CN100490137C - Thin-film flip-chip packaging construction and circuit thin-film used for it - Google Patents
Thin-film flip-chip packaging construction and circuit thin-film used for it Download PDFInfo
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- CN100490137C CN100490137C CN 200610111544 CN200610111544A CN100490137C CN 100490137 C CN100490137 C CN 100490137C CN 200610111544 CN200610111544 CN 200610111544 CN 200610111544 A CN200610111544 A CN 200610111544A CN 100490137 C CN100490137 C CN 100490137C
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 83
- 239000010409 thin film Substances 0.000 title claims description 77
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- 239000010408 film Substances 0.000 claims description 75
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- 238000005538 encapsulation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
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- 238000004804 winding Methods 0.000 description 2
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- 238000007731 hot pressing Methods 0.000 description 1
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
- H01L2224/73204—Bump and layer connectors the bump connector being embedded into the layer connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/19—Details of hybrid assemblies other than the semiconductor or other solid state devices to be connected
- H01L2924/191—Disposition
- H01L2924/19101—Disposition of discrete passive components
- H01L2924/19107—Disposition of discrete passive components off-chip wires
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- Wire Bonding (AREA)
Abstract
The present invention relates to a Chip-On-Film package and its used circuit film. The Chip-On-Film package (COF) mainly includes a circuit film, a protrusive wafer and point-coated colloid. Protrusion of the wafer is connected to pins of the circuit film. The point-coated colloid is formed between the wafer and the circuit film. And the circuit film has at least one jumpering line or additional jumpering component, which are electrically connected to at least two of the pins, can replace ground under the wafer in current Chip-On-Film (COF) packaging, and can solve the problem of uneven flow velocity of the point-coated colloid.
Description
Technical field
The present invention relates to a kind of diaphragm type IC circuit packing structure, especially relevant a kind of thin-film flip-chip packaging construction (Chip-On-Film package, COF package), particularly relate to and a kind ofly can solve existing thin-film flip-chip packaging construction and spread the inhomogeneous problem that causes bubble of speed, also can prevent the thin-film flip-chip packaging construction that jumper exposes and the circuit film of use thereof in addition because of earthing strip under the wafer (ground bar under chip) influences the spot printing colloid.
Background technology
In diaphragm type IC circuit packing structure in the past is with the circuit film bearing wafer, has disclosed a kind of " thin-film flip-chip packaging construction " No. 505315 as the original application people at the TaiWan, China patent announcement.(Tape Carrier Package TCP) has thinner and the advantage little spacing of pin thin-film flip-chip packaging construction (Chip-On-Film package, COF package), to meet the required of advanced integrated circuit encapsulation with respect to the winding support packaging structure.Yet the chaff interference regular meeting of thin-film flip-chip packaging construction between wafer and circuit film influences the filling flow velocity of spot printing colloid, and causes bubble to produce.
See also Figure 1 and Figure 2, Fig. 1 is a kind of schematic cross-section of existing known thin-film flip-chip packaging construction, and Fig. 2 is the bottom surface perspective diagram.Existing known thin-film flip-chip packaging construction 100 comprises a circuit film 110, a wafer 120 and a bit is coated with colloid 130.This circuit film 110 has a soft dielectric layer 111, a plurality of pin 112 and a welding resisting layer 113.This wafer 120 has plurality of bump 121, its be engaged to those pins 112 in connect finger.This spot printing colloid 130 is to flow and be filled between this wafer 120 and this circuit film 110 with capillarity, and heats and be shaped with slaking.As shown in Figure 2, these circuit film 110 correspondences are to be provided with at least one earthing strip 114 (ground bar) below this wafer 120 usually, and itself and those pin 112 is with layer metal structure, and connects the pin 112 that needs the ground connection conduction more than two.Because earthing strip 114 is transverse arrests in the flow direction of this spot printing colloid 130 (by a longer sides of this wafer 120 direction to another longer sides), become first-class fast chaff interference, and cause the flowing velocity of this spot printing colloid 130 inhomogeneous, promptly particularly at the flow velocity of earthing strip 114 parts for slower.Therefore, behind this spot printing colloid 130 of slaking, its inside has micro-bubble or the slit produces, and belongs to the unreal defective of gluing.
