CN100460090C - Method of utizing jet in preparing anisotropic conductive adhesive film - Google Patents
Method of utizing jet in preparing anisotropic conductive adhesive film Download PDFInfo
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- CN100460090C CN100460090C CNB200510019728XA CN200510019728A CN100460090C CN 100460090 C CN100460090 C CN 100460090C CN B200510019728X A CNB200510019728X A CN B200510019728XA CN 200510019728 A CN200510019728 A CN 200510019728A CN 100460090 C CN100460090 C CN 100460090C
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- discharging head
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- 238000000034 method Methods 0.000 title claims abstract description 32
- 239000002313 adhesive film Substances 0.000 title abstract 3
- 239000007788 liquid Substances 0.000 claims abstract description 56
- 239000002245 particle Substances 0.000 claims abstract description 34
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- 238000002347 injection Methods 0.000 claims description 29
- 239000007924 injection Substances 0.000 claims description 29
- 238000007599 discharging Methods 0.000 claims description 23
- 238000000576 coating method Methods 0.000 claims description 21
- 239000011248 coating agent Substances 0.000 claims description 20
- 239000007921 spray Substances 0.000 claims description 16
- 239000012528 membrane Substances 0.000 claims description 11
- 238000001035 drying Methods 0.000 claims description 6
- 238000002360 preparation method Methods 0.000 claims description 6
- 238000007774 anilox coating Methods 0.000 claims description 3
- 239000012467 final product Substances 0.000 claims description 3
- 238000005096 rolling process Methods 0.000 claims description 3
- 238000010345 tape casting Methods 0.000 claims description 3
- 230000001105 regulatory effect Effects 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 abstract description 3
- 238000004377 microelectronic Methods 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 description 12
- 238000010586 diagram Methods 0.000 description 8
- 230000005540 biological transmission Effects 0.000 description 7
- 238000005507 spraying Methods 0.000 description 7
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 239000000178 monomer Substances 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000996 additive effect Effects 0.000 description 3
- -1 fatty acid ester Chemical group 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 229910052759 nickel Inorganic materials 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- BAPJBEWLBFYGME-UHFFFAOYSA-N Methyl acrylate Chemical compound COC(=O)C=C BAPJBEWLBFYGME-UHFFFAOYSA-N 0.000 description 2
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 2
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 2
- 150000001412 amines Chemical class 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 239000003093 cationic surfactant Substances 0.000 description 2
- 239000003638 chemical reducing agent Substances 0.000 description 2
- 239000007822 coupling agent Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000007800 oxidant agent Substances 0.000 description 2
- 230000001590 oxidative effect Effects 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 2
- 239000004810 polytetrafluoroethylene Substances 0.000 description 2
- 238000007639 printing Methods 0.000 description 2
- 150000003254 radicals Chemical class 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 125000000391 vinyl group Chemical group [H]C([*])=C([H])[H] 0.000 description 2
- 229920002554 vinyl polymer Polymers 0.000 description 2
- DNIAPMSPPWPWGF-GSVOUGTGSA-N (R)-(-)-Propylene glycol Chemical compound C[C@@H](O)CO DNIAPMSPPWPWGF-GSVOUGTGSA-N 0.000 description 1
- YYPNJNDODFVZLE-UHFFFAOYSA-N 3-methylbut-2-enoic acid Chemical compound CC(C)=CC(O)=O YYPNJNDODFVZLE-UHFFFAOYSA-N 0.000 description 1
- DBCAQXHNJOFNGC-UHFFFAOYSA-N 4-bromo-1,1,1-trifluorobutane Chemical compound FC(F)(F)CCCBr DBCAQXHNJOFNGC-UHFFFAOYSA-N 0.000 description 1
- 101100433727 Caenorhabditis elegans got-1.2 gene Proteins 0.000 description 1
- VVQNEPGJFQJSBK-UHFFFAOYSA-N Methyl methacrylate Chemical compound COC(=O)C(C)=C VVQNEPGJFQJSBK-UHFFFAOYSA-N 0.000 description 1
- 229920000426 Microplastic Polymers 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 239000004411 aluminium Substances 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000007900 aqueous suspension Substances 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 229920001940 conductive polymer Polymers 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 229920006037 cross link polymer Polymers 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 1
