CN100443397C - Microcooling observing and controlling system and machining method thereof - Google Patents
Microcooling observing and controlling system and machining method thereof Download PDFInfo
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- CN100443397C CN100443397C CNB2004100137833A CN200410013783A CN100443397C CN 100443397 C CN100443397 C CN 100443397C CN B2004100137833 A CNB2004100137833 A CN B2004100137833A CN 200410013783 A CN200410013783 A CN 200410013783A CN 100443397 C CN100443397 C CN 100443397C
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Abstract
The present invention relates to a micro-cooling measuring and controlling system and a machining method thereof. The micro-cooling measuring and controlling system comprises a silicon substrate and a glass sheet, wherein a micro channel and a non-valve micro-pump figure are arranged on the surface of the silicon substrate. A temperature and flow sensor is arranged on the glass sheet, and the silicon substrate and the glass sheet are bonded through a bonding technique. The product of the present invention has the advantages of simple structure, easy operation, easy mass production, high reliability and wide flow controlling ranges, and the present invention is suitable for the fields, such as the thermal control and the fuel control of nanometer satellite environment, the cooling of microelectronic chip systems, etc.
Description
(1) technical field
Patent of the present invention relates to a kind of new micro cooling TT﹠C system based on the MEMS technological design, the present invention also relates to a kind of processing method of miniature cooling TT﹠C system.
(2) background technology
In the past ten surplus year in, along with people's being gradually improved to the research of each discrete device (as microflow sensor, Micropump, little valve, microchannel etc.) in microfluid field, and market increases day by day to the demand of high accuracy microfluidic control system, and the micrometeor closed-loop control system becomes one of research focus among the MEMS.Its operation principle can be expressed as: system detects by sensor convection cell state wherein, again detection signal is carried out analyzing and processing after, feed back to actuator and move, the flow of final accurately control fluid.Each device in this closed-loop control system mainly can be divided into: assembly type (Hybrid) and monolithic integrated form (Monolithic) two big classes by the difference of compound mode.
The assembly type microfluidic control system is meant that mainly each device that system is required is independently processed earlier, and is then in aggregates with the assembling of precision optical machinery method simply again.This system comprises that mainly silicon piezoelectricity (static) drives Micropump/Valve core blade (9mm * 9mm), silicon fluid sensor (6mm * 12mm) each.Main pin, nail, the adhesive of relying on assembled connection between each device.This system can obtain the bidirectional traffics of 40～80 μ l/min by regulating square-wave input signal.The portable drug injection system that declines of the developments such as R.Ro β berg of Germany Braunschweig Polytechnics also belongs to this type.Obvious this level of integrated system is lower, and assembly difficulty is bigger, is unfavorable for producing in enormous quantities.
Monolithic integrated microfluid control system then is that employing micro-processing methods such as Micropump, little valve, microsensor and other additional device (as microchannel, screen pack, blender etc.) and control circuit are integrated on the same substrate (or circuit board), to obtain the intelligent chip device of a globality.For example, the ammoniacal liquor integrated analysis system that has now developed based on MCB (MixedCircuit Board), it promptly is typical monolithic integrated microfluid control system, its upper strata integrated fluid device and detection components and parts (Micropump, little valve, fluid sensor), microfluidic channel, lower floor is a control circuit.Different fluids passes through inlet (little valve separately, sometimes also have screen pack), drive Micropump through separately hot gas and flow out, wherein the flow of each passage detects by separately flow sensor, then drive the Micropump action by circuit controller again, finally reach the purpose of each fluid flow of control.This system needs the turnover of little valve controlling flow body, and hot gas drives Micropump simultaneously needs the thermal source heating, so complex structure, and the flow-control scope is also little.
(3) summary of the invention
The object of the present invention is to provide a kind of simple in structurely, be easy to produce in batches, and have the processing method of the chilly but TT﹠C system of big flow-control scope and high heat-flux.
The object of the present invention is achieved like this: the composition of chilly but TT﹠C system comprises that silicon chip and sheet glass are two-layer, the silicon chip surface is provided with little raceway groove and valve free pump figure, sheet glass is provided with temperature and flow sensor, and silicon chip and sheet glass bond together by bonding technology.
Product of the present invention can also comprise some architectural features like this:
1, the valve free pump cavity on the described silicon chip connects, and is bonded with the piezoelectric ceramics diaphragm below the valve free pump cavity that connects.
2, described piezoelectric ceramics diaphragm is bonded in valve free pump cavity below with one heart.
