CN100412656C - Method for producing liquid crystalline display panel - Google Patents
Method for producing liquid crystalline display panel Download PDFInfo
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- CN100412656C CN100412656C CNB2004800307688A CN200480030768A CN100412656C CN 100412656 C CN100412656 C CN 100412656C CN B2004800307688 A CNB2004800307688 A CN B2004800307688A CN 200480030768 A CN200480030768 A CN 200480030768A CN 100412656 C CN100412656 C CN 100412656C
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- encapsulant
- glass substrate
- liquid crystal
- electromagnetic wave
- heating
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1339—Gaskets; Spacers; Sealing of cells
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/1333—Constructional arrangements; Manufacturing methods
- G02F1/1341—Filling or closing of cells
- G02F1/13415—Drop filling process
-
- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F2202/00—Materials and properties
- G02F2202/28—Adhesive materials or arrangements
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- Physics & Mathematics (AREA)
- Nonlinear Science (AREA)
- Mathematical Physics (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Liquid Crystal (AREA)
Abstract
A method for producing a liquid crystalline display panel, which comprises a sealing agent placing step of placing a sealing agent (5) on the main surface of one or both mother glass substrates (1,2) of two mother glass substrates (1,2) to be pasted with each other, a liquid crystal dropping step of dropping a liquid crystal (6) on one mother glass substrate (1,2) of the two mother glass substrates (1,2), a pasting step of pasting the two mother glass substrates (1,2), and a heating step of heating the sealing agent (5), wherein the heating step is carried out by irradiating the sealing agent (5) with an electromagnetic wave containing a wave length of 3 to 5 micrometer. The method allows the satisfactory inhibition of the elution of the sealing agent (5) into the liquid crystal (6).
Description
Technical field
The present invention relates to the manufacture method of LCD panel; In particular to fully suppressing the manufacture method that encapsulant is added to the LCD panel in the liquid crystal.
Background technology
In the manufacturing of LCD panel, need 2 glass substrate, bonding with encapsulant with mutual opposed state of transparency electrode and thin film transistor (TFT) battle array will be set in advance on the surface, make its minimum interval that keeps a few μ m degree, and in this interval, seal behind the filling liquid crystal.Here, in the time of will opening glass substrate (being called " female glass substrate ") as the material of substrate greatly, the liquid crystal method of inclosureing below for example adopting is to fill also encapsulated liquid crystals.
At first, under atmospheric environment, female glass substrate is carried out the encapsulant configuration.The area configurations encapsulant that should form liquid crystal cells along a female glass substrate surface.At this moment, not with the full cut-off ring-type, but by being provided with the pattern that liquid crystal is injected the crack of using in the liquid crystal cells (i.e. " inlet "), the configuration encapsulant.Below, one by one this encapsulant pattern is called " seal pattern ".1 female glass substrate is disposed a plurality of seal patterns.Under this state, make 2 female glass substrate bonding, and push and harden.With mutual so bonding 2 female glass substrate and be added with fixing substrate and be called " at the bottom of the adhesive lining ".Then, size is blocked at the bottom of this adhesive lining in accordance with regulations, makes the inlet of each seal pattern appear at the end, thereby obtains the sky liquid crystal cells.The empty liquid crystal cells of obtaining is like this used existing liquid crystal implantttion technique, from inlet liquid crystal is injected inside after, the sealing inlet.
In above-mentioned liquid crystal inclosure method, need carry out operation that 2 female glass substrate are bonding mutually and the operation of enclosing liquid crystal respectively.
In contrast, as the method that can carry out these 2 operations simultaneously, the technology (being called " liquid crystal drippage mode ") that the clear 63-179323 communique of Japan's patent disclosure (patent documentation 1) discloses is proposed.In liquid crystal drippage mode, liquid crystal drop is fallen the substrate surface that forms loop-like seal pattern, and bonding in a vacuum 2 substrates, thereby carry out the bonding and liquid crystal inclosure of substrate simultaneously.Particularly, printing and sealing material on either party's the substrate in 2 substrates that should be bonding mutually, and after liquid crystal drop being fallen either party's substrate, these 2 substrates are bonding mutually.Then, to sealing material irradiation ultraviolet radiation, thus the ultraviolet hardening resin sclerosis that encapsulant is comprised.Then, bake encapsulant, make the thermosetting resin sclerosis that comprises in the encapsulant by heating.The flat 5-232420 communique of Japan's patent disclosure (patent documentation 2) discloses the method that heating bakes encapsulant.
