CN100433392C - Special finned pipe shaped radiator for semiconductor refrigeration unit and its preparation method - Google Patents

Special finned pipe shaped radiator for semiconductor refrigeration unit and its preparation method Download PDF

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Publication number
CN100433392C
CN100433392C CNB2006101022060A CN200610102206A CN100433392C CN 100433392 C CN100433392 C CN 100433392C CN B2006101022060 A CNB2006101022060 A CN B2006101022060A CN 200610102206 A CN200610102206 A CN 200610102206A CN 100433392 C CN100433392 C CN 100433392C
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CN
China
Prior art keywords
transverse tube
standpipe
end cap
refrigeration unit
bar shaped
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CNB2006101022060A
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Chinese (zh)
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CN1971959A (en
Inventor
温金宇
王双玲
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Luquan Jiwei Electric Appliance Co., Ltd.
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王双玲
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 王双玲 filed Critical 王双玲
Priority to CNB2006101022060A priority Critical patent/CN100433392C/en
Publication of CN1971959A publication Critical patent/CN1971959A/en
Priority to US11/940,836 priority patent/US20080128120A1/en
Application granted granted Critical
Publication of CN100433392C publication Critical patent/CN100433392C/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Classifications

    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • B23P15/26—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass heat exchangers or the like
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F9/0219—Arrangements for sealing end plates into casing or header box; Header box sub-elements
    • F28F9/0224—Header boxes formed by sealing end plates into covers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P2700/00—Indexing scheme relating to the articles being treated, e.g. manufactured, repaired, assembled, connected or other operations covered in the subgroups
    • B23P2700/09—Heat pipes
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D21/00—Heat-exchange apparatus not covered by any of the groups F28D1/00 - F28D20/00
    • F28D2021/0019—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for
    • F28D2021/0028—Other heat exchangers for particular applications; Heat exchange systems not otherwise provided for for cooling heat generating elements, e.g. for cooling electronic components or electric devices
    • F28D2021/0031—Radiators for recooling a coolant of cooling systems
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F9/00—Casings; Header boxes; Auxiliary supports for elements; Auxiliary members within casings
    • F28F9/02—Header boxes; End plates
    • F28F2009/0285—Other particular headers or end plates
    • F28F2009/0292—Other particular headers or end plates with fins
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2255/00—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes
    • F28F2255/16—Heat exchanger elements made of materials having special features or resulting from particular manufacturing processes extruded
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2265/00—Safety or protection arrangements; Arrangements for preventing malfunction
    • F28F2265/12—Safety or protection arrangements; Arrangements for preventing malfunction for preventing overpressure
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • F28F3/04—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element
    • F28F3/048—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations the means being integral with the element in the form of ribs integral with the element or local variations in thickness of the element, e.g. grooves, microchannels
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/4935—Heat exchanger or boiler making
    • Y10T29/49359—Cooling apparatus making, e.g., air conditioner, refrigerator

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Thermal Sciences (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

This invention relates to one semiconductor cooling device special tube dissipation fin and its process method, which comprises space tube and top and down level tubes by welding to form dissipation chamber, wherein, the dissipation chamber is connected to evaporator through pipes with two ends as blind ends; the level and stand tube surfaces are distributed with tangent line at angle alphaalong bar fins with 0degree<alpha<= 90degree to process each part through protruding, impacting or other process for dissispation device.

