CN100433231C - Method for manufacturing focusing guard of field emission display and focusing guard produced thereby - Google Patents
Method for manufacturing focusing guard of field emission display and focusing guard produced thereby Download PDFInfo
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- CN100433231C CN100433231C CNB2004100428275A CN200410042827A CN100433231C CN 100433231 C CN100433231 C CN 100433231C CN B2004100428275 A CNB2004100428275 A CN B2004100428275A CN 200410042827 A CN200410042827 A CN 200410042827A CN 100433231 C CN100433231 C CN 100433231C
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- guard
- wire
- metal guard
- field emission
- minus plate
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Abstract
The present invention relates to a method for manufacturing a focusing guard of a field emission display and a manufactured focusing guard. One negative guide wire is formed on the base plate edge of a negative plate of a field emission display. After the metal guard is formed on the negative plate, a guide wire which is parallel to the edge is formed on the edge of the metal guard. The length of the parallel guide wire is at least longer than one specific length, and the thickness of the parallel guide wire is thinner than that of the metal guard. Without applying the external force, the parallel guide wire droops because of self weight and contacts the negative plate. By using a sintering technology, the parallel guide wire is connected with the negative guide wire to make the metal guard sealed in the base plate. By using the method of the present invention, the manufactured focusing guard can not generate the breakage of connecting guide wires and a phenomenon of air overflow, do not need extra cost, can not influence a whole structure, can not generate phenomena of a short circuit and circuit break, and can fully reduce an invalid area.
Description
Technical field
The present invention relates to a kind of Field Emission Display and focus on the manufacture method of guard and the focusing guard of manufacturing, relate in particular to a kind of by the metal guard of change Field Emission Display and the manufacture of the connection lead between the minus plate, thereby make to focus on guard and can not produce and connect wire fracture and the gas phenomenon of overflowing, the Field Emission Display that encapsulation is more prone to focuses on the manufacture method of guard and the Field Emission Display of manufacturing focuses on guard.
Background technology
Present known Field Emission Display can divide two utmost points, three utmost points and quadrupole field emission display.In three utmost points and quadrupole field emission display, all have the metal guard, the metal guard is applied control voltage after, allow minus plate institute electrons emitted bundle can be smoothly produce image and show by the metal guard and on the directive positive plate.Because the difference of wire netting cover material and glass cement and cathode and anode substrate causes the metal guard to extend in the assembly outside, use to be used as lead, but this kind mode causes encapsulation bad easily, causes vacuumizing deficiency and excessive gas.
In order to overcome above-mentioned shortcoming, the metal guard can be encapsulated in fully cathode and anode substrate inside, extend in the assembly outside at the other lead of making, but these class methods have following shortcoming at present:
As shown in Figure 1 and Figure 2, first method is to set up a three-dimensional lead 5 between metal guard 3 and cathode base 4, utilize again and print another lead 6 on the cathode base 4 to extend to outside the assembly, though this mode can realize line purpose connected vertically, but fabrication schedule is loaded down with trivial details, three-dimensional lead 5 easy deformation and form short circuit.
As shown in Figure 3, second method is directly to print elargol lead 7 between metal guard 3 and cathode base 4, yet this method little fashion of drop between metal guard 3 and cathode base 4 can be used, but the drop between metal guard 3 and cathode base 4 reaches more than the specific degrees, when surmounting the ductility of the material of elargol own, the phenomenon of bad connection is arranged when vertical wires connects, open circuit and cause.
As Fig. 4, shown in Figure 5, the third method is directly perpendicular to metal guard 3 marginal portion extension wires 31, with lead 31 distortion of this metal guard 3 and be connected with the lead of cathode base 4.The extension of the vertical direction of the lead 31 of this metal guard 3 can make 3 distortion of metal guard, thereby influences the structure of the convergence hole in metal guard 3 effective coverages 32, and increases invalid edges zone 33.