In this liquid crystal drippage mode, along with the miniaturization of liquid crystal board scale and the slimming of plate, the liquid crystal rate of propagation during dropping liquid crystal on the substrate is accelerated.As a result, liquid crystal contact encapsulant is fast.Therefore, under encapsulant and liquid crystal state of contact, carry out sealing material curing, exist encapsulant to dissolve in problem in the liquid crystal.If encapsulant dissolves in the liquid crystal, then liquid crystal is contaminated, causes the liquid crystal property deterioration.
Dissolve in method in the liquid crystal as suppressing encapsulant to a certain degree, can enumerate the method for using the encapsulant that comprises the UV cured material of radical reaction class.Below, this method is described
As mentioned above, comprise ultraviolet hardening resin and thermosetting resin in the encapsulant.Wherein, ultraviolet hardening resin is made up of acryl resin and UV cured material.And UV cured material is divided into UV cured material of cationoid reaction class and the UV cured material of radical reaction class according to the difference of sclerosis principle.The character that the UV cured material of cationoid reaction class has makes beyond the part of irradiation ultraviolet radiation, also carries out sclerous reaction in linkage, and produces Louis (Le イ ス) acid as reaction residues.Therefore, the lewis acid that produces in the sclerous reaction is added in the liquid crystal easily.On the other hand, the UV cured material of radical reaction class only activates the free radical of the molecule that UV cured material comprises in the part of irradiation ultraviolet radiation, to produce sclerous reaction.The UV cured material of radical reaction class does not produce reaction residues when sclerous reaction.Therefore, if use the UV cured material of radical reaction class, when then utilizing the ultraviolet ray irradiation to make the ultraviolet hardening resin sclerosis, reaction residues is not added in the liquid crystal, thereby can suppress encapsulant to a certain degree and dissolve in the liquid crystal.
Yet, even, can not fully suppress encapsulant and dissolve in the liquid crystal with the UV cured material of the UV cured material of radical reaction class as encapsulant.Below, its reason is described.
The thermosetting resin of encapsulant comprises epoxy resin and UV cured material usually.When utilizing heating to bake to make the thermosetting resin sclerosis, under the temperature that is lower than the thermosetting resin hardening temperature, epoxy resin existing temporarily softening after, work at the time point of thermmohardening material softening, make the thermmohardening material have abundant flowability.As a result, thermmohardening material evenly sclerosis easily.Like this, the epoxy resin that comprises in the encapsulant is softening under the temperature that is lower than the thermosetting resin hardening temperature, is added in the liquid crystal with hardened material.Therefore, can not fully suppress encapsulant dissolves in the liquid crystal.
On the other hand, dissolve in method in the liquid crystal, can consider to shorten the softening time of epoxy resin, epoxy resin is hardened rapidly by accelerating the programming rate of encapsulant as suppressing encapsulant.The method that discloses in the above-mentioned patent documentation 2 is by the 2 female glass substrate and the heating plate of alternately laminated coating encapsulant, and pressurizes after with press fixture it all being sandwiched, directly to the surface heating of female glass substrate, and quickening encapsulant programming rate.
Fig. 4 is the figure that explanation is used based on the heat-transferring method in the heating means of prior art.
With reference to Fig. 4, utilize encapsulant 105 bonding 2 female glass substrate 101 and 102.Liquid crystal 106 is filled in the unit that is formed by 2 female glass substrate 101,102 and encapsulant 105.And, on the surface (top among Fig. 4) of female glass substrate 101 of uncoated encapsulant 105 sides heating plate 103 is set.On the surface (bottom among Fig. 4) of female glass substrate 102 of uncoated encapsulant 105 sides heating plate 104 is set again.Like this, 2 female glass substrate 101,102 of alternately laminated coating encapsulant 105 and heating plate 103,104.
