CN100499189C - 纯金Au的合金键合LED倒装芯片的制备方法 - Google Patents
纯金Au的合金键合LED倒装芯片的制备方法 Download PDFInfo
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- CN100499189C CN100499189C CNB2006101244494A CN200610124449A CN100499189C CN 100499189 C CN100499189 C CN 100499189C CN B2006101244494 A CNB2006101244494 A CN B2006101244494A CN 200610124449 A CN200610124449 A CN 200610124449A CN 100499189 C CN100499189 C CN 100499189C
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CNB2006101244494A CN100499189C (zh) | 2006-09-05 | 2006-09-05 | 纯金Au的合金键合LED倒装芯片的制备方法 |
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CNB2006101244494A CN100499189C (zh) | 2006-09-05 | 2006-09-05 | 纯金Au的合金键合LED倒装芯片的制备方法 |
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CN101075654A CN101075654A (zh) | 2007-11-21 |
CN100499189C true CN100499189C (zh) | 2009-06-10 |
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Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
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DE102008026839A1 (de) * | 2007-12-20 | 2009-07-02 | Osram Opto Semiconductors Gmbh | Verfahren zum Herstellen eines optoelektronischen Bauelements in Dünnschichttechnik |
CN101281944B (zh) * | 2008-04-30 | 2010-06-02 | 苏州纳米技术与纳米仿生研究所 | 大功率led多层梯度材料散热通道的构造方法 |
CN102104099B (zh) * | 2009-12-18 | 2012-05-09 | 上海蓝光科技有限公司 | 高亮度发光二极管芯片的制造方法 |
CN102347434B (zh) * | 2010-08-03 | 2014-12-10 | 上海蓝光科技有限公司 | 倒装结构的发光二极管芯片及制作方法 |
CN102185073B (zh) * | 2011-04-01 | 2012-09-19 | 厦门市三安光电科技有限公司 | 一种倒装发光二极管及其制作方法 |
CN102931313B (zh) * | 2012-08-30 | 2014-11-19 | 安徽三安光电有限公司 | 倒装发光二极管及其制作方法 |
CN106463575A (zh) * | 2014-07-23 | 2017-02-22 | 深圳市国源铭光电科技有限公司 | Led光源的制作方法及批量制作方法 |
US11387383B2 (en) * | 2019-02-14 | 2022-07-12 | Seoul Viosys Co., Ltd. | Method of transferring light emitting device for display and display apparatus |
CN112701205B (zh) * | 2021-03-23 | 2021-09-24 | 元旭半导体科技股份有限公司 | 一种深紫外芯片的全无机封装制备方法及深紫外芯片 |
CN113422291B (zh) * | 2021-06-21 | 2022-06-07 | 常州纵慧芯光半导体科技有限公司 | 一种激光器及其制造方法与应用 |
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Denomination of invention: Process for preparaing reversing chip of pure-golden Au alloy bonding LED Effective date of registration: 20110815 Granted publication date: 20090610 Pledgee: Bank of Hankou, Limited by Share Ltd, Optics Valley branch Pledgor: Diyuan Photoelectric Science & Technology Co., Ltd., Wuhan Registration number: 2011990000310 |
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Date of cancellation: 20130315 Granted publication date: 20090610 Pledgee: Bank of Hankou, Limited by Share Ltd, Optics Valley branch Pledgor: Diyuan Photoelectric Science & Technology Co., Ltd., Wuhan Registration number: 2011990000310 |
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Denomination of invention: Process for preparaing reversing chip of pure-golden Au alloy bonding LED Effective date of registration: 20130315 Granted publication date: 20090610 Pledgee: Bank of Hankou Limited by Share Ltd Optics Valley branch Pledgor: Diyuan Photoelectric Science & Technology Co., Ltd., Wuhan Registration number: 2013990000147 |
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Owner name: AQUALITE OPTOELECTRONICS CO., LTD. Free format text: FORMER NAME: DIYUAN PHOTOELECTRIC SCIENCE + TECHNOLOGY CO., LTD., WUHAN |
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Address after: 430000 No. 227, Optics Valley Road, East Lake Development Zone, Hubei, Wuhan, China Patentee after: AQUALITE OPTOELECTRONICS CO., LTD. Address before: 430074 building, No. 18, Huaguang Avenue, Kanto science and Technology Industrial Zone, East Lake District, Hubei, Wuhan, 12 Patentee before: Diyuan Photoelectric Science & Technology Co., Ltd., Wuhan |
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