CN100411091C - Apparatus and method for reducing electrical noise in a thermally controlled chuck - Google Patents
Apparatus and method for reducing electrical noise in a thermally controlled chuck Download PDFInfo
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- CN100411091C CN100411091C CNB2004800409639A CN200480040963A CN100411091C CN 100411091 C CN100411091 C CN 100411091C CN B2004800409639 A CNB2004800409639 A CN B2004800409639A CN 200480040963 A CN200480040963 A CN 200480040963A CN 100411091 C CN100411091 C CN 100411091C
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Abstract
A system and method for controlling temperature of a workpiece such as a semiconductor wafer and the chuck supporting the wafer are described. The system includes a heat exchanger used in controlling temperature of a temperature control fluid. A first fluid carrying path carries the temperature control fluid from the heat exchanger to an outlet, the outlet being connectable to the workpiece chuck to carry the temperature control fluid to the workpiece chuck. A second fluid carrying path carries the temperature control fluid from an inlet to the heat exchanger, the inlet being connectable to the workpiece chuck to carry the temperature control fluid from the workpiece chuck to the temperature control system. A dual-flow are technique is employed such that, when the chuck temperature is in transition, the temperature control fluid is circulated at a relatively high flow rate such that temperature transition of the chuck can be realized at a fast rate. When the temperature of the chuck is being maintained at a set point temperature, the flow rate of the fluid can be reduced such that electrical noise introduced by the motion of the fluid, such as by the triboelectric effect, can be reduced. A capillary tube can be connected between the first fluid carrying path and the second fluid carrying path. First and second valves can be connected in the first and second fluid carrying paths to prevent the flow of fluid into the chuck when the chuck is at high temperature such that motion induced by boiling of the fluid is eliminated.
Description
Related application
The application is 60/526,030 U.S. Provisional Patent Application based on the sequence number of submitting on November 26th, 2003, is incorporated herein by reference at this its full content.
Background technology
In semiconductor integrated circuit industry, compare with the IC packaging cost, the cost of integrated circuit (IC) chip continues to reduce separately.Therefore, when chip still is arranged in wafer, rather than after having carried out relatively costly encapsulation step, carries out a lot of IC processing steps and become more important.
Usually, in IC handled, semiconductor wafer was subjected to a series of test and appraisal procedure.For each step, the processing position handling remains on fixing position with wafer.For example, in being assembled into encapsulation before, in the temperature range of broadening day by day, the circuit detection test is carried out in temperature shielding (temperature screen).Usually the detection apparatus vacuum stayed surface with respect to the circuit on the electrical testing wafer keeps wafer to fix.Detector comprises one group of electric probe, and it combines with tester, and predetermined electric excitation is applied to a plurality of predetermined portions of circuit on the wafer, and reads the circuit response of excitation.
In typical detector system, wafer is installed on the top surface of wafer chuck (chuck), and wafer chuck is remained on the supporting construction of its basal surface to detector.Vacuum system is typically connected to chuck.A series of raceway grooves that are associated with the top surface of chuck or hole district implement vacuum to wafer and inhale processing, to hold it in the appropriate position on the chuck top surface.Then, the detector supporting construction of chuck is used to positions wafer below probe, to carry out electrical testing as required strategic point on wafer circuit.
Chuck also comprises the temperature control system that raises or reduce chuck surface and chip temperature, with the chip temperature shielding of wishing as required strategic point (temperature screening).For this test accuracy, as much as possible with chip temperature and chuck surface temperature is therefore controlled accurately and accurately be very important.
Used the whole bag of tricks with the control wafer temperature.For example, chuck can comprise the circulatory system by its circulating temperature control fluid.The temperature of control fluid is with control chuck temperature and chip temperature therefore.This temperature control chuck can comprise that also heater is as the resistance heater in chuck inside.By power is applied to stratie, heat can be incorporated in the chuck.
In some applications, in the application as testing wafer on the circuit detector, the electrical noise in system can reduce the performance accuracy of test.Therefore, be important with being incorporated into that electrical noise in the system minimizes.A kind of sources of electronic noise is the temperature control fluid by the chuck circulation.In chuck or from chuck, transport moving of fluid the circuit of fluid back and forth or other behavior meeting produces electrical noise by the tribocouple effect, thereby produced electric charge by the friction between two objects.
Summary of the invention
The invention is characterized in provides a kind of temperature control system that is used for being controlled at the temperature of workpiece or wafer chuck, wherein, has reduced the electrical noise influence of being introduced by fluid in workpiece or wafer chuck.
