CN100441615C - Preparation method of polybenzoxazole thin film - Google Patents
Preparation method of polybenzoxazole thin film Download PDFInfo
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- CN100441615C CN100441615C CNB2006100308253A CN200610030825A CN100441615C CN 100441615 C CN100441615 C CN 100441615C CN B2006100308253 A CNB2006100308253 A CN B2006100308253A CN 200610030825 A CN200610030825 A CN 200610030825A CN 100441615 C CN100441615 C CN 100441615C
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Abstract
The present invention discloses preparation process of polybenzoxazole film. The preparation process includes the following steps: 1. the reaction of aromatic di-o-amino phenol compound and aromatic binary anhydride in the molar ratio of 1 to 1 at 0-30 deg.c inside strong polar non-protonic organic solvent under nitrogen protection for 3-10 hr to obtain poly(o-hydroxy amino acid) solution; and 2. flow casting the poly(o-hydroxy amino acid) solution to form homogeneous film, heating to 100-300 deg.c under nitrogen protection to react for 4-8 hr, and further heating to 350-450 deg.c to react for 2.5-4 so as to obtain the polybenzoxazole film. The present invention has the beneficial effects of simple operation, environment friendship, low power consumption and easy recovering of organic solvent as reaction medium.
Description
Technical field
The present invention relates to a kind of preparation method of fire-resistant high-performance polymeric film, particularly relate to a kind of preparation method of polybenzoxazole thin film.
Background technology
Polybenzoxazole has very good thermotolerance, lower temperature resistance, self lubricity, radiation resistance, hydrolytic resistance and characteristic such as fire-retardant, simultaneously, also has very excellent mechanical property and dielectric properties.Can be applicable to advanced configuration matrix material, radome, nose cone and empennage, the coating of anti-ablation the etc. of middle and high supersonic vehicle; Also can be applicable to the FPC of the high temperature resistant radiation hardness material of spaceship, C level insulating material and electronics microelectronic or the body material of PCB, interlayer dielectic, super large-scale integration passivating coating and the alpha-particle blocking layer coating material etc. of IC.
U.S. Pat 5276128 discloses a kind of preparation method of polybenzoxazole; it is characterized in that: after the terephthalic acid sodium water solution is made in the reaction of terephthalic acid and yellow soda ash earlier; under the nitrogen protection; with 4; the 6-diamino resorcin hydrochlorate aqueous solution reacts, filtration, vacuum-drying; obtain 4,6-diamino resorcin/terephthalate is then at polyphosphoric acid/P
2O
5Carry out polyreaction in the system.The weak point of this method is: (1) water consumption is big, and the wasting of resources is bigger; (2) waste water is more, is unfavorable for environment protection; In addition, also increased the wastewater treatment expense.(3) obtain 4, the easy oxidation by air of 6-diamino resorcin/terephthalate and influence quality is unfavorable for follow-up polyreaction.The drying palpus vacuum-drying of (4) 4,6-diamino resorcin/terephthalates, it is bigger to consume energy.(5) adopt at polyphosphoric acid/P
2O
5Carry out polyreaction in the system, conversion unit is required height, and the subsequent disposal difficulty is big, expense is high, is unfavorable for commercial scale production.
European Polymer Journal 2004,40,1127-1135 disclose the preparation method of the aromatic series polybenzoxazole that contains adjacent penylene dioxy group, it is characterized in that: (1) low-temperature polycondensation, propylene oxide (PO) is an acid absorber: two (Ortho-Aminophenol) compound (as, 2, two (the 3-amino-4-hydroxy phenyl)-1 of 2-, 1,1,3,3,3-HFC-236fa (B3A4HPFP), 3,3 '-dihydroxyl-4,4 '-benzidine (B3H4ABP) etc.) be dissolved among the NMP, add propylene oxide (PO) at-10 ℃～0 ℃, after stirring, adding diacid chloride compound (as, 4,4 '-(1,2-penylene dioxy) dibenzoyl chlorine, 4,4 '-(4-tertiary butyl-1,2-penylene dioxy) dibenzoyl chlorine etc.), in-10 ℃～0 ℃ reaction down, reaction at ambient temperature must gather adjacent oxyamide then; (2) the high temperature dehydration cyclization generates polybenzoxazoles.Chemical equation is as follows:
-R:-H or
The shortcoming of this method is: (1) is reflected under-10 ℃～0 ℃ the cold condition and carries out polyreaction, and it is bigger to consume energy; (2) produce HCl in the reaction process, need absorb with propylene oxide, thereby cost is increased, the three wastes increase, and to the also corresponding raising of equipment requirements, are unfavorable for carrying out industrialized production.
