CN100464976C - High temperature resistant resin board and its preparation method - Google Patents
High temperature resistant resin board and its preparation method Download PDFInfo
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- CN100464976C CN100464976C CNB031508154A CN03150815A CN100464976C CN 100464976 C CN100464976 C CN 100464976C CN B031508154 A CNB031508154 A CN B031508154A CN 03150815 A CN03150815 A CN 03150815A CN 100464976 C CN100464976 C CN 100464976C
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- fire resistant
- resin liquid
- resistant resin
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Abstract
A refractory resin plate for flexible circuit board is composed of refractory upper resin layer and lower substrate layer. Its preparing process includes such steps as preparing resin liquid, defoaming, coating it on substrate, and baking.
Description
Technical field
The present invention relates to a kind of mechanical electric element and preparation method thereof, relate in particular to a kind of fire resistant resin plate and preparation method thereof.
Background technology
Flexible PCB is that a kind of softness is collapsible, is provided with the circuit board of printed circuit above, generally is used for the manufacturing of Liquid Crystal Module, as mobile phone Liquid Crystal Module, notebook computer Liquid Crystal Module etc.And Liquid Crystal Module is shown, must be on flexible PCB components and parts such as mounting semiconductor IC chip and resistance capacitance, again through 220
0Hot setting about C forms.But want components and parts such as mounting semiconductor IC chip and resistance capacitance, flexible PCB must be fixed on a kind of resistant to elevated temperatures hardboard, just can carry out mounting of components and parts.Existing flexible PCB location technology is to cling along the flexible circuit panel edges with high temperature resistant adhesive tape, sticks on the high temperature resistant plate, with components and parts such as mounting semiconductor chips and resistance capacitances again.Owing to be to paste by hand with adhesive tape, its positioning accuracy is difficult to grasp, and the not reproducible use of adhesive tape, production cost is bigger.
Summary of the invention
Purpose of the present invention is in order to solve the problem that the flexible PCB positioning accuracy that exists in the prior art is difficult to grasp, and a kind of fire resistant resin plate that is used for the sticking flexible circuit board and preparation method thereof is provided.
To achieve these goals, the technical solution used in the present invention is: a kind of fire resistant resin plate, be characterized in, described fire resistant resin plate is a double-decker, comprise upper strata fire resistant resin layer and lower floor's substrate layer, described fire resistant resin is mixed by silicon rubber 50-95% (weight) and antisatic additive 5-50% (weight).
Described silicon rubber is selected from one or more in dimethyl polysiloxane, organic silicon acrylic ester, dimethicone and the dimethyl diethoxy methyl-monosilane.
Described antisatic additive is selected from a kind of in silica, silver oxide, polyethers, aluminium oxide and the carbon black.
Described substrate is aluminium alloy plate or glass mat.
A kind of preparation method of above-mentioned fire resistant resin plate may further comprise the steps:
Step 1, preparation resin liquid
Press the proportioning metering of silicon rubber 50-95% (weight), antisatic additive 5-50% (weight), get a certain amount of silicon rubber and antisatic additive and mix, fully stir and be prepared into resin liquid;
Step 2, deaeration are handled
Step 1 gained resin liquid is placed in the vacuum extractor, vacuumize the bubble of sloughing in the resin liquid, or step 1 gained resin liquid placed in 3-5 ℃ the refrigerator, leave standstill the bubble of sloughing in the resin liquid in 5-10 hour;
Step 3, coated with resins liquid
Evenly be coated in step 2 gained resin liquid on the substrate;
Step 4, drying forming
The substrate that step 3 gained is scribbled resin liquid places baking oven, is warming up to 200 gradually
0C is at 200-300
0C toasted 5-30 minute down, was shaped to the fire resistant resin plate.
In described step 3, directly step 2 gained resin liquid evenly is coated on the substrate by hand.
In described step 3, the corrosion resistant plate that has mesh is pressed on the substrate, pour step 2 gained resin liquid into and evenly apply.
Fire resistant resin plate of the present invention is solidificated on the substrate owing to fire resistant resin is directly applied, thereby when the sticking flexible circuit board, above can directly flexible PCB being sticked on, simple to operate quick, the location is raising accurately.Because the fire resistant resin plate can use repeatedly, can save a large amount of adhesives, reduces production costs.Because the edge that has been produced when not had with adhesive tape sticking flexible circuit module provides new tool for developing littler trickleer flexible circuit module from now on.Can be widely used in microelectronics, semiconductor packages field.
Description of drawings
Fig. 1 is the structure cutaway view of invention fire resistant resin plate.