This shows that the circuit film of above-mentioned existing thin-film flip-chip packaging construction and use thereof obviously still has inconvenience and defective, and demands urgently further being improved in structure and use.In order to solve the problem of above-mentioned existence, relevant manufacturer there's no one who doesn't or isn't seeks solution painstakingly, but do not see always that for a long time suitable design finished by development, and common product does not have appropriate structure to address the above problem, this obviously is the problem that the anxious desire of relevant dealer solves.Therefore how to found a kind of new thin-film flip-chip packaging construction and the circuit film of use thereof, real one of the current important research and development problem that belongs to, also becoming the current industry utmost point needs improved target.
Because the defective that the circuit film of above-mentioned existing thin-film flip-chip packaging construction and use thereof exists, the inventor is based on being engaged in this type of product design manufacturing abundant for many years practical experience and professional knowledge thereof, and the utilization of cooperation scientific principle, actively studied innovation, in the hope of founding a kind of new thin-film flip-chip packaging construction and the circuit film of use thereof, can improve the circuit film of general existing thin-film flip-chip packaging construction and use thereof, make it have more practicality.Through constantly research, design, and, create the present invention who has practical value finally through after studying sample and improvement repeatedly.
Summary of the invention
Main purpose of the present invention is, overcome the defective of the circuit film existence of existing thin-film flip-chip packaging construction and use thereof, and provide a kind of new thin-film flip-chip packaging construction and the circuit film of use thereof, technical problem to be solved is to make it can solve existing known thin-film flip-chip packaging construction to spread the inhomogeneous problem that causes bubble of speed because of earthing strip under the wafer (ground bar under chip) influences the spot printing colloid, thereby is suitable for practicality more.
Another object of the present invention is to, a kind of new thin-film flip-chip packaging construction and the circuit film of use thereof are provided, technical problem to be solved is to make it can prevent exposing of jumper, thereby is suitable for practicality more.
The object of the invention to solve the technical problems is to adopt following technical scheme to realize.A kind of thin-film flip-chip packaging construction according to the present invention's proposition, it comprises: a circuit film, it has one first dielectric layer, one second dielectric layer, a plurality of pin and at least one jumper between first dielectric layer and second dielectric layer, and wherein this jumper is to form on this second dielectric layer and wherein at least two of being electrically conducted those pins; One wafer, it has plurality of bump, and those projections are to be engaged to those pins; And a bit being coated with colloid, it is formed between this circuit film and this wafer.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid thin-film flip-chip packaging construction, wherein said second dielectric layer has a plurality of laser drill, connects those pins for this jumper.
Aforesaid thin-film flip-chip packaging construction, it includes a megohmite insulant in addition, is formed on this circuit film, to seal this jumper.
Aforesaid thin-film flip-chip packaging construction, at least one pin that does not connect with this jumper of wherein said those pins is belows of passing this jumper.
The object of the invention to solve the technical problems also realizes by the following technical solutions.According to a kind of circuit film that is applicable to thin-film flip-chip packaging construction that the present invention proposes, it comprises: one first dielectric layer; A plurality of pins, it is formed on this first dielectric layer; One second dielectric layer, it is formed on those pins and this first dielectric layer, covers those pins with the part; And at least one jumper, it forms on this second dielectric layer, and is electrically conducted wherein at least two of those pins
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
The aforesaid circuit film that is applicable to thin-film flip-chip packaging construction, wherein said second dielectric layer has a plurality of laser drill, connects those pins for this jumper.
The aforesaid circuit film that is applicable to thin-film flip-chip packaging construction, other includes a megohmite insulant, is formed on this second dielectric layer, to seal this jumper.
The aforesaid circuit film that is applicable to thin-film flip-chip packaging construction, wherein said first dielectric layer is a pliability core layer, and this second dielectric layer is a welding resisting layer.
The object of the invention to solve the technical problems also realizes in addition by the following technical solutions.According to a kind of thin-film flip-chip packaging construction that the present invention proposes, it comprises: a circuit film, and it has one first dielectric layer, one second dielectric layer and a plurality of pin between first dielectric layer and second dielectric layer; One wafer, it has plurality of bump, and those bump bond are to those pins; Any is coated with colloid, and it is formed between this circuit film and this wafer; And at least one jumper connection element, it forms on this circuit film, and is electrically conducted wherein at least two of those pins.
The object of the invention to solve the technical problems also can be applied to the following technical measures to achieve further.
Aforesaid thin-film flip-chip packaging construction, wherein said second dielectric layer has a plurality of laser drill, and is filled with conductive materials, for connecting of this jumper connection element.