Description

Special finned pipe shaped radiator for semiconductor refrigeration unit and preparation method thereof
Technical field
The invention belongs to radiator and preparation method, be meant a kind of special finned pipe shaped radiator for semiconductor refrigeration unit and preparation method thereof especially.
Background technology
Present disclosed data shows that the overall structure of standpipe radiator is to beat connection holes between last lower transverse tubule and the standpipe to finish with artificial assembly weldings of mode such as adding the heat radiation silk.Its transverse tube generally adopts the welding of light pipe and standpipe, the area of dissipation of original transverse tube, standpipe, because the employing light pipe adds welding heat radiation silk and fin solves, contact for spot welding so cause between light pipe and heat radiation thread and the fin, not only area of dissipation is subjected to the restriction of pad, and heat transfer efficiency only is 20%～30% of an overall structure heat transfer efficiency.The number of welds that this kind radiator exists the radiating tube surface is various, and the welding procedure complexity can only be limited to manual welding and make, and can not realize industrialized mass production, and parts are difficult for realizing standardized production, and welding quality does not have the problem of assurance.
Summary of the invention
One of purpose of the present invention is to provide a kind of designs simplification, is easy to realize standardized production, and the special finned pipe shaped radiator for semiconductor refrigeration unit of good heat dissipation effect.
Another object of the present invention is to provide a kind of preparation method who is easy to realize the special finned pipe shaped radiator for semiconductor refrigeration unit of suitability for industrialized production.
Overall technology solution of the present invention is:
A, with standpipe (1), transverse tube or bar shaped end cap (2) respectively by respectively extrusion molding of extruding-out process, the sheet material that surface-coated is welded dressing is made end cap (7) that periphery is groove and surface by punch forming process and is offered the connecting plate (9) that flange through hole, both sides are groove; Or directly adopt machining mode to process through hole on the transverse tube surface;
B, bar shaped end cap (2), standpipe (1) are cut into corresponding length;
C, bar shaped end cap (2), connecting plate (9), end cap (7) that preparation among step a, the b is finished are assembled into transverse tube, then the standpipe (1) for preparing among transverse tube and the step b is connected according to the matching requirements plug-in mounting and finishes, and with special mould clamp fixing after, send into the stove soldering equipment, the welding dressing fusion of heating and making each component surface, fusion dressing is undertaken from spreading by capillarity at place, the connection slit of each member, realizes fixedly connected between each member; In this step also can with the transverse tube that has through hole for preparing among the step a directly and the standpipe (1) among the step b weld assembly.
Concrete technology solution among the present invention also has:
Transverse tube for form by section bar and section be arch form bar shaped end cap 2, be plugged in the tubular-shaped structures that the connecting plate 9 at bar shaped end cap 2 strip gab places is formed, the two ends of transverse tube are packaged with end cap 7.Can be apparently, it is the integrated section bar of " U " shape that bar shaped end cap 2 both can adopt section, also can select for use sheet material or heterotype profiled sheet overlap joint assembly welding to form, wherein optimized technical scheme is that to adopt bar shaped end cap 2 to select section for use be the integrated section bar of " U " shape.This kind structure is suitable for large-scale mass production.
Transverse tube or can also be directly pass through the section bar extrusion molding, and process the through hole that is connected with standpipe by mach mode on its surface, this kind structure is suitable for small-scale production, though number of welds is more, production efficiency is low, does not break away from essence of the present invention.
Bar shaped fin 6 is radial distribution, extends vertically at the outer surface of tube wall of transverse tube and standpipe 1.Wherein optimized technical scheme is that bar shaped fin 6 is radially equal angles distribution, extends vertically at the outer surface of tube wall of transverse tube and standpipe 1.
Bar shaped fin 6 adopts integrated molding with transverse tube or standpipe 1.Wherein optimized technical scheme is that the aluminium section bar is for making material, adopting the extruding-out process integrated molding.
