CN100443635C - Etching method of copper-coated electronic circuit board - Google Patents
Etching method of copper-coated electronic circuit board Download PDFInfo
- Publication number
- CN100443635C CN100443635C CNB2006100409998A CN200610040999A CN100443635C CN 100443635 C CN100443635 C CN 100443635C CN B2006100409998 A CNB2006100409998 A CN B2006100409998A CN 200610040999 A CN200610040999 A CN 200610040999A CN 100443635 C CN100443635 C CN 100443635C
- Authority
- CN
- China
- Prior art keywords
- copper
- ammonium chloride
- overlay film
- electronic circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The invention relates to a copper film covered on electron circuit surface processing method. The principle of this etching method is that using ammonium chloride solution to react with the copper film to generate alkali cupric chloride and cupric chloride ammine complex which reacts with hydrochloric acid to generate alkali cupric chloride precipitation and ammonium chloride. Its advantages are that the etched copper film can be transformed to salable alkali cupric chloride product; the processing ammonium chloride etching solution can be used circularly; thus it has good environmental protection function, and great social and economic benefits.
Description
Technical field
The present invention relates to the treatment process of the copper film that covers on the electronic circuit board surface.
Background technology
There is the overlay film copper of recovery value on the electronic circuit board surface, can reclaim by handling.Conventional at present treatment process is tri-chlorination iron processes and hydrochloric acid hydrogen peroxide method.Though these ordinary methods can make wiring board resin coated copper etch separates effectively, the waste liquid after the etching need carry out comparatively complicated process can reclaim the valuable mantoquita that wherein contains, and easily produces secondary pollution, is unfavorable for environmental protection.
Goal of the invention
The objective of the invention is to design a kind of engraving method that can make resin coated copper can effectively separate, be easy to reclaim valuable mantoquita and free of contamination electronic circuit board overlay film copper in order to solve the defective that ordinary method exists.
The technical scheme that realizes above-mentioned purpose is as follows:
The engraving method of electronic circuit board overlay film copper comprises the steps:
A, in being contained with the device of ammonium chloride solution, put into the wiring board that contains overlay film copper, simultaneously charge into oxygen to ammonium chloride solution, make ammonium chloride solution under aerobic condition with wiring board overlay film copper generation redox reaction, generate basic copper chloride and cupric chloride ammonia complex;
B takes out wiring board and puts into the hydrochloric acid soln for preparing after reaction for some time, to neutralize a small amount of basic copper chloride precipitation that is adsorbed on PCB surface, wash wiring board again;
C filters the mixed solution after a step reaction, the precipitation after the filtration dry the basic copper chloride product;
D adds hydrochloric acid and separates out the basic copper chloride precipitation and refilter in the filtrate that produces in the c step, will precipitate dry the basic copper chloride product, filtrate is used for the ammonium chloride solution that a step participates in reaction for containing trace copper ionic ammonium chloride solution with its circulation.
Ammonium chloride solution concentration in the described a step is 5%-40%.
In the described a step for to charge into oxygen by charging into air.
The reaction times is 0.5-1.5 hour in the described a step.
The neutralization reaction time in the described b step is 10-20 minute.
Adding hydrochloric acid in the described d step in filtrate makes the pH value of solution value transfer to 5.5-6.5.
Add in the described b step in the hydrochloric acid and after solution join in the filtrate of d step.
Principle of the present invention is to adopt ammonium chloride solution to generate basic copper chloride and cupric chloride ammonia complex with the overlay film copper generation redox reaction of wiring board under aerobic condition, the latter and hydrochloric acid effect generate basic copper chloride precipitation and ammonium chloride, can be expressed as follows with chemical equation:
Cu+NH
4Cl+O
2→CuCl
2.3CuO·3-1/2H
2O↓+Cu(NH
3)
4Cl
2
Cu(NH
3)
4Cl
2+Cu→Cu(NH
3)
2Cl
Cu(NH
3)
2Cl+O2→CuCl
2.3CuO·3-1/2H
2O↓+Cu(NH
3)
4Cl
2
Cu(NH
3)
4Cl
2+HCl→CuCl
2.3CuO·3-1/2H
2O↓+NH
4Cl
Advantage of the present invention is the resin coated copper etching in the wiring board can be got off, and changes into market basic copper chloride product salable, ammonium chloride etching solution reusable edible in the treating processes, and very environmental protection has higher society and economy benefit.
Description of drawings
Fig. 1 is the process flow sheet in the specific embodiment of the invention.
