CN100428404C - Enclosed infrared heating device for semiconductor chip - Google Patents
Enclosed infrared heating device for semiconductor chip Download PDFInfo
- Publication number
- CN100428404C CN100428404C CNB2006100313694A CN200610031369A CN100428404C CN 100428404 C CN100428404 C CN 100428404C CN B2006100313694 A CNB2006100313694 A CN B2006100313694A CN 200610031369 A CN200610031369 A CN 200610031369A CN 100428404 C CN100428404 C CN 100428404C
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- Prior art keywords
- water
- cooling
- cover plate
- heating device
- housing
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Control Of Resistance Heating (AREA)
- Resistance Heating (AREA)
Abstract
Description
Claims (5)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100313694A CN100428404C (en) | 2006-03-17 | 2006-03-17 | Enclosed infrared heating device for semiconductor chip |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CNB2006100313694A CN100428404C (en) | 2006-03-17 | 2006-03-17 | Enclosed infrared heating device for semiconductor chip |
Publications (2)
Publication Number | Publication Date |
---|---|
CN101038856A CN101038856A (en) | 2007-09-19 |
CN100428404C true CN100428404C (en) | 2008-10-22 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CNB2006100313694A Expired - Fee Related CN100428404C (en) | 2006-03-17 | 2006-03-17 | Enclosed infrared heating device for semiconductor chip |
Country Status (1)
Country | Link |
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CN (1) | CN100428404C (en) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103076822B (en) * | 2012-12-27 | 2015-09-09 | 烟台睿创微纳技术有限公司 | Regulate control method and the implement device thereof for the treatment of device temperature processed in vacuum equipment |
CN105158873A (en) * | 2015-08-31 | 2015-12-16 | 武汉宇虹环保产业发展有限公司 | High-temperature sealed reflector device |
CN105551922B (en) * | 2015-12-11 | 2018-07-24 | 中国电子科技集团公司第四十八研究所 | A kind of SiC high temperature high-energy aluminum ion implantation apparatus |
CN107046081B (en) * | 2017-03-07 | 2019-06-14 | 东莞市科隆威自动化设备有限公司 | A kind of anti-light furnace that declines |
CN112738928B (en) * | 2020-12-04 | 2022-11-22 | 上海航天精密机械研究所 | Universal combined cooling type modular radiation heater |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN88211587U (en) * | 1988-04-01 | 1988-12-28 | 上海市交通大学 | Rapid annealing device |
US5194401A (en) * | 1989-04-18 | 1993-03-16 | Applied Materials, Inc. | Thermally processing semiconductor wafers at non-ambient pressures |
US5345534A (en) * | 1993-03-29 | 1994-09-06 | Texas Instruments Incorporated | Semiconductor wafer heater with infrared lamp module with light blocking means |
US5693578A (en) * | 1993-09-17 | 1997-12-02 | Fujitsu, Ltd. | Method of forming thin silicon oxide film with high dielectric breakdown and hot carrier resistance |
-
2006
- 2006-03-17 CN CNB2006100313694A patent/CN100428404C/en not_active Expired - Fee Related
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN88211587U (en) * | 1988-04-01 | 1988-12-28 | 上海市交通大学 | Rapid annealing device |
US5194401A (en) * | 1989-04-18 | 1993-03-16 | Applied Materials, Inc. | Thermally processing semiconductor wafers at non-ambient pressures |
US5345534A (en) * | 1993-03-29 | 1994-09-06 | Texas Instruments Incorporated | Semiconductor wafer heater with infrared lamp module with light blocking means |
US5693578A (en) * | 1993-09-17 | 1997-12-02 | Fujitsu, Ltd. | Method of forming thin silicon oxide film with high dielectric breakdown and hot carrier resistance |
Also Published As
Publication number | Publication date |
---|---|
CN101038856A (en) | 2007-09-19 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C06 | Publication | ||
PB01 | Publication | ||
C10 | Entry into substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hunan Hongtaiyang New Energy Science and Technology Co., Ltd. Assignor: No.48 Inst. China Electronics Tech Group Contract fulfillment period: 2009.9.16 to 2019.9.15 Contract record no.: 2009430000163 Denomination of invention: Enclosed infrared heating device for semiconductor chip Granted publication date: 20081022 License type: Exclusive license Record date: 20091027 |
|
LIC | Patent licence contract for exploitation submitted for record |
Free format text: EXCLUSIVE LICENSE; TIME LIMIT OF IMPLEMENTING CONTACT: 2009.9.16 TO 2019.9.15; CHANGE OF CONTRACT Name of requester: HUNAN HONGTAIYANG NEW ENERGY SCIENCE AND TECHNOLOG Effective date: 20091027 |
|
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20081022 Termination date: 20180317 |