfer printing according to the present invention draws.Wherein, same as the previously described embodiments or approximate assembly is to represent with identical or approximate element numbers, and omits detailed narration.
Embodiment 5 is that with the maximum difference of the foregoing description embodiment 5 has omitted the keeper that has accommodation space originally, equal casting die 13 directly is attached to pressure plate 9 " that connect driver element 3.In other words, the pressure-equalizing device of present embodiment is this equal casting die 13.
As shown in Figure 5, identically with embodiment 1 to embodiment 3 be the fluid 133 that this equal casting die 13 comprises elastic membrane 131 and is filled in these elastic membrane 131 inside; But this equal casting die 13 is to be connected to this pressure plate 9 ", and this pressure plate 9 " then connect and are set to driver element 3.Wherein, can as above-mentioned embodiment, be provided with the joint portion between this pressure plate 9 " and this equal casting die 13, and also can to select for example be metal latch fixing structure, joint type structure, adhesion coating or other equivalent fixed structure in this joint portion.
Certainly, as embodiment 1 and embodiment 4, it also can be by load bearing unit 9 these substrates 7 of carrying, and this load bearing unit 9 also can be as embodiment 1 as transmitting energy module or can be as embodiment 2 as simple board, and for example also can be with the location swap of mould 5 and substrate 7 in embodiment 5; In other words, each assembly in the foregoing description can be changed or be replaced according to the actual requirements, but not exceeds with described in the embodiment.
Because this equal casting die 13 can keep it that bang path that driver can not departed from position is set by this pressure plate 9 ", so when this driver element 3 is subjected to the downward feeding of drive power source, this pressure plate 9 " feed downwardly into mould 5 simultaneously with this equal casting die 13 and contact fully with formable material layer 71, and set up suitable pressure.Like this, just, can directly press on this mould 5 by this equal casting die 13.
Hence one can see that, with must compare by strength transmission being distinguished to being shaped in the prior art such as parts such as outer cover, heating, cooling unit, load bearing unit combinations, the pressure-equalizing device that the present invention is used for micro nano transfer printing can minimize required number of spare parts, when transmitting uniform transfer printing pressure, reach the effect of simplified structure, and can make installation cost more reduce.
Simultaneously, no matter be embodiment 1 with embodiment 2 in single substrate or the continuity substrate among the embodiment 3, all can use pressure-equalizing device of the present invention, so the present invention not only is fit to large-area impression as can be known, more can carry out continuous impression.Therefore, use the present invention and can once finish the large tracts of land transfer printing, improve output.
In addition, design of the present invention can be satisfied ultraviolet light photopolymerization shaping processing procedure and the required process conditions of hot forming processing procedure at least, except the needs that meet different processing procedures, also can be used for according to structural adjustment the present invention of transfer device micro nano transfer printing pressure-equalizing device the position is set, more can exchange the position that is oppositely arranged of substrate and mould flexibly, and this variation there is no difficulty.So the user can use the present invention according to actual demand, the present invention has more flexibility than prior art, has more market competition advantage.
In sum, the invention provides and directly apply the pressure-equalizing device of transfer pressure to mould, can when transmitting uniform transfer printing pressure, reach the effect of simplified structure, and can reduce installation cost and improve output, and can be applicable on the transfer device of different configurations.So the present invention can solve the various shortcoming of prior art, and the present invention has design flexibility, and can effectively improve industrial utilization.

Claims (20)