On the one hand, the present invention relates to a kind of temperature control system and a kind of method of temperature that is controlled in the workpiece chuck.This system comprises temperature control equipment and fluid intake and the fluid issuing that is used to control the temperature control fluid temperature, transports temperature control fluid by fluid intake and fluid issuing back and forth from chuck.Controller control temperature control equipment, for example by the flow velocity of control by the temperature control fluid of chuck, so that the flow velocity of the temperature control fluid by chuck when chuck temperature is in translate phase is higher than when chuck temperature remains on design temperature point the flow velocity by the temperature control fluid of chuck, and/or by the control temperature control equipment, so that prevent that when chuck temperature is higher than the boiling point of predetermined temperature such as temperature control fluid temperature control fluid from entering chuck.
In one embodiment, can the control flows dynamic control device to change the flow velocity of temperature control fluid.
In one embodiment, this system comprises that one the first fluid that is connected in the entrance and exit transports the path and is connected to another second fluid carrying path in the entrance and exit.Flow control apparatus can be connected in first and second fluid carrying path.Flow control apparatus can be included in fixed-orifice flow deceleration device in and the controllable valve in parallel with the fixed-orifice flow deceleration device in first and second fluid carrying path.Controller can be controlled controllable valve, to open controllable valve and close controllable valve when the temperature in the chuck is in translate phase when the temperature in the chuck remains on the set point of hope.
Alternatively, flow control apparatus can comprise one first controllable valve being connected in first and second fluid carrying path and be connected in first and second fluid carrying path another second controllable valve in parallel with first controllable valve.Controller can be controlled first and second controllable valves, opens and it is closed when the temperature in the chuck is maintained at the set point of hope with one in first and second controllable valves when the temperature in the chuck is in translate phase.
In one embodiment, capillary can be connected in first and second fluid carrying path, with the pressure in balance first and second fluid carrying path.
In one embodiment, first valve is connected to first fluid and transports the path, and second valve is connected to second fluid carrying path.When chuck temperature is higher than the boiling temperature of predetermined temperature such as temperature control fluid, close first and second valves, flow in the chuck to prevent temperature control fluid.
Various technology of the present invention can be controlled flowing and other behavior of the temperature control fluid that is used for controlling the chuck temperature.The result has reduced the electrical noise that is caused by fluid, and therefore, can carry out the detection test in processing of wafers such as the temperature range more accurately.
Description of drawings
According to the following more detailed description of the preferred embodiment of the present invention as shown in the figures, the present invention is aforesaid will to be become apparent with other purpose, feature and advantage, in the accompanying drawing, run through different figure, and same reference numeral relates to same parts.Accompanying drawing needn't be proportionally, and it is emphasized but not is set to explanation principle of the present invention.
Fig. 1 has comprised temperature control system and has been connected with the top-level schematic block diagram of control workpiece as the workpiece chuck of the temperature that is installed to the semiconductor wafer on the workpiece chuck.
Fig. 2 is the schematic diagram that is used for controlling the temperature control system of workpiece chuck temperature according to embodiments of the invention.
Fig. 3 is the schematic diagram that is used for controlling the temperature control system of workpiece chuck temperature according to another embodiment of the present invention.
Embodiment
Fig. 1 has comprised temperature control system and has been connected with the top-level schematic block diagram of control workpiece as the workpiece chuck of the temperature that is installed to the semiconductor wafer on the workpiece chuck.System 9 comprises temperature control system such as cooler 11, the temperature of its control temperature control fluid.Cooler 11 can be the assignee Sharon by the application, the type that the Temptronic company of Massachusetts makes and sells.Especially, this cooler can be Model Number TP03500A AtlasChiller or similar system, improves this cooler to comprise the feature of the present invention that is used to reduce electrical noise, as described herein.
Temperature control fluid can send back and forth from test macro, as wafer prober 13 along flexible pipe or conduit 15.Flexible pipe or conduit 15 can be Sharon, and the type of describing in the U.S. Patent number 6,070,413 of the Temptronic company appointment of Massachusetts is incorporated its integral body into this paper at this by reference.In fact, flexible pipe or conduit 15 comprise that at least two fluids transport flexible pipe or conduit, and one of them transports temperature control fluid from cooler 11 to detector 13, and wherein another transports back cooler 11 from detector 13 with temperature control fluid.Workpiece or wafer 21 by detector 13 tests are installed on the chuck 19.Chuck 19 and/or the method for temperature by its control chuck 19 and wafer 21 can be included in U.S. Patent number 4,734,872; 6,073,681; 6,540,014; 6,415,858; 6,505,478; 6,802,368; 6,091,060; 6,019,164; 6,328,096; 6,375,176; 6,700,099; 6,552,561; 6,744,270; Any disclosed arbitrary feature in 6,745,575, it is all by Sharon, and the Temtronic company of Massachusetts specifies, and incorporates this paper at this into by the reference content whole that it is all.