Aforesaid thin-film flip-chip packaging construction, wherein said jumper connection element is a bonding wire.
Aforesaid thin-film flip-chip packaging construction, wherein said jumper connection element is a passive device.
The present invention compared with prior art has tangible advantage and beneficial effect.As known from the above, in order to achieve the above object, the invention provides a kind of thin-film flip-chip packaging construction, mainly comprise a circuit film, a wafer and a bit be coated with colloid, this circuit film has one first dielectric layer, one second dielectric layer, a plurality of pin and at least one jumper between first dielectric layer and second dielectric layer, and wherein this jumper is to form on this second dielectric layer and wherein at least two of being electrically conducted those pins.This wafer has plurality of bump, and those projections are to be engaged to those pins.This spot printing colloid is to be formed between this circuit film and this wafer.In another embodiment, jumper can be the jumper connection element of extra setting.
By technique scheme, the circuit film of thin-film flip-chip packaging construction of the present invention and use thereof has following advantage at least:
1, the circuit film of thin-film flip-chip packaging construction of the present invention and use thereof, can solve existing known thin-film flip-chip packaging construction and spread the inhomogeneous problem that causes bubble of speed, thereby be suitable for practicality more because of earthing strip under the wafer (ground bar under chip) influences the spot printing colloid.
2, in addition, the circuit film of thin-film flip-chip packaging construction of the present invention and use thereof can prevent exposing of jumper, thereby be suitable for practicality more.
In sum, the invention relates to the circuit film of a kind of thin-film flip-chip packaging construction and use thereof.(Chip-On-Film package, COF) packaging structure consist predominantly of a circuit film, a projection wafer and a bit are coated with colloid this membrane of flip chip.The projection of this wafer is the pin that is engaged to this circuit film.This spot printing colloid is to be formed between this wafer and this circuit film.And, this circuit film has at least one jumper or the extra jumper connection element that is provided with, it is to be electrically conducted wherein at least two of those pins, can replace the earthing strip below wafer in existing known membrane of flip chip (COF) packaging structure, and can solve the spot printing colloid and spread the uneven problem of speed.The present invention has above-mentioned plurality of advantages and practical value, no matter it all has bigger improvement on product structure or function, be a significant progress in technology, and produced handy and practical effect, and the circuit film of more existing thin-film flip-chip packaging construction and use thereof has the outstanding effect of enhancement, thereby being suitable for practicality more, and having the extensive value of industry, really is a new and innovative, progressive, practical new design.
Above-mentioned explanation only is the general introduction of technical solution of the present invention, for can clearer understanding technological means of the present invention, and can be implemented according to the content of specification, and for above-mentioned and other purposes, feature and advantage of the present invention can be become apparent, below especially exemplified by preferred embodiment, and conjunction with figs., be described in detail as follows.
Description of drawings
Fig. 1 is the schematic cross-section that has known thin-film flip-chip packaging construction now.
Fig. 2 is the bottom surface perspective diagram that has known thin-film flip-chip packaging construction now.
Fig. 3 is according to first preferred embodiment of the present invention, a kind of schematic cross-section of thin-film flip-chip packaging construction.
Fig. 4 is according to first preferred embodiment of the present invention, the bottom surface perspective diagram of this thin-film flip-chip packaging construction.
Fig. 5 is that this thin-film flip-chip packaging construction is along the generalized section of 5-5 hatching among Fig. 3 according to first preferred embodiment of the present invention.
Fig. 6 is according to second preferred embodiment of the present invention, the schematic cross-section of another kind of thin-film flip-chip packaging construction.
Fig. 7 is that this thin-film flip-chip packaging construction is along the generalized section of 7-7 hatching among Fig. 6 according to second preferred embodiment of the present invention.
Fig. 8 is according to the 3rd preferred embodiment of the present invention, the schematic cross-section of another kind of thin-film flip-chip packaging construction.
Fig. 9 is that this thin-film flip-chip packaging construction is along the generalized section of 9-9 hatching among Fig. 8 according to the 3rd preferred embodiment of the present invention.
