CN100500370C - 修正化学机械抛光作业工艺条件的方法 - Google Patents
修正化学机械抛光作业工艺条件的方法 Download PDFInfo
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- CN100500370C CN100500370C CNB2006101162511A CN200610116251A CN100500370C CN 100500370 C CN100500370 C CN 100500370C CN B2006101162511 A CNB2006101162511 A CN B2006101162511A CN 200610116251 A CN200610116251 A CN 200610116251A CN 100500370 C CN100500370 C CN 100500370C
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研磨速率倾向参数(CER) | 工艺条件代码名称 | 工艺条件中主要参数(如:I/M/R) | 工艺条件备注 |
CER=1.1~1.15 | C*** | 6/8.0/5 | 边缘偏快 |
CER=1.03~1.09 | D*** | 5/7.5/5 | 边缘有点快 |
CER=0.97~1.03 | F*** | 4/7/5 | 接近 |
CER=0.91~0.96 | H*** | 4/6.5/5 | 边缘有点慢 |
CER=0.85~0.90 | G*** | 3.5/6/5 | 边缘较慢 |
……. | ……. | ……. | ……. |
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CNB2006101162511A CN100500370C (zh) | 2006-09-20 | 2006-09-20 | 修正化学机械抛光作业工艺条件的方法 |
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CNB2006101162511A CN100500370C (zh) | 2006-09-20 | 2006-09-20 | 修正化学机械抛光作业工艺条件的方法 |
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CN101148016A CN101148016A (zh) | 2008-03-26 |
CN100500370C true CN100500370C (zh) | 2009-06-17 |
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Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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CN102152237B (zh) * | 2010-02-11 | 2013-02-27 | 中芯国际集成电路制造(上海)有限公司 | 用于化学机械研磨机台的制造程序控制方法及其控制系统 |
TWI492288B (zh) * | 2010-02-11 | 2015-07-11 | 聯華電子股份有限公司 | 控制晶圓研磨製程之方法 |
CN108122751A (zh) * | 2017-11-30 | 2018-06-05 | 上海华虹宏力半导体制造有限公司 | 化学机械研磨方法 |
CN110673557B (zh) * | 2019-09-27 | 2021-09-24 | 南京大学 | 基于工艺条件选择的智能化工系统 |
CN112331561B (zh) * | 2020-11-20 | 2024-04-26 | 上海华力集成电路制造有限公司 | 提高化学机械研磨良率的方法 |
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