CN100496187C - Transmission line for cross-groove structure - Google Patents
Transmission line for cross-groove structure Download PDFInfo
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- CN100496187C CN100496187C CNB2006100834827A CN200610083482A CN100496187C CN 100496187 C CN100496187 C CN 100496187C CN B2006100834827 A CNB2006100834827 A CN B2006100834827A CN 200610083482 A CN200610083482 A CN 200610083482A CN 100496187 C CN100496187 C CN 100496187C
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Abstract
Description
技术领域 technical field
本发明涉及一种传输线,特别涉及一种用于跨槽沟结构的传输线。The present invention relates to a transmission line, in particular to a transmission line used in a cross-slot structure.
背景技术 Background technique
布线(Layout)是印刷电路板(Printed Circuit Board;PCB)的设计之一。布线的好坏将直接影响到整个系统的性能,大多数高速电路的设计理论也要最终经过布线得以实现并验证,由此可见,布线在高速印刷电路板设计中是至关重要的。Layout is one of the designs of Printed Circuit Board (PCB). The quality of wiring will directly affect the performance of the entire system, and most high-speed circuit design theories will eventually be realized and verified through wiring. It can be seen that wiring is crucial in high-speed printed circuit board design.
在多层印刷电路板的设计中,由于要节省成本,必须使用较少的层数来完成整个板子的布线,因此,就必须在有限的电源层上切割不同的电压准位,如此一来,若是传输线跨越这些不同的电压切割面,就形成了跨越槽沟(Oversplit Plane)结构。In the design of multilayer printed circuit boards, in order to save costs, fewer layers must be used to complete the wiring of the entire board. Therefore, different voltage levels must be cut on the limited power supply layer. In this way, If the transmission line crosses these different voltage cutting planes, an Oversplit Plane structure is formed.
请参照图1A与图1B,图1A为现有的传输线跨槽结构的示意图10,图1B为现有的传输线跨槽结构的俯视图11,如图所示,印刷电路板101上具有一切割之槽沟102,传输线103用以传输讯号且跨越槽沟102,其中传输线103的线宽为W。然而,由于跨越槽沟102上方的传输线103因无讯号参考平面,使得此部分线段呈现电感性的高阻抗特性,导致传输线的阻抗产生不连续性的效应,即造成讯号传输至此部分线段时发生讯号反射。有鉴于此,现有技术的解决方案为在两个分割面上加入电容让传输线上的电流可以在两个分割面上回流,以降低讯号反射现象。然而,此现有技术虽可解决讯号反射问题,却增加了制造成本,以及必须面临增加电容造成布线空间减少的问题。Please refer to FIG. 1A and FIG. 1B. FIG. 1A is a schematic diagram 10 of an existing transmission line straddling structure, and FIG. 1B is a top view 11 of an existing transmission line straddling structure. As shown in the figure, a printed
发明内容 Contents of the invention
为了解决上述的问题,本发明揭露一种用于跨越槽沟结构的传输线,本发明利用阻抗匹配的观念,利用史密斯图(Smith Chart)依据预期频率来调整单根传输线最佳化的线长与线宽,以改变连接到跨槽沟结构的传输线部分线段的宽度,使其呈现电容性的低阻抗特性,达到设计频率点的阻抗匹配,进而改善跨槽沟结构上传输线的电感性的高阻抗特性所造成不连续的效应,并改善讯号反射损失。In order to solve the above-mentioned problems, the present invention discloses a transmission line for crossing the trench structure. The present invention utilizes the concept of impedance matching and uses Smith Chart to adjust the optimal line length and length of a single transmission line according to the expected frequency. Line width, to change the width of the part of the transmission line connected to the cross-slot structure, so that it presents capacitive low impedance characteristics, achieves impedance matching at the design frequency point, and then improves the inductive high impedance of the transmission line on the cross-slot structure The effect of discontinuity caused by the characteristic, and improve the signal reflection loss.
以下结合附图和具体实施例对本发明进行详细描述,但不作为对本发明的限定。The present invention will be described in detail below in conjunction with the accompanying drawings and specific embodiments, but not as a limitation of the present invention.