100: thin-film flip-chip packaging construction 110: circuit film
111: soft dielectric layer 112: pin
113: welding resisting layer 114: earthing strip
115: opening 120: wafer
121: projection 130: the spot printing colloid
200: thin-film flip-chip packaging construction 210: circuit film
212A: connect pin 212B: pass pin
215: laser drill 220: wafer
221: projection 230: the spot printing colloid
240: megohmite insulant 300: thin-film flip-chip packaging construction
310: 311: the first dielectric layers of circuit film
312: pin 312A: connect pin
312B: pass 313: the second dielectric layers of pin
314: conductive materials 320: wafer
321: projection 330: the spot printing colloid
340: jumper connection element 400: thin-film flip-chip packaging construction
410: 411: the first dielectric layers of circuit film
412: pin 412A: connect pin
412B: pass 413: the second dielectric layers of pin
414: conductive materials 420: wafer
421: projection 430: the spot printing colloid
440: the jumper connection element
Embodiment
Reach technological means and the effect that predetermined goal of the invention is taked for further setting forth the present invention, below in conjunction with accompanying drawing and preferred embodiment, the thin-film flip-chip packaging construction that foundation the present invention is proposed and its embodiment of circuit film, structure, feature and the effect thereof of use thereof, describe in detail as after.
See also Fig. 3 and shown in Figure 4, Fig. 3 is according to first preferred embodiment of the present invention, a kind of schematic cross-section of thin-film flip-chip packaging construction.Fig. 4 is the bottom surface perspective diagram of this thin-film flip-chip packaging construction.According to first specific embodiment of the present invention, disclosed a kind of thin-film flip-chip packaging construction (COFpackage).This thin-film flip-chip packaging construction 200 mainly comprises a circuit film 210, a projection wafer 220 and a bit is coated with colloid 230.Wherein, this circuit film 210 is in order to carrying this wafer 220, to carry out packaging operation with the winding transmission means, and output/input signal, the power supply that can electrically conduct this wafer 220 are supplied with and the ground connection guiding.This spot printing colloid 230 is to protect this wafer 220 in order to partially sealed.
Above-mentioned circuit film 210 has one first dielectric layer 211, a plurality of pin 212 and one second dielectric layer 213.
Those pins 212 are between this first dielectric layer 211 and second dielectric layer 213.
In the present embodiment, this first dielectric layer 211 is to be a pliability core layer, its material can be polyimides (polyimide, PI) or poly terephthalic acid diethylester (PET);
This second dielectric layer 213, be to be a welding resisting layer, can select liquid photosensitive welding cover layer (1iquidphotoimagable solder mask for use, LPI), photosensitive cover lay (photoimagable coverlayer, PIC) or can be the non-conductive printing ink or the cover layer (coverlayer) of general non-photosensitive dielectric material.Perhaps, this first dielectric layer 211 can be identical material with this second dielectric layer 213.This second dielectric layer 213 is local those pins 212 that cover.
Those pins 212 are I/O signal, power supply, ground connection in order to this wafer 220 of electrical conduction etc.One end of those pins 212 is to concentrate toward these first dielectric layer, 211 central fan-ins, and its part that is not covered by this second dielectric layer 213 is to become to connect finger in a plurality of; The other end of those pins 212 is to arrange toward these first dielectric layer, 211 both sides fan-outs, and its part that is not covered by this second dielectric layer 213 is to become a plurality of external fingers.
In addition, this circuit film 210 has at least one jumper 214 in addition, and wherein this jumper 214 is to form on this second dielectric layer 213 (as shown in Figure 3), and is electrically conducted wherein at least two of those pins 212 (as shown in Figure 4 connect pin 212A).Therefore, this jumper 214 has and is equivalent to existing known membrane of flip chip (Chip-On-Film package, COF) the jumper connection function of earthing strip in the packaging structure does not need to be formed on the below of this wafer 220 again, and can not influence the moving speed of some solation of this spot printing colloid 230.
Please consult Fig. 3 and shown in Figure 4 again, this wafer 220 is to have plurality of bump 221, those projections 221 be for these wafer 220 internal integrated circuits to external electrode.Usually this wafer 220 is to can be the driving integrated circuit (IC) of a display or other special purpose integrated circuit (ASIC) or the like.Can utilize modes such as hot pressing, reflow or conducting resinl joint that those projections 221 are engaged in those of those pins 212 and connect finger.In addition, this spot printing colloid 230 is to be formed between this circuit film 210 and this wafer 220 in the spot printing mode.
