CN100447942C - Cleaning clamp for wafer carrying bench of semiconductor machine - Google Patents
Cleaning clamp for wafer carrying bench of semiconductor machine Download PDFInfo
- Publication number
- CN100447942C CN100447942C CNB2004100922231A CN200410092223A CN100447942C CN 100447942 C CN100447942 C CN 100447942C CN B2004100922231 A CNB2004100922231 A CN B2004100922231A CN 200410092223 A CN200410092223 A CN 200410092223A CN 100447942 C CN100447942 C CN 100447942C
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- Prior art keywords
- cleaning
- wafer carrying
- carrying bench
- semiconductor machine
- clamp
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- Expired - Fee Related
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- 238000004140 cleaning Methods 0.000 title claims abstract description 109
- 239000004065 semiconductor Substances 0.000 title claims abstract description 27
- 230000004308 accommodation Effects 0.000 claims description 6
- 238000010521 absorption reaction Methods 0.000 claims description 2
- 239000012535 impurity Substances 0.000 abstract description 19
- 239000000463 material Substances 0.000 abstract description 2
- 230000009471 action Effects 0.000 description 6
- 238000005259 measurement Methods 0.000 description 5
- 230000008859 change Effects 0.000 description 4
- 230000000007 visual effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000003068 static effect Effects 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000047 product Substances 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000001149 cognitive effect Effects 0.000 description 1
- 239000000356 contaminant Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 230000008034 disappearance Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
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- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
The present invention relates to a cleaning clamp for a wafer carrying bench of a semiconductor machine, which mainly comprises a body part, a driving device, a power supply device and a cleaning module which is composed of a rotary base, an elastic element and a cleaning rotary disk, wherein the length of the body part can be freely adjusted, the front end of the body part is provided with containing space, the driving device is arranged in the containing space and motive power can be provided by the driving device. The power supply device is coupled to the driving device and is used for providing electric power source of the driving device. The rotary base is arranged adjacent to the side of the driving device and is connected with the cleaning rotary disk by the elastic element. The motive power is provided by the driving device, which enables the cleaning rotary disk to clean impurities of the wafer carrying bench of the semiconductor machine. The size or materials of the cleaning rotary disk can be replaced according to different cleaning requirements.
Description
Technical field
The present invention relates to a kind of cleaning clamp for wafer carrying bench of semiconductor machine, when particularly relating to a kind of wafer carrying bench cleaning that is used for semiconductor machine, the cleaning clamp of retractable.
Background technology
When the wafer carrying bench (Wafer Stage) of exposure machine has impurity (Particle) to produce, can cause wafer to produce defocusing phenomenon (Defocus), this moment, machine must stop to produce at once, removed the impurity on the wafer carrying bench.
Existing method commonly used is removed the wiping wafer carrying bench for using non-dust cloth to be stained with alcohol, and the manual type of cooperation flashlight lighting, but because existing employed 12 cun semiconductor machines, also be provided with the element of a lot of precisions near its wafer carrying bench, and it can be very low for the spatial altitude of wiping, the degree of depth that adds wafer carrying bench is dark again, puzzlement when often causing wiping personnel wiping wafer carrying bench, even and the wiping personnel are very careful, still have an opportunity to touch near the precision element that is provided with the wafer carrying bench, cause machine breakdown.
Take a broad view of the above, there is following shortcoming at least in existing wafer carrying bench cleaning mode:
One, existing wafer carrying bench cleaning mode because of semiconductor machine can be very low for the spatial altitude of wiping, adds that the degree of depth of wafer carrying bench is dark again, so be easy to take place the not problem of easy-clear of dead angle.
Two, existing wafer carrying bench cleaning mode, Chang Yinwei throw light on not enough, complexity and degree of difficulty when increasing cleaning, and then reduce the cleaning quality, influence the rate of finished products of subsequent wafer manufacturing process.
Three, existing wafer carrying bench cleaning mode owing to adopt the mode of manual wipping, runs into and adheres to the higher impurity of viscosity, and being difficult for influences the rate of finished products of subsequent wafer manufacturing process with contaminant removal.
Four, existing wafer carrying bench cleaning mode, when running into the other precision element of wafer carrying bench, just removal of contamination very fast, and accidentally just cause the infringement of machine easily.
Summary of the invention
So, how to design a kind of cleaning clamp for wafer carrying bench, can take into account the spatial altitude and the degree of depth of wiping wafer carrying bench simultaneously, and the convenience that increases the wiping wafer carrying bench, in the hope of reaching the purpose of removing fully with rapid cleaning, be the emphasis that this patent institute desire is inquired into.
