CN100444083C - Computer system with cooling apparatus - Google Patents
Computer system with cooling apparatus Download PDFInfo
- Publication number
- CN100444083C CN100444083C CNB2005101012505A CN200510101250A CN100444083C CN 100444083 C CN100444083 C CN 100444083C CN B2005101012505 A CNB2005101012505 A CN B2005101012505A CN 200510101250 A CN200510101250 A CN 200510101250A CN 100444083 C CN100444083 C CN 100444083C
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- Prior art keywords
- radiator
- computer system
- casing
- circuit board
- flow path
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Abstract
This invention relates to one computer system, which comprises one shell, one circuit board inside shell, one heating electron element on circuit board and one cooling device, wherein, the shell has relative first and second boards with first one set with gas in hole and second board set with discharge hole. The gas in hole and discharge hole form one gas flow path outside gas flow path. The cooling device comprises first dissipation part of electron element trigger through circuit board edge into gas flow second dissipation part.
Description
[technical field]
The present invention relates to a kind of computer system, be meant a kind of computer system especially with cooling device.
[background technology]
In recent years, the speed of central processing unit constantly promotes.For handling various information with fast speeds, central processing unit comprises increasing transistor, and these transistors have clock faster, and the energy of its consumption is also corresponding to be increased.This heat that will cause central processing unit to produce constantly increases.The gathering of these heats certainly will make the temperature in the computer rise and cause the reduction of computer performance and cause the system failure.So various heating radiators are installed on the central processing unit, be beneficial to the heat on the central processing unit is distributed in the environment towards periphery.Usually, industry also is set to a fan in the computer chassis, flows through the heating radiator that is installed on the central processing unit to quicken air, thereby strengthens the heat-sinking capability of heating radiator.
Computer has a casing that holds and protect element in the computer usually.This casing is generally a rectangular parallelepiped box, and it comprises front and rear panel, upper and lower plates and biside plate.It is interior and parallel with biside plate that one motherboard is installed in this casing.Central processing unit and other electronic components of cooperating with central processing unit then are installed on the motherboard.Be respectively equipped with hole on the front and rear panel of casing.These holes form one and are convenient to the passage that outside air flows in the casing and central processing unit is cooled off from the hole of casing header board, are discharged by the hole of plate behind the casing of the air after the central processing unit heating.Fan is arranged in this passage, quickens air flowing in this passage.
Yet and the motherboard parallel with motherboard of the air flow path in the computer chassis is positioned at this air flow path.The shortcoming of this air flow path is: flow through behind the central processing unit hot-air must through behind the other electron component between central processing unit and the back plate could through after plate hole and flow out computer chassis.Consequently, air-flow can be subjected to the obstruction of the electronic component between central processing unit and the back plate to a certain extent and can not be discharged to the casing outside in time.Because the temperature in the delay of these hot-airs in casing, casing can increase, and is unfavorable for the heat radiation of central processing unit.
[summary of the invention]
In view of this, be necessary to provide a kind of computer system that has cooling device.
A kind of computer system that has cooling device, comprise a casing, be positioned at casing a circuit board, be installed in a heat-generating electronic elements and a cooling device on the circuit board, this casing has the first relative plate body and second plate body, first plate body is provided with air admission hole, second plate body is provided with vent port, form an air flow path between air admission hole and the vent port, this cooling device comprises one first radiator with the electronic component thermo-contact.This air flow path has a length, and this length is the short-scale of casing, and this circuit board is positioned at outside the air flow path, and this cooling device also comprises one second radiator that extends to through an edge of circuit board in the air flow path.
Compared with prior art, because circuit board separates with air flow path, and second radiator of cooling device is through an edge of circuit board and extend in this air flow path, like this, carry out heat interchange and be discharged to the casing outside from vent port apace from air admission hole cold air that enters casing and second radiator that is positioned at air flow path.
With reference to the accompanying drawings, the invention will be further described in conjunction with the embodiments.
[description of drawings]
Fig. 1 is the three-dimensional exploded view of computer system of the present invention.
Fig. 2 is the enlarged drawing of a cooling device on another visual angle among Fig. 1.
Fig. 3 is the unit assembly drawing of Fig. 1.