附图说明 Description of drawings
图1A为现有的跨槽沟结构的示意图;FIG. 1A is a schematic diagram of an existing cross-groove structure;
图1B为现有的跨槽沟结构的俯视图;FIG. 1B is a top view of an existing trench-spanning structure;
图2A为本发明的改变传输线部分线长与线宽的示意图;FIG. 2A is a schematic diagram of changing the length and width of part of the transmission line according to the present invention;
图2B为本发明的改变传输线部分线长与线宽的俯视图;Fig. 2B is a top view of changing the line length and line width of part of the transmission line according to the present invention;
图3为本发明的利用增加传输线的线宽补偿阻抗不匹配与未补偿前的反射损失曲线图;及FIG. 3 is a curve diagram of impedance mismatch compensation and uncompensated reflection loss before compensation by increasing the line width of the transmission line according to the present invention; and
图4为本发明的利用增加传输线的线宽补偿阻抗不匹配与未补偿前的显示图。FIG. 4 is a display diagram of compensation for impedance mismatch and uncompensated by increasing the line width of the transmission line according to the present invention.
其中,附图标记Among them, reference signs
10 现有的跨槽沟结构的示意图10 Schematic diagram of the existing cross-trough structure
11 现有的跨槽沟结构的俯视图11 Top view of the existing trench-spanning structure
20 本发明的改变传输线部分线长与线宽的示意图20 Schematic diagram of changing the line length and line width of the transmission line part of the present invention
21 本发明的改变传输线部分线长与线宽的俯视图21 Top view of changing the line length and line width of the transmission line part of the present invention
30 本发明的利用增加传输线的线宽补偿阻抗不匹配与未补偿前的反射损失曲线图30 Curves of Impedance Mismatch Compensation and Uncompensated Reflection Loss by Increasing the Line Width of the Transmission Line in the Present Invention
40 本发明的利用增加传输线的线宽补偿阻抗不匹配与未补偿前的显示图40 The present invention utilizes increasing the line width of the transmission line to compensate the impedance mismatch and the display before uncompensation
101,201 印刷电路板101, 201 Printed circuit boards
102,202 槽沟102, 202 Groove
103 传输线103 transmission line
203 第一线段203 first line segment
204 第二线段204 second segment
301 补偿后讯号的反射损失曲线301 Reflection loss curve of signal after compensation
302 未补偿的传输线的讯号的反射损失曲线302 Reflection Loss Curves for Uncompensated Transmission Line Signals
303,304 共振点303, 304 resonance points
401 补偿后讯号的显示图401 Display of signal after compensation
402 未补偿传输线的讯号的显示图402 Display of the signal of the uncompensated transmission line
L2 第二线长L2 second line length
W 线宽W line width
W1 第一线宽W1 first line width
W2 第二线宽W2 second line width
具体实施方式 Detailed ways
以下在实施方式中详细叙述本发明的详细特征以及优点,其内容足以使任何熟习相关技艺者了解本发明的技术内容并据以实施,且根据本说明书所揭露的内容、申请专利范围及图式,任何熟习相关技艺者可轻易地理解本发明相关的目的及优点。The detailed features and advantages of the present invention are described in detail below in the embodiments, the content of which is sufficient to enable any person familiar with the relevant art to understand the technical content of the present invention and implement it accordingly, and according to the content disclosed in this specification, the scope of the patent application and the drawings , anyone skilled in the relevant art can easily understand the related objects and advantages of the present invention.
本发明是利用阻抗匹配的观念,以改变传输线宽度的方式,使跨越印刷电路板的槽沟上的传输线的部分线段呈现电容性的低阻抗特性,达到设计频率点的阻抗匹配,进而改善传输线因电感性的高阻抗特性所造成阻抗不连续的效应。The present invention uses the concept of impedance matching to change the width of the transmission line so that part of the line segment of the transmission line across the groove of the printed circuit board presents capacitive low-impedance characteristics to achieve impedance matching at the design frequency point, thereby improving the performance of the transmission line. The effect of impedance discontinuity caused by the high impedance characteristic of inductance.