Embodiment
Below in conjunction with description of drawings the specific embodiment of the present invention:
In being contained with the device that concentration is 20% ammonium chloride solution, put into the wiring board that contains overlay film copper in right amount, simultaneously charge into competent air to ammonium chloride solution, ammonium chloride solution is being had under the condition of sufficient oxygen and wiring board overlay film copper generation redox reaction, generate basic copper chloride precipitation (CuCl
2.3CuO3-1/2H
2O) and cupric chloride ammonia complex (Cu (NH
3)
4Cl
2);
React after about one hour and to take out wiring board and put into the hydrochloric acid soln dipping for preparing 15 minutes, to neutralize a small amount of basic copper chloride precipitation that is adsorbed on PCB surface, solution is separated with wiring board, the solution after the separation is Cupric Chloride Solution, washes wiring board again;
Reacted mixed solution is filtered, the precipitation after the filtration dry the basic copper chloride product;
Add hydrochloric acid in the filtrate that produces after filtering in front, and the Cupric Chloride Solution that separation behind the front pickling wiring board is obtained is added in the filtrate, the amount that adds hydrochloric acid is 6 to keep the pH value of solution value, separating out the basic copper chloride precipitation this moment refilters, to precipitate dry the basic copper chloride product, filtrate is used for its circulation to participate at first the ammonium chloride solution of reaction for containing trace copper ionic ammonium chloride solution.
Claims (5)
1, the engraving method of electronic circuit board overlay film copper is characterized by: comprises the steps,
A, in being contained with the device of ammonium chloride solution, put into the wiring board that contains overlay film copper, simultaneously charge into oxygen to ammonium chloride solution, make ammonium chloride solution under aerobic condition with wiring board overlay film copper generation redox reaction, generate basic copper chloride and cupric chloride ammonia complex;
B takes out wiring board and puts into the hydrochloric acid soln for preparing after reaction for some time, to neutralize a small amount of basic copper chloride precipitation that is adsorbed on PCB surface, wash wiring board again;
C filters the mixed solution after a step reaction, the precipitation after the filtration dry the basic copper chloride product;
D, add hydrochloric acid in the filtrate that in the c step, produces and make the pH value of solution value transfer to 5.5-6.5, separate out the basic copper chloride precipitation and refilter, will precipitate dry the basic copper chloride product, filtrate is used for the ammonium chloride solution that a step participates in reaction for containing trace copper ionic ammonium chloride solution with its circulation.
2, the engraving method of electronic circuit board overlay film copper according to claim 1 is characterized in that: the ammonium chloride solution concentration in the described a step is 5%-40%.
3, the engraving method of electronic circuit board overlay film copper according to claim 1 is characterized in that: in the described a step for to charge into oxygen by charging into air.
4, the engraving method of electronic circuit board overlay film copper according to claim 1 is characterized in that: the reaction times is 0.5-1.5 hour in the described a step.
5, the engraving method of electronic circuit board overlay film copper according to claim 1 is characterized in that: the neutralization reaction time in the described b step is 10-20 minute.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100409998A CN100443635C (en) | 2006-08-18 | 2006-08-18 | Etching method of copper-coated electronic circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2006100409998A CN100443635C (en) | 2006-08-18 | 2006-08-18 | Etching method of copper-coated electronic circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1912184A CN1912184A (en) | 2007-02-14 |
| CN100443635C true CN100443635C (en) | 2008-12-17 |
Family
ID=37721231
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2006100409998A Expired - Fee Related CN100443635C (en) | 2006-08-18 | 2006-08-18 | Etching method of copper-coated electronic circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN100443635C (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102443805A (en) * | 2010-10-13 | 2012-05-09 | 江德馨 | Method for circularly using alkaline waste etching liquid |
| CN109095642A (en) * | 2018-08-30 | 2018-12-28 | 惠州大亚湾亿田环保技术有限公司 | A kind of alkalinity erosion copper waste liquid environmental protection recovery process of zero-emission |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB964665A (en) * | 1963-07-10 | 1964-07-22 | Siemens Ag | Method of continuously regenerating etching solutions containing copper |
| US5312515A (en) * | 1990-12-27 | 1994-05-17 | Sony Corporation | Dry etching method |
| US5534043A (en) * | 1994-03-15 | 1996-07-09 | Heritage Environmental Services, Inc. | Micronutrient supplement |
| CN1156766A (en) * | 1996-02-03 | 1997-08-13 | 深圳市工业废物处理站 | Process for preparing regenerated alkaline etching supplementary liquid and device system thereof |
| CN1392289A (en) * | 2001-06-14 | 2003-01-22 | 索尼公司 | Regenerating method for corrosion liquid and corrosion device |
-
2006
- 2006-08-18 CN CNB2006100409998A patent/CN100443635C/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB964665A (en) * | 1963-07-10 | 1964-07-22 | Siemens Ag | Method of continuously regenerating etching solutions containing copper |
| US5312515A (en) * | 1990-12-27 | 1994-05-17 | Sony Corporation | Dry etching method |
| US5534043A (en) * | 1994-03-15 | 1996-07-09 | Heritage Environmental Services, Inc. | Micronutrient supplement |
| CN1156766A (en) * | 1996-02-03 | 1997-08-13 | 深圳市工业废物处理站 | Process for preparing regenerated alkaline etching supplementary liquid and device system thereof |
| CN1392289A (en) * | 2001-06-14 | 2003-01-22 | 索尼公司 | Regenerating method for corrosion liquid and corrosion device |
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| Publication number | Publication date |
|---|---|
| CN1912184A (en) | 2007-02-14 |
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Granted publication date: 20081217 Termination date: 20110818 |