Content of the present invention
The purpose of this invention is to provide a kind of Field Emission Display focuses on the manufacture method of guard and provides a kind of Field Emission Display Field Emission Display that utilizes this method to make to focus on guard.Described manufacture method can not produce the connection wire fracture and the gas phenomenon of overflowing when vacuumizing encapsulation, encapsulation is more prone to, and can improve the good rate of manufacturing of Field Emission Display.
For achieving the above object, the invention provides a kind of manufacture method of focusing guard of Field Emission Display, may further comprise the steps: a) on the substrate edges of minus plate, form a cathode wire; B) on minus plate after the form metal guard, this described wire netting shroud rim forms a lead parallel with the edge, the length of described parallel wire is at least more than a certain length-specific, and than metal guard thin thickness, must not apply under the external force situation, described parallel wire contacts with the cathode wire of described minus plate because of weight own is sagging; C) utilize sintering technology, described parallel wire is connected with described cathode wire, make described metal guard be encapsulated in described substrate inside.
According to a further aspect in the invention, the invention provides a kind of focusing guard of Field Emission Display, comprise a minus plate and the metal guard that is formed on the described minus plate, described minus plate comprises a substrate, wherein, form a cathode wire on the described substrate edges, be formed with a bonding pad in the appropriate position of described cathode wire; The top edge of described metal guard forms the length parallel wire more than a length-specific at least; Described parallel wire need not apply under the external force situation, can be connected because of the sagging and described bonding pad of weight own.
Utilize manufacture method of the present invention when vacuumizing encapsulation, can not produce the connection wire fracture and the gas phenomenon of overflowing, encapsulation is more prone to, can improve the good rate of manufacturing of Field Emission Display.And method of the present invention does not only need extra cost, can not have influence on unitary construction, can not produce short circuit, breaking phenomena yet, more can not influence the setting of system, can fully reduce the inactive area of focusing guard of the Field Emission Display of manufacturing effective coverage and inactive area.
Brief description of drawings
Fig. 1 is the schematic side view that a kind of metal guard of Field Emission Display of conventional method is connected with the minus plate lead;
Fig. 2 is the schematic top plan view that a kind of metal guard of Field Emission Display of conventional method is connected with the minus plate lead;
Fig. 3 is the schematic side view that the metal guard of the Field Emission Display of another kind of conventional method is connected with the minus plate lead, and it shows the shortcoming of this method bad connection;
Fig. 4 is the combination elevational schematic view that the metal guard of the Field Emission Display of another conventional method is connected with minus plate;
Fig. 5 is the combination schematic side view that the metal guard of Field Emission Display shown in Figure 4 is connected with minus plate;
Fig. 6 is the schematic diagram according to the metal guard of one embodiment of the present of invention;
Fig. 7 is the combination schematic top plan view of the metal guard and the cathode base of one embodiment of the present of invention;
The metal guard of Fig. 8 one embodiment of the present of invention and the combination schematic side view of cathode base.
Accompanying drawing 1 assembly conventional letter in the accompanying drawing 5 is listed as follows:
32 invalid edges zones 33, effective coverage
Accompanying drawing 6 assembly conventional letter in the accompanying drawing 8 is listed as follows:
Embodiment
Below in conjunction with accompanying drawing content of the present invention is described in detail.
Fig. 6, Fig. 7, Fig. 8 are respectively the schematic diagram of metal guard of the present invention, metal guard and the cathode base combination schematic top plan view and the schematic side view of Field Emission Display.As shown in the figure, the parallel wire manufacture method of the focusing guard of Field Emission Display of the present invention mainly is that formed metal guard in three utmost points or the quadrupole field emission display is encapsulated in cathode and anode glass substrate inside, the lead of the metal guard that applies control voltage can effectively be contacted with the minus plate lead, can not produce any wire fracture phenomenon, allow three utmost points or quadrupole field emission display when vacuumizing encapsulation, can not produce the gas phenomenon of overflowing, allow encapsulation be more prone to, to improve the good rate of Field Emission Display manufacturing.