Fig. 2 is the schematic diagram that is used for controlling the temperature control system of workpiece chuck temperature according to embodiments of the invention.With reference to figure 2, temperature control system or cooler 11 are connected to detector 13 by flexible pipe or conduit 15, and flexible pipe or conduit 15 transport the chuck 19 of temperature control fluid to the detector 13 to and fro.Cooler 11 comprises the heat exchanger 23 that is used to control the temperature control fluid temperature.Pump 25 is by the systemic circulation fluid.Fluid automatic heat-exchanger 23 is transported to the fluid issuing that transports the cooler 11 on the path 17 at first fluid.Fluid is got back to cooler 11 by chuck 19 circulations and by flexible pipe or conduit 15.From the fluid intake of cooler 11 fluid is sucked back heat exchanger 23 along second fluid carrying path 29.Cooler 11 comprises controller 7, and the running of its control cooler 11 for example comprises the sequential that opens and closes valve and open and close valve to realize the generation and the supply of temperature control fluid.
According to the present invention, first valve 14 is connected to that first fluid transports path 27 and second valve 16 is connected to second fluid carrying path 29.Fixed-orifice flow decelerator 12 is connected to first fluid and transports path 27 and three valve 10 in parallel with fixed-orifice flow decelerator 12 and be connected to first fluid and transport path 27.Capillary 18 is connected between first and second fluid carrying path.As shown in Figure 2, capillary 18 is between chuck 19 and valve 10,12,14,16.
One or more methods according to the present invention are used in the work chuck thermal control system of the present invention, to reduce the frictional electricity noise in the chuck.The use of these methods is controlled by cooling control system, and the suitable thermal control range synchronization the most useful with its use.These methods have reduced electrical noise all, and do not rely on the different mode of system operation.
This first method is from the flow velocity that is used for temperature transition chuck 19 cooling agent the flowing by chuck 19 of having slowed down significantly.It comprises valve 10 and flow reducer 12.The slowing down of this ANALYSIS OF COOLANT FLOW cause move (vibration) that chuck and other chuck parts have slowed down, the electrical noise level that it has caused reducing on the chuck conversely.In one embodiment, slowing down of flowing realizes by switching cooling agent stream from high flow circuits to the route with flow restriction.In one embodiment, this restriction is a choke valve, and it has the flow area more much lower than high Flow Line.
In thermal chuck of the present invention, be starved of rapid temperature transition at test period.Realize that a kind of mode of rapid temperature transition provides the flow at high speed of temperature control fluid.Yet because the vibration and the tribocouple effect of chuck, high flowing velocity comprises high electrical noise.According to the present invention, flow reducer 12 and valve 10,14 and 16 are used for during temperature transition realizing high rate of flow of fluid, with the relative low flow velocity of realization when keeping chuck and wafer to be in the temperature of set point temperatures of hope.During temperature transition, open valve 10,14 and 16, allow fluid to flow through valve 10,14 and 16 and flow reducer 12 with its maximal rate.When the temperature of chuck 19 reaches the set point of hope, valve-off 10, and valve 14 and 16 stays open.As a result, having reduced total fluid flows to reach the degree that fixed-orifice flow decelerator 12 is allowed.In one embodiment, the flow velocity under steady temperature is about half of transition period flow velocity.Lower flow velocity causes much lower electrical noise when temperature keeps constant, and its set point temperatures place in hope provides the accuracy that increases in the wafer detection test.
Second method also comprises uses valve 14 and 16.This method prevent chuck temperature be higher than the boiling point of cooling fluid after coolant fluid enter chuck.If allow coolant fluid to enter into work chuck under the temperature that is higher than the coolant fluid boiling point, then cooling agent evaporates and the pressure fluctuation (pressure pulsation) that obtains comprises the vibration in the chuck that causes electrical noise tempestuously.Coolant fluid is by entering the work chuck from cooling agent fluid storage cylinder by the periodicity of supply of work chuck and/or reflux line is mobile.Should flow usually by causing by coolant fluid boiling itself or by the pressure of the fluid buoyancy difference generation that runs through system.Be arranged on capillary 18 between the chuck entrance and exit also be equilibrated at prevent and circuit in coolant fluid than the fluid in other circuit more near the pressure between these circuits of chuck.This has reduced the possibility that fluid enters high-temperature chuck again and seethes with excitement fast and move with the introduction of generation noise.
