CN100444707C - Heating device - Google Patents
Heating device Download PDFInfo
- Publication number
- CN100444707C CN100444707C CNB2005100558432A CN200510055843A CN100444707C CN 100444707 C CN100444707 C CN 100444707C CN B2005100558432 A CNB2005100558432 A CN B2005100558432A CN 200510055843 A CN200510055843 A CN 200510055843A CN 100444707 C CN100444707 C CN 100444707C
- Authority
- CN
- China
- Prior art keywords
- mentioned
- heated object
- heater
- circuit substrate
- curved anti
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
A heating chamber 126 for heating a circuit base 101 is formed in a reflow furnace 100. This heating device is provided with a pair of conveyance units 130, 140 provided in the heating chamber 126 and conveying the circuit base 101 by holding end parts on both sides of the circuit base 101, a warping prevention unit 150 provided between the conveyance units 130 and 140 to prevent warping of the circuit base 101 by holding a substantially central part of the circuit base 101, and a support unit 160 for supporting the warping prevention unit 150 so as to move to a holding position for holding the substantially central part of the circuit base 101 and an evacuation position close to the conveyance unit 130 on one side and separating from the circuit base 101.
Description
Technical field
The present invention relates to form the technical field of the heater of the heating chamber that heated object is heated.
Background technology
In the prior art, as this heater for example known have on various circuit substrates welding (reflection welding) electronic unit, so-called reverberatory furnace (for example, with reference to patent documentation 1).
Specifically, existing reverberatory furnace comprises the heating unit that is made of upper portion heater and lower heater.Between upper portion heater and lower heater, be formed with the heated object heating chamber that heats of circuit substrate for example, in heating chamber, be formed with the transfer path that is used for the transfer circuit substrate.At welding during transfer path transfer circuit substrate (reflection welding) electronic unit.
In addition, existing reverberatory furnace comprises the curved anti stop element, and it is set between transfer path and the lower heater, prevents the bending of circuit substrate by the substantial middle portion of holding circuit substrate.When not needing the curved anti stop element, make the curved anti stop element keep out of the way below to transfer path.
Specifically, when the curved anti stop element was kept out of the way the below of transfer path, the height that it is necessary to keep out of the way more than or equal to being installed in the electronic unit on the circuit substrate generally was necessary to keep out of the way more than or equal to 20mm.
Patent documentation 1: the spy opens 2001-345551 communique (the 3rd page, the 6th figure)
Yet above-mentioned existing reverberatory furnace has following problems: for the curved anti stop element is kept out of the way lower heater can not be configured in to the below of transfer path transfer path near, thereby reduce the degree of freedom of device design.
Summary of the invention
The present invention makes in view of the above problems, and its purpose is to provide a kind of heater, this device lower heater can be configured in transfer path near, improve the degree of freedom of device design.In addition, its purpose also is to provide a kind of heater that can simplify curved anti stop element structure.
In order to address the above problem, heater provided by the invention, be formed with the heating chamber that heated object is heated, this heater comprises: a pair of connecting gear, and it is set in the above-mentioned heating chamber and by the both side ends that keeps above-mentioned heated object and transmits above-mentioned heated object; The curved anti locking mechanism, it is set between the above-mentioned connecting gear and prevents the bending of above-mentioned heated object by the substantial middle portion that keeps above-mentioned heated object; Supporting device, it supports described curved anti locking mechanism, this curved anti locking mechanism can be moved between holding position and retreating position, keep the substantial middle portion of above-mentioned heated object in this holding position, this retreating position is near above-mentioned connecting gear of the side and leave above-mentioned heated object.