The above-mentioned most important condition that metal guard 1 is encapsulated in glass substrate 21 inside is that glass substrate 21 areas of minus plate 2 are greater than metal guard 1 area, makes metal guard 1 can be encapsulated in glass substrate 21 inside.
When making minus plate 2,, on cathode wire 22, form a bonding pad 23 simultaneously utilizing wire mark, spraying method elargol to be formed on glass substrate 21 edges on glass substrate 21 edges to form a cathode wire 22.
After manufacturing steps such as utilizing printing, spraying, photoresistance, little shadow is formed in minus plate 2 with metal guard 1, form a lead 11 parallel at the edge of this metal guard 1 with the edge, the length of this parallel wire 11 should be at least more than a certain length-specific.Because metal guard 1 very thin thickness, be no more than 0.2mm, (there are 8 inches and planar dimension is very big, 12 inches, even more than 48 inches), so thick wide ratio is very little, simply supported beam (Cantilever beam) theory according to structure, must not apply under the external force situation, this parallel wire 11 can hang down to naturally because of own weight own on the cathode wire 22 of minus plate 2 and contact with bonding pad 23, and can not have influence on metal guard 1, can not make mesh 12 distortion of metal guard 1, with after the bonding pad 23 of cathode wire 22 contacts, utilize sintering technology that parallel wire 11 is connected with bonding pad 23 again at parallel wire 11.
At parallel wire 11 with after bonding pad 23 is connected, vacuumize encapsulation after, can not produce the gas phenomenon of overflowing, parallel wire can not rupture yet, thereby encapsulation is more prone to, and can improve the good rate of Field Emission Display manufacturing.
Fig. 6, Fig. 7 show the metal guard and the cathode electrode substrate combination schematic top plan view of metal guard schematic diagram of the present invention, Field Emission Display.As shown in the figure, the focusing guard of Field Emission Display of the present invention comprises at least:
One minus plate comprises a glass substrate 21, is formed with a cathode wire 22 on these glass substrate 21 edges, and the appropriate position of this cathode wire 22 forms a bonding pad 23;
One is formed in the metal guard 1 on the described minus plate 2, this metal guard 1 edge forms length at least more than a certain length-specific, the parallel wire 11 that can be connected with above-mentioned bonding pad 23, this parallel wire 11 can be made by same material with metal guard 1, also can be made by the material that separates.
Because the length of parallel wire 11 is more than a certain length-specific, so this parallel wire 11 need not apply under the external force situation, can contact with bonding pad 23 because of weight own is sagging naturally, utilizes sintering technology that parallel wire 11 is connected with bonding pad 23 again.
Like this, on metal guard 1, set up a parallel wire 11, do not need extra cost, can not have influence on unitary construction, also can not cause short circuit, breaking phenomena, more can not influence the utilization that system is provided with effective coverage and inactive area, can fully reduce inactive area.
Further, when metal guard 1 and parallel wire 11 are not same material, can utilize the preferable metal material of conductivity that this parallel wire 11 is formed in metal guard 1.
Above-mentioned is preferred embodiment of the present invention only, is not to be used for limiting practical range of the present invention.The equivalence of being made in claim scope of the present invention changes and revises, all in claim of the present invention.
Claims (8)
1. the manufacture method of the focusing guard of a Field Emission Display may further comprise the steps:
A) on the substrate edges of minus plate, form a cathode wire;
B) on minus plate after the form metal guard, this described wire netting shroud rim forms a lead parallel with the edge, the length of described parallel wire is at least more than a certain length-specific, and than metal guard thin thickness, must not apply under the external force situation, described parallel wire contacts with the cathode wire of described minus plate because of weight own is sagging, and the substrate area of described minus plate is long-pending greater than described wire netting cover;
C) utilize sintering technology, described parallel wire is connected with described cathode wire, make described metal guard be encapsulated in described substrate inside.
2. manufacture method according to claim 1 is characterized in that described substrate is made by glass material.
