CN100412111C - Preparation method of phenolic hydroxyl group containing polyimide powder - Google Patents
Preparation method of phenolic hydroxyl group containing polyimide powder Download PDFInfo
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- CN100412111C CN100412111C CNB2006100308272A CN200610030827A CN100412111C CN 100412111 C CN100412111 C CN 100412111C CN B2006100308272 A CNB2006100308272 A CN B2006100308272A CN 200610030827 A CN200610030827 A CN 200610030827A CN 100412111 C CN100412111 C CN 100412111C
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- amino
- dianhydride
- benzene
- benzene oxygen
- tetracarboxylic acid
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- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
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CNB2006100308272A CN100412111C (en) | 2006-09-05 | 2006-09-05 | Preparation method of phenolic hydroxyl group containing polyimide powder |
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CNB2006100308272A CN100412111C (en) | 2006-09-05 | 2006-09-05 | Preparation method of phenolic hydroxyl group containing polyimide powder |
Publications (2)
Publication Number | Publication Date |
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CN1927908A CN1927908A (en) | 2007-03-14 |
CN100412111C true CN100412111C (en) | 2008-08-20 |
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CNB2006100308272A Expired - Fee Related CN100412111C (en) | 2006-09-05 | 2006-09-05 | Preparation method of phenolic hydroxyl group containing polyimide powder |
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CN (1) | CN100412111C (en) |
Families Citing this family (22)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101289537B (en) * | 2008-05-19 | 2010-09-08 | 东华大学 | Method for preparing 1,4-di(2,4-diaminophenoxy)benzenoid form self-plasticizing unsaturated polyimides powder |
CN101353424B (en) * | 2008-05-21 | 2011-11-16 | 广东生益科技股份有限公司 | Thermoplastic polyimide resin containing active lateral group, flexible copper clad laminate manufactured with the same and manufacturing method thereof |
CN101787290B (en) * | 2010-02-11 | 2013-02-06 | 东华大学 | Method for preparing polyimide intercalated grafted magnesium hydroxide flame retardant |
CN101922061B (en) * | 2010-08-06 | 2013-04-03 | 东华大学 | Polyimide fiber and preparation method thereof |
CN101914357A (en) * | 2010-08-06 | 2010-12-15 | 东华大学 | Epoxy-organic silicon polyimide adhesive and preparation method thereof |
CN101928460B (en) * | 2010-08-18 | 2012-07-04 | 东华大学 | Preparation method of linear polyimide-maleimide copolymer film containing active groups |
US20120211258A1 (en) * | 2011-02-18 | 2012-08-23 | Hitachi Cable, Ltd. | Polyamide-imide resin insulating coating material and insulated wire using the same |
CN103370354B (en) * | 2011-03-16 | 2016-01-20 | 东丽株式会社 | Composition epoxy resin and manufacture method thereof and use its semiconductor device |
CN102391226A (en) * | 2011-08-25 | 2012-03-28 | 中国航空工业集团公司北京航空材料研究院 | Diamine monomer with phthalein structure and phenolic hydroxyl and preparation method thereof |
CN102633662A (en) * | 2012-03-27 | 2012-08-15 | 湖北大学 | Preparation method of 2,2-di[4-(4'-aminophenoxy)phenyl]propane |
CN102660796B (en) * | 2012-04-27 | 2014-05-28 | 东华大学 | Polyimide fiber spinning solution based on 2,2-bi(3-amimo-4-hydroxycyclohexyl phenyl) hexafluoropropane and preparation method thereof |
CN103131371B (en) * | 2013-03-11 | 2014-07-02 | 东华大学 | 4,4'-bis(2,4-diamidophenoxy)diphenylmethane high-temperature-resistant epoxy adhesive and preparation method thereof |
KR101562146B1 (en) | 2013-09-30 | 2015-10-20 | 주식회사 엘지화학 | Substrate for organic electronic |
CN105001421A (en) * | 2015-07-03 | 2015-10-28 | 中科院广州化学有限公司南雄材料生产基地 | Preparation of polyimide solid powder containing phenolic hydroxyl group and application thereof |
CN105111927B (en) * | 2015-09-02 | 2017-04-05 | 东华大学 | A kind of high temperature resistant BAHPFP type wire enamel and preparation method thereof |
CN110591092B (en) * | 2018-06-13 | 2020-11-10 | 北京大学 | Polyimide high polymer material based on 2, 5-diallyloxy p-phenylenediamine monomer and preparation method thereof |
CN109694574A (en) * | 2018-12-17 | 2019-04-30 | 无锡创彩光学材料有限公司 | A kind of high adhesiveness Kapton, preparation method and flexible copper-clad plate |
CN109722213A (en) * | 2018-12-21 | 2019-05-07 | 东华大学 | A kind of BAHPP type silicon-containing adhesive and preparation method thereof |
CN109749100B (en) * | 2018-12-21 | 2022-11-18 | 航天科工(长沙)新材料研究院有限公司 | Preparation method and application of small-particle-size polyimide powder |
CN110204717A (en) * | 2019-06-05 | 2019-09-06 | 无锡创彩光学材料有限公司 | It is a kind of with the thermoplastic polyimide resin, thermoplastic polyimide film and flexible metal foil laminate that are hot bonding performance |
CN111876116A (en) * | 2020-06-24 | 2020-11-03 | 南北兄弟药业投资有限公司 | Polyimide modified epoxy resin composite conductive adhesive and preparation method thereof |
CN113831559B (en) * | 2021-09-22 | 2023-11-21 | 浙江省开化七一电力器材有限责任公司 | Method for improving interfacial adhesion performance of epoxy resin matrix composite material |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1428360A (en) * | 2001-12-25 | 2003-07-09 | 中国科学院大连化学物理研究所 | Method for preparing polyimide molding powder |
JP2005200435A (en) * | 2002-12-20 | 2005-07-28 | Kaneka Corp | Polyimide film, and metal laminated plate obtained using polyimide film |
US20060105185A1 (en) * | 2004-11-12 | 2006-05-18 | Chang Chun Plastics Co., Ltd. | New process for preparing polyimide |
-
2006
- 2006-09-05 CN CNB2006100308272A patent/CN100412111C/en not_active Expired - Fee Related
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN1428360A (en) * | 2001-12-25 | 2003-07-09 | 中国科学院大连化学物理研究所 | Method for preparing polyimide molding powder |
JP2005200435A (en) * | 2002-12-20 | 2005-07-28 | Kaneka Corp | Polyimide film, and metal laminated plate obtained using polyimide film |
US20060105185A1 (en) * | 2004-11-12 | 2006-05-18 | Chang Chun Plastics Co., Ltd. | New process for preparing polyimide |
Also Published As
Publication number | Publication date |
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CN1927908A (en) | 2007-03-14 |
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EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Sinoinfo ECommerce Inc. Assignor: Donghua University Contract fulfillment period: 2009.10.23 to 2015.10.22 Contract record no.: 2009350000266 Denomination of invention: Preparation method of phenolic hydroxyl group containing polyimide powder Granted publication date: 20080820 License type: Exclusive license Record date: 20091225 |
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LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.10.23 TO 2015.10.22; CHANGE OF CONTRACT Name of requester: FUJIAN LIHAO ELECTRONIC SCIENCE AND TECHNOLOGY CO. Effective date: 20091225 |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20080820 Termination date: 20190905 |
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CF01 | Termination of patent right due to non-payment of annual fee |