[embodiment]
Please referring to Fig. 1, the computer system of present embodiment comprises a casing (not label), is installed in the circuit board in the casing, as motherboard 100, be located at the heat-generating electronic elements on the motherboard 100, as central processing unit 150 and be installed on the motherboard 100 cooling device 400 in order to cooling central processing unit 150.
This casing comprises first and second plate bodys 210,240, the 3rd plate body 270 between first and second plate bodys 210,240 that is parallel to each other.The spacing of first and second plate bodys 210,240 constitutes the height of casing.The 3rd plate body 270 vertically connects first and second plate bodys 210,240.First plate body 210 is provided with some air admission holes 212 at contiguous the 3rd plate body 270 places.Second plate body 240 is provided with the plurality of rows pore 242 relative with air admission hole 212 at contiguous the 3rd plate body 270 places.The height of this casing is short than the width of casing and the degree of depth, and therefore, the short-scale of the spacing of air admission hole 212 and vent port 242 and casing is suitable, and air-flow can pass through air admission hole 212 and vent port 242 apace and pass this casing.
Motherboard 100 is parallel to first and second plate bodys 210,240 and between first and second plate bodys 210,240.Motherboard 100, first plate body 210, second plate body 240 and the 3rd plate body 270 surround a space 300.This space 300 communicates with air admission hole 212 and vent port 242, thereby forms an air flow path (not label) that passes air admission hole 212, space 300 and vent port 242, and air can be flowed along the direction perpendicular to motherboard 100 in casing.Central processing unit 150 is installed in motherboard 100 proximity spaces 300 places.
Please referring to Fig. 2 and Fig. 3, second radiating part 430, three heat pipes 450,460,470 and a fan 480 that this cooling device 400 comprises base 410, first radiating part 420, extends to form from first radiating part, 420 one.Base 410, first radiating part 420 and heat pipe 450 form one first radiator (not label), and second radiating part 430 forms one second radiator (not label).This base 410 contacts with central processing unit 150 so that absorb heat on the central processing unit 150.This first radiating part 420 is sticked on base 410 with mode or other known modes of welding.This second radiating part 430 extends and extends in the space 300 through an edge of motherboard 100 from first radiating part 420.This fan 480 is installed on second radiating part 430 and is relative with air admission hole 212.The top surface of fan 480 and the top surface of first radiating part 420 flush or are lower than the top surface of first radiating part 420.This fan 480 is positioned at a groove (not label) at second radiating part, 430 tops, and base 410 is positioned at a groove (not label) of first radiating part, 420 bottoms.Contiguous first plate body 210 of the top surface of the fan 480 and first radiating part 420.The part that second radiating part 430 is positioned at space 300 is provided with the some passages (not label) that communicate with fan 480, air admission hole 212 and vent port 242.Therefore, the passage of air admission hole 212, fan 480, second radiating part 430 and vent port 242 orders are communicated with, and a side of the passage of second radiating part 430 near and over against the opposite side of the passage of air admission hole 212, the second radiating parts 430 near and over against vent port 241.The fan 480 and second radiating part 430 are positioned on air admission hole 212, space 300 and the vent port 242 formed air flow paths.
Each heat pipe 450,460,470 comprises an evaporation part (not label) and is parallel to a condensation part (not label) of evaporation part.The evaporation part all is fixed on the base 410 with mode or other known modes of welding.The condensation part of heat pipe 450 is arranged in the top of first radiating part 420, thereby with the top and base 410 hot tie-ins of first radiating part 420.The condensation part of heat pipe 460,470 is arranged in the different piece of second radiating part 430, thereby with second radiating part 430 and base 410 hot tie-ins.Therefore, the heat on the base 410 can be passed on the top and second radiating part 430 of first radiating part 420 apace so that with these heats towards periphery environment distribute.
Produce heat during central processing unit 150 operations.These heats are absorbed by base 410, then respectively by heat conducting mode be sent to first radiating part 420 the bottom, by heat pipe 450 be sent to first radiating part 420 the top, be sent to second radiating part 430 by heat pipe 460,470.This first radiating part 420 mainly outwards distributes the heat on it in the mode of natural convection.Cold air is driven by fan 480 and second radiating part 430 and carry out heat interchange with second radiating part 430 of flowing through leaves second radiating part 430 then and is discharged to the casing outside through vent port 242.Therefore, the heat that is sent to second radiating part 430 by heat pipe 460,470 is taken away by cold air and is loose in the casing atmosphere outside.