3. manufacture method according to claim 1 is characterized in that, described cathode wire utilizes wire mark or spraying method to be formed on the described substrate edges.
4. manufacture method according to claim 3 is characterized in that, forms a bonding pad in described cathode wire appropriate location.
5. manufacture method according to claim 1 is characterized in that, described cathode wire and parallel wire are made for the elargol material.
6. manufacture method according to claim 1 is characterized in that, described metal guard and described parallel wire are made by same material.
7. the focusing guard of a Field Emission Display comprises a minus plate and the metal guard that is formed on the described minus plate, and described minus plate comprises a substrate, it is characterized in that,
Form a cathode wire on the described substrate edges, be formed with a bonding pad in the appropriate position of described cathode wire;
The top edge of described metal guard forms the length parallel wire more than a length-specific at least, and described parallel wire need not apply under the external force situation, can be connected because of the sagging and described bonding pad of weight own.
8. focusing guard according to claim 7 is characterized in that, described wherein metal guard and described parallel wire are same material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100428275A CN100433231C (en) | 2004-05-26 | 2004-05-26 | Method for manufacturing focusing guard of field emission display and focusing guard produced thereby |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2004100428275A CN100433231C (en) | 2004-05-26 | 2004-05-26 | Method for manufacturing focusing guard of field emission display and focusing guard produced thereby |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1705063A CN1705063A (en) | 2005-12-07 |
| CN100433231C true CN100433231C (en) | 2008-11-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004100428275A Expired - Fee Related CN100433231C (en) | 2004-05-26 | 2004-05-26 | Method for manufacturing focusing guard of field emission display and focusing guard produced thereby |
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| CN (1) | CN100433231C (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1098224A (en) * | 1993-07-05 | 1995-02-01 | 株式会社金星社 | The elastic component of supporting shadow mask of color picture tube |
| CN1134198A (en) * | 1994-07-18 | 1996-10-23 | 索尼株式会社 | Method and device for welding spring to aperture grille |
| CN1199237A (en) * | 1998-05-18 | 1998-11-18 | 徐冰 | High-reliability method for welding between shadow mask frames of color kinescope |
| US5928047A (en) * | 1996-05-15 | 1999-07-27 | Matsushita Electronics Corporation | Planar member for shadow mask of cathode-ray tube and manufacturing method of shadow mask |
| CN2586248Y (en) * | 2002-12-05 | 2003-11-12 | 上海钢铁研究所 | Low componsating capacity, edge welding and bimetal suspension CRT |
| JP2004127638A (en) * | 2002-10-01 | 2004-04-22 | Mitsubishi Electric Corp | Color selection electrode support mounting positioning device and color selection electrode support mounting positioning method using it |
-
2004
- 2004-05-26 CN CNB2004100428275A patent/CN100433231C/en not_active Expired - Fee Related
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1098224A (en) * | 1993-07-05 | 1995-02-01 | 株式会社金星社 | The elastic component of supporting shadow mask of color picture tube |
| CN1134198A (en) * | 1994-07-18 | 1996-10-23 | 索尼株式会社 | Method and device for welding spring to aperture grille |
| US5928047A (en) * | 1996-05-15 | 1999-07-27 | Matsushita Electronics Corporation | Planar member for shadow mask of cathode-ray tube and manufacturing method of shadow mask |
| CN1199237A (en) * | 1998-05-18 | 1998-11-18 | 徐冰 | High-reliability method for welding between shadow mask frames of color kinescope |
| JP2004127638A (en) * | 2002-10-01 | 2004-04-22 | Mitsubishi Electric Corp | Color selection electrode support mounting positioning device and color selection electrode support mounting positioning method using it |
| CN2586248Y (en) * | 2002-12-05 | 2003-11-12 | 上海钢铁研究所 | Low componsating capacity, edge welding and bimetal suspension CRT |
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| Publication number | Publication date |
|---|---|
| CN1705063A (en) | 2005-12-07 |
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Granted publication date: 20081112 Termination date: 20110526 |