Summary of the invention
Technical problem to be solved by this invention provides a kind of preparation method of polybenzoxazole thin film, to remedy the deficiencies in the prior art or defective meets the demands of production and living.
In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is: a kind of preparation method of polybenzoxazole thin film comprises the steps:
(1) with mol ratio is 1: 1 two (Ortho-Aminophenol) compounds of aromatic series and aromatic dicarboxylic acid anhydride, in strong polar non-proton organic solvent, under the nitrogen protection, after reacting 3～10 hours under 5 ℃, obtain poly-adjacent oxyamide acid solution, wherein, to account for the mass percent of whole reaction system be 5%～20% to strong polar non-proton organic solvent; Described strong polar non-proton organic solvent is N, one or more in dinethylformamide (DMF), N,N-dimethylacetamide (DMAc), N-N-methyl-2-2-pyrrolidone N-(NMP) or the dimethyl sulfoxide (DMSO) (DMSO).
(2) will gather adjacent oxyamide acid solution curtain coating and become uniform thin film; under the nitrogen protection; the temperature range internal reaction of heat temperature raising to 100 ℃～300 ℃ 4～8 hours continues to be warming up to 350 ℃～450 ℃ temperature range internal reaction 2.5～4 hours, obtains tough and tensile transparent polybenzoxazole thin film.
As optimized technical scheme: two (Ortho-Aminophenol) compounds of described aromatic series are 2, two (the 3-amino-4-hydroxy phenyl)-1 of 2-, 1,1,3,3,3-HFC-236fa (B3A4HPFP), 2, two (the 3-hydroxyls-4-aminophenyl)-1 of 2-, 1,1,3,3,3-HFC-236fa (B3H4APFP), 2, two (the 3-amino-4-hydroxy phenyl) propane (B3A4HPP) of 2-, 2, two (3-hydroxyl-4-aminophenyl) propane (B3H4APP) of 2-, 3,3 '-diamino-4,4 '-dihydroxybiphenyl (B3A4HBP), 3,3 '-dihydroxyl-4,4 '-benzidine (B3H4ABP), 3,3 '-diamino-4,4 '-dioxydiphenyl methane (3A4HDPM), 3,3 '-dihydroxyl-4,4 '-diaminodiphenylmethane (3H4ADPM), 3,3 '-diamino-4,4 '-dihydroxy diphenylsulphone (3A4HDPS), 3,3 '-dihydroxyl-4,4 '-diaminodiphenylsulfone(DDS) (3H4ADPS), 3,3 '-diamino-4,4 '-dihydroxyl diphenyl sulfide (3A4HDPSE), 3,3 '-dihydroxyl-4,4 '-diaminodiphenyl sulfide (3H4ADPSE), 3,3 '-diamino-4,4 '-dihydroxy diphenyl ether (3A4HDPE), 3,3 '-dihydroxyl-4,4 '-diaminodiphenyl oxide (3H4ADPE) or 4, one or more in the 6-diamino resorcin (46DAR).
Described aromatic dicarboxylic acid anhydride is pyromellitic acid anhydride (PMDA), 3,3 ', 4,4 '-tetracarboxylic acid phenyl ether dianhydride (ODPA), 2,3,3 ', 4 '-tetracarboxylic acid phenyl ether dianhydride (23340DPA), 2,2 ', 3,3 '-tetracarboxylic acid phenyl ether dianhydride (22330DPA), 3,3 ', 4,4 '-tetracarboxylic acid benzophenone dianhydride (BTDA), 2,3,3 ', 4 '-tetracarboxylic acid benzophenone dianhydride (2334BTDA), 2,2 ', 3,3 '-tetracarboxylic acid benzophenone dianhydride (2233BTDA), 3,3 ', 4,4 '-tetracarboxylic acid biphenyl dianhydride (BPDA), 2,3,3 ', 4 '-tetracarboxylic acid biphenyl dianhydride (2334BPDA), 2,2 ', 3,3 '-tetracarboxylic acid biphenyl dianhydride (2233BPDA), 3,3 ', 4,4 '-tetracarboxylic acid diphenyl sulfone dianhydride (DSDA), 2,3,3 ', 4 '-tetracarboxylic acid diphenyl sulfone dianhydride (2334DSDA), 2,2 ', 3,3 '-tetracarboxylic acid diphenyl sulfone dianhydride (2233DSDA), 3,3 ', 4,4 '-tetracarboxylic acid diphenyl sulfide dianhydride (SDPA), 2,3,3 ', 4 '-tetracarboxylic acid diphenyl sulfide dianhydride (2334SDPA), 2,2 ', 3,3 '-tetracarboxylic acid diphenyl sulfide dianhydride (2233SDPA), 2,2-two (3,4-dicarboxyl phenyl) hexafluoropropane dianhydride (6FDA), 1, two (3, the 4-di carboxyl phenyloxy) benzene dianhydrides (HQDA) of 4-, 1,3-two (3, the 4-di carboxyl phenyloxy) benzene dianhydride (ResDA), 1, two (3, the 4-di carboxyl phenyloxy) benzene dianhydrides (OPDDA) of 2-, 2,2-is two, and [4-(3, the 4-di carboxyl phenyloxy) phenyl] propane dianhydride (BPADA), 2, two [4-(3, the 4-di carboxyl phenyloxy) phenyl] hexafluoropropane dianhydrides (BPAFDA) or 1,4 of 2-, 5, one or more in the 8-naphthalenetetracarbacidic acidic dianhydride (NTDA).