- 239000002270 dispersing agent Substances 0.000 description 1
- 238000009826 distribution Methods 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005485 electric heating Methods 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000007720 emulsion polymerization reaction Methods 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N ethylene glycol Natural products OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- STVZJERGLQHEKB-UHFFFAOYSA-N ethylene glycol dimethacrylate Substances CC(=C)C(=O)OCCOC(=O)C(C)=C STVZJERGLQHEKB-UHFFFAOYSA-N 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229930195733 hydrocarbon Natural products 0.000 description 1
- 150000002430 hydrocarbons Chemical class 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- 239000011133 lead Substances 0.000 description 1
- 239000004579 marble Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910044991 metal oxide Inorganic materials 0.000 description 1
- 150000004706 metal oxides Chemical class 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 230000007935 neutral effect Effects 0.000 description 1
- 239000002736 nonionic surfactant Substances 0.000 description 1
- FATBGEAMYMYZAF-KTKRTIGZSA-N oleamide Chemical compound CCCCCCCC\C=C/CCCCCCCC(N)=O FATBGEAMYMYZAF-KTKRTIGZSA-N 0.000 description 1
- FATBGEAMYMYZAF-UHFFFAOYSA-N oleicacidamide-heptaglycolether Natural products CCCCCCCCC=CCCCCCCCC(N)=O FATBGEAMYMYZAF-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 238000010557 suspension polymerization reaction Methods 0.000 description 1
- 229910052718 tin Inorganic materials 0.000 description 1
- 239000011135 tin Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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Abstract
The present invention provides one jet set and the method of using the jet in preparing anisotropic conductive adhesive film. The jet set includes one working platform, one heating base board, one upper shift assembly, and one liquid drop generator in the shift assembly and including one liquid drop nozzle, one liquid supplying unit, one controlling unit, one pair of tracks and one pair of columns. After receiving the signal from the control terminal, the controlling unit operates and the nozzle jets liquid drop containing conducting particles to form conducting layer. The present invention can locate the conducting component effectively through simple operation, and can form anisotropic conductive adhesive film for connecting microelectronic elements and devices with low failure rate and low cost.
Description
Technical field
The present invention relates to a kind of device that utilizes liquid droplet ejection apparatus to prepare the method for anisotropic conductive film and realize this method.
Background technology
Along with the high speed development of microelectric technique, the application of small chip, large scale integrated circuit, super large-scale integration is more and more general, and this is more and more higher to the requirement as the connection material-anisotropic conductive film of microelectronic component.
Routinely, the conductive compositions in the anisotropic conductive film is random even distribution, and fully mixing again by resin binder and conductive compositions, tiling forms.When connecting meticulousr electronic circuit, the phenomenon that short circuit often occurs or open circuit.Therefore, the orderly discharging of conductive compositions match circuit just becomes very important problem.At the problem of above-mentioned existence, several solutions is also arranged at present, as Japanese SUMITOMO ELECTRIC INDUSTRIES, LTD propose with magnetic field realize conducting particles the location method and adopt the method etc. of intaglio printing e-inks.These schemes or operation easier is big, cost is high again, or effect is not too obvious, so the present invention arises at the historic moment.
Summary of the invention
Purpose of the present invention will overcome the deficiencies in the prior art exactly, a kind of device that utilizes liquid droplet ejection apparatus to prepare the method for anisotropic conductive film and realize this method is provided, adopt drop to spray and form conductive layer, thereby can realize the location of conductive compositions easily, it is easy and simple to handle, effective location of conductive compositions makes that cost reduces as connection material-anisotropic conductive film short circuit or the minimizing of breaking phenomena incidence in meticulous electronic circuit of microelectronic component.