In the method that patent documentation 2 discloses, shown in the No.1 A of arrow, at first utilize each heating plate 103,104 respectively to each female glass substrate 101,102 heating.Then, shown in the No.1 B of arrow,, make encapsulant 105 be warmed up to hardening temperature by conducting heat from 101,102 pairs of encapsulants of female glass substrate 105.That is,, female glass substrate 101,102 need be warmed up to the hardening temperature of encapsulant 105 for encapsulant 105 is warmed up to hardening temperature.Therefore, waste the heat energy of the thermal capacity share of female glass substrate 101,102, and need the time for encapsulant 105 is warmed up to hardening temperature.As indicated above, epoxy resin is being lower than under the hardening temperature of thermosetting resin softeningly, thereby for encapsulant 105 is warmed up to hardening temperature and spended time, then Ruan Hua epoxy resin and thermmohardening material are added in the liquid crystal 106.As a result, the method that discloses of above-mentioned patent documentation 2 can not fully suppress encapsulant 105 and dissolves in the liquid crystal 106.
Therefore, the object of the present invention is to provide and a kind ofly can fully suppress the manufacture method that encapsulant dissolves in the LCD panel in the liquid crystal.
Summary of the invention
In order to solve above-mentioned problem, the manufacture method of LCD panel of the present invention, have in wanting bonding mutually 2 glass substrate either party or both sides glass substrate first type surface configuration encapsulant the encapsulant arrangement step, liquid crystal drop fallen the bonding process of the liquid crystal drippage operation of either party's glass substrate in 2 glass substrate, bonding 2 glass substrate and to liquid crystal (6) irradiation electromagnetic wave and to the heating process of encapsulant heating.By encapsulant irradiation being comprised more than or equal to 3 μ m, carry out heating process to electromagnetic wave smaller or equal to the wavelength of 5 μ m.
According to the manufacture method of LCD panel of the present invention, because an electromagnetic part penetrates glass substrate, do not absorbed by glass substrate, electromagnetic wave shines directly into and is clipped on 2 blocks of encapsulants between the glass substrate, can directly heat encapsulant.Therefore, encapsulant can be warmed up to hardening temperature, and glass substrate is not warmed up to the sealing material curing temperature, so can accelerate the encapsulant programming rate.Thus, shorten the softening time of encapsulant, softening encapsulant is difficult to dissolve in the liquid crystal, can fully suppress encapsulant and dissolve in the liquid crystal.
In the manufacture method of LCD panel of the present invention, preferably, carry out heating process by encapsulant irradiation being comprised more than or equal to 4 μ m to electromagnetic wave smaller or equal to the wavelength of 5 μ m.
Thus, the epoxy resin that comprises in the encapsulant further absorbs electromagnetic wave easily, thereby encapsulant efficient is heated up well.
In the manufacture method of LCD panel of the present invention, preferably respectively do for oneself intermediary ground to encapsulant irradiation electromagnetic wave, carry out heating process by 2 glass substrate.
Thus, shine electromagnetic wave, thereby encapsulant is heated up from the both sides that are added in 2 blocks of encapsulants between the glass substrate.
According to the manufacture method of LCD panel of the present invention, an electromagnetic part penetrates glass substrate, do not absorbed by glass substrate, thereby electromagnetic wave shines directly into and be added in 2 blocks of encapsulants between the glass substrate, can directly heat encapsulant.Therefore, can make encapsulant be warmed up to hardening temperature, and glass substrate is not warmed up to the sealing material curing temperature, so can accelerate the programming rate of encapsulant.Thus, the softening time of encapsulant shortens, and softening encapsulant is difficult to dissolve in the liquid crystal, thereby can fully suppress encapsulant and dissolve in the liquid crystal.
Description of drawings
Fig. 1 is the figure that the LCD panel manufacturing process of an embodiment of the present invention is shown.
Fig. 2 is the cut-open view that the heating means of explanation one embodiment of the present invention are used.
Fig. 3 is the cut-open view used of heat-transferring method in the heating means of explanation one embodiment of the present invention.
Fig. 4 is the figure that explanation is used based on the heat-transferring method in the heating means of prior art.
Label declaration
1, the 2,101, the 102nd, female glass substrate, the 3rd, the IR device, 4a, 4b are heat generating members, the 5, the 105th, encapsulant, the 6, the 106th, liquid crystal, the 7th, substrate is supported pin, the 103, the 104th, heating plate.
Embodiment
Below, one embodiment of the present invention is described with reference to the accompanying drawings.
Fig. 1 is the figure of manufacturing process that the LCD panel of one embodiment of the present invention is shown.