Description of drawings
Fig. 1 is the side view of the reverberatory furnace of one embodiment of the invention;
Fig. 2 is the profile of reverberatory furnace shown in Figure 1;
Fig. 3 is the profile of reverberatory furnace shown in Figure 1;
Fig. 4 (A) is the top figure of a conveyer chain of reverberatory furnace shown in Figure 1; Fig. 4 (B) is the side view of one conveyer chain of reverberatory furnace shown in Figure 1;
Fig. 5 (A) is the top figure of another conveyer chain of reverberatory furnace shown in Figure 1; Fig. 5 (B) is the side view of another conveyer chain of reverberatory furnace shown in Figure 1;
Fig. 6 (A) is the top figure that the bending of reverberatory furnace shown in Figure 1 prevents chain; Fig. 6 (B) is the side view that the bending of reverberatory furnace shown in Figure 1 prevents chain.
Embodiment
Describe being used to implement optimum execution mode of the present invention with reference to the accompanying drawings.What in addition, below the execution mode of explanation represented is execution mode when heater of the present invention is applicable to the so-called reverberatory furnace that for example welds electronic unit (reflection weld) on various circuit substrates.
At first, referring to figs. 1 through Fig. 6 the structure of the reverberatory furnace of present embodiment is described.In addition, what Fig. 1 represented is the side view of the reverberatory furnace of present embodiment, what Fig. 2 and Fig. 3 represented is the profile of reverberatory furnace shown in Figure 1, and that Fig. 4 and Fig. 5 represent is the figure of the conveyer chain of reverberatory furnace shown in Figure 1, and Fig. 6 represents is the figure that the bending of reverberatory furnace shown in Figure 1 prevents chain.
The reverberatory furnace 100 of present embodiment as shown in Figure 1, it comprises the basket 110 of total length 3900mm, overall with 1100mm, overall height 1450mm, and is configured in a plurality of heating units 120 on the length direction of basket 110.
Between upper portion heater 121 and lower heater 122, be formed with the heated object heating chamber 126 that heats of circuit substrate 101 for example, in heating chamber 126, be formed for the transfer path 102 of transfer circuit substrate 101 by following delivery unit 130,140.During transfer path 102 transfer circuit substrates 101, welding (reflection welding) not shown electronic unit.
In addition, reverberatory furnace 100 comprises as shown in Figure 2: for example a pair of delivery unit 130,140 of connecting gear, and the curved anti locking mechanism is curved anti stop element 150 for example, and supporting device is bearing unit 160 for example, and the scaffold 170 that supports each unit.
Scaffold 170 comprises: be fixed on the base plate 171 on the basket 110, the upright fixed head 172,173 that is located on the base plate 171, be erected at the axle 174,175 on the fixed head 172,173, Jie is supported in the movable platen 178,179 of axle on 174,175 movably by linear guide apparatus 176,177, Jie liftably is supported in lifter plate 181 on the movable platen 178 by linear guide apparatus 180, and is used to trapezoidal screw 182,183 that movable platen 178,179 is moved.
Delivery unit 130,140 is set in the heating chamber 126, by the both side ends transfer circuit substrate 101 of holding circuit substrate 101.
Specifically, delivery unit 130 is mounted in the fixed cell on the fixed head 172, comprising: the conveyer chain 131 of a side end of holding circuit substrate 101, guide the transmission guider 132 of this conveyer chain 131 and the not shown driver parts such as sprocket wheel that drive conveyer chain 131.Conveyer chain 131 is uniformly-spaced disposed as shown in Figure 4, and it comprises a plurality of pins 133 to transfer path 102 side-prominent 4mm degree, sells a side end of 133 holding circuit substrates 101 by this.
In addition, another delivery unit (140) is mounted in the mobile unit on the movable platen 179, and it comprises: the not shown driver parts such as sprocket wheel of the conveyer chain 141 of the end side of holding circuit substrate 101, the transmission guider 142 that guides this conveyer chain 141 and driving conveyer chain 141.Conveyer chain 141 is uniformly-spaced disposed as shown in Figure 5, and it comprises a plurality of pins 143 to transfer path 102 side-prominent 4mm degree, sells another side end of 143 holding circuit substrates 101 by this.
The width of delivery unit 130, the 140 corresponding circuits substrates 101 of Gou Chenging changes the width of above-mentioned transfer path 102 like this.