Fig. 3 is the schematic diagram that is used for controlling the temperature control system of workpiece chuck temperature according to another embodiment of the present invention.In this embodiment, with being connected to valve 10 and the flow reducer 12 that first fluid transports a pair of valve 45 and the 47 replacement Fig. 2 in path 27 in parallel.In this embodiment, during temperature transition, two valves 45 and 47 are opened, with the mobile maximal rate of allowable temperature control fluid.When chuck reached set point temperatures, in the valve one closed as valve 45, and another valve such as valve 47 are still opened.As a result, allowable temperature control fluid only flows by the valve of opening 47 with the flow velocity that has reduced, and causes the reduction of the electrical noise that the fluid by relative high flow rate causes.Should be noted that in the embodiments of figure 3 valve 14 is optional.Valve 14 can omit, and this is because valve 45 and 47 can be used for reaching the purpose of valve 14.
According to the present invention, when temperature control workpiece or wafer chuck inversion temperature, realize high conversion speed by using by the high flow rate temperature control fluid of chuck.When chuck temperature reached the set point temperatures of hope, chuck temperature remained on set point.Under this steady-state condition, reduce the flow velocity of temperature control fluid, to reduce the electrical noise that causes by mobile fluid.Here in the embodiment of the invention of Miao Shuing, be connected to the flow control apparatus that transports one or more circuits of temperature control fluid back and forth from chuck by use and realize this double fluid speed method.This flow control apparatus can be a pair of valve or a valve and a fixed-orifice flow restrictor that is connected in parallel.Can control at least one valve, so that in that it is opened to realize high-speed conversion and it is closed to reduce electrical noise during steady state temperature is kept during the temperature transition.In another embodiment of the present invention, realize double-current fast method as pump 25 by using variable speed pump.During temperature transition, can be set to high relatively speed by pump, so that rate of flow of fluid is high relatively.During steady-state temperature set point is kept, can be with the speed operation pump that reduces to reduce rate of flow of fluid, the electrical noise that has caused in the test period chuck, reducing.
Should be noted that the description that runs through the front and following claim, this application relates to temperature control fluid.But temperature control fluid gaseous state or liquid state.As involved here, suppose that fluid is liquid, yet, be well known that fluid also can be a gaseous state in system, in chuck, seethe with excitement and enter gaseous state as the fluid of liquid state.Unless at this explanation is arranged in addition, otherwise when mentioning temperature control fluid, for example in a certain embodiment of the present invention, mentions when preventing that fluid from entering into chuck, should be mentioned that liquid fluid.For example, mention when preventing that the promptly liquid fluid of fluid from entering into chuck, should be appreciated that the fluid of gaseous state can be present in the chuck.
Though illustrate especially and described the present invention, it will be appreciated by those skilled in the art that the various changes that wherein can make on form and the details, and do not exceed as the spirit and scope of the present invention defined in the claim with reference to its preferred embodiment.
Claims (88)
1. temperature control system that is used for workpiece chuck comprises:
Temperature control equipment is used to control the temperature of temperature control fluid;
Fluid intake and fluid issuing transport temperature control fluid by fluid intake and fluid issuing back and forth from chuck;
Controller, be used to control temperature control equipment, this controller control is by the flow velocity of the temperature control fluid of chuck, so that the flow velocity of temperature control fluid by chuck when chuck temperature is in translate phase be higher than when chuck temperature is maintained at set point temperatures the temperature control fluid by chuck flow velocity and
First fluid transports the path, and it is connected in fluid intake and the fluid issuing one;
First-class dynamic control device has and is connected to the input and output and second fluid control device that first fluid transports the path, has to be connected to the input and output that the first fluid in parallel with first-class dynamic control device transports the path.
2. temperature control system according to claim 1, wherein said first and second flow control apparatus, its flow velocity of may command with the change temperature control fluid.
3. temperature control system according to claim 2 also comprises:
Second fluid carrying path, it is connected in fluid intake and the fluid issuing another.
4. temperature control system according to claim 3, wherein:
First-class dynamic control device comprises the fixed-orifice flow deceleration device; With
Second flow control apparatus comprises the controllable valve in parallel with the fixed-orifice flow deceleration device.
5. temperature control system according to claim 4, its middle controller control controllable valve is so that it is opened and it is closed when temperature in the chuck is maintained at the set point of hope when the temperature in the chuck is in translate phase.
6. temperature control system according to claim 3, wherein:
First-class dynamic control device comprises first controllable valve; With
Second flow control apparatus comprises second controllable valve that is connected in parallel with first controllable valve.