Chemical equation of the present invention is as follows:
The invention has the beneficial effects as follows: (1) preparation method of the present invention helps realizing the industrial production of polybenzoxazole thin film on casting machine; (2) operation steps of the present invention is simple, does not have materials such as polyphosphoric acid, sulfuric acid, hydrochloric acid in the reaction system, and equipment need not the acid-proof rotproofing, has saved the fixed capital input; (3) reaction does not produce HCl, need not to remove HCl, need not acid absorber, has overcome because of removing the many disadvantages that HCl produces; (4) need not operations such as salt-forming reaction, washing, filtration, vacuum-drying, do not produce waste water, environmental friendliness has also been saved the waste water treatment expense; (5) polyreaction gentleness (normal pressure, near room temperature) greatly reduces energy consumption; (6) reaction medium is an organic solvent, is easy to recycle and reuse; With respect to polyphosphoric acid/P
2O
5Reaction medium, the present invention more helps the operation sequence of follow-up removal " reaction medium ".
Embodiment
Below in conjunction with specific embodiment the present invention is further elaborated.
Embodiment 1
With 25.8 gram (0.1 moles) 2, two (the 3-amino-4-hydroxy phenyl) propane (B3A4HPP) of 2-are added in the polymerization bottle, add 400 milliliters of N-N-methyl-2-2-pyrrolidone N-s (NMP), feed nitrogen, ice-water bath is cooled to 5 ℃, stirs, after making it to dissolve fully, add 21.8 gram (0.1 mole) pyromellitic acid anhydride (PMDA) powder, stirring reaction obtained thick poly-adjacent oxyamide acid solution after 3 hours.Subsequently, thick poly-adjacent oxyamide acid solution curtain coating is become uniform film, under the nitrogen protection, heat temperature raising to 100 ℃ kept 2 hours; Each temperature spot that continues to be warming up to 150 ℃, 200 ℃, 250 ℃, 300 ℃, 350 ℃, 400 ℃ kept 1 hour; Be warming up to 450 ℃ then, keep half an hour after, close heating system, naturally cool to room temperature after, carry out demoulding, obtain tough and tensile transparent polybenzoxazole thin film.Infrared spectra absorbs the charateristic avsorption band that tangible benzoxazole ring is arranged in the spectrogram: 1616cm
-1(C=N) and 1060cm
-1(C-O), there is not OH absorption peak (3400cm
-1).
Embodiment 2
With 25.8 gram (0.1 moles) 2, two (the 3-amino-4-hydroxy phenyl) propane (B3A4HPP) of 2-are added in the polymerization bottle, add 450 milliliters of N-N-methyl-2-2-pyrrolidone N-s (NMP), feed nitrogen, ice-water bath is cooled to 5 ℃, stir, after making it to dissolve fully, add 10.9 gram (0.05 mole) pyromellitic acid anhydride (PMDA) powder and 14.7 gram (0.05 moles) 3,3 ', 4,4 '-tetracarboxylic acid biphenyl dianhydride (BPDA) powder, behind the stirring reaction 5 hours, obtain thick poly-adjacent oxyamide acid solution.Subsequently, thick poly-adjacent oxyamide acid solution curtain coating is become uniform film, under the nitrogen protection, heat temperature raising to 100 ℃ kept 2 hours; Each temperature spot that continues to be warming up to 150 ℃, 200 ℃, 250 ℃, 300 ℃, 350 ℃, 400 ℃ kept 1 hour; Be warming up to 450 ℃ then, keep half an hour after, close heating system, naturally cool to room temperature after, carry out demoulding, obtain tough and tensile transparent polybenzoxazole thin film.