At first, when transmitting big circuit substrate 101, as shown in Figure 2, by rotating trapezoidal screw 182 to a direction, movable platen 179 moves along axle 174,175 right side in figure, and the interval corresponding circuits substrate 101 of conveyer chain 131,141 enlarges.
On the other hand, when transmitting little circuit substrate 101, as shown in Figure 3, by rotate trapezoidal screw 182 to other direction, movable platen 179 moves along axle 174,175 left side in figure, and the interval corresponding circuits substrate 101 of conveyer chain 131,141 dwindles.
Curved anti stop element 150 is set between the delivery unit 130,140, prevents the bending of circuit substrate 101 by the substantial middle portion of holding circuit substrate 101.
Specifically, curved anti stop element 150 is mounted in the mobile unit on the lifter plate 181, comprising: the bending of the substantial middle portion of holding circuit substrate 101 prevents chain 151, guides this bending to prevent that the bending of chain 151 from preventing guider 152 and driving the crooked not shown driver parts such as sprocket wheel that prevent chain 151.Bending prevents that chain 151 from uniformly-spaced being disposed as shown in Figure 6, and it comprises a plurality of annexes 153 to transfer path 102 side-prominent 30mm degree, comes the substantial middle portion of holding circuit substrate 101 by this accessory 153.
Specifically, bearing unit 160 comprises: is erected on the fixed head 172,173 and is formed with on the direction of relative delivery unit 130,140 almost parallels and extend the cam 162 of the spigot surface 161 that is provided with, and the cam follower wheel 163 that is situated between and links and move along the spigot surface 161 of cam 162 by lifter plate 181 and curved anti stop element 150.
The width of the curved anti stop element 150 corresponding circuits substrates 101 of Gou Chenging and between above-mentioned holding position and retreating position, moving like this.
At first, when transmitting big circuit substrate 101, as shown in Figure 2, by rotating trapezoidal screw 183 to a direction, movable platen 178 moves along axle 174,175 right side in figure, simultaneously, lifter plate 181 is gone up side shifting along cam 162 in figure, thereby makes curved anti stop element 150 move to the holding position.
At this moment, because the upper end of the pin 133,143 of the upper end of the annex 153 of curved anti stop element 150 and delivery unit 130,140 is configured in roughly the same height, so the substantial middle portion of curved anti stop element 150 holding circuit substrates 101, thereby prevent the bending of circuit substrate 101.
On the other hand, when transmitting little circuit substrate 101, as shown in Figure 3, by rotate trapezoidal screw 183 along other direction, movable platen 178 moves along axle 174,175 left side in figure, simultaneously, lifter plate 181 descends side shifting along cam 162 in figure, thereby makes curved anti stop element 150 move to retreating position.
At this moment because the annex 153 of curved anti stop element 150 is configured in the below of the pin 133 of delivery unit 130, so curved anti stop element 150 keep out of the way from the stream of lower heater 122, thereby effective heater circuit substrate 101.
Then, use Fig. 2 and Fig. 3 that the action of the reverberatory furnace of present embodiment is described.
At first, when transmitting big circuit substrate 101, as shown in Figure 2, by rotating trapezoidal screw 182 in the same direction as, movable platen 179 moves along axle 174,175 right side in figure, and the interval corresponding circuits substrate 101 of conveyer chain 131,141 enlarges.
Then, by rotating trapezoidal screw 183 in the same direction as, movable platen 178 moves along axle 174,175 right side in figure, and simultaneously, lifter plate 181 is gone up side shifting along cam 162 in figure, thereby makes curved anti stop element 150 move to the holding position.
At this moment, because the upper end of the pin 133,143 of the upper end of the annex 153 of curved anti stop element 150 and delivery unit 130,140 is configured in roughly the same height, so the substantial middle portion of curved anti stop element 150 holding circuit substrates 101, thereby prevent the bending of circuit substrate 101.
On the other hand, when transmitting little circuit substrate 101, as shown in Figure 3, by rotate trapezoidal screw 183 to other direction, movable platen 178 moves along axle 174,175 left side in figure, simultaneously, lifter plate 181 descends side shifting along cam 162 in figure, thereby makes curved anti stop element 150 move to retreating position.