7. temperature control system according to claim 6, its middle controller is controlled first and second controllable valves, so that in first and second controllable valves opens and it is closed when the temperature in the chuck is maintained at the set point of hope when the temperature in the chuck is in translate phase.
8. temperature control system according to claim 1 also comprises:
Second fluid carrying path, it is connected in the entrance and exit another; With
Capillary is connected between first and second fluid carrying path.
9. temperature control system according to claim 8, wherein capillary is suitable for the pressure in balance first and second fluid carrying path.
10. temperature control system according to claim 8 also is included in first fluid and transports first valve in the path and second valve in second fluid carrying path.
11. temperature control system according to claim 10, wherein first and second valve closings when chuck temperature is higher than predetermined temperature flow in the chuck to prevent temperature control fluid.
12. temperature control system according to claim 11, wherein predetermined temperature is higher than the boiling point of temperature control fluid.
13. temperature control system according to claim 1 also comprises:
Second fluid carrying path, it is connected in the entrance and exit another;
First valve transports in the path at first fluid; With
Second valve is in second fluid carrying path.
14. temperature control system according to claim 13, wherein first and second valve closings when chuck temperature is higher than predetermined temperature flow in the chuck to prevent temperature control fluid.
15. temperature control system according to claim 14, wherein predetermined temperature is higher than the boiling point of temperature control fluid.
16. temperature control system according to claim 1, its middle controller control temperature control equipment is so that when chuck temperature is higher than predetermined temperature, prevent that temperature control fluid from entering chuck.
17. temperature control system according to claim 16, wherein predetermined temperature is higher than the boiling temperature of temperature control fluid.
18. one kind is used for the described temperature control system of workpiece chuck, comprises:
Temperature control equipment is used to control the temperature of temperature control fluid;
Fluid intake and fluid issuing transport temperature control fluid by fluid intake and fluid issuing back and forth from chuck;
Controller is used to control temperature control equipment, with when chuck temperature is higher than predetermined temperature, prevents that temperature control fluid from entering chuck; With
Fluid control device, its may command is to change the flow velocity of temperature control fluid.
19. temperature control system according to claim 18, wherein predetermined temperature is higher than the boiling temperature of temperature control fluid.
20. temperature control system according to claim 18 also comprises:
First fluid transports the path, and it is connected in the entrance and exit one;
Second fluid carrying path, it is connected in the entrance and exit another;
First valve transports in the path at first fluid; With
Second valve is in second fluid carrying path.
21. temperature control system according to claim 20 is wherein closed first and second valves when chuck temperature is higher than predetermined temperature, to prevent in the temperature control fluid stream chuck.
22. temperature control system according to claim 21, wherein predetermined temperature is higher than the boiling point of temperature control fluid.
23. temperature control system according to claim 18 also comprises:
First fluid transports the path, is connected in the entrance and exit;
Second fluid carrying path, it is connected in the entrance and exit another; With
Capillary, it is connected between first and second fluid carrying path.
24. temperature control system according to claim 23, wherein capillary is suitable for the pressure in balance first and second fluid carrying path.
25. temperature control system according to claim 23 also is included in first fluid and transports first valve in the path and second valve in second fluid carrying path.
26. temperature control system according to claim 25 is wherein closed first and second valves when chuck temperature is higher than predetermined temperature, flow in the chuck to prevent temperature control fluid.
27. temperature control system according to claim 26, wherein predetermined temperature is higher than the boiling point of temperature control fluid.
28. temperature control system according to claim 18, wherein:
Controller control temperature control fluid is by the flow velocity of chuck, so that the flow velocity of the temperature control fluid by chuck is higher than the flow velocity that passes through the temperature control fluid of chuck when chuck temperature is maintained at set point temperatures when chuck temperature is in translate phase.
29. temperature control system according to claim 28 also comprises:
First fluid transports the path, and it is connected in the entrance and exit one; With
Second fluid carrying path, it is connected in the entrance and exit another; Wherein flow control apparatus is connected in first and second fluid carrying path one.
30. temperature control system according to claim 29, wherein flow control apparatus comprises:
The fixed-orifice flow deceleration device is among its in first and second fluid carrying path; With
Controllable valve, in parallel with the fixed-orifice flow deceleration device.
31. temperature control system according to claim 30, its middle controller control controllable valve, so that it is opened when the temperature in the chuck is in translate phase, and it is closed when temperature in the chuck is maintained at the set point of hope.
32. temperature control system according to claim 29, wherein flow control apparatus comprises:
First controllable valve, it is connected in first and second fluid carrying path one; With
Second controllable valve, itself and first controllable valve are connected in first and second fluid carrying path in parallel.