See also Fig. 3 and shown in Figure 5, Fig. 5 is that this thin-film flip-chip packaging construction is along the generalized section of 5-5 hatching among Fig. 3 according to first preferred embodiment of the present invention.In the concrete structure of present embodiment, this second dielectric layer 213 has a plurality of laser drill 215 (laser drilled hole), connects pin 212A to be communicated to those, and this jumper 214 is can connect those to connect pin 212A.Usually those laser drill 215 are to be positioned at the fan-out position that those connect pin 212A, and those connect pin 212A and have bigger line-spacing at the fan-out position, provide enough to allow the boring of laser work form, to avoid adjacent those pins 212.
See also Fig. 4 and shown in Figure 5, at least one pin 212B that does not connect with this jumper 214 of those pins 212 is belows of passing this jumper 214.Preferably, this thin-film flip-chip packaging construction 200 includes a megohmite insulant 240 in addition, and it is formed on this second dielectric layer 213 of this circuit film 210, to seal this jumper 214.The material of this megohmite insulant 240 can be all anti-welding material mutually or be all adhesive material or other material that is electrically insulated mutually with this spot printing colloid 230 with this second dielectric layer 213, and its main purpose is to protect this jumper 214 not expose.
In addition,, the jumper 214 in first embodiment is connected in the characteristic that this circuit film 210 can reach thin deflection though being one, and also can be in different embodiment by the jumper among alternative first embodiment of the extra jumper connection element that is provided with.So-called " one of jumper 214 connects " is meant that jumper 214 is to be pre-formed in this circuit film 210 before the wafer of encapsulation procedure engages.
See also Figure 6 and Figure 7, Fig. 6 is that the schematic cross-section of another kind of thin-film flip-chip packaging construction, Fig. 7 are the generalized section of this thin-film flip-chip packaging construction along 7-7 hatching among Fig. 6 according to second preferred embodiment of the present invention.In second specific embodiment, disclosed another kind of thin-film flip-chip packaging construction 300, mainly comprised a circuit film 310, a projection wafer 320, a bit be coated with colloid 330 and at least one jumper connection element 340, wherein:
This circuit film 310, wafer 320 and spot printing colloid 330, it can be identical with first specific embodiment, so give unnecessary details no longer in detail at this.
This circuit film 310 has first dielectric layer 311, one second dielectric layer 313 and a plurality of pin 312 between first dielectric layer 311 and second dielectric layer 313.
This wafer 320, the projection 321 on it is the inners that are engaged to those pins 312.
This spot printing colloid 330 is to be formed between this circuit film 310 and this wafer 320.
This jumper connection element 340 be to form on this circuit film 310 and be electrically conducted wherein at least two of those pins 312 (as shown in Figure 7 connect pin 312A), and at least one pin 312B that passes that does not connect is the below that can pass this jumper connection element 340.In the present embodiment, this jumper connection element 340 is to be bonding wire (bonding wire), and it is provided by wire bonding machine table, can be easily electrically connects this in the jumper connection mode and two connects pin 312A.
In the present embodiment, this second dielectric layer 313 is to have a plurality of laser drill, and is filled with conductive materials 314, can be electro-coppering, elargol or other electric conducting material, for connecting of this jumper connection element 340.This jumper connection element 340 is to have to be equivalent to existing known membrane of flip chip (Chip-On-Filmpackage, COF) the jumper connection function of earthing strip in the packaging structure can not influence the moving speed of some solation of this spot printing colloid 330 again.
See also Fig. 8 and shown in Figure 9, Fig. 8 is that the schematic cross-section of another kind of thin-film flip-chip packaging construction, Fig. 9 are the generalized section of this thin-film flip-chip packaging construction along 9-9 hatching among Fig. 8 according to the 3rd preferred embodiment of the present invention.In the 3rd specific embodiment, disclosed a kind of thin-film flip-chip packaging construction 400, mainly comprised a circuit film 410, a projection wafer 420, a bit be coated with colloid 430 and at least one jumper connection element 440, wherein:
This circuit film 410, wafer 420 and spot printing colloid 430, roughly the same with first specific embodiment, so give unnecessary details no longer in detail.
This circuit film 410 has first dielectric layer 411, one second dielectric layer 413 and a plurality of pin 412 between first dielectric layer 411 and second dielectric layer 413.
This wafer 420, the projection 421 on it is the inners that are engaged to those pins 412.
This spot printing colloid 430 is to be formed between this circuit film 410 and this wafer 420.