The objective of the invention is to be achieved through the following technical solutions:
A kind of method of utilizing injection apparatus to prepare anisotropic conductive film, this method comprises the following steps:
(1) resin-made membrane or the surperficial support level that has resin bed are passed through apparatus for coating 1, coating ground floor insulative resin;
(2) the object level that will be coated with the ground floor insulative resin is an injection apparatus by workbench, mobile S
1, S
1=1～100 μ m stop, t, and t=0.01～5 second, at t in time second, after the liquid that injector head will contain metallic was finished once complete injection along guide rail, slide block stopped at guide rail one side, and this object is moved horizontally S, S=S again
1+ S
2μ m stops t second, and at t in time second, the liquid that injector head will contain metallic is finished another injection along guide rail, and slide block stops at the opposite side of guide rail, so repeats, and just having formed width on the ground floor insulative resin object is S
2, S
2=1～100 μ m, spacing is S
1The conductive layer of μ m;
(3) object that will form conductive layer again level by apparatus for coating 2, coating outermost layer insulative resin; Being cut into the specification that needs gets final product.
Apparatus for coating 1 of the present invention and apparatus for coating 2 are for revolving rubbing method or knife coating or the anilox roll method of getting rid of.
A kind of liquid droplet ejection apparatus that is used to realize said method, this device comprises:
(a) spray device arrangement a workbench, above abswolute level a heatable soleplate is installed, pair of guide rails and pair of columnar thing, guide rail and column are fastened on the workbench with screw orthogonally;
(b) top moving-member, in this moving-member droplet generator is installed, droplet generator comprises a droplet discharging head, droplet discharging head liquid supply part, droplet discharging head is fixed on the slide block, and vertically face heatable soleplate, the linear electric machine (not shown) drives the control slide block and slides along guide rail, the moving direction (Y-axis) of the preparation object on guide rail direction (X-axis) and the heatable soleplate is vertical, makes the conductive layer that is ejected on the preparation object at 0.2 second time inner drying by regulating the control of heatable soleplate temperature.
(c) the droplet discharging head liquid supply part is by a liquid container, a container cover, jar and droplet discharging head control assembly (26) constitute, after receiving the signal that TCE terminal control element sends, the droplet discharging head control assembly is started working, the liquid component that liquid injection apparatus ejects is a conducting particles, and conductive layer is continuous linearity.
Injection apparatus of the present invention, what it is characterized in that spray device arrangement is single shower nozzle, and the shower nozzle diameter is at 8～25 μ m.
Injection apparatus of the present invention is characterized in that the liquid in the liquid container of injection apparatus is the conducting particles that contains the 20%-80% mass percentage concentration, and the diameter of conducting particles is 0.1～10 μ m.
Description of drawings
Fig. 1 makes the flow chart of anisotropic conductive film for the present invention.
Fig. 2 sprays the form of the conductive layer of formation for the present invention.
Fig. 3 is the overall structure schematic diagram of injection apparatus of the present invention.
Fig. 4 is the droplet generator of injection apparatus of the present invention.
Fig. 5 is the internal structure schematic diagram of heatable soleplate device of the present invention.
Fig. 6 is a transmission device schematic diagram of the present invention.
Fig. 7 is for realizing work schematic diagram of the present invention.
The specific embodiment:
Spray the aspect graph that forms conductive layer for anisotropic conductive film preparation method's of the present invention flow chart and the present invention as depicted in figs. 1 and 2, the manufacture method of anisotropic conductive film 14 comprises following three steps successively: (1) has coating one deck insulative resin 11 on the support 10 of resin bed at resin-made membrane or surface; (2) liquid component that contains metal conductive particles that will make from liquid droplet ejecting head is ejected into the resin bed formation conductive layer 12 that step (1) forms; (3) coating one deck insulative resin 13 on the conductive layer 12 that step (2) forms.
Compositions such as antiseize resin that described coating ground floor insulating resin is a class such as silicone oil resin, polyamide, oleamide and antistatic additive, antistatic additive mainly is based on nonionic and cationic surfactant, the compound of main employing hydroxyethylation fatty amine, quaternary amine, fatty acid ester antistatic additive etc., the composition of each component is by weight:
100 parts of antiseize resins
Antistatic resin 1-5 part.