33. temperature control system according to claim 32, its middle controller is controlled first and second controllable valves, open and it is closed when temperature in the chuck is maintained at when wishing set point with one in first and second controllable valves when the temperature in the chuck is in translate phase.
34. a temperature control system that is used for workpiece chuck comprises:
Temperature control equipment, it is used to control the temperature of temperature control fluid;
Fluid intake and fluid issuing transport temperature control fluid by fluid intake and fluid issuing back and forth from chuck;
First fluid transports the path, and it is connected in the entrance and exit one;
Second fluid carrying path, it is connected in the entrance and exit another;
Controller, be used to control temperature control equipment, controller (i) control is by the flow velocity of the temperature control fluid of chuck, so that be higher than when chuck temperature is maintained at set point temperatures flow velocity by the temperature control fluid of chuck when chuck temperature is in the flow velocity of translate phase by the temperature control fluid of chuck, (ii) control temperature control equipment, so that when chuck temperature is higher than predetermined temperature, prevent that temperature control fluid from entering chuck; With
Flow control apparatus can be controlled it to change the flow velocity of temperature control fluid by controller.
35. temperature control system according to claim 34, wherein flow control apparatus is connected in first and second fluid carrying path one.
36. temperature control system according to claim 35, wherein flow control apparatus comprises:
The fixed-orifice flow deceleration device is among its in first and second fluid carrying path; With
Controllable valve, in parallel with the fixed-orifice flow deceleration device.
37. temperature control system according to claim 36, its middle controller control controllable valve is so that it is opened and it is closed when temperature in the chuck is maintained at the set point of hope when temperature is in translate phase in the chuck.
38. temperature control system according to claim 35, wherein flow control apparatus comprises:
First controllable valve, it is connected in first and second fluid carrying path one; With
Second controllable valve, itself and first controllable valve are connected in first and second fluid carrying path in parallel.
39. according to the described temperature control system of claim 38, its middle controller is controlled first and second controllable valves, so that in first and second controllable valves opens and it is closed when temperature in the chuck is maintained at the set point of hope when temperature is in translate phase in the chuck.
40. temperature control system according to claim 34 also comprises capillary, it is connected between first and second fluid carrying path.
41. according to the described temperature control system of claim 40, wherein capillary is suitable for the pressure in balance first and second fluid carrying path.
42. temperature control system according to claim 34 also comprises:
First valve, it transports in the path at first fluid; With
Second valve, it is in second fluid carrying path.
43. according to the described temperature control system of claim 42, wherein when chuck temperature is higher than predetermined temperature, close first and second valves, flow in the chuck to prevent temperature control fluid.
44. according to the described temperature control system of claim 43, wherein predetermined temperature is higher than the boiling point of temperature control fluid.
45. the described method of temperature in the control workpiece chuck comprises:
Temperature with temperature control equipment control temperature control fluid;
Transport temperature control fluid by fluid intake and fluid issuing back and forth from chuck;
Controller is provided, be used to control temperature control equipment, the control of this controller is by the flow velocity of the temperature control fluid of chuck, so that the flow velocity of the temperature control fluid by chuck when chuck temperature is in translate phase is higher than the flow velocity that passes through the temperature control fluid of chuck when chuck temperature is maintained at set point temperatures; With
First fluid is transported the path be connected in fluid intake and the fluid issuing one;
First-class dynamic control device is provided, has and be connected to the input and output and second fluid control device that first fluid transports the path, have and be connected to the input and output that the first fluid in parallel with first-class dynamic control device transports the path.
46. according to the described method of claim 45, wherein said first and second flow control apparatus that provide, its flow velocity of may command with the change temperature control fluid.
47., also comprise according to the described method of claim 46:
Second fluid carrying path is connected in the entrance and exit another; With
Flow control apparatus is connected in first and second fluid carrying path one.
48. according to the described method of claim 47, wherein:
First-class dynamic control device comprises the fixed-orifice flow deceleration device; With
Second flow control apparatus comprises the controllable valve in parallel with the fixed-orifice flow deceleration device.
49. according to the described method of claim 48, its middle controller control controllable valve is so that it is opened and it is closed when temperature in the chuck is maintained at the set point of hope when temperature is in translate phase in the chuck.
50. according to the described method of claim 47, wherein:
First-class dynamic control device comprises first controllable valve; With
Second flow control apparatus comprises second controllable valve that is connected in parallel with first controllable valve.
51. according to the described method of claim 50, its middle controller is controlled first and second controllable valves, open and it is closed when temperature in the chuck is maintained at the set point of hope with one in first and second controllable valves when temperature is in translate phase in the chuck.