In the present embodiment, heat pipe 460,470 will be sent to from the heat on the nearer base 410 of central processing unit 150 on central processing unit 150 second radiating part 430 far away.It is inner and flow out casings from the vent port 242 of second plate body 240 that cold air enters casing from the air admission hole 212 of first plate body 210, and the spacing of first and second plate bodys 210,240 is the smallest dimension of casing, air admission hole 212 is relative with vent port 242, therefore, the air flow path that directly passes air admission hole 212 and vent port 242 is for taking the heat on the central processing unit 150 out of the flow path of losing heart most of casing, air can pass this air flow path apace, takes heat out of the casing outside.In addition, in this air flow path, have only second radiating part 430 and the air of this air flow path of flowing through to carry out heat interchange.This makes element and formed obstruction thereof on this air flow path minimize, and is convenient to air and flows apace.Fan 480 can strengthen air pressure, the increasing gas velocity on this air flow path, thereby makes cold air flow through casing fast, in time takes away the heat on second radiating part 430.
Claims (10)
1. computer system, comprise a casing, be positioned at a circuit board of casing, be installed in a heat-generating electronic elements and a cooling device on the circuit board, this casing has the first relative plate body and second plate body, first plate body is provided with air admission hole, second plate body is provided with vent port, form an air flow path between air admission hole and the vent port, this cooling device comprises one first radiator with the electronic component thermo-contact, it is characterized in that: this air flow path has a length, this length is the short-scale of casing, this circuit board is positioned at outside the air flow path, and this cooling device also comprises one second radiator that extends to through an edge of circuit board in the air flow path.
2. computer system as claimed in claim 1 is characterized in that: it also comprises a fan that is installed on second radiator.
3. computer system as claimed in claim 1 is characterized in that: it also comprises and first radiator and the hot linked heat pipe of second radiator.
4. computer system as claimed in claim 1 is characterized in that: it also comprises a fan that is installed on second radiator and between second radiator and air admission hole.
5. computer system as claimed in claim 4 is characterized in that: this first radiator comprises with a base of heat-generating electronic elements thermo-contact, a radiating part and with base and the hot linked heat pipe of radiating part.
6. computer system as claimed in claim 1 is characterized in that: this second radiator is provided with groove, and a fan is installed in the groove of second radiator and between second radiator and air admission hole; This first radiator is provided with groove, a base be arranged in the groove of first radiator and with the heat-generating electronic elements thermo-contact.
7. computer system as claimed in claim 6 is characterized in that: the groove of first radiator is arranged at its bottom, and the groove of second radiator is arranged at its top.
8. computer system as claimed in claim 1 is characterized in that: this circuit board is parallel to first plate body and second plate body.
9. computer system as claimed in claim 1 is characterized in that: heat-generating electronic elements is installed in circuit board adjacent gas flow path place.
10. computer system as claimed in claim 1, it is characterized in that: air admission hole and vent port are over against setting, second radiator comprises some passages, and the passage of second radiator and air admission hole and vent port be over against being communicated with, and air-flow is along the described gas channel of flowing through perpendicular to the direction of circuit board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101012505A CN100444083C (en) | 2005-11-08 | 2005-11-08 | Computer system with cooling apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101012505A CN100444083C (en) | 2005-11-08 | 2005-11-08 | Computer system with cooling apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1963724A CN1963724A (en) | 2007-05-16 |
| CN100444083C true CN100444083C (en) | 2008-12-17 |
Family
ID=38082801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101012505A Expired - Fee Related CN100444083C (en) | 2005-11-08 | 2005-11-08 | Computer system with cooling apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100444083C (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1396505A (en) * | 2001-07-12 | 2003-02-12 | 联想(北京)有限公司 | Ventilating and heat dissipating system for computer cabinet |
-
2005
- 2005-11-08 CN CNB2005101012505A patent/CN100444083C/en not_active Expired - Fee Related
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1396505A (en) * | 2001-07-12 | 2003-02-12 | 联想(北京)有限公司 | Ventilating and heat dissipating system for computer cabinet |
Also Published As
| Publication number | Publication date |
|---|---|
| CN1963724A (en) | 2007-05-16 |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081217 Termination date: 20131108 |