Product of the present invention is such processing and fabricating: the silica of at first on the twin polishing silicon chip, growing, carry out photoetching afterwards, and on silicon, leave window, at photoresist and SiO
2Protection under deep etching Si sheet; on silicon chip, form little raceway groove and valve free pump figure; adopt the method for mechanical lapping that the valve free pump cavity is connected then; adopt the electrochemical discharge method again; on the circular cavity position of silicon chip diffusing opening and nozzle exit, beat system's water filling port; at last silicon chip is put into concentrated sulfuric acid solution and under the water-bath environment, heated, remove photoresist, put into HF solution again and float SiO
2At 95 sputter one deck 8-12 nanometer Ti on glass, sputter 0.05-0.15 micron Pt utilizes the lithography stripping technology to carve the RTD figure afterwards more earlier; Utilize anode linkage technology that silicon chip and glass are closely linked.Wherein in glass and silicon bonding process, adopt the 7740 suitable glass of thermal coefficient of expansion with silicon, bonding temperature is 380 ℃～450 ℃, voltage is 900V～1100V, maximum current 80-100 microampere.
In the patent of the present invention, silicon chip is to utilize the deep etching technology to etch the figure of little raceway groove and valve free pump on silicon chip, and the Micropump cavity connects, and this layer structure is as the bottom of whole system chip; Sheet glass is the cover plate of whole system chip, and this one deck is manufactured with temperature and flow sensor, and two class sensors all adopt the metal platinum film resistor to make.A side that has figure on a side that has metallic film on the sheet glass and the silicon chip is corresponding, and temperature detecting resistance is corresponding with little raceway groove simultaneously, is bonded together.On the position of cavity correspondence, bonding with one heart piezoelectric ceramics diaphragm is so form enclosed construction.If want to realize the making in enormous quantities of chip, only need each layer of batch making structure respectively, bonding gets final product then.Because the batch making technology of each layer is relative with bonding techniques ripe, so this chilly but TT﹠C system can be realized making in enormous quantities.The native system chip structure is integrated with the valve free pump that utilizes inverse piezoelectric effect to drive, valve free pump have can adopt planar design, simple in structure, be convenient to adopt micromachining technology processing, be convenient to advantage such as batch process; And owing to there is not moving part, make valve free pump be applicable to various fluids, and as gas, liquid and have the liquid etc. of solia particle, and reduced the generation of choking phenomenon, therefore, and there is the valve Micropump to compare, valve free pump is more reliable, durable; Simultaneously piezoelectric diaphragm be easy to combine with substrate, highly sensitive, simple in structure, efficient is high, the voltage power supply scope has the flow system flow control range of broad at 0～150V.
The invention has the advantages that:
1, simple, easy operating;
2, be easy to produce in batches;
3, reliability height;
4, flow-control wide ranges.
Fields such as product of the present invention is applicable to and receives, the control of the thermal control of skin satellite environment, fuel and microelectronic chip system cools.
(4) description of drawings
Fig. 1 is the silicon chip structure chart that is carved with little raceway groove and valve free pump figure;
Fig. 2 is the sheet glass structure chart that has temperature and flow sensor;
Fig. 3 is the arrangement of temperature sensor schematic diagram;
Fig. 4 is the flow sensor structural representation;
System chip structure plane behind Fig. 5 bonding.
(5) specific embodiment
The agent structure valve free pump 1 of fluid system and little raceway groove 2 adopt the deep etching fabrication techniques; Flow sensor 3 and temperature sensor 4 adopt the metal platinum membrane structure to realize, therefore need to draw two lithography mask versions.The silica of at first growing on the twin polishing silicon chip is as the mask layer of deep etching technology.Wherein, the oxidation furnace temperature is 1180 ℃, and the waters temperature is 95～97 ℃, and oxygen flow is 1l/min.Afterwards, carry out photoetching, the pattern that comes out owing to pattern on the mask version and the surface corrosion of photoetching back substrate is opposite, so select negative photoresist for use, the developer solution acetone soln.Photolithography process: gluing＞preceding baking＞exposure＞development＞post bake＞corrode＞remove photoresist.On silicon, leave window, at photoresist and SiO
2Protection under deep etching Si sheet.The etching depth of valve free pump 1 and little raceway groove 2 is 50～200 microns.Then, adopt the method for mechanical lapping that cavity is broken into perforation.Adopt the electrochemical discharge method again, punch on the circular cavity position of silicon chip diffusing opening and nozzle exit, as the water filling port of system, wherein 30～40% KOH solution is as corrosive liquid, and probe institute making alive is 80～120V.At last silicon chip is put into concentrated sulfuric acid solution and under 60 ℃ of water-bath environment, heated, remove photoresist.Put into HF solution again and float SiO
2Flow sensor 3 and temperature sensor 4 adopts the metal platinum film resistance structures: first step gluing and form figure on substrate, and requiring does not need the zone of metal film to be covered with photoresist; Second step depositing metal film on substrate-photoresist combination, first sputter one deck 8-10 nanometer Ti, sputter 0.1-0.12 micron Pt utilizes the lithography stripping technology to carve the such metal film of RTD figure afterwards and only contacts with substrate in its zone of needs again.At last, remove photoresist with the solvent of attack metal film not.So, photoresist is peeled off the metal film above it, and has stayed the metal that forms figure.Utilize anode linkage technology that silicon chip and glass are closely linked, guarantee the air-tightness of device.At glass---in the silicon bonding techniques, adopt 7740 suitable glass of thermal coefficient of expansion with silicon.Bonding temperature is 380 ℃～450 ℃, and voltage is 900V～1100V, about 90 microamperes of maximum currents.At last the Piezoelectric Driving diaphragm is bonded to one heart the Micropump cavity below of getting through.