Select for use welding to cooperate between transverse tube, standpipe 1 and adjacent pipe fitting or the member.
Transverse tube or standpipe 1 are provided with relief valve 3.
The transverse tube end is provided with and is communicated with inspection hole 5 with its inner chamber.
Also wrap a steps d among the preparation method, be about to the corresponding component surface assembling relief valve 3 of radiator and the inspection hole 5 that prepare among the step c.
Substantive distinguishing features that the present invention is obtained and significant technological progress are:
First; Adopt transverse tube, the disposable extrusion molding of standpipe, connecting plate and through hole are once blanking punched, and assemble welding fabrication of laggard stove and finish.Radiator body is fixed to standpipe class radiator, it is single to have overcome the coil radiator circulation line, and the detour that water of radiation runs in cyclic process is a lot, the problem that circulation is obstructed, the bearing capacity that has also overcome simultaneously panel radiator is low, causes distortion, distortion, the solder joint problems of crack of radiator easily.
Second; Critical piece is an extrusion profile, and production and processing technology is simple and reliable, and with low cost, the rate of finished products height.The bar shaped end cap of standpipe, transverse tube or transverse tube and the extrusion molding of bar shaped fin one piece, so not only area of dissipation has increased by 8～10 times than existing product, and heat transfer efficiency has improved 60%～80%.
The 3rd; The welding of use high-end devices has overcome the of poor quality of manual welding, inefficient problem, and can large batch of suitability for industrialized production.
The 4th; Employing is provided with the bar shaped fin at standpipe and transverse tube surface, has increased the efficiently radiates heat area of standpipe and transverse tube, and a large amount of minimizings pad.
Description of drawings
Accompanying drawing of the present invention has:
Fig. 1 is an overall structure schematic diagram of the present invention.
Fig. 2 is the left view of Fig. 1.
Fig. 3 is the I portion structure for amplifying schematic diagram among Fig. 2.
Embodiment
Below in conjunction with accompanying drawing embodiments of the invention are described further, but not as a limitation of the invention.
Special finned pipe shaped radiator for semiconductor refrigeration unit, comprise by the welding of standpipe 1 and last lower transverse tubule and communicate with each other and forms the chamber of dispelling the heat, with the evaporator 4 of heat radiation chamber by pipeline connection, the two ends of transverse tube are cecum, described transverse tube and standpipe 1 outer surface are distributed with bar shaped fin 6, and bar shaped fin 6 is radially equal angles distribution, extends vertically at the outer surface of tube wall of transverse tube and standpipe 1.Transverse tube by the bar shaped end cap 2 that is arch form for section, be plugged in the tubular-shaped structures that the connecting plate 9 at bar shaped end cap 2 strip gab places is formed, the two ends of transverse tube are packaged with end cap 7.
Bar shaped fin 6 is that the aluminium section bar is for making material, adopting the extruding-out process integrated molding with transverse tube or standpipe 1.
Select for use welding to cooperate between transverse tube, standpipe 1 and adjacent pipe fitting or the member.
Transverse tube or standpipe 1 are provided with relief valve 3.
The transverse tube end is provided with and is communicated with inspection hole 5 with its inner chamber.
The preparation method of special finned pipe shaped radiator for semiconductor refrigeration unit comprises the steps:
A, with bar shaped end cap 2, standpipe 1 by extruding-out process disposable extrusion molding respectively, the sheet material that surface-coated is welded dressing is made periphery by punch forming process and is the end cap 7 of groove and surface and offers the connecting plate 9 that flange through hole, both sides are groove;
B, bar shaped end cap 2, standpipe 1 are cut into corresponding length;
C, bar shaped end cap 2, connecting plate 9, end cap 7 that preparation among step a, the b is finished are assembled into transverse tube, then the standpipe 1 for preparing among transverse tube and the step b is connected according to the matching requirements plug-in mounting and finishes, and with special mould clamp fixing after, send into the stove soldering equipment, heat to about 230 ℃, make the welding dressing fusion of each component surface, fusion dressing is undertaken from spreading by capillarity at place, the connection slit of each member, realizes fixedly connected between each member.
Also wrap a steps d among the preparation method, be about to the corresponding component surface assembling relief valve 3 of radiator and the inspection hole 5 that prepare among the step c.

