CN100481423C - Chip with projection cube structure - Google Patents
Chip with projection cube structure Download PDFInfo
- Publication number
- CN100481423C CN100481423C CN 200510126191 CN200510126191A CN100481423C CN 100481423 C CN100481423 C CN 100481423C CN 200510126191 CN200510126191 CN 200510126191 CN 200510126191 A CN200510126191 A CN 200510126191A CN 100481423 C CN100481423 C CN 100481423C
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- CN
- China
- Prior art keywords
- block
- chip
- projection
- electrically connected
- cube structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The disclosed chip includes chip, weld pads, and lugs. Chip is a microcircuit produced through IC technique. Being as metallized part on chip, weld pads are in use for electrical connection. Being as metal bulges formed on weld pads of chip, lugs are in use for connecting piece of electrical connection between weld pad and end point section of terminal module. Lugs are arranged along transverse direction. Each lug includes first section block and second section block. In long direction, first section block and second section block are connected to each other electrically. The first section block is contacted to weld pad electrically. Size of second section block is larger than size of first section block along transverse direction. Second section block is in use for electrical connection between chip and end point section of terminal module. First section blocks and second section blocks in adjacent lug form staggered arrangement.
Description
Technical field
The present invention relates to a kind of chip with projection cube structure, it is especially in regard to the metal end that the electric output of chip is provided.
Background technology
In the known chip with projection cube structure, the metallization that this chip manufacture of semiconductor forms partly as chip export/go into to be electrically connected weld pad, this projection cube structure is then for being electrically connected pairing metallization partly, in order to form the partly electric output of those metallization/go into.Usually, be probe in the system in order to cooperate chip testing, or in order to cooperate the routing device of Chip Packaging journey in continuing, it is long-pending that the projection cube structure of this class chip can have bigger plane, in order to guarantee to test or the reliability of routing.Because manufacture of semiconductor development of technology now, the live width of the chip of manufacturing is more and more littler, makes that the spacing of those weld pads is more and more littler, and reaches the purpose of chip microminiaturization gradually.Yet, because the test or the restriction of routing device, make that projection cube structure can't microminiaturization, so the present inventor makes area of chip be dwindled more because the known male block structured restriction of chip is urgently thought invention and improved a kind of projection cube structure.
Summary of the invention
Main purpose of the present invention is to provide a kind of chip with projection cube structure, and it provides chip to carry out electric output.
Another object of the present invention is to provide a kind of chip with projection cube structure, its projection that provides chip to carry out electric output forms arrangement architecture closely.
In order to reach above-mentioned purpose of the present invention, the invention provides a kind of chip with projection cube structure, it comprises chip, several weld pads and several projections.This chip is the microcircuit that integrated circuit technique constitutes; Those weld pads are respectively the metallization part on this chip, are electrically connected in order to conduct; And those projections are formed metal protuberance thing on the weld pad of this chip, in order to the interface that provides the weld pad of making chip and its end assembly end points district to be electrically connected; Wherein those projections are arranged along a transversely arranged direction, and each projection comprises first block and second block respectively, this first block and second block are electrically connected in a longitudinal direction mutually, this first block contacts with the weld pad of this chip is electric, this second block transversely the size of orientation greater than first block, and this second block is made chip and its end assembly end points district is electrically connected in order to provide, and first block in each projection on those adjacent welding-pads and second block form the state that interlaces and arrange.
Moreover this projection can be electrically connected institute mutually by first block of strip and circular second block and constitute.Perhaps, this projection presents the ladder type shape, and regional area can be defined as this first block and second block respectively.
For making those of ordinary skill in the art understand purpose of the present invention, feature and effect, now by following specific embodiment, and cooperate appended graphicly, the present invention is described as follows in detail.
Description of drawings
Fig. 1 has the view profile of the chip of projection cube structure for the present invention;
Fig. 2 has the vertical view of the chip of projection cube structure for the present invention;
Fig. 3 has the vertical view of another embodiment of chip of projection cube structure for the present invention;
Fig. 4 has the vertical view of the another embodiment of chip of projection cube structure for the present invention.
The explanation of figure number numbering
Transversely arranged direction 4
First vertical 5
Second vertical 6
Embodiment
Fig. 1 has the view profile of the chip of projection cube structure for the present invention; Fig. 2 has the vertical view of the chip of projection cube structure for the present invention.With reference to Figure 1 and Figure 2, the present invention is mainly in several weld pad 2 corresponding projections 3 that form projection of chip 1.This chip 1 is on same substrate, sees through the microcircuit that integrated circuit technique constitutes, and has specific electronic circuit; Those weld pads 2 are respectively the metallization part on this chip 1, are electrically connected in order to conduct; And formed metal protuberance thing on those projections 3 weld pad 2 that is this chip 1, in order to the interface that provides the weld pad 2 of making chip 1 and its end assembly end points district to be electrically connected.The concrete example of above-mentioned those projections 3 for example is golden projection (Gold Bumps).