Embodiment 3
With 12.9 gram (0.05 moles) 2, two (3-amino-4-hydroxy phenyl) propane (B3A4HPP) of 2-and 18.3 gram (0.05 moles) 2, two (the 3-amino-4-hydroxy phenyl)-1,1 of 2-, 1,3,3,3-HFC-236fa (B3A4HPFP) is added in the polymerization bottle, add 400 milliliters of N, N-N,N-DIMETHYLACETAMIDE (DMAc) feeds nitrogen, and ice-water bath is cooled to 5 ℃, stir, after making it to dissolve fully, add 10.9 (0.05 moles) gram pyromellitic acid anhydride (PMDA) powder and 14.7 gram (0.05 moles) 3,3 ', 4,4 '-tetracarboxylic acid biphenyl dianhydride (BPDA) powder, stirring reaction obtained thick poly-adjacent oxyamide acid solution after 10 hours.Subsequently, thick poly-adjacent oxyamide acid solution curtain coating is become uniform film, under the nitrogen protection, heat temperature raising to 100 ℃, each temperature spot of 150 ℃, 200 ℃, 250 ℃, 300 ℃, 350 ℃, 400 ℃ kept 1 hour; Be warming up to 450 ℃ then, keep half an hour after, close heating system, naturally cool to room temperature after, carry out demoulding, obtain tough and tensile transparent polybenzoxazole thin film.
Embodiment 4
Remove and adopt 31.0 gram (0.1 moles) 3,3 ', 4,4 '-tetracarboxylic acid phenyl ether dianhydride (ODPA) powder to replace outside 21.8 gram (0.1 mole) pyromellitic acid anhydride (PMDA) powder, other raw material, prescription, technology are all with embodiment 1.Finally also obtain tough and tensile transparent polybenzoxazole thin film.
Embodiment 5
Remove and adopt 32.2 gram (0.1 moles) 3,3 ', 4,4 '-tetracarboxylic acid benzophenone dianhydride (BTDA) powder to replace outside 21.8 gram (0.1 mole) pyromellitic acid anhydride (PMDA) powder, other raw material, prescription, technology are all with embodiment 1.Finally also obtain tough and tensile transparent polybenzoxazole thin film.
Embodiment 6
Remove and adopt 52.0 gram (0.1 moles) 2, two [4-(3, the 4-di carboxyl phenyloxy) phenyl] propane dianhydride (BPADA) powder of 2-to replace outside 21.8 gram (0.1 mole) pyromellitic acid anhydride (PMDA) powder, other raw material, prescription, technology are all with embodiment 1.Finally also obtain tough and tensile transparent polybenzoxazole thin film.
Claims (3)
1, a kind of preparation method of polybenzoxazole thin film is characterized in that, comprises the steps:
(1) with mol ratio is 1: 1 two (Ortho-Aminophenol) compounds of aromatic series and aromatic dicarboxylic acid anhydride, in strong polar non-proton organic solvent, under the nitrogen protection, after reacting 3～10 hours under 5 ℃, obtain poly-adjacent oxyamide acid solution, wherein, to account for the mass percent of whole reaction system be 5%～20% to strong polar non-proton organic solvent; Described strong polar non-proton organic solvent is N, a kind of in dinethylformamide, N,N-dimethylacetamide, N-N-methyl-2-2-pyrrolidone N-or the dimethyl sulfoxide (DMSO);
(2) will gather adjacent oxyamide acid solution curtain coating and become uniform thin film; under the nitrogen protection; the temperature range internal reaction of heat temperature raising to 100 ℃～300 ℃ 4～8 hours continues to be warming up to 350 ℃～450 ℃ temperature range internal reaction 2.5～4 hours, obtains tough and tensile transparent polybenzoxazole thin film.
2, preparation method according to claim 1, it is characterized in that, two (Ortho-Aminophenol) compounds of described aromatic series are 2, two (the 3-amino-4-hydroxy phenyl)-1,1,1 of 2-, 3,3, the 3-HFC-236fa, 2, two (the 3-hydroxyls-4-aminophenyl)-1 of 2-, 1,1,3,3, the 3-HFC-236fa, 2, two (the 3-amino-4-hydroxy phenyl) propane of 2-, 2, two (3-hydroxyl-4-aminophenyl) propane of 2-, 3,3 '-diamino-4,4 '-dihydroxybiphenyl, 3,3 '-dihydroxyl-4,4 '-benzidine, 3,3 '-diamino-4,4 '-dioxydiphenyl methane, 3,3 '-dihydroxyl-4,4 '-diaminodiphenylmethane, 3,3 '-diamino-4,4 '-dihydroxy diphenylsulphone, 3,3 '-dihydroxyl-4,4 '-diaminodiphenylsulfone(DDS), 3,3 '-diamino-4,4 '-dihydroxyl diphenyl sulfide, 3,3 '-dihydroxyl-4,4 '-diaminodiphenyl sulfide, 3,3 '-diamino-4,4 '-dihydroxy diphenyl ether, 3,3 '-dihydroxyl-4,4 '-diaminodiphenyl oxide or 4, one or more in the 6-diamino resorcin.