Because the disappearance of prior art, the invention provides a kind of cleaning clamp for wafer carrying bench of semiconductor machine, little and the collapsing length arbitrarily of its volume, to overcome the problem at dead angle, add the mode of selecting suitable cleaning module rotating disk spin-cleaning, reach the purpose of the impurity of piling up on the thorough clean wafer microscope carrier.
In the preferred embodiment of the cleaning clamp for wafer carrying bench of semiconductor machine of the present invention, this cleaning clamp mainly comprises: a body, one drive unit, one power supply device and a cleaning module, wherein, body has a cleaning module end and a holding end of corresponding setting, wherein and can and also have an accommodation space at the cleaning module end, be used for holding drive unit and mutual, and the power supply device that power supply device couples is in drive unit, in order to the power source of drive unit to be provided, connect the cleaning module end that a cleaning module then is positioned at body in drive unit, this cleaning module rotary power that drive unit provided of can arranging in pairs or groups is rotated the action of clean wafer microscope carrier.
Preferred person, cleaning clamp can be equipped with lighting device, so do not have the not enough problem of illumination, the impurity on the also easier discovery wafer carrying bench is to increase the speed of cleaning.And the revolving force of the cleaning rotating disk that cleaning module utilizes in the preferred embodiment of the present invention carries out the cleaning of equipment, but also visual demand difference, change the rotating disk cleaning module of different qualities, for example: lean on cleaning module of static or vacuum suction or the like, be used for cleaning the static rotating disk of impurity, clean vacuum spin chuck of impurity or the like by vacuum action, to be applicable to the cleaning ambient of different demands.
Description of drawings
Fig. 1 is the preferred embodiment schematic diagram of the cleaning clamp for wafer carrying bench of semiconductor machine of the present invention.
Fig. 2 is the preferred use schematic flow sheet of the cleaning clamp for wafer carrying bench of semiconductor machine of the present invention.
The simple symbol explanation
100 body 100a cleaning module ends
102 power supply devices, 103 cleaning modules
1031 rotating basiss, 1032 flexible members
1033 cleaning rotating disks, 104 lighting devices
105 starting switches, 106 lighting switches
200 impurity produce
201 measurement flatness are to determine the impurity position
202 use this cleaning clamp cleaning
Whether 203 measurement flatness are confirmed to remove to finish
204 finish
Embodiment
For making feature of the present invention, purpose and function have further cognitive and understanding, conjunction with figs. describes in detail now.
As shown in Figure 1, it is the preferred embodiment schematic diagram of the cleaning clamp for wafer carrying bench of semiconductor machine of the present invention, wherein, cleaning clamp of the present invention mainly comprises: a body 100, be arranged in body 100 a drive unit 101 and, a power supply device 102, with, and with drive unit 101 and power supply device 102 interconnective cleaning modules 103., and body 100 has the cleaning module end 100a and the holding end 100b of corresponding setting, cleaning module then is arranged at cleaning module end 100a.Except stationary fixture length, also for example can use between cleaning module end 100a and the holding end 100b: expansion link is freely adjusted the length of flexible body 100, with the cleaning in response to various diverse locations, does not have any dead angle and produces.
The present invention and one accommodation space 1001 is set in cleaning module end 100a, and drive unit 101 is set in accommodation space 1001, to provide cleaning clamp required power, generally speaking, for example all be to use: motor is as drive unit 101.Power supply device 102 is coupled to drive unit 101, to provide drive unit 101 power sources, in this preferred embodiment, use battery to get final product as power supply device 102, because of the electric power that motor is required little, use battery just can reach the effect of driving,, can say suitable convenience and save cost so do not need numerous and diverse circuit to come power supply.
Because the major function of drive unit 101 and power supply device 102 is in order to provide required power of cleaning module and electric power, therefore illustrate as institute in the present invention's explanation and the diagram, drive unit 101 directly is located in the accommodation space of anchor clamps front end the part that links with cleaning device 103 and power supply device 102 is located at the handle end only for for example, can be optionally and drive unit 101 and power supply device 102 are arranged at any position in the body, and utilize mechanical organ to be linked and make and have its function.