Then, by rotate trapezoidal screw 182 towards other direction, movable platen 179 moves along axle 174,175 left side in figure, and the corresponding base board 101 in the interval of conveyer chain 131,141 dwindles.
At this moment because the annex 153 of curved anti stop element 150 is configured in the below of the pin 133 of delivery unit 130, so curved anti stop element 150 keep out of the way from the stream of lower heater 122, thereby effective heater circuit substrate 101.
As described above such, in the present embodiment, it is formed with the heating chamber 126 that circuit substrate 101 is heated, it has following structures, comprise: reverberatory furnace 100 in, be arranged in the heating chamber 126 and come a pair of delivery unit 130,40 of transfer circuit substrate 101 by the both side ends of holding circuit base 101; Be arranged between the delivery unit 130,140 and prevent the curved anti stop element 150 of circuit substrate 101 bendings by the substantial middle portion of holding circuit substrate 101; Can move the bearing unit 160 that supports curved anti stop element 150 in the holding position of the substantial middle portion of holding circuit substrate 101 with between near delivery unit 130 and the retreating position that leaves from circuit substrate 101.
By this structure, in the present embodiment, because can between near a delivery unit 130 and the retreating position that leaves from circuit substrate 101, support curved anti stop element 150 movably, so can be near transfer path 102 configuration lower heater 122, the degree of freedom of device design is improved.
In addition, in the present embodiment, curved anti stop element 150 after moving to retreating position, be configured in a delivery unit 130 below.
By this structure, in the present embodiment, because curved anti stop element 150 after moving to retreating position, be configured in a delivery unit 130 below, so curved anti stop element 150 is kept out of the way from the stream of lower heater 122, thereby heater circuit substrate 101 effectively.
In addition, in the present embodiment, bearing unit 160 has following structure: be formed with at the cam 162 of the spigot surface 161 that extends setting on the direction of delivery unit 130,140 almost parallels and the cam follower wheel 163 that links curved anti stop element 150 and move along spigot surface 161.
By this structure, because bearing unit 160 is made of cam 162 and cam follower wheel 163, thus structure that can simplification device, thus the cost of device reduced.
In addition, in the present embodiment, heated object is a circuit substrate 101.
By this structure, in the present embodiment, because heated object is a circuit substrate 101, so width that can corresponding circuits substrate 101 prevents the bending of circuit substrate 101.
The various variation that is appreciated that embodiments of the present invention described herein is also to be used to implement the present invention.Therefore what is claimed is the accurate qualification scope of the invention in claims as can be known, and it is interior that the method in the scope of these claims and their equivalent and structure also are included in these claim scopes.
Claims (5)
1. heater, it is formed with the heating chamber that heated object is heated, and it is characterized in that, comprising: a pair of connecting gear, it is set in the above-mentioned heating chamber and by the both side ends that keeps above-mentioned heated object and transmits above-mentioned heated object; The curved anti locking mechanism, it is set between the above-mentioned connecting gear and prevents the bending of above-mentioned heated object by the substantial middle portion that keeps above-mentioned heated object; Supporting device, it supports above-mentioned curved anti locking mechanism, this curved anti locking mechanism can be moved between holding position and retreating position, keep the substantial middle portion of above-mentioned heated object in this holding position, this retreating position is near above-mentioned connecting gear of the side and leave above-mentioned heated object.
2. heater as claimed in claim 1 is characterized in that, above-mentioned curved anti locking mechanism after moving to above-mentioned retreating position, be configured in an above-mentioned connecting gear below.
3. as claim 1 or the described heater of claim 2, it is characterized in that above-mentioned supporting device comprises: be formed with the cam that on the direction of above-mentioned relatively connecting gear almost parallel, extends the spigot surface that is provided with; The cam follower wheel that links above-mentioned curved anti locking mechanism and move along above-mentioned spigot surface.
4. heater as claimed in claim 1 or 2 is characterized in that described heated object is a circuit substrate.