The specific embodiment
Referring to Fig. 1, fire resistant resin plate of the present invention is a double-decker, comprises upper strata fire resistant resin layer 1 and lower floor's substrate layer 2, and fire resistant resin is mixed by silicon rubber 50-95% (weight) and antisatic additive 5-50% (weight).Silicon rubber is selected from one or more in dimethyl polysiloxane, organic silicon acrylic ester, dimethicone and the dimethyl diethoxy methyl-monosilane.Antisatic additive is selected from a kind of in silica, silver oxide, polyethers, aluminium oxide and the carbon black.Substrate 2 is aluminium alloy plate or glass mat.
The preparation method of fire resistant resin plate of the present invention, carry out according to the following steps:
At first press the proportioning metering of silicon rubber 50-95% (weight), antisatic additive 5-50% (weight), get a certain amount of silicon rubber and antisatic additive and mix, fully stir and be prepared into resin liquid; Then the gained resin liquid is placed and carry out application of vacuum in the vacuum extractor, vacuumize the bubble of sloughing in the resin liquid, or the gained resin liquid placed in 3-5 ℃ the refrigerator, leave standstill the bubble of sloughing in the resin liquid in 5-10 hour; Evenly be coated in the gained resin liquid on the substrate then; Painting method can be directly evenly to be coated in resin liquid on the substrate by hand; Also can be that the corrosion resistant plate that will have mesh is pressed on the substrate, pour resin liquid into and evenly apply.The substrate that will scribble resin liquid at last places baking oven, is warming up to 200 gradually
0C is at 200-300
0C toasted 5-30 minute down, promptly was shaped to the fire resistant resin plate.
Embodiment 1
Get dimethyl polysiloxane 75 grams, silica 25 gram mixing, fully stir and be prepared into resin liquid; Then the gained resin liquid is placed and carry out application of vacuum in the vacuum extractor, vacuumize the bubble of sloughing in the resin liquid, evenly be coated in the gained resin liquid on the aluminium alloy plate then; The aluminium alloy plate that will scribble resin liquid at last places baking oven, is warming up to 200 gradually
0C is at 200-300
0C toasted 5 minutes down, promptly was shaped to the fire resistant resin plate.
Embodiment 2
Get dimethyl polysiloxane 50 grams, silica 50 gram mixing, fully stir and be prepared into resin liquid; Then the gained resin liquid is placed and carry out application of vacuum in the vacuum extractor, vacuumize the bubble of sloughing in the resin liquid, evenly be coated in the gained resin liquid on the aluminium alloy plate then; The substrate that will scribble resin liquid at last places baking oven, is warming up to 200 gradually
0C is at 200-300
0C toasted 10 minutes down, promptly was shaped to the fire resistant resin plate.
Embodiment 3
Get dimethyl polysiloxane 95 grams, silica 5 gram mixing, fully stir and be prepared into resin liquid; Then the gained resin liquid is placed and carry out application of vacuum in the vacuum extractor, vacuumize the bubble of sloughing in the resin liquid, evenly be coated in the gained resin liquid on the aluminium alloy plate then; The substrate that will scribble resin liquid at last places baking oven, is warming up to 200 gradually
0C is at 200-300
0C toasted 20 minutes down, promptly was shaped to the fire resistant resin plate.
Embodiment 4
Mixture 75 grams, silver oxide 25 grams of getting dimethyl polysiloxane and organic silicon acrylic ester mix, and fully stir and are prepared into resin liquid; Then the gained resin liquid is placed and carry out application of vacuum in the vacuum extractor, vacuumize the bubble of sloughing in the resin liquid, evenly be coated in the gained resin liquid on the glass mat then; The aluminium alloy plate that will scribble resin liquid at last places baking oven, is warming up to 200 gradually
0C is at 200-300
0C toasted 15 minutes down, promptly was shaped to the fire resistant resin plate.
Embodiment 5
Mixture 50 grams, silver oxide 50 grams of getting dimethyl polysiloxane and organic silicon acrylic ester mix, and fully stir and are prepared into resin liquid; Then the gained resin liquid is placed and carry out application of vacuum in the vacuum extractor, vacuumize the bubble of sloughing in the resin liquid, evenly be coated in the gained resin liquid on the glass mat then; The substrate that will scribble resin liquid at last places baking oven, is warming up to 200 gradually
0C is at 200-300
0C toasted 25 minutes down, promptly was shaped to the fire resistant resin plate.