The cleaning module 103 of the preferred embodiment of the present invention is connected in drive unit 101, the action that the power that receiving drive unit 101 provides cleans, and cleaning module 103 utilizes rotation mode to clean in the preferred embodiment of the present invention, and by rotating basis 1031, flexible member 1032 and cleaning rotating disk 1033 are formed, wherein, rotating basis 1031 links the side of being located near drive unit 101, and cleaning rotating disk 1033 and being linked on the rotating basis 1031, and by flexible member 1032 connection cleaning rotating disks 1033, can utilize the elastic force of the flexible member 1032 between rotating basis 1031 and cleaning rotating disk 1033, the stress that is produced when disperseing to clean avoids damaging wafer carrying bench.And, make cleaning rotating disk 1033 be utilized rotation mode to remove the impurity of the wafer carrying bench of semiconductor machine by the power that drive unit 101 provides.Except the above-mentioned rotating disk rotation mode that utilizes comes the cleaning equipment, and visual different cleaning demand is changed the cleaning module rotating disk 1033 of different qualities, for example use: be replaced with by Electrostatic Absorption or be used for cleaning the static rotating disk of impurity, also change into and be used for vacuum spin chuck that cleans impurity or the like by vacuum suction, to be applicable to the cleaning ambient of different demands.
Preferred person, connect a lighting device 104 again in cleaning module end 100a, so that the illumination source in when cleaning to be provided, where reach cleaning, illumination is purpose where just, and utilizes and be located at starting switch 105 and lighting switch 106 difference accessory drives of preferably being located on the holding end 100b 101 and the switch of controlling lighting device 104, as for the mode of operation of starting switch 105 and lighting switch 106, should be known to those skilled in the art, just do not give unnecessary details more at this.And the position of starting switch 105 and lighting switch 106 can optionally and in addition change, and the invention is not restricted to this.
As shown in Figure 2, it is the preferred use schematic flow sheet of the cleaning clamp for wafer carrying bench of semiconductor machine of the present invention, and it includes the following step:
Impurity produces 200, loses burnt situation when operating personnel find to expose and takes place, and inspects operating procedure and vacuum state or the like, finds to have had on the wafer carrying bench impurity to produce.
Measurement flatness, to determine impurity position 201, this moment, operating personnel began to measure the flatness of wafer carrying bench, and the uneven position of identification is to determine the impurity position.
Use this cleaning clamp cleaning 202, the action of using cleaning clamp of the present invention as shown in Figure 1 to clean, at this moment, the visual impurity of operating personnel position, magnitude range or the like different demand, change the cleaning rotating disk 1033 (as shown in Figure 1) that is fit to size, material, and open starting switch 105 and lighting switch 106 (as shown in Figure 1), the action of removing the impurity of wafer carrying bench is finished up to removing.
Whether measurement flatness is confirmed to remove to finish 203, and if yes, the flatness of the wafer carrying bench that operating personnel remeasure at this moment can be returned to normal value, and expression is removed and finished, and finishes 204 actions of removing; If not, then the flatness of the wafer carrying bench of expression measurement is still not enough, reuses the step of this cleaning clamp cleaning 202, finishes up to removing.
In sum, the cleaning clamp for wafer carrying bench of a kind of semiconductor machine of the present invention, the little and collapsing length arbitrarily of volume can be equipped with lighting device again, and visual demand changes the cleaning turntable module of different cleaning characteristic, to be applicable to different cleaning ambients; The above person of thought, only be the preferred embodiments of the present invention, when can not with limit the scope of the invention, association obtains easily, such as: the exterior design difference of cleaning clamp, use other drive unit, or use plug-in to replace battery or the like, those skilled in the art are after comprehension spirit of the present invention, can expect changing enforcements, promptly the equalization of doing according to claim of the present invention generally changes and modification, will not lose main idea of the present invention place, also do not break away from the spirit and scope of the present invention, the former capital should be considered as further enforcement situation of the present invention.
Claims (11)
1. the cleaning clamp for wafer carrying bench of a semiconductor machine, this cleaning clamp includes at least:
One body have a cleaning module end and a holding end of corresponding setting, and this cleaning module end also has an accommodation space;
One drive unit is located in this body accommodation space;
One power supply device is located in this body, and is coupled to this drive unit;
One cleaning module is positioned at this cleaning module end of this body, and is connected in this drive unit replaceably,
Wherein, comprise that also a lighting device is positioned at this cleaning module end.
2. the cleaning clamp for wafer carrying bench of semiconductor machine as claimed in claim 1, wherein this body can be adjusted length.
3. the cleaning clamp for wafer carrying bench of semiconductor machine as claimed in claim 1 comprises that also a starting switch is linked to this power supply device.