The used decentralized medium of liquid that described liquid droplet ejection apparatus sprays must be oil-soluble, as long as can the dispersed electro-conductive particle and do not produce caking, employed decentralized medium is not had special restriction, and its composition mainly contains aliphatic alcohol, aliphatic ester, organic solvent (as alcohols, hydro carbons, ether, ester, ketone etc.), cationic surfactant etc.
The used conducting particles of liquid component in the liquid droplet ejection apparatus so long as the good metallic of electric conductivity all may be utilized, the conductive micro-balloons described in application for a patent for invention number 200510018992.1 patents for example, its seed that to be vinyl monomer make with the method for non-aqueous suspension polymerization is a styrene at polymerization single polymerization monomer, methyl methacrylate, AMS, vinyl monomer and glycol diacrylates such as methyl acrylate, the diglycol diacrylate, ethylene glycol dimethacrylate, cross-linking monomer mixed emulsions such as diglycol dimethylacrylate carry out method of emulsion polymerization and make that to have cross-linked polymer be shell, the lower molecular weight polymer is the polymer microballoon of core, polymer microballoon plating nickel on surface and gold with above-mentioned preparation obtains the electric conductive polymer microballoon then, and the composition of each component is by weight:
100 parts in decentralized medium
Dispersant 0.1-0.5 part
The mass percentage concentration 20%-80% of conducting particles.
The material of described coating outermost layer insulating resin is described by number of patent application 200510018856.2, be the composition such as Oxidizing and Reducing Agents, coupling agent, age resistor of a kind of polymerism resin that contains free radical, microencapsulation, the composition of each component is by weight:
100 parts of polymerism resins that contain free radical
Oxidizing and Reducing Agents 5-10 part of microencapsulation
Coupling agent 1-5 part
Age resistor 0.5-3 part.
As long as can reach the accuracy of setting, above-mentioned steps (a), (c) can adopt common coating method, as: the layer 13 that step (c) forms is thinner than the layer 11 that step (a) forms, and represents thickness with alphabetical t, t
13=revolve 0.5～0.95t such as getting rid of rubbing method, knife coating, anilox roll method
11, this is because drop is ejected into solvent scattering and permeating effect (seeing the 3C among Fig. 3), the bottom portion embeding layer 11 (seeing the 3D among Fig. 3) of the conductive layer that droplet drying forms to be arranged before the drying on the layer 11.According to actual needs, also allow evenly to disperse the part conductive compositions in layer 11, the layer 13.
In fact jet printing has taken place in above-mentioned steps (b), after liquid droplet ejection apparatus receives the working signal that TCE terminal control element sends, beginning is sprayed along straight line, and repeats by setting constantly, finally sprays the linear fringe shape (seeing the 3E among Fig. 3) that the conductive layer that forms is orderly arrangement.
Liquid droplet ejection apparatus of the present invention configuration be single shower nozzle, shower nozzle moving linearly only during injection is so can obtain continuous preferably injection conductive layer.
Liquid droplet ejection apparatus of the present invention should adopt the random mode spraying technique, and it just begins to spray along straight line after only receiving the working signal that TCE terminal control element sends.The present invention also can adopt the continous way spraying technique, compare with random mode have complex structure, separately retracting device be set, shower nozzle needs the efficient of pressue device and working method not high enough, and it is accurate inadequately, and the random mode spraying technique can overcome the problems referred to above, is the best spraying technique that the present invention should adopt.This spraying technique significantly also has application in the printer in HP Designjet 30 grades.
What liquid droplet ejection apparatus of the present invention used is little piezoelectric type shower nozzle, and the shower nozzle diameter is at 8～25 microns.Micro Piezo technology is divided into 3 stages to the control of the drop in the course of injection: before the spraying, piezoelectric element at first shrinks under the control of signal slightly; Then, element produces once bigger extension, and drop is released shower nozzle; In the moment that drop will fly away from shower nozzle, element can shrink again, and clarity ground shrinks the drop liquid level from shower nozzle at once.Like this, the drop liquid level has obtained accurate control, and the drop of each ejection all has perfect shape and correct heading.