With reference to Fig. 1, as the substrate pre-treatment, utilize sputtering method or vapour deposition method etc. after forming transparency electrode respectively on the thick 2 female glass substrate of for example 0.7mm, clean 2 female glass substrate (S1) respectively.Then, utilize method such as hectographic printing on each transparency electrode, to apply the liquid crystal oriented material, and after standard bakes, formally bakes, form alignment films (S2).Then, utilize grinding that each alignment films is carried out orientation process (S3).Then, water is cleaned 2 female glass substrate respectively, to remove the foreign matter and the dirt (S4) on surface.
Then, utilize divider picture and stencil printing etc., printing (configuration) encapsulant (S5) around a female glass substrate surface.As encapsulant, the material of the thermosetting resin of heat of mixing hardened material in the ultraviolet hardening resin of the UV cured material of mixing, for example epoxy resin etc. especially comprises more than or equal to the material of 40% epoxy resin preferable as encapsulant in the available for example acryl resins etc.Locate to apply the ultraviolet hardening resin of temporary fixed usefulness in the bight of at least one glass substrate etc.And then the surface configuration in a glass substrate forms the separator (S6) that the gap is used at least.As separator, use 5 μ m's for example.
Then, liquid crystal drop is fallen (S7) in the unit that separates with encapsulant.According to the area of encapsulant divided portion with bonding after the gap of unit, calculating drops onto the amount of liquid crystal of unit.The amount of a dropping liquid crystal preferably can fully obtain the minimum of the precision of dropping amount of liquid crystal, preferably according to the number of times of this amount decision toward the unit dropping liquid crystal.Preferably the scale of unit is big more, and the quantity at liquid crystal drippage place is many more, and the narrower gap of the unit after preferably bonding, and the quantity at liquid crystal drippage place is many more.Thus, liquid crystal is spread evenly in the unit.In the present embodiment, the dividing elements of 6.5 inches scales is become 12 places, dropping liquid crystal.
Then, behind 2 female glass substrate location, bonding in a vacuum.At this moment the bonding encapsulant that is meant connects 2 female glass substrate respectively and utilizes encapsulant to surround the state of inside, unit fully.Then, open to atmospheric pressure, thus push 2 female glass substrate (S8) with the pressure of 0.1M Pa.Utilize this atmospheric pressure that the vacuum section in the unit is reduced, the gap of 2 female glass substrate is near the purpose value, and liquid crystal spreads simultaneously, is evenly distributed in the unit.Then, irradiation ultraviolet radiation is located in bight of female glass substrate etc., thus temporary fixed 2 female glass substrate.Thus, when carrying 2 female glass substrate so that making sealing material curing, can prevent 2 female glass substrate offsets.
Then, 2 female glass substrate are carried to ultraviolet lamp,, make the accurate sclerosis of encapsulant (S9) the encapsulant irradiation ultraviolet radiation.Thus, can make the gap of unit stable equably.Then, encapsulant is done formal sclerosis (S10).In the present embodiment, profit is carried out the formal sclerosis of encapsulant in the following method.
Fig. 2 is the cut-open view that the heating means of explanation one embodiment of the present invention are used.
With reference to Fig. 2, utilize encapsulant 5 that 2 female glass substrate 1,2 are bonding, and in the unit that female glass substrate 1,2 and encapsulant 5 by 2 blocks form filling liquid crystal 6.So female glass substrate 1,2 is supported on substrate in IR (infrared radiation) device 3 support on the pin 7.In the upper and lower of IR device 3 heat generating member 4a, 4b are set respectively.With female glass substrate 1 is intermediary, from the heat generating member 4a on top to encapsulant 5 irradiation electromagnetic waves.Again, be intermediary with female glass substrate 2, from the heat generating member 4b of bottom to encapsulant 5 irradiation electromagnetic waves.Comprise more than or equal to 3 μ m to wavelength from the electromagnetic wave (infrared ray) of heat generating member 4a, the 4b of IR device 3 irradiation, preferably comprise 4 μ m to wavelength smaller or equal to 5 μ m smaller or equal to 5 μ m.For example, when to use the efficient based on the emittance of the ideal black-body of Planck rule be 80% heat generating member 4a, 4b, shine the electromagnetic wave of 4 μ m～12 mum wavelengths.Regulate the output of heat generating member 4a, 4b, the temperature that makes female glass substrate 1,2 is 120 ℃.To encapsulant 5 heating for example 60 minutes.