Embodiment 6
Mixture 95 grams, silver oxide 5 grams of getting dimethyl polysiloxane and organic silicon acrylic ester mix, and fully stir and are prepared into resin liquid; Then the gained resin liquid is placed and carry out application of vacuum in the vacuum extractor, vacuumize the bubble of sloughing in the resin liquid, evenly be coated in the gained resin liquid on the glass mat then; The substrate that will scribble resin liquid at last places baking oven, is warming up to 200 gradually
0C is at 200-300
0C toasted 30 minutes down, promptly was shaped to the fire resistant resin plate.
Deaeration in the various embodiments described above is handled, and also can be the gained resin liquid is placed in 3-5 ℃ the refrigerator, leaves standstill deaeration in 5-10 hour, and effect is the same.
Aluminium alloy plate in the various embodiments described above and glass mat can exchange, and effect is the same.
With the dimethyl polysiloxane in dimethicone or above-mentioned each example of dimethyl diethoxy methyl-monosilane replacement or the mixture of dimethyl polysiloxane and organic silicon acrylic ester, with silica or the silver oxide in polyethers, aluminium oxide or above-mentioned each example of carbon black replacement, through same step, can make fire resistant resin plate of the present invention.
Claims (7)
1, a kind of fire resistant resin plate that is used to locate flexible PCB, it is characterized in that: described fire resistant resin plate is a double-decker, comprise upper strata fire resistant resin layer and lower floor's substrate layer, described fire resistant resin is mixed by silicon rubber 50-95% (weight) and antisatic additive 5-50% (weight).
2, fire resistant resin plate according to claim 1 is characterized in that: described silicon rubber is selected from one or more in dimethyl polysiloxane, organic silicon acrylic ester, dimethicone and the dimethyl diethoxy methyl-monosilane.
3, fire resistant resin plate according to claim 1 is characterized in that: described antisatic additive is selected from a kind of in silica, silver oxide, polyethers, aluminium oxide and the carbon black.
4, fire resistant resin plate according to claim 1 is characterized in that: described substrate is aluminium alloy plate or glass mat.
5, the preparation method of the described fire resistant resin plate of a kind of claim 1, it is characterized in that: this preparation method may further comprise the steps:
Step 1, preparation resin liquid
Press the proportioning metering of silicon rubber 50-95% (weight), antisatic additive 5-50% (weight), get a certain amount of silicon rubber and antisatic additive and mix, fully stir and be prepared into resin liquid;
Step 2, deaeration are handled
Step 1 gained resin liquid is placed in the vacuum extractor, vacuumize the bubble of sloughing in the resin liquid, or step 1 gained resin liquid placed in 3-5 ℃ the refrigerator, leave standstill the bubble of sloughing in the resin liquid in 5-10 hour;
Step 3, coated with resins liquid
Evenly be coated in step 2 gained resin liquid on the substrate;
Step 4, drying forming
The substrate that step 3 gained is scribbled resin liquid places baking oven, is warming up to 200 ℃ gradually, toasts 5-30 minute down at 200-300 ℃, is shaped to the fire resistant resin plate.
6, the preparation method of fire resistant resin plate according to claim 5 is characterized in that: in described step 3, directly step 2 gained resin liquid evenly is coated on the substrate by hand.
7, the preparation method of fire resistant resin plate according to claim 5 is characterized in that: in described step 3, the corrosion resistant plate that has mesh is pressed on the substrate, pours step 2 gained resin liquid into and evenly apply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031508154A CN100464976C (en) | 2003-09-05 | 2003-09-05 | High temperature resistant resin board and its preparation method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB031508154A CN100464976C (en) | 2003-09-05 | 2003-09-05 | High temperature resistant resin board and its preparation method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1590079A CN1590079A (en) | 2005-03-09 |
| CN100464976C true CN100464976C (en) | 2009-03-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB031508154A Expired - Fee Related CN100464976C (en) | 2003-09-05 | 2003-09-05 | High temperature resistant resin board and its preparation method |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100464976C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102497170A (en) * | 2011-12-06 | 2012-06-13 | 爱普科斯科技（无锡）有限公司 | Carrier device for laminate surface diagram mounting and reflow soldering |
| CN103042796B (en) * | 2013-01-07 | 2015-06-10 | 惠州宝柏包装有限公司 | Antistatic polyethylene film and preparation method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4871607A (en) * | 1986-03-10 | 1989-10-03 | Kabushiki Kaisha Seibu Giken | Humidity exchanger element |
-
2003
- 2003-09-05 CN CNB031508154A patent/CN100464976C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4871607A (en) * | 1986-03-10 | 1989-10-03 | Kabushiki Kaisha Seibu Giken | Humidity exchanger element |
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| CN1590079A (en) | 2005-03-09 |
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Granted publication date: 20090304 |