1. a pressure-equalizing device that is used for micro nano transfer printing provides uniform transfer printing pressure to the moulding material layer between substrate and mould, it is characterized in that this device comprises at least:
Driver element;
Keeper connects this driver element, and this keeper has an accommodation space, and an end is formed with the structure of opening;
All casting die is adjacent with this keeper, comprises a sealing elastomeric membrane and the filling fluid in this elastic membrane inside, for directly contacting this substrate or this mould; And
Load bearing unit is used to provide this mould of carrying or this substrate to carry out transfer printing and is shaped;
Wherein, when this driver element is driven and during feeding downwards, make this keeper and the downward feeding of this equal casting die, contact and set up suitable pressure fully with this moulding material layer to this mould, by directly apply pressure to this mould or this substrate by the equal casting die that this keeper kept.
2. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 1 is characterized in that this keeper is located at the top of mould.
3. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 1, it is characterized in that, this elastic membrane is by the made structure of the material that can bear high pressure and sealing, the outside joint portion that forms of this elastic membrane, this joint portion are to be selected from cohesive structure, joint type structure or metal latch fixing structure to form a kind of in the group.
4. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 1 is characterized in that, this load bearing unit is the energy delivery part and is provided with at least one energy source in inside, transfers energy to this moulding material layer, this moulding material layer is carried out transfer printing be shaped.
5. a pressure-equalizing device that is used for micro nano transfer printing provides uniform transfer printing pressure to the moulding material layer between substrate and mould, it is characterized in that this device comprises at least:
Driver element;
Pressure plate is arranged in this driver element;
Keeper is adjacent with this driver element;
All casting die is adjacent with this keeper, and an end connects this pressure plate, comprises a sealing elastomeric membrane and the filling fluid in this elastic membrane inside, for directly contacting this mould; And
Load bearing unit is used to provide this substrate of carrying to carry out transfer printing and is shaped;
Wherein, when this driver element is driven and during feeding downwards, make this keeper, this pressure plate, with the downward feeding of this equal casting die, contact and set up suitable pressure fully with this moulding material layer to this mould, by directly apply pressure to this mould by the equal casting die that this keeper kept.
6. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 5 is characterized in that these keeper two ends all are formed with the structure of opening.
7. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 6 is characterized in that, this a keeper wherein end opening connects and establishes this mould, and other end opening part then is provided with this pressure plate, to form an accommodation space for ccontaining this equal casting die.
8. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 5 is characterized in that, this elastic membrane is by the made structure of the material that can bear high pressure and sealing.
9. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 5 is characterized in that, these load bearing unit both sides are provided with transmission component respectively, is used for this substrate of transmission, and wherein, this transmission component is conveyer belt or roller.
10. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 5 is characterized in that, this load bearing unit is the energy delivery part and is provided with at least one energy source in inside, transfers energy to this moulding material layer, this moulding material layer is carried out transfer printing be shaped.
11. a pressure-equalizing device that is used for micro nano transfer printing provides uniform transfer printing pressure to the moulding material layer between substrate and mould, it is characterized in that this device comprises at least:
Driver element;
Keeper, adjacent with this driver element, have an accommodation space, an end is formed with the structure of opening;
All casting die comprises filling in the fluid of this accommodation space and the elastic membrane of sealing this opening, for directly contacting this substrate or this mould; And
Load bearing unit is shaped to provide this mould of carrying or this substrate to carry out transfer printing;
Wherein, when this driver element is driven and during feeding downwards, makes this keeper and the downward feeding of this equal casting die, contact and set up suitable pressure fully to this mould and this moulding material layer, directly apply pressure to this mould or this substrate by the equal casting die in this keeper.
12. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 11 is characterized in that this keeper is located at the top of mould.
13. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 11 is characterized in that, this elastic membrane is the structure of being made by the material that can bear high pressure and sealing.
14. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 11, it is characterized in that, this load bearing unit is an energy delivery part and is provided with at least one energy source in inside, transfers energy to this moulding material layer, this moulding material layer is carried out transfer printing be shaped.
15. a pressure-equalizing device that is used for micro nano transfer printing provides uniform transfer printing pressure to the moulding material layer between substrate and mould, it is characterized in that this device comprises at least:
Driver element;
Load bearing unit connects this driver element;
All casting die is used to carry this mould or this substrate, comprises for the sealing elastomeric membrane of directly this substrate of contact or this mould and filling in the fluid of this elastic membrane inside; And
Keeper is used for keeping this equal casting die;
Wherein, when this driver element is driven and during feeding downwards, makes the downward feeding of this load bearing unit, contact and set up suitable pressure fully to this mould and this moulding material layer, by directly apply pressure to this mould or this substrate by the equal casting die that this keeper kept.
16. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 15 is characterized in that this load bearing unit is located at the top of mould.
17. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 15 is characterized in that this keeper has an accommodation space, an end is formed with the structure of opening, with ccontaining this equal casting die.
18. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 15 is characterized in that, this elastic membrane is by the made structure of the material that can bear high pressure and sealing.
19. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 15 is characterized in that, the outside joint portion that forms of this elastic membrane, this joint portion are to be selected from cohesive structure, joint type structure or metal latch fixing structure to form a kind of in the group.
20. the pressure-equalizing device that is used for micro nano transfer printing as claimed in claim 15 is characterized in that, this load bearing unit is the energy delivery part and is provided with at least one energy source in inside, transfers energy to this moulding material layer, this moulding material layer is carried out transfer printing be shaped.
CNB2005100699534A 2005-04-30 2005-04-30 Pressure equalizing device for micro nano transfer printing Expired - Fee Related CN100505147C (en)

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Application Number Priority Date Filing Date Title
CNB2005100699534A CN100505147C (en) 2005-04-30 2005-04-30 Pressure equalizing device for micro nano transfer printing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2005100699534A CN100505147C (en) 2005-04-30 2005-04-30 Pressure equalizing device for micro nano transfer printing

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CN100505147C true CN100505147C (en) 2009-06-24

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Publication number Priority date Publication date Assignee Title
CN101380824B (en) * 2007-09-07 2010-09-29 洪荣崇 Pressure-equalizing device for microstructure transfer printing
TW201219193A (en) * 2010-11-02 2012-05-16 Ind Tech Res Inst Uniform pressing apparatus for roll-to-sheet
CN107839366A (en) * 2017-10-31 2018-03-27 四川南格尔生物科技有限公司 A kind of film bag printing process and device
CN116330828A (en) * 2023-05-16 2023-06-27 山东万腾彩印包装有限公司 Paper support surface printing device and method

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