4. the cleaning clamp for wafer carrying bench of semiconductor machine as claimed in claim 3, wherein this starting switch system is arranged at this holding end of this body.
5. the cleaning clamp for wafer carrying bench of semiconductor machine as claimed in claim 1, wherein this drive unit is a motor.
6. the cleaning clamp for wafer carrying bench of semiconductor machine as claimed in claim 1, wherein this power supply device is a battery.
7. the cleaning clamp for wafer carrying bench of semiconductor machine as claimed in claim 1, wherein this cleaning module also includes:
One rotating basis is located at the side near this drive unit;
One cleaning rotating disk is connected in this rotating basis; And
One flexible member is connected in this rotating basis between this rotating basis and this cleaning rotating disk.
8. the cleaning clamp for wafer carrying bench of semiconductor machine as claimed in claim 1 comprises that also a lighting switch is connected in this lighting device.
9. the cleaning clamp for wafer carrying bench of semiconductor machine as claimed in claim 8, wherein this lighting switch is positioned at this holding end of this body.
10. the cleaning clamp for wafer carrying bench of semiconductor machine as claimed in claim 1, wherein this cleaning module utilizes the Electrostatic Absorption mode to clean.
11. the cleaning clamp for wafer carrying bench of semiconductor machine as claimed in claim 1, wherein this cleaning module utilizes the vacuum suction mode to clean.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100922231A CN100447942C (en) | 2004-11-03 | 2004-11-03 | Cleaning clamp for wafer carrying bench of semiconductor machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100922231A CN100447942C (en) | 2004-11-03 | 2004-11-03 | Cleaning clamp for wafer carrying bench of semiconductor machine |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1770388A CN1770388A (en) | 2006-05-10 |
| CN100447942C true CN100447942C (en) | 2008-12-31 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100922231A Expired - Fee Related CN100447942C (en) | 2004-11-03 | 2004-11-03 | Cleaning clamp for wafer carrying bench of semiconductor machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100447942C (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104117507B (en) * | 2014-06-30 | 2017-10-20 | 佛山市达骏纺织有限公司 | Weaving loom cleaner |
| CN110449413B (en) * | 2018-05-08 | 2021-06-25 | 中国科学院理化技术研究所 | Laser intracavity particle detecting and arranging device |
| CN112246747B (en) * | 2020-09-30 | 2021-09-17 | 青岛金汇源电子有限公司 | Continuous semiconductor wafer etching equipment |
| CN113539777B (en) * | 2021-07-07 | 2022-11-08 | 长鑫存储技术有限公司 | A kind of tool |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4989295A (en) * | 1989-05-05 | 1991-02-05 | Vorwerk & Co. Interholding Gmbh | Telescopic guide wand for floor-cleaning appliances |
| US5351360A (en) * | 1991-06-06 | 1994-10-04 | Enya Systems, Limited | Cleaning device for a wafer mount plate |
| JPH09327421A (en) * | 1996-06-13 | 1997-12-22 | Seiichi Yoda | Vacuum cleaner |
| JPH10189512A (en) * | 1996-12-26 | 1998-07-21 | Sony Corp | Substrate cleaning device |
| US6058542A (en) * | 1998-08-20 | 2000-05-09 | Teh-Liang Lo | Portable electric cleaning device |
| US20040060131A1 (en) * | 2002-09-30 | 2004-04-01 | Moravsky Robert J. | Anode cleaning tool |
-
2004
- 2004-11-03 CN CNB2004100922231A patent/CN100447942C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4989295A (en) * | 1989-05-05 | 1991-02-05 | Vorwerk & Co. Interholding Gmbh | Telescopic guide wand for floor-cleaning appliances |
| US5351360A (en) * | 1991-06-06 | 1994-10-04 | Enya Systems, Limited | Cleaning device for a wafer mount plate |
| JPH09327421A (en) * | 1996-06-13 | 1997-12-22 | Seiichi Yoda | Vacuum cleaner |
| JPH10189512A (en) * | 1996-12-26 | 1998-07-21 | Sony Corp | Substrate cleaning device |
| US6058542A (en) * | 1998-08-20 | 2000-05-09 | Teh-Liang Lo | Portable electric cleaning device |
| US20040060131A1 (en) * | 2002-09-30 | 2004-04-01 | Moravsky Robert J. | Anode cleaning tool |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1770388A (en) | 2006-05-10 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081231 Termination date: 20091203 |