In addition, by the heating-up temperature of female glass substrate 1,2 that raises, the irradiated electromagnetic wave wavelength zone is strengthened.Yet, after the hardening temperature that reaches encapsulant 5, be difficult to reduce temperature, so the heating-up temperature of female glass substrate 1,2 is fixed.The material of the heat radiator that utilization is clipped in the middle heat generating member 4a, 4b also can change the efficient of heat generating member 4a, 4b.The heat radiator of the material of the efficient by select improving heat generating member 4a, 4b can enlarge heat generating member 4a, 4b irradiated electromagnetic wave wavelength zone.
Fig. 3 is the cut-open view used of heat-transferring method in the heating means of explanation one embodiment of the present invention.
With reference to Fig. 3, glass substrate have usually transmission 40% more than or equal to 3 μ m to smaller or equal to the electromagnetic wave of the wavelength of 5 μ m and wavelength greater than the electromagnetic wave of 5 μ m, 100% characteristic that can not get transmission roughly.Therefore, shown in the No.1 A1 of arrow, heat generating member 4a, 4b irradiated electromagnetic wave about 40% penetrate female glass substrate 1,2 respectively, and direct sealed material 5 absorbs.Thus, to encapsulant 5 heating.Here, epoxy resin have absorption more than or equal to 2 μ m to smaller or equal to the electromagnetic characteristic of 12 μ m, especially have easier absorption greater than 4 μ m to smaller or equal to the electromagnetic characteristic of 5 μ m, thereby the thermosetting resin of encapsulant 5 is when containing epoxy resin, by irradiation greater than 4 μ m to smaller or equal to the electromagnetic wave of 5 μ m, the easier sealed material 5 of electromagnetic wave is absorbed.Again, shown in the No.1 A2 of arrow, remaining about 60% is absorbed by female glass substrate 1,2 respectively in the electromagnetic wave of heat generating member 4a, 4b irradiation.Thus, to female glass substrate 1,2 heating.So, when female glass substrate 1,2 is subjected to heating, shown in the No.1 B of arrow, conduct heat from 1,2 pairs of encapsulants of female glass substrate 5.Thus, encapsulant 1 further is heated.Above-mentioned such heat transfer can make encapsulant 5 be warmed up to hardening temperature rapidly.
Then, polaroid is configured on the surface of female glass substrate 1,2, and in the female glass substrate 1,2 of each dividing elements, thereby finishes the LCD panel of present embodiment.
Manufacture method according to the LCD panel of present embodiment, heat generating member 4a, 4b irradiated electromagnetic wave about 40% penetrate female glass substrate 1,2, do not absorbed by female glass substrate 1,2, so electromagnetic wave shines directly into encapsulant 5, can be directly to encapsulant 5 heating.Therefore, can make encapsulant 5 be warmed up to hardening temperature, and female glass substrate 1,2 is not warmed up to the hardening temperature of encapsulant 5, so can accelerate the programming rate of encapsulant 5.Thus, softening time of encapsulant 5 shortens, and softening encapsulant 5 is difficult to dissolve in the liquid crystal 6, thereby can fully suppress encapsulant 5 and dissolve in the liquid crystal 6.
In the manufacture method of the LCD panel of present embodiment,, carry out the heating of encapsulant 5 by irradiation comprises more than or equal to 4 μ m to the electromagnetic wave smaller or equal to the wavelength of 5 μ m to encapsulant 5.
Thus, the epoxy resin that comprises in the encapsulant 5 further absorbs electromagnetic wave easily, thereby encapsulant 5 efficient are heated up well.
In the manufacture method of the LCD panel of present embodiment, respectively do for oneself intermediary ground to encapsulant 5 irradiation electromagnetic waves, carry out the heating of encapsulant 5 by 2 glass substrate 1,2.
Thus, shine electromagnetic wave, thereby encapsulant 5 is heated up from the both sides that are clipped in the encapsulant 5 between 2 glass substrate 1,2.
Moreover, in the present embodiment, the situation of the encapsulant that uses ultraviolet hardening resin and thermosetting resin is shown, but the invention is not restricted to this situation, use the encapsulant that comprises the thermosetting composition at least to get final product.
The everyway that should consider the embodiment of above announcement is an example, and unrestricted.Scope original meaning of the present invention is not above-mentioned embodiment just, but by shown in claims, and comprise and the connotation of claims equalization and whole modifications and the conversion in the scope.