52., also comprise according to the described method of claim 45:
Second fluid carrying path is connected in the entrance and exit another; And
Capillary is connected between first and second fluid carrying path.
53. according to the described method of claim 52, wherein capillary is suitable for the pressure in balance first and second fluid carrying path.
54., also be included in first fluid and transport and first valve is provided in the path and second valve is provided in second fluid carrying path according to the described method of claim 52.
55. according to the described method of claim 54, wherein when chuck temperature is higher than predetermined temperature, close first and second valves, flow in the chuck to prevent temperature control fluid.
56. according to the described method of claim 55, wherein predetermined temperature is higher than the boiling point of temperature control fluid.
57., also comprise according to the described method of claim 45:
Second fluid carrying path is connected in the entrance and exit another;
Transporting at first fluid provides first valve in the path; With
Second valve is provided in second fluid carrying path.
58. according to the described method of claim 57, wherein when chuck temperature is higher than predetermined temperature, close first and second valves, flow in the chuck to prevent temperature control fluid.
59. according to the described method of claim 58, wherein predetermined temperature is higher than the boiling point of temperature control fluid.
60. according to the described method of claim 45, its middle controller control temperature control equipment with when chuck temperature is higher than predetermined temperature, prevents that temperature control fluid from entering chuck.
61. according to the described method of claim 60, wherein predetermined temperature is higher than the temperature control fluid boiling temperature.
62. method of temperature in the control workpiece chuck comprises:
Temperature with temperature control equipment control temperature control fluid;
Transport temperature control fluid by fluid intake and fluid issuing back and forth from chuck; With
Controller is provided, is used to control temperature control equipment,, prevent that temperature control fluid from entering chuck with when chuck temperature is higher than predetermined temperature,
Wherein said flow control apparatus can be by controller control to change the flow velocity of temperature control fluid.
63. according to the described method of claim 62, wherein predetermined temperature is higher than the boiling temperature of temperature control fluid.
64., also comprise according to the described method of claim 62:
First fluid is transported the path be connected in the entrance and exit one;
Second fluid carrying path is connected in the entrance and exit another;
Transporting at first fluid provides first valve in the path; With
Second valve is provided in second fluid carrying path.
65. according to the described method of claim 64, wherein when chuck temperature is higher than predetermined temperature, close first and second valves, prevent that with method temperature control fluid from flowing in the chuck.
66. according to the described method of claim 65, wherein predetermined temperature is higher than the boiling point of temperature control fluid.
67., also comprise according to the described method of claim 62:
First fluid is transported the path be connected in the entrance and exit one;
Second fluid carrying path is connected in the entrance and exit another; With
Capillary is connected between first and second fluid carrying path.
68. according to the described method of claim 67, wherein capillary is suitable for the pressure in balance first and second fluid carrying path.
69., also be included in first fluid and transport and first valve is provided in the path and second valve is provided in second fluid carrying path according to the described method of claim 67.
70. the described method of claim 69 is wherein closed first and second valves when chuck temperature is higher than predetermined temperature, flow in the chuck to prevent temperature control fluid.
71. according to the described method of claim 70, wherein predetermined temperature is higher than the boiling point of temperature control fluid.
72. according to the described method of claim 62, wherein:
Controller control is by the flow velocity of the temperature control fluid of chuck, so that the flow velocity of the temperature control fluid by chuck when chuck temperature is in translate phase is higher than the flow velocity that passes through the temperature control fluid of chuck when chuck temperature is maintained at set point temperatures.
73., also comprise according to the described method of claim 72:
First fluid is transported the path be connected in the entrance and exit one; With
Second fluid carrying path is connected in the entrance and exit another; Wherein flow control apparatus is connected in first and second fluid carrying path one.
74. according to the described method of claim 73, wherein flow control apparatus comprises:
The fixed-orifice flow deceleration device is among its in first and second fluid carrying path; With
Controllable valve, it is in parallel with the fixed-orifice flow deceleration device.
75. according to the described method of claim 74, its middle controller control controllable valve is so that it is opened and it is closed when the temperature in the chuck is maintained at the set point of hope when the temperature in the chuck is in translate phase.
76. according to the described method of claim 73, wherein flow control apparatus comprises:
First controllable valve, it is connected in first and second fluid carrying path one; With
Second controllable valve, itself and first controllable valve are connected in first and second fluid carrying path in parallel.
77. according to the described method of claim 76, its middle controller is controlled first and second controllable valves, so that in first and second controllable valves opens and it is closed when the temperature in the chuck is maintained at the set point of hope when the temperature in the chuck is in translate phase.
