CN1004528B - 电沉积金-碳化硅复合镀层 - Google Patents

电沉积金-碳化硅复合镀层 Download PDF

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CN1004528B
CN1004528B CN85100021.5A CN85100021A CN1004528B CN 1004528 B CN1004528 B CN 1004528B CN 85100021 A CN85100021 A CN 85100021A CN 1004528 B CN1004528 B CN 1004528B
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gold
composite deposit
sic
deposited
composite
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CN85100021.5A
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CN85100021A (zh
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郭鹤桐
王兆勇
邱训高
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Tianjin University
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Tianjin University
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Publication of CN85100021A publication Critical patent/CN85100021A/zh
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Abstract

一种用于继电器触点的抗电浸蚀的耐磨复合镀层，是用电镀方法沉积在铜合金或其他金属基体上、复合镀层中弥散有占镀层体积０．１～１０％，粒径小于０．５微米的ＳｉＣ微粒。这种金基复合镀层具有比纯金高的显微硬度，低的摩擦系数，接触电阻略大于金，但低于金．　　　　本发明提供一种具有非矩阵型遮光结构的平面显示器。非矩阵型遮光结构包括主遮光结构和辅助遮光结构，其中主遮光结构具有间隙和对应于像素区的主空间，而辅助遮光结构对应于主遮光结构的间隙。每一间隙对应于扫描线或信号线。每一主空间与至少一间隙合金，并且耐电浸蚀性、抗腐蚀及抗变色能力强，这种Ａｕ－ＳｉＣ复合镀层可在含有ＳｉＣ微粒的、氰化物的、酸性的及亚硫酸盐的镀金溶液中获得。连接，而每一间隙连接两相邻的主空间。＜＾＾＞

Description

电沉积金-碳化硅复合镀层
本发明涉及用作继电器触点材料的金基复合镀层。
制作弱电流、小功率、高灵敏度的继电器的电触点，通常采用纯金（包括电镀纯金）或金合金（包括电镀金合金）。金具有优良的导电导热性能，非常好的耐蚀性和抗变色能力，对有机污染的敏感性也很小。但是金的硬度低，抗液＊浸蚀能力差，且摩擦系数大（约为0.94），耐磨性差，价格昂＊
自本世纪六十年代以来，复合电沉积技术迅速发展。1969年培费尔（Peiffer）等人曾报导用电沉积方法获得Au-WC复合镀层用于干簧继电器的电触点。经检索1961到1984年的CA来发现有记载关于Au-SiC复合镀层用于继电器及其电化学形成工艺的文献或专利。
本发明的目的在于，用复合电镀技术在铜合金或其他金属材料基体上形成一薄层Au-SiC复合物表层。该复合物层将金的优良导电导热性，优异的化学稳定性与碳化硅的耐热耐磨性结合在一起，形成一种综合性能优良的复合镀层，用在继电器的触点上，可使继电器工作的可靠性和使用寿命大幅度提高。
本发明的特征是采用电化学沉积的方法，在铜合金或其他金属基体上沉积一薄层Au-SiC复合镀层，SiC微粒的含量占镀层体积的0.1～10%，粒径小于0.5微米。这种复合镀层具有硬度高，Hv达100～180，电镀金层的Hv在90左右，电镀金-钴合金的Hv为140～180，耐磨性好;摩擦系数小于0.5。作为继电器的电触点，Au-SiC复合镀层的接触电阻低，在接触压力为10克，电流10～40毫安条件下，接触电阻≤5mΩ，在同样条件下，金的接触电阻为3.5mΩ，金-钴合金为7mΩ，而且耐电浸蚀，抗腐蚀及抗变色能力强。
本发明的复合电镀工艺的特点在于，可以在氰化镀金液，酸性镀金液及亚硫酸盐镀金液等电解液中加入一定量的SiC微粒，在整个电镀过程中，使微粒在电解液中充分悬浮。本发明Au-SiC复合电镀工艺的一种实施方案如下：
金（以KAu（CN）2形式加入） 8～12克/升
柠檬酸氢二铵 80～110克/升
碳化硅微粒（粒径＜0.5微米） 0.1～10克/升
pH 5.4～5.8
镀液温度 30～50℃
阴极电流密度 0.1～0.5安/分米2
阳极用纯金或钛基镀铂电极。采用机械搅拌或镀液循环使SiC微粒在镀液中充分悬浮。镀层厚度根据需要可在2～50微米间选择。

Claims (2)

1、一种用作继电器电触点的金基复合镀层，其特征在于，镀层中弥散有占镀层体积0.1～10%，粒径小于0.5微米的SiC微粒。
2、权利要求1所述金基复合镀层的镀覆方法，其特征在于，在添加有0.1～10克/升粒径小于0.5微米的SiC微粒的，氰化物的、酸性的或亚硫酸盐的镀金电解液中将Au-SiC复合镀层沉积。在铜合金或其它金属基体上。
CN85100021.5A 1985-04-01 1985-04-01 电沉积金-碳化硅复合镀层 Expired CN1004528B (zh)

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CN1004528B true CN1004528B (zh) 1989-06-14

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1308496C (zh) * 2003-06-06 2007-04-04 吴化 一种提高金属表面耐高温和耐磨损的电沉积复合镀方法

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1074574C (zh) * 1998-09-18 2001-11-07 北京工业大学 金属基复合电封装热沉材料及其制备方法
CN105401180A (zh) * 2015-12-23 2016-03-16 苏州市金星工艺镀饰有限公司 一种耐磨镀金膜的电镀液及其电镀方法
CN105401181A (zh) * 2015-12-23 2016-03-16 苏州市金星工艺镀饰有限公司 一种环保无氰镀金电镀液的电镀方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1308496C (zh) * 2003-06-06 2007-04-04 吴化 一种提高金属表面耐高温和耐磨损的电沉积复合镀方法

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