Claims (3)
1. the manufacture method of a LCD panel is characterized in that, has following operation:
In wanting bonding mutually 2 glass substrate (1,2) first type surface of either party or both sides' described glass substrate (1,2) dispose encapsulant (5) the encapsulant arrangement step,
With liquid crystal (6) drop onto either party's described glass substrate (1,2) in described 2 glass substrate (1,2) liquid crystal drippage operation,
The bonding process of bonding described 2 glass substrate (1,2) and
To liquid crystal (6) irradiation electromagnetic wave and to the heating process of described encapsulant (5) heating, and
By described encapsulant (5) irradiation being comprised more than or equal to 3 μ m, carry out described heating process to electromagnetic wave smaller or equal to the wavelength of 5 μ m.
2. the manufacture method of the LCD panel described in claim 1 is characterized in that,
By described encapsulant (5) irradiation being comprised more than or equal to 4 μ m, carry out described heating process to electromagnetic wave smaller or equal to the wavelength of 5 μ m.
3. the manufacture method of the LCD panel described in claim 1 is characterized in that,
Described encapsulant (5) is shone described electromagnetic wave by described 2 glass substrate (1,2) with respectively doing for oneself intermediary, carry out described heating process.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2003403267 | 2003-12-02 | ||
| JP403267/2003 | 2003-12-02 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1871542A CN1871542A (en) | 2006-11-29 |
| CN100412656C true CN100412656C (en) | 2008-08-20 |
Family
ID=34650065
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004800307688A Expired - Fee Related CN100412656C (en) | 2003-12-02 | 2004-10-22 | Method for producing liquid crystalline display panel |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2005054938A1 (en) |
| KR (1) | KR100803863B1 (en) |
| CN (1) | CN100412656C (en) |
| TW (1) | TWI268386B (en) |
| WO (1) | WO2005054938A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5070959B2 (en) * | 2006-10-06 | 2012-11-14 | 日立化成工業株式会社 | Curing method for liquid crystal sealing material |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63179323A (en) * | 1987-01-20 | 1988-07-23 | Matsushita Electric Ind Co Ltd | Production of liquid crystal display element |
| JPH05203929A (en) * | 1992-01-29 | 1993-08-13 | Dainippon Ink & Chem Inc | Production of liquid crystal device |
| JPH07218886A (en) * | 1994-01-28 | 1995-08-18 | Sintokogio Ltd | Production of liquid crystal panel and apparatus therefor |
| CN1380577A (en) * | 2001-04-05 | 2002-11-20 | 松下电器产业株式会社 | Method and device for manufacturing optical resin base plate for liquid crystal display |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008000007A (en) * | 2006-06-20 | 2008-01-10 | Tomoko Futai | Appetite enhancer for animal |
-
2004
- 2004-10-22 JP JP2005515881A patent/JPWO2005054938A1/en active Pending
- 2004-10-22 CN CNB2004800307688A patent/CN100412656C/en not_active Expired - Fee Related
- 2004-10-22 KR KR1020067013165A patent/KR100803863B1/en not_active IP Right Cessation
- 2004-10-22 WO PCT/JP2004/015701 patent/WO2005054938A1/en active Application Filing
- 2004-12-01 TW TW093137101A patent/TWI268386B/en not_active IP Right Cessation
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63179323A (en) * | 1987-01-20 | 1988-07-23 | Matsushita Electric Ind Co Ltd | Production of liquid crystal display element |
| JPH05203929A (en) * | 1992-01-29 | 1993-08-13 | Dainippon Ink & Chem Inc | Production of liquid crystal device |
| JPH07218886A (en) * | 1994-01-28 | 1995-08-18 | Sintokogio Ltd | Production of liquid crystal panel and apparatus therefor |
| CN1380577A (en) * | 2001-04-05 | 2002-11-20 | 松下电器产业株式会社 | Method and device for manufacturing optical resin base plate for liquid crystal display |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20060105875A (en) | 2006-10-11 |
| JPWO2005054938A1 (en) | 2007-06-28 |
| TWI268386B (en) | 2006-12-11 |
| KR100803863B1 (en) | 2008-02-14 |
| TW200530674A (en) | 2005-09-16 |
| CN1871542A (en) | 2006-11-29 |
| WO2005054938A1 (en) | 2005-06-16 |
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