请参照图2A与图2B,图2A为本发明的改变传输线部分线长与线宽的示意图20,图2B为本发明的改变传输线部分线长与线宽的俯视图21,根据本发明的一具体实施例,利用史密斯图(Smith Chart)依据预期频率来调整单根传输线最佳化的线长与线宽,以达到阻抗匹配,例如,印刷电路板201外层的传输线的第一线段203有第一线长L1(图中未标示)与第一线宽W1,若是再以同第一线段203的第一线宽W1的线段跨越槽沟202时,槽沟202上方的传输线会与原本设计的传输线呈现阻抗不匹配的电感性的高阻抗特性。因此,增加在槽沟202上方的传输线的线宽以克服阻抗不连续性,即为第二线段204,其具有第二线长L2与第二线宽W2,此增加线宽的第二线段204即是以凹槽202中心,向传输线的至少一端延伸,根据本发明的具体实施例,例如,第一线段203的线宽是以7密尔(mil;千分之一英时)实现,而凹槽202的宽度为20密尔,则第二线段204向传输线两端分别延伸75密尔形成第二线长L2为150密尔、第二线宽W2为14密尔的线段。于此所述增加线宽的线段的长度与宽度并非用以限定本发明的范围,熟息此技艺者可改变凹槽202与传输线的第一线段203的第一线长L1及/或第一线宽W1,进而改变凹槽202上方的传输线的第二线段204应增加的第二线长L2及/或第二线宽W2,并且根据本发明的实施例,此增加传输线的线宽而达到阻抗匹配的方式可同时适用于单端(Single-End)传输及差模(Differential Mode)传输电路。Please refer to FIG. 2A and FIG. 2B. FIG. 2A is a schematic diagram 20 of changing the length and width of a part of a transmission line according to the present invention, and FIG. 2B is a
请参照图3,为本发明的利用增加传输线203的线宽补偿阻抗不匹配与未补偿前的反射损失曲线图30,使用史密斯图得到频率2~8GHz(十亿赫兹)的传输线的线长与线宽,量测予以补偿后讯号的反射损失曲线301并与未补偿的传输线的讯号的反射损失曲线302作一比较,如图所示,补偿后可在2GHz和6.5GHz产生两个共振点303、304,在这两个共振点303、304附近的频率皆能大幅降低反射损失。Please refer to FIG. 3 , which is a
请参照图4,为本发明的利用增加传输线203的线宽补偿阻抗不匹配与未补偿前的显示图40,使用史密斯图得到频率3GHz的传输线的线长与线宽,量测予以补偿后讯号的显示图401并与未补偿传输线的讯号的显示图402作一比较,如图所示,未补偿传输线的讯号的显示图402失真较为严重。Please refer to FIG. 4 , which is a display diagram 40 of the present invention before compensating for impedance mismatch and uncompensated by increasing the line width of the
当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求的保护范围。Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection of the appended claims of the present invention.
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CN104039075A (en) * | 2014-06-13 | 2014-09-10 | 杭州华三通信技术有限公司 | Pcb circuit |
CN104797078A (en) * | 2015-04-10 | 2015-07-22 | 福州瑞芯微电子有限公司 | Method for reducing impedance mismatching degree under condition of discontinuous returning path |
CN104733823A (en) * | 2015-04-14 | 2015-06-24 | 上海安费诺永亿通讯电子有限公司 | Bendable flat transmission line |
CN112867229A (en) * | 2020-12-25 | 2021-05-28 | 广州朗国电子科技有限公司 | Signal routing structure across division gaps and signal impedance optimization method |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
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KR20020055038A (en) * | 2000-12-28 | 2002-07-08 | 박종섭 | A printed circuit board |
US20030136580A1 (en) * | 2002-01-18 | 2003-07-24 | Juan Chen | Plane splits filled with lossy materials |
CN2563884Y (en) * | 2002-04-28 | 2003-07-30 | 神达电脑股份有限公司 | Design structure of signal transmission line in high frequency circuit board |
CN2563885Y (en) * | 2002-05-21 | 2003-07-30 | 神达电脑股份有限公司 | Improved Wiring Structure of Circuit Board Test Line |
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Publication number | Priority date | Publication date | Assignee | Title |
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KR20020055038A (en) * | 2000-12-28 | 2002-07-08 | 박종섭 | A printed circuit board |
US20030136580A1 (en) * | 2002-01-18 | 2003-07-24 | Juan Chen | Plane splits filled with lossy materials |
CN2563884Y (en) * | 2002-04-28 | 2003-07-30 | 神达电脑股份有限公司 | Design structure of signal transmission line in high frequency circuit board |
CN2563885Y (en) * | 2002-05-21 | 2003-07-30 | 神达电脑股份有限公司 | Improved Wiring Structure of Circuit Board Test Line |
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