Claims (9)

1, special finned pipe shaped radiator for semiconductor refrigeration unit, comprise by the welding of standpipe (1) and last lower transverse tubule and communicate with each other and forms the chamber of dispelling the heat, with the evaporator (4) of heat radiation chamber by pipeline connection, the two ends of transverse tube are cecum, it is characterized in that bar shaped fin (6) is radial distribution, extends vertically at the outer surface of tube wall of transverse tube and standpipe (1); Transverse tube for form by section bar and section be arch form bar shaped end cap (2), be plugged in the tubular-shaped structures that the connecting plate (9) at bar shaped end cap (2) strip gab place is formed, the two ends of transverse tube are packaged with end cap (7), and bar shaped fin (6) adopts integrated molding with transverse tube or standpipe (1).
2, special finned pipe shaped radiator for semiconductor refrigeration unit according to claim 1, it is characterized in that described transverse tube is for being made up of section bar and section is the bar shaped end cap (2) of arch form, be plugged in the tubular-shaped structures of connecting plate (9) composition at bar shaped end cap (2) strip gab place, the two ends of transverse tube are packaged with end cap (7).
3, special finned pipe shaped radiator for semiconductor refrigeration unit according to claim 1 is characterized in that described bar shaped fin (6) is radial distribution, extends vertically at the outer surface of tube wall of transverse tube and standpipe (1).
4, special finned pipe shaped radiator for semiconductor refrigeration unit according to claim 1 is characterized in that described bar shaped fin (6) and transverse tube or standpipe (1) adopt integrated molding.
5, special finned pipe shaped radiator for semiconductor refrigeration unit according to claim 1 is characterized in that selecting for use welding to cooperate between described transverse tube, standpipe (1) and adjacent pipe fitting or the member.
6, special finned pipe shaped radiator for semiconductor refrigeration unit according to claim 1 is characterized in that described transverse tube or standpipe (1) are provided with relief valve (3).
7, special finned pipe shaped radiator for semiconductor refrigeration unit according to claim 1 is characterized in that described transverse tube end is provided with and is communicated with inspection hole (5) with its inner chamber.
8,, it is characterized in that comprising the steps: according to the preparation method of the described special finned pipe shaped radiator for semiconductor refrigeration unit of claim 1-5
A, with standpipe (1), transverse tube or bar shaped end cap (2) respectively by respectively extrusion molding of extruding-out process, the sheet material that surface-coated is welded dressing is made end cap (7) that periphery is groove and surface by punch forming process and is offered the connecting plate (9) that flange through hole, both sides are groove; Or directly adopt machining mode to process through hole on the transverse tube surface;
B, bar shaped end cap (2), standpipe (1) are cut into corresponding length;
C, bar shaped end cap (2), connecting plate (9), end cap (7) that preparation among step a, the b is finished are assembled into transverse tube, then the standpipe (1) for preparing among transverse tube and the step b is connected according to the matching requirements plug-in mounting and finishes, and with special mould clamp fixing after, send into the stove soldering equipment, the welding dressing fusion of heating and making each component surface, fusion dressing is undertaken from spreading by capillarity at place, the connection slit of each member, realizes fixedly connected between each member; In this step also can with the transverse tube that has through hole for preparing among the step a directly and the standpipe (1) among the step b weld assembly.
9, the preparation method of special finned pipe shaped radiator for semiconductor refrigeration unit according to claim 8 is characterized in that also wrapping a steps d, is about to the corresponding component surface assembling relief valve (3) of radiator and the inspection hole (5) that prepare among the step c.
CNB2006101022060A 2006-12-01 2006-12-01 Special finned pipe shaped radiator for semiconductor refrigeration unit and its preparation method Expired - Fee Related CN100433392C (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CNB2006101022060A CN100433392C (en) 2006-12-01 2006-12-01 Special finned pipe shaped radiator for semiconductor refrigeration unit and its preparation method
US11/940,836 US20080128120A1 (en) 2006-12-01 2007-11-15 Fin-pipe shaped radiator specially adapted to a semiconductor chilling unit and the method of making same

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB2006101022060A CN100433392C (en) 2006-12-01 2006-12-01 Special finned pipe shaped radiator for semiconductor refrigeration unit and its preparation method

Publications (2)

Publication Number Publication Date
CN1971959A CN1971959A (en) 2007-05-30
CN100433392C true CN100433392C (en) 2008-11-12

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CN102478317B (en) * 2010-11-29 2014-08-13 陶礼德 Flat box vertical heat pipe heat exchange water tank
CN102528409B (en) * 2012-01-05 2014-07-16 华为技术有限公司 Radiator of gravity loop heat pipe, condenser and manufacturing method thereof
GB2498373B (en) * 2012-01-12 2016-08-31 ECONOTHERM UK Ltd Heat exchanger
DE102014002407B4 (en) * 2014-02-20 2017-12-21 Modine Manufacturing Company Brazed heat exchanger
DE102015010288A1 (en) 2014-08-22 2016-02-25 Modine Manufacturing Company Heat exchanger, heat exchanger tank and method of making same

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CN1459853A (en) * 2002-05-20 2003-12-03 吴鸿平 Radiator fin, heat pipe, platter metal integrated radiator

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Publication number Publication date
US20080128120A1 (en) 2008-06-05
CN1971959A (en) 2007-05-30

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