The basic demand of the liquid component that liquid droplet ejection apparatus of the present invention sprays is that low surface tension, low viscosity, relative density are little, and drying property is fast etc., and pH value is neutral basically, avoids corroding shower nozzle.Comprise conducting particles in the liquid component that liquid droplet ejection apparatus of the present invention sprays, conducting particles is as long as electric conductivity is good, there is no particular restriction, metallic, as nickel, iron, copper, aluminium, tin, lead, cobalt, gold, silver, palladium, titanium, rhodium etc., metal oxide, carbon, graphite and have glass, pottery, plastic pellet of metal outer etc.The diameter of conducting particles is preferably between 0.1 μ m～10 μ m.If the diameter of conducting particles greater than 10 μ m, stops up shower nozzle easily during injection, if less than 0.1 μ m, then conduction is bad.The mass percentage concentration of conducting particles is preferably 20%～80%.The viscosity of the liquid component that liquid droplet ejection apparatus of the present invention sprays is moderate, and the too big injection of viscosity is not smooth, stops up shower nozzle easily yet, and too Xiao Yi produces damped oscillation, influences jet velocity, and its optimum range is 0.0015～0.0035pas.The surface tension of the liquid component that liquid droplet ejection apparatus of the present invention sprays preferably between 0.02～0.05N/m, its surface tension too greatly, the too little accuracy of spray that all influences.Be advisable less than 0.2 second the drying time of the liquid component that liquid droplet ejection apparatus of the present invention sprays.
Fig. 3 is the overall structure perspective diagram of injection apparatus of the present invention.This injection apparatus 20 has mainly disposed a workbench 21,22, one guide rails 23 of heatable soleplate and pair of columnar thing 27a; A top moving-member 31 is equipped with droplet generator and comprises 25, one droplet discharging head control assemblies 26 of 24, one droplet discharging head liquid supply parts of a droplet discharging head in this moving-member.
Top moving-member 31 firmly is fixed on the pair of columnar thing 27a of workbench 21 centres.Pair of guide rails 23, slide block 32, droplet discharging head 24 all are installed on the moving-member 31 of top, and droplet discharging head 24 is fixed on the slide block 32, and droplet discharging head 24 faces heatable soleplate 22, and is perpendicular.Linear electric machine (not marking among the figure) drives control slide block 32 and slides along guide rail 23, and resin-made membrane on guide rail 23 directions (X-axis) and the heatable soleplate 22 or the surperficial moving direction (Y-axis) that has a support of resin bed are vertical.
Droplet discharging head control assembly 26 has two effects: only after receiving the signal that TCE terminal control element 51 sends, and the one, the emitted dose of control drop; The 2nd, collaborative linear electric machine control slide block 32 is along guide rail 23 line slidings (for example moving by side to an other side, t=0.01～5 from one of guide rail 23 at time t in second).
Fig. 4 is the internal structure schematic diagram of droplet discharging head liquid supply part 25, and it is made of 34, one jars of 33, one container cover of 26, one liquid containers of a droplet discharging head control assembly 36.
Fig. 5 is a transmission device schematic diagram of the present invention.Transmission device of the present invention is actually an arbor wheel system that can accurately control rotation, drives arbor wheel by stepper motor (not marking among the figure), and the support that arbor wheel drives resin-made membrane or has a resin bed passes through along workbench.This transmission device also disposes the support that the collaborative stepper motors of a TCE terminal control element 51 control resin-made membrane jointly or have a resin bed to be passed through along workbench.TCE terminal control element 51 is a kind of have the interactive electronic device of computer function or computers of the relevant control program software of assembling, control assembly 26 controls of it and injection apparatus are interconnected, make injection apparatus and transmission device alternation, be that resin-made membrane or the support that has resin whenever move horizontally s (s=1～200) μ m dead time t second, interior droplet discharging head 24 moved along guide rail 23 with slide block 32 and finished a spraying (seeing that example 1 specifically describes) t second, when making anisotropic conductive film, must be in advance to TCE terminal control element 51 input signals.