5. heater as claimed in claim 3 is characterized in that, described heated object is a circuit substrate.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP73759/04 | 2004-03-16 | ||
| JP73759/2004 | 2004-03-16 | ||
| JP2004073759A JP2005265202A (en) | 2004-03-16 | 2004-03-16 | Heating device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1671272A CN1671272A (en) | 2005-09-21 |
| CN100444707C true CN100444707C (en) | 2008-12-17 |
Family
ID=35042275
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005100558432A Expired - Fee Related CN100444707C (en) | 2004-03-16 | 2005-03-15 | Heating device |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JP2005265202A (en) |
| CN (1) | CN100444707C (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101924016B (en) * | 2009-06-11 | 2012-09-05 | 北京北方微电子基地设备工艺研究中心有限责任公司 | Heating method, device and substrate processing equipment |
| CN105195401B (en) * | 2015-09-22 | 2018-07-20 | 深圳市大创自动化设备有限公司 | Triple channel electronic circuit board curing oven |
| CN108672880A (en) * | 2018-08-31 | 2018-10-19 | 郑州云海信息技术有限公司 | A kind of solder reflow device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000307240A (en) * | 1999-04-23 | 2000-11-02 | Fuji Photo Film Co Ltd | Reflow device |
| JP2001345551A (en) * | 2000-06-02 | 2001-12-14 | Nippon Antomu Kogyo Kk | Board carriage mechanism in reflow-soldering apparatus |
| JP2002240920A (en) * | 2001-02-20 | 2002-08-28 | Tamura Seisakusho Co Ltd | Carrying device and heating device |
-
2004
- 2004-03-16 JP JP2004073759A patent/JP2005265202A/en active Pending
-
2005
- 2005-03-15 CN CNB2005100558432A patent/CN100444707C/en not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000307240A (en) * | 1999-04-23 | 2000-11-02 | Fuji Photo Film Co Ltd | Reflow device |
| JP2001345551A (en) * | 2000-06-02 | 2001-12-14 | Nippon Antomu Kogyo Kk | Board carriage mechanism in reflow-soldering apparatus |
| JP2002240920A (en) * | 2001-02-20 | 2002-08-28 | Tamura Seisakusho Co Ltd | Carrying device and heating device |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2005265202A (en) | 2005-09-29 |
| CN1671272A (en) | 2005-09-21 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US20080258360A1 (en) | Continuous carburizing furnace | |
| US8234884B2 (en) | Air-cooling/tempering apparatus and air-cooling/tempering method for a glass sheet | |
| CN100444707C (en) | Heating device | |
| JPS6132264B2 (en) | ||
| WO2009075135A1 (en) | Conveyance equipment and hot press forming device having it | |
| JP2004536012A5 (en) | ||
| JP4688011B2 (en) | Glass plate bending apparatus and method | |
| CN100407880C (en) | Backflow brazier | |
| JP4896776B2 (en) | Reflow device | |
| KR101705441B1 (en) | Carrying heating device | |
| KR900002524B1 (en) | Apparatus and method for locally heating conveyed glass sheets | |
| US8561279B2 (en) | Spring product manufacturing line | |
| US4973243A (en) | Heating system in the manufacture of printed circuit boards, assemblies and the like | |
| KR20060024441A (en) | Apparatus for bending glass panels | |
| JP4524377B2 (en) | Reflow device | |
| JP4229580B2 (en) | Reflow soldering equipment | |
| KR101156646B1 (en) | Vertical cure oven | |
| JP4635350B2 (en) | Transport device | |
| JP2682085B2 (en) | Reflow soldering equipment | |
| JP2008159961A (en) | Board transfer apparatus | |
| JPH0645747A (en) | Reflow device | |
| NO147830B (en) | PROCEDURE FOR HEATING A GLASS PLATE. | |
| JPH06244546A (en) | Reflowing apparatus | |
| EP0346117A1 (en) | Improved heating system in the manufacture of printed circuit boards, assemblies and the like | |
| JPH0669642A (en) | Reflow device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081217 Termination date: 20100315 |