CN100431767C - 一种基于液晶掩模技术的激光表面冲击加工的方法和装置 - Google Patents
一种基于液晶掩模技术的激光表面冲击加工的方法和装置 Download PDFInfo
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- CN100431767C CN100431767C CNB2005100941612A CN200510094161A CN100431767C CN 100431767 C CN100431767 C CN 100431767C CN B2005100941612 A CNB2005100941612 A CN B2005100941612A CN 200510094161 A CN200510094161 A CN 200510094161A CN 100431767 C CN100431767 C CN 100431767C
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CNB2005100941612A CN100431767C (zh) | 2005-08-31 | 2005-08-31 | 一种基于液晶掩模技术的激光表面冲击加工的方法和装置 |
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CNB2005100941612A CN100431767C (zh) | 2005-08-31 | 2005-08-31 | 一种基于液晶掩模技术的激光表面冲击加工的方法和装置 |
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CN1792536A CN1792536A (zh) | 2006-06-28 |
CN100431767C true CN100431767C (zh) | 2008-11-12 |
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Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
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CN101920397B (zh) * | 2010-04-16 | 2013-01-23 | 江苏大学 | 一种基于衍射微光学元件的强激光无模成形方法及装置 |
CN102603029A (zh) * | 2012-03-26 | 2012-07-25 | 东华大学 | 一种介质阻挡放电技术处理染料废水的装置及其方法 |
CN102626828A (zh) * | 2012-04-26 | 2012-08-08 | 江苏大学 | 一种基于激光冲击波的高效微凹坑制造方法及装置 |
CN102626826B (zh) * | 2012-04-26 | 2015-02-04 | 江苏大学 | 一种基于激光冲击波的高效微凹槽制造装置及方法 |
CN104841751B (zh) * | 2015-01-30 | 2017-06-27 | 江苏大学 | 一种激光冲击微冲裁装置 |
CN105033461B (zh) * | 2015-06-24 | 2017-03-22 | 江苏大学 | 一种利用激光获得减摩耐磨工件表面的方法 |
CN111069779B (zh) * | 2019-12-06 | 2021-07-20 | 江苏大学 | 一种激光冲击成形超疏水微零件的装置及其方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09174273A (ja) * | 1995-12-27 | 1997-07-08 | Hitachi Ltd | 液晶マスク式レーザマーカ |
JPH10211593A (ja) * | 1997-01-29 | 1998-08-11 | Hitachi Ltd | 加工物への刻印方法 |
CN2293414Y (zh) * | 1997-04-16 | 1998-10-07 | 西安交通大学 | 多线段激光快速成型装置 |
JP2003025085A (ja) * | 2001-07-12 | 2003-01-28 | Seiko Epson Corp | レーザー加工方法及びレーザー加工装置 |
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- 2005-08-31 CN CNB2005100941612A patent/CN100431767C/zh not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09174273A (ja) * | 1995-12-27 | 1997-07-08 | Hitachi Ltd | 液晶マスク式レーザマーカ |
JPH10211593A (ja) * | 1997-01-29 | 1998-08-11 | Hitachi Ltd | 加工物への刻印方法 |
CN2293414Y (zh) * | 1997-04-16 | 1998-10-07 | 西安交通大学 | 多线段激光快速成型装置 |
JP2003025085A (ja) * | 2001-07-12 | 2003-01-28 | Seiko Epson Corp | レーザー加工方法及びレーザー加工装置 |
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EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Yangzhou Wutingqiao Cylinder Casing Co., Ltd. Assignor: Jiangsu University Contract fulfillment period: 2009.7.1 to 2014.12.31 contract change Contract record no.: 2009320001091 Denomination of invention: Method and device for laser surface impacting processing based on liquid crystal masking tech. Granted publication date: 20081112 License type: Exclusive license Record date: 2009.7.13 |
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Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.7.1 TO 2014.12.31; CHANGE OF CONTRACT Name of requester: YANGZHOU WUTINGQIAO CYLINDER JACKET CO., LTD. Effective date: 20090713 |
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