The System on Chip/SoC course of work is as follows:
Heater places silicon chip 6 one sides, and fin places silicon chip 5 one sides, so silicon chip 6 one sides become the high-temperature region, and 5 one sides become low-temperature space, and cooling fluid is a water.Heater is with the heat transferred silicon chip.The driving signal of control circuit output makes Micropump work, and water is pumped in the little raceway groove in high-temperature region, absorbs the silicon chip heat.When water flows into the little raceway groove of low-temperature space from the high-temperature region, just a part of heat is carried into low-temperature space from the high-temperature region.This part heat is distributed by fin at low-temperature space.So circulation has realized the heat radiation of heater.Rate of flow of fluid in the control raceway groove can be controlled 1 heat that is carried to low-temperature space from the high-temperature region.In the raceway groove 3 and 4 can be monitored water velocity and the silicon chip temperature in little raceway groove in real time, to realize intelligent control.
Claims (2)
1, a kind of processing method of chilly but TT﹠C system is characterized in that: the silica of at first on the twin polishing silicon chip, growing, carry out photoetching afterwards, and on silicon, leave window, at photoresist and SiO
2Protection under deep etching Si sheet; on silicon chip, form little raceway groove and valve free pump figure; adopt the method for mechanical lapping that the valve free pump cavity is connected then; adopt the electrochemical discharge method again; on the circular cavity position of silicon chip diffusing opening and nozzle exit, beat system's water filling port; at last silicon chip is put into concentrated sulfuric acid solution and under the water-bath environment, heated, remove photoresist, put into HF solution again and float SiO
2At 95 sputter one deck 8-12 nanometer Ti on glass, sputter 0.05-0.15 micron Pt utilizes the lithography stripping technology to carve the RTD figure afterwards more earlier; Utilize anode linkage technology that silicon chip and glass are closely linked.
2, the processing method of chilly but TT﹠C system according to claim 1, it is characterized in that: in glass and silicon bonding process, the 7740 suitable glass of thermal coefficient of expansion of employing and silicon, bonding temperature is 380 ℃～450 ℃, voltage is 900V～1100V, maximum current 80-100 microampere.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CNB2004100137833A CN100443397C (en) | 2004-05-28 | 2004-05-28 | Microcooling observing and controlling system and machining method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CNB2004100137833A CN100443397C (en) | 2004-05-28 | 2004-05-28 | Microcooling observing and controlling system and machining method thereof |
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| CN1583542A CN1583542A (en) | 2005-02-23 |
| CN100443397C true CN100443397C (en) | 2008-12-17 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1313356C (en) * | 2005-06-09 | 2007-05-02 | 上海交通大学 | Micro oxygen pump based on hydrogen peroxide solution decomposition |
| CN1313355C (en) * | 2005-06-09 | 2007-05-02 | 上海交通大学 | Single piece of pneumatic gelatious tiny valve |
| CN102179831B (en) * | 2011-04-06 | 2012-08-01 | 哈尔滨工业大学 | Micro-channel processing equipment of microfluidic chip |
| CN102716771B (en) * | 2012-06-07 | 2014-04-16 | 北京大学 | Continuous flow type micro-flow control chip for realizing reactions under high temperature and high pressure and preparation method thereof |
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| CN1398295A (en) * | 2000-12-07 | 2003-02-19 | 艾菲克特细胞研究所股份有限公司 | Appts. for treating sample in microamount |
| CN1431495A (en) * | 2003-02-22 | 2003-07-23 | 浙江大学 | Integrated mini capillary electrophoresis chip in non-valve pump type |
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- 2004-05-28 CN CNB2004100137833A patent/CN100443397C/en not_active Expired - Fee Related
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| CN1437560A (en) * | 2000-06-20 | 2003-08-20 | 财团法人川村理化学研究所 | Microdevice having multilayer structure and method for fabricating the same |
| CN1398295A (en) * | 2000-12-07 | 2003-02-19 | 艾菲克特细胞研究所股份有限公司 | Appts. for treating sample in microamount |
| CN1431495A (en) * | 2003-02-22 | 2003-07-23 | 浙江大学 | Integrated mini capillary electrophoresis chip in non-valve pump type |
| CN1437018A (en) * | 2003-03-14 | 2003-08-20 | 哈尔滨工业大学 | Prepn of capillary electrophoresis chip for biochemical analysis |
| CN1442612A (en) * | 2003-04-11 | 2003-09-17 | 华中科技大学 | Valve less thin film driving micro pump |
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| CN1583542A (en) | 2005-02-23 |
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