Embodiment 1
Requirement produces and is suitable for electrode width 8 μ m, the anisotropic conductive film that distance between centers of tracks 5 μ m use:
According to above-mentioned requirements, as conducting particles, the conducting particles diameter is got 0.3 μ m with the conductive micro-balloons described in application number 200510018992.1 patents for we, and conducting particles concentration is 20%, and the shower nozzle diameter is 8 μ m, by following method operation.
Resin-made membrane or the surperficial support that has resin bed are passed apparatus for coating 1 successively, injection apparatus, apparatus for coating 2, the transmission device (see figure 7), regulate the heatable soleplate temperature to preference temperature, start apparatus for coating 1 and apparatus for coating 2, in advance to TCE terminal control element 51 input signals to start injection apparatus and transmission device, move 5 μ m when making support level that resin-made membrane or surface have a resin bed and stop 0.08 second by workbench, in 0.08 second time, after injector head is finished once complete injection along guide rail, slide block stops at guide rail one side, the support that resin-made membrane or surface have resin bed moves horizontally 13 μ m again, stop 0.08 second, in 0.08 second time, injector head is finished another injection along guide rail, slide block stops at the opposite side of guide rail, so repeat, just produce the anisotropic conductive film of above-mentioned requirements.At last the anisotropic conductive film that produces being cut into the specification that needs gets final product.
Embodiment 2
Requirement produces and is suitable for electrode width 20 μ m, the anisotropic conductive film that distance between centers of tracks 15 μ m use
According to above-mentioned requirements, as conducting particles, the conducting particles diameter is got 1 μ m with gold goal for we, and conducting particles concentration is 80%, and the shower nozzle diameter is 12 μ m, t=0.1 second.
Concrete operations are with embodiment 1
Embodiment 3
Requirement produces and is suitable for electrode width 40 μ m, the anisotropic conductive film that distance between centers of tracks 40 μ m use
According to above-mentioned requirements, as conducting particles, cut-off directly is 2 μ m with the nickel ball for we, and conducting particles concentration is 65%, and the shower nozzle diameter is 15 μ m, t=0.3 second.
Concrete operations are with embodiment 1.
Embodiment 4
Requirement produces and is suitable for electrode width 60 μ m, the anisotropic conductive film that distance between centers of tracks 60 μ m use
According to above-mentioned requirements, as conducting particles, the conducting particles diameter is taken as 6 μ m with copper powder for we, and conducting particles concentration is 60%, and the shower nozzle diameter is 18 μ m, t=0.8 second.
Concrete operations are with embodiment 1.
Embodiment 5
Requirement produces and is suitable for electrode width 80 μ m, the anisotropic conductive film that distance between centers of tracks 80 μ m use
According to above-mentioned requirements, as conducting particles, the conducting particles diameter is 8 μ m with carbon dust for we, and conducting particles concentration is 40%, and the shower nozzle diameter is 22 μ m, t=2 second.
Concrete operations are with embodiment 1.
Embodiment 6
Requirement produces and is suitable for electrode width 100 μ m, the anisotropic conductive film that distance between centers of tracks 100 μ m use
According to above-mentioned requirements, as conducting particles, the conducting particles diameter is 10 μ m with glass marble with metal outer for we, and conducting particles concentration is 30%, and the shower nozzle diameter is 25 μ m, t=5 second.
Concrete operations are with embodiment 1.
With the above-mentioned anisotropic conductive film that produces and their short circuit of the bonding measurement of electrode hot pressing and breaking phenomena, every example is measured 100 points, the results are shown in Table 1:
Table 1
Can find out along with the attenuating of circuit width that from last table 1 the anisotropic conductive film short circuit that former method is made becomes seriously with breaking phenomena, and the anisotropic conductive film of this patent method manufacturing has clear improvement to short circuit and breaking phenomena.