This jumper connection element 440 is to form on this circuit film 410.In the present embodiment, this jumper connection element 440 can be passive device, promoting electrical property efficiency such as ground connection and to be electrically conducted wherein at least two of those pins 412 (as shown in Figure 9 connect pin 412A), and at least one pin 412B that passes that does not connect is the below that can pass this jumper connection element 440.
In the present embodiment, this second dielectric layer 413 is to have a plurality of laser drill, and is filled with conductive materials 414, and forms the connection pad shape on extensible this second dielectric layer 413, connects for the jumper connection element 440 of this passive device.
The above, it only is preferred embodiment of the present invention, be not that the present invention is done any pro forma restriction, though the present invention discloses as above with preferred embodiment, yet be not in order to limit the present invention, any those skilled in the art, in not breaking away from the technical solution of the present invention scope, when the technology contents that can utilize above-mentioned announcement is made a little change or is modified to the equivalent embodiment of equivalent variations, in every case be not break away from the technical solution of the present invention content, according to technical spirit of the present invention to any simple modification that above embodiment did, equivalent variations and modification all still belong in the scope of technical solution of the present invention.
Claims (12)
1, a kind of thin-film flip-chip packaging construction is characterized in that it comprises:
One circuit film, it has one first dielectric layer, one second dielectric layer, a plurality of pin and at least one jumper between first dielectric layer and second dielectric layer, and wherein this jumper is to form on this second dielectric layer and wherein at least two of being electrically conducted those pins;
One wafer, it has plurality of bump, and those projections are to be engaged to those pins; And
Any is coated with colloid, and it is formed between this circuit film and this wafer.
2, thin-film flip-chip packaging construction according to claim 1 is characterized in that wherein said second dielectric layer has a plurality of laser drill, connects those pins for this jumper.
3, thin-film flip-chip packaging construction according to claim 1 is characterized in that it includes a megohmite insulant in addition, is formed on this circuit film, to seal this jumper.
4, thin-film flip-chip packaging construction according to claim 1, at least one pin that does not connect with this jumper that it is characterized in that wherein said those pins is the below of passing this jumper.
5, a kind of circuit film that is applicable to thin-film flip-chip packaging construction is characterized in that it comprises:
One first dielectric layer;
A plurality of pins, it is formed on this first dielectric layer;
One second dielectric layer, it is formed on those pins and this first dielectric layer, covers those pins with the part; And
At least one jumper, it forms on this second dielectric layer, and is electrically conducted wherein at least two of those pins.
6, the circuit film that is applicable to thin-film flip-chip packaging construction according to claim 5 is characterized in that wherein said second dielectric layer has a plurality of laser drill, connects those pins for this jumper.
7, the circuit film that is applicable to thin-film flip-chip packaging construction according to claim 5 is characterized in that it includes a megohmite insulant in addition, is formed on this second dielectric layer, to seal this jumper.
8, the circuit film that is applicable to thin-film flip-chip packaging construction according to claim 5 it is characterized in that wherein said first dielectric layer is a pliability core layer, and this second dielectric layer is a welding resisting layer.
9, a kind of thin-film flip-chip packaging construction is characterized in that it comprises:
One circuit film, it has one first dielectric layer, one second dielectric layer and a plurality of pin between first dielectric layer and second dielectric layer;
One wafer, it has plurality of bump, and those bump bond are to those pins;
Any is coated with colloid, and it is formed between this circuit film and this wafer; And
At least one jumper connection element, it forms on this circuit film, and is electrically conducted wherein at least two of those pins.
10, thin-film flip-chip packaging construction according to claim 9 is characterized in that wherein said second dielectric layer has a plurality of laser drill, and is filled with conductive materials, for connecting of this jumper connection element.
11, thin-film flip-chip packaging construction according to claim 9 is characterized in that wherein said jumper connection element is a bonding wire.
12, thin-film flip-chip packaging construction according to claim 9 is characterized in that wherein said jumper connection element is a passive device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610111544 CN100490137C (en) | 2006-08-23 | 2006-08-23 | Thin-film flip-chip packaging construction and circuit thin-film used for it |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200610111544 CN100490137C (en) | 2006-08-23 | 2006-08-23 | Thin-film flip-chip packaging construction and circuit thin-film used for it |
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| CN101131981A CN101131981A (en) | 2008-02-27 |
| CN100490137C true CN100490137C (en) | 2009-05-20 |
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| US20170192453A1 (en) * | 2015-12-30 | 2017-07-06 | Novatek Microelectronics Corp. | Wearable device with a chip on film package structure |
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