3, preparation method according to claim 1 is characterized in that, described aromatic dicarboxylic acid anhydride is a pyromellitic acid anhydride, 3,3 ', 4,4 '-tetracarboxylic acid phenyl ether dianhydride, 2,3,3 ', 4 '-tetracarboxylic acid phenyl ether dianhydride, 2,2 ', 3,3 '-tetracarboxylic acid phenyl ether dianhydride, 3,3 ', 4,4 '-tetracarboxylic acid benzophenone dianhydride, 2,3,3 ', 4 '-tetracarboxylic acid benzophenone dianhydride, 2,2 ', 3,3 '-tetracarboxylic acid benzophenone dianhydride, 3,3 ', 4,4 '-tetracarboxylic acid biphenyl dianhydride, 2,3,3 ', 4 '-tetracarboxylic acid biphenyl dianhydride, 2,2 ', 3,3 '-tetracarboxylic acid biphenyl dianhydride, 3,3 ', 4,4 '-tetracarboxylic acid diphenyl sulfone dianhydride, 2,3,3 ', 4 '-tetracarboxylic acid diphenyl sulfone dianhydride, 2,2 ', 3,3 '-tetracarboxylic acid diphenyl sulfone dianhydride, 3,3 ', 4,4 '-tetracarboxylic acid diphenyl sulfide dianhydride, 2,3,3 ', 4 '-tetracarboxylic acid diphenyl sulfide dianhydride, 2,2 ', 3,3 '-tetracarboxylic acid diphenyl sulfide dianhydride, 2,2-two (3,4-dicarboxyl phenyl) hexafluoropropane dianhydride, 1, two (3, the 4-di carboxyl phenyloxy) benzene dianhydrides of 4-, 1,3-two (3, the 4-di carboxyl phenyloxy) benzene dianhydride, 1, two (3, the 4-di carboxyl phenyloxy) benzene dianhydrides of 2-, 2,2-is two, and [4-(3, the 4-di carboxyl phenyloxy) phenyl] the propane dianhydride, 2, two [4-(3, the 4-di carboxyl phenyloxy) phenyl] hexafluoropropane dianhydrides or 1,4 of 2-, 5, one or more in the 8-naphthalenetetracarbacidic acidic dianhydride.
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| WO2014168054A1 (en) * | 2013-04-08 | 2014-10-16 | 住友ベークライト株式会社 | Polymer solution, polymer film, stacked composite, display element, optical element, illumination element, and production method therefor |
| CN103682364B (en) * | 2013-12-27 | 2016-06-01 | 上海孚赛特新材料股份有限公司 | The tackiness agent of cathode of lithium battery and the lithium cell cathode material of preparation thereof and lithium cell |
| CN107474251A (en) * | 2017-08-18 | 2017-12-15 | 南京工业大学 | A kind of preparation method of membrane capacitance compound dielectric film |
| CN108043232B (en) * | 2017-12-06 | 2021-02-09 | 上海交通大学 | Six-membered ring polyimide copolymer separation membrane and preparation method and application thereof |
| CN109679098B (en) * | 2019-01-03 | 2021-05-28 | 华东理工大学 | Preparation method of pomegranate type closed-cell silicon dioxide-fluorine-containing polybenzoxazole composite film |
| CN110305332B (en) * | 2019-07-03 | 2022-01-28 | 华东理工大学 | Composite packaging material, preparation method thereof and composite film |
| CN115477757B (en) * | 2021-05-31 | 2024-04-05 | 中国科学院宁波材料技术与工程研究所 | Thermal rearrangement polymer based on 2,2', 3' -biphenyl tetracarboxylic dianhydride, and preparation method and application thereof |
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Assignee: Guangdong Demei Fine Chemical Co., Ltd. Assignor: Donghua University Contract fulfillment period: 2008.12.15 to 2014.12.14 contract change Contract record no.: 2010440000097 Denomination of invention: Preparation method of polybenzoxazole thin film Granted publication date: 20081210 License type: Exclusive license Record date: 2010.1.12 |
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| LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2008.12.15 TO 2014.12.14; CHANGE OF CONTRACT Name of requester: GUANGDONG DEMEI FINE CHEMICAL CO., LTD. Effective date: 20100112 |
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| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081210 Termination date: 20110905 |