Aforesaid several projections 3 are arranged along a transversely arranged direction 4, and each projection 3 comprises first block 31 and second block 32 respectively.This first block 31 and second block 32 are electrically connected mutually, weld pad 2 electric contacts of this first block 31 and this chip 1, transversely the size of orientation 4 is greater than first block 31 for this second block 32, and this second block 32 is made chip 1 and is electrically connected with its end assembly end points district in order to provide.For instance, those second blocks 32 are electrically connected through routing technology and its end assembly end points district.Defining the direction that this first block 31 extends to second block 32 is first vertical 5, the direction that this second block 32 extends to first block 31 is second vertical 6, those projections 3 be arranged so that first vertical 5 and second vertical 6 vertical transverse orientations 4, and first block 31 in the adjacent projection 3 and second block 32 form the state that interlaces and arrange, and make adjacent projection 3 form the first vertical 5 and second vertical 6 staggered state.Distribute based on first block 31 in those projections 3 and second block 32, therefore the spacing between each adjacent projections 3 can dwindle, and therefore can further dwindle the area of chip 1.
Aforesaid each projection 3 mainly is that in the vertical an end forms less lateral dimension, and the other end in the vertical forms bigger lateral dimension, small size end and the large scale end that sees through adjacent projections 3 put upside down opposed mutually again, make that adjacent projections 3 can be tightr, and therefore the waste of saving plane space can further dwindle the area of chip 1.
Fig. 3 has the vertical view of another embodiment of chip of projection cube structure for the present invention.Reach the notion of saving plane space based on aforementioned each projection 3, as shown in Figure 3, this projection 3 can be electrically connected institute mutually by first block 31 of strip and circular second block 32 and constitute.Moreover second block, 32 its shapes of Fig. 3 can be adopted with the geometry of two kinds of different in width up and down, for example adopt to fall the geometry of convex.
Fig. 4 has the vertical view of the another embodiment of chip of projection cube structure for the present invention.As shown in Figure 4, the ladder type area that can be formed by first block 31 and second block 32 of this projection 3.
Moreover, the embodiment of above-mentioned disclosed several projection cube structures of the present invention, only as the example explanation, all those of ordinary skill in the art are after understanding spirit of the present invention, first block 31 of this projection 3 and second block 32 can be changed and adopt other geometry, yet these variations still belong in the category of the present invention.
Though specific embodiment has been openly as above in the present invention; but its disclosed specific embodiment is not in order to limit the present invention; any those of ordinary skill in the art without departing from the spirit and scope of the present invention; when being used for a variety of modifications and variations; its change of doing all belongs to category of the present invention with retouching, and protection scope of the present invention is when looking being as the criterion that claim defines.
Claims (5)
1. chip with projection cube structure comprises:
Chip, the microcircuit that it constitutes for integrated circuit technique;
Several weld pads, the metallization part that it is respectively on this chip is electrically connected in order to conduct;
And
Several projections, it is a formed metal protuberance thing on the weld pad of this chip, in order to the interface that provides the weld pad of making chip and its end assembly end points district to be electrically connected;
Wherein, those projections are arranged along a transversely arranged direction, and each projection comprises first block and second block respectively, this first block and second block are electrically connected in a longitudinal direction mutually, this first block contacts with the weld pad of this chip is electric, this second block transversely the size of orientation greater than first block, and this second block is made chip and its end assembly end points district is electrically connected in order to provide, and first block in each projection on those adjacent welding-pads and second block form the state that interlaces and arrange.
2. the chip with projection cube structure as claimed in claim 1 is characterized in that, this projection is electrically connected institute mutually by second block of first block of strip and rectangle and constitutes.
3. the chip with projection cube structure as claimed in claim 1 is characterized in that, this projection is electrically connected institute mutually by first block of strip and circular second block and constitutes.
4. the chip with projection cube structure as claimed in claim 1 is characterized in that this projection presents the ladder type shape, and regional area can be defined as this first block and second block respectively.
5. the chip with projection cube structure as claimed in claim 1 is characterized in that, this projection is electrically connected institute mutually by second block of first block of a strip and any geometry and constitutes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510126191 CN100481423C (en) | 2005-11-30 | 2005-11-30 | Chip with projection cube structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200510126191 CN100481423C (en) | 2005-11-30 | 2005-11-30 | Chip with projection cube structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1979830A CN1979830A (en) | 2007-06-13 |
| CN100481423C true CN100481423C (en) | 2009-04-22 |
Family
ID=38130930
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200510126191 Expired - Fee Related CN100481423C (en) | 2005-11-30 | 2005-11-30 | Chip with projection cube structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100481423C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105116578A (en) * | 2015-09-06 | 2015-12-02 | 深圳市华星光电技术有限公司 | Drive chip structure and liquid crystal display device |
-
2005
- 2005-11-30 CN CN 200510126191 patent/CN100481423C/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN1979830A (en) | 2007-06-13 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20090422 Termination date: 20111130 |