78. the described method of controlling in the workpiece chuck of temperature comprises:
Temperature with temperature control equipment control temperature control fluid;
Transport temperature control fluid by fluid intake and fluid issuing back and forth from chuck;
First fluid is transported the path be connected in the entrance and exit one;
Second fluid carrying path is connected in the entrance and exit another;
Controller is provided, be used to control temperature control equipment, this controller (i) control is by the flow velocity of the temperature control fluid of chuck, so that the flow velocity of the temperature control fluid by chuck when chuck temperature is in translate phase is higher than when chuck temperature is maintained at set point temperatures the flow velocity by the temperature control fluid of chuck, (ii) control temperature control equipment, so that when chuck temperature is higher than predetermined temperature, prevent that temperature control fluid from entering chuck; With
Providing can be by the flow control apparatus of controller control, to change the flow velocity of temperature control fluid.
79. according to the described method of claim 78, wherein flow control apparatus is connected in first and second fluid carrying path one.
80. according to the described method of claim 79, wherein flow control apparatus comprises:
The fixed-orifice flow deceleration device is among its in first and second fluid carrying path; With
Controllable valve, it is in parallel with the fixed-orifice flow deceleration device.
81. 0 described method according to Claim 8, its middle controller control controllable valve is so that it is opened and works as that it was closed when temperature in the chuck was maintained at the set point of hope when the temperature in the chuck is in translate phase.
82. according to the described method of claim 79, wherein flow control apparatus comprises:
First controllable valve, its with first and second fluid carrying path in one be connected; With
Second controllable valve, its with first controllable valve in parallel with first and second fluid carrying path in one be connected.
83. 2 described methods according to Claim 8, its middle controller is controlled first and second controllable valves, and it is closed when being maintained at the set point of hope with one in first and second controllable valves when the temperature in the chuck the is in translate phase temperature of opening and working as in the chuck.
84., also comprise capillary is connected between first and second fluid carrying path according to the described method of claim 78.
85. 4 described methods according to Claim 8, wherein capillary is suitable for the pressure in balance first and second fluid carrying path.
86., also comprise according to the described method of claim 78:
Transporting at first fluid provides first valve in the path; With
Second valve is provided in second fluid carrying path.
87. 6 described methods are wherein closed first and second valves when chuck temperature is higher than predetermined temperature according to Claim 8, flow in the chuck to prevent temperature control fluid.
88. 7 described methods according to Claim 8, wherein predetermined temperature is higher than the boiling point of temperature control fluid.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US52603003P | 2003-11-26 | 2003-11-26 | |
| US60/526,030 | 2003-11-26 | ||
| US10/997017 | 2004-11-23 |
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| Publication Number | Publication Date |
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| CN1918690A CN1918690A (en) | 2007-02-21 |
| CN100411091C true CN100411091C (en) | 2008-08-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2004800409639A Expired - Fee Related CN100411091C (en) | 2003-11-26 | 2004-11-23 | Apparatus and method for reducing electrical noise in a thermally controlled chuck |
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| Country | Link |
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| CN (1) | CN100411091C (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8596336B2 (en) * | 2008-06-03 | 2013-12-03 | Applied Materials, Inc. | Substrate support temperature control |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299379A (en) * | 1992-04-21 | 1993-11-12 | Mitsubishi Electric Corp | Temperature control device and method thereof |
| US5892207A (en) * | 1995-12-01 | 1999-04-06 | Teisan Kabushiki Kaisha | Heating and cooling apparatus for reaction chamber |
| US20020139523A1 (en) * | 2001-03-28 | 2002-10-03 | Dainippon Screen Mfg.Co., Ltd. | Thermal processor |
| US6635580B1 (en) * | 1999-04-01 | 2003-10-21 | Taiwan Semiconductor Manufacturing Co. Ltd. | Apparatus and method for controlling wafer temperature in a plasma etcher |
-
2004
- 2004-11-23 CN CNB2004800409639A patent/CN100411091C/en not_active Expired - Fee Related
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05299379A (en) * | 1992-04-21 | 1993-11-12 | Mitsubishi Electric Corp | Temperature control device and method thereof |
| US5892207A (en) * | 1995-12-01 | 1999-04-06 | Teisan Kabushiki Kaisha | Heating and cooling apparatus for reaction chamber |
| US6635580B1 (en) * | 1999-04-01 | 2003-10-21 | Taiwan Semiconductor Manufacturing Co. Ltd. | Apparatus and method for controlling wafer temperature in a plasma etcher |
| US20020139523A1 (en) * | 2001-03-28 | 2002-10-03 | Dainippon Screen Mfg.Co., Ltd. | Thermal processor |
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| CN1918690A (en) | 2007-02-21 |
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