Claims (5)
1. method of utilizing liquid droplet ejection apparatus to prepare anisotropic conductive film, this method comprises the following steps:
(1) resin-made membrane or the surperficial support level that has resin bed are passed through apparatus for coating (1), coating ground floor insulative resin;
(2) the object level that will be coated with the ground floor insulative resin is an injection apparatus by workbench, mobile S
1, S
1=1～100 μ m stop t, t=0.01～5 second, and at t in time second, after the liquid that injector head will contain metallic was finished once complete injection along guide rail, slide block stopped at guide rail one side, and this object is moved horizontally S, S=S again
1+ S
2μ m stops t second, and at t in time second, the liquid that injector head will contain metallic is finished another injection along guide rail, and slide block stops at the opposite side of guide rail, so repeats, and just having formed width on the ground floor insulative resin object is S
2, S
2=1～100 μ m, spacing is S
1The conductive layer of μ m;
(3) object that will form conductive layer again level by apparatus for coating (2), coating outermost layer insulative resin; Being cut into the specification that needs gets final product.
2. the method for utilizing liquid droplet ejection apparatus to prepare anisotropic conductive film according to claim 1 is characterized in that: described apparatus for coating (1) and apparatus for coating (2) are for revolving rubbing method or knife coating or the anilox roll method of getting rid of.
3. liquid droplet ejection apparatus that is used to realize the method for claim 1, this device comprises:
(a) injection apparatus (20) has disposed a workbench (21), a heatable soleplate (22) is installed to top abswolute level, pair of guide rails (23) and pair of columnar thing (27a), guide rail and column are fastened on the workbench (21) with screw orthogonally;
(b) top moving-member (31), in this moving-member droplet generator is installed, droplet generator comprises a droplet discharging head (24), droplet discharging head liquid supply part (25), droplet discharging head (24) is fixed on slide block (32) and goes up, also vertically faces heatable soleplate (22), linear electric motor control slide block (32) slides along guide rail (23), the moving direction of the preparation object on guide rail direction and the heatable soleplate (22) is vertical, makes the conductive layer that is ejected on the preparation object at 0.2 second time inner drying by regulating the control of heatable soleplate (22) temperature.
(c) droplet discharging head liquid supply part (25) is by a liquid container (33), a container cover (34), a jar (36) and droplet discharging head control assembly (26) constitute, after receiving the signal that TCE terminal control element (51) sends, droplet discharging head control assembly (26) is started working, the liquid component that liquid injection apparatus ejects is a conducting particles, and conductive layer is continuous linearity.
4. liquid droplet ejection apparatus according to claim 3 is characterized in that: spray device arrangement be single shower nozzle, and the shower nozzle diameter is at 8～25 μ m.
5. liquid droplet ejection apparatus according to claim 3 is characterized in that: the liquid in the liquid container of injection apparatus (33) is the conducting particles that contains 20%～80% mass percentage concentration, and the diameter of conducting particles is 0.1～10 μ m.
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| CNB200510019728XA CN100460090C (en) | 2005-11-03 | 2005-11-03 | Method of utizing jet in preparing anisotropic conductive adhesive film |
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| CNB200510019728XA CN100460090C (en) | 2005-11-03 | 2005-11-03 | Method of utizing jet in preparing anisotropic conductive adhesive film |
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| CN100460090C true CN100460090C (en) | 2009-02-11 |
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| CN101972736A (en) * | 2010-09-29 | 2011-02-16 | 卓盈微电子（昆山）有限公司 | Tool for dispensing glue on flexible circuit board |
| CN103861772B (en) * | 2014-03-12 | 2017-01-25 | 王元 | Glue applying method and device |
| CN106475275A (en) * | 2016-12-03 | 2017-03-08 | 合肥国轩高科动力能源有限公司 | Coating device and coating method for lithium ion battery electrode |
| CN108722786A (en) * | 2017-04-18 | 2018-11-02 | 扬州汉龙电气有限公司 | A kind of flexible transparent conductive film intelligent coating apparatus and its application method |
| CN110124924B (en) * | 2019-05-06 | 2021-04-20 | 河北科技大学 | Automatic spraying device |
| CN112968116A (en) * | 2020-10-15 | 2021-06-15 | 重庆康佳光电技术研究院有限公司 | Chip bonding method and system, storage medium and electronic device |
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