CN100397297C - Electronic apparatus with sliding radiation module - Google Patents

Electronic apparatus with sliding radiation module Download PDF

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Publication number
CN100397297C
CN100397297C CNB200510088623XA CN200510088623A CN100397297C CN 100397297 C CN100397297 C CN 100397297C CN B200510088623X A CNB200510088623X A CN B200510088623XA CN 200510088623 A CN200510088623 A CN 200510088623A CN 100397297 C CN100397297 C CN 100397297C
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CN
China
Prior art keywords
guide pillar
radiating module
electronic installation
circuit board
heater element
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Application number
CNB200510088623XA
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Chinese (zh)
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CN1904801A (en
Inventor
黄健强
李宗宪
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Asustek Computer Inc
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Asustek Computer Inc
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Priority to CNB200510088623XA priority Critical patent/CN100397297C/en
Publication of CN1904801A publication Critical patent/CN1904801A/en
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Publication of CN100397297C publication Critical patent/CN100397297C/en
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Abstract

The invention relates to an electric device with sliding heat emission module. It includes circuit board, heat emission module, and at least one guide pillar. The heat emission module is set on heating component that is set on circuit board. At least a spring tab that has installing hole is set in heat emission module. And the installing hole contains inducing section and the first fixation section. The guide pillar is located in installing hole, and the side has groove. When the heat emission module moves a suitable distance, the groove would slide into the first fixation section that would be buckled by the guide pillar. Thus, the heat emission module would be tightly fixed on the heating component.

Description

A kind of electronic installation with sliding radiation module
Technical field
The present invention relates to a kind of electronic installation, and be particularly related to a kind of electronic installation with radiating module.
Background technology
In recent years, along with advancing by leaps and bounds of science and technology, make it for example is that the arithmetic speed of electronic installation of main frame inside constantly improves.Because the arithmetic speed of electronic installation constantly improves, the heating power of electronic installation is also along with constantly soaring, for the electronic installation that prevents main frame inside overheated, and causing electronic installation that temporary or nonvolatil inefficacy takes place, it can normally move so electronic installation need have enough heat-sinking capabilities.
Fig. 1 is the three-dimensional exploded view of known a kind of electronic installation.Please refer to Fig. 1, known electronic installation 100 has circuit board 110, radiating module 120, heater element 130, locking backboard 140, a plurality of shell fragment 150 and a plurality of screw 160.Wherein, heater element 130 is arranged on the circuit board 110, and radiating module 120 is fixed in the surface in contact 130a on the heater element 130.In addition, 140 of backboards of locking are arranged at circuit board 110 belows, and the backboard 140 that wherein locks has a plurality of double-screw bolts 142, and in other words, double-screw bolt 142 protrudes from circuit board 110.In addition, shell fragment 150 has a plurality of through holes 152 and is riveted on the side of radiating module 120.
In addition, radiating module 120 can successfully be fixed on the heater element 130, using at least four screws 160 passes the through hole 152 on the shell fragment 150 respectively and is locked on the double-screw bolt 142, shell fragment 150 promptly can impose downward pressure to radiating module 120, radiating module 120 thereby can closely contact with heater element 130.
When electronic installation 100 in when operation, heater element 130 is in the condition of high temperature, heater element 130 can be by contacting with radiating module 120, make the high temperature of heater element 130 be passed to radiating module 120, reduce the temperature of heater element 130 again by the thermal convection phenomenon between radiating module 120 and surrounding air by heat exchange pattern.Therefore, electronic installation 100 does not have superheating phenomenon.
Yet, can be fixed on the heater element for making radiating module, a plurality of screws must be locked in corresponding double-screw bolt, shell fragment just can give radiating module downward pressure, as mentioned above.So, will expend many times in above-mentioned locking process, be an important topic so how to reduce the locking time that radiating module is fixed on the heater element.In addition, if the locking tightness between each screw double-screw bolt corresponding with it is different, the power that the feasible shell fragment that is arranged at each side of radiating module gives radiating module downwards is different, cause the radiating module discontinuity equalization that is fixed on the heater element, not only have influence on the heat dissipation of radiating module on heater element, also influence the total quality of electronic installation, so when how to make radiating module be fixed on the heater element, the state that radiating module can be in stress equalization is another important topic.
Summary of the invention
In view of the foregoing, the purpose of this invention is to provide a kind of electronic installation, in this electronic installation, can radiating module be fastened on the heater element, to reduce the time of assembling in the mode of ease of Use.
For reaching above-mentioned purpose of the present invention, the invention provides a kind of electronic installation with sliding radiation module, it comprises circuit board, radiating module and at least one guide pillar.Wherein, circuit board is provided with heater element, and radiating module is positioned on the heater element, and comprises with the contacted base of heater element and be positioned at second fixed part of a side of base.Radiating module then is provided with at least one shell fragment, and shell fragment is fixed in second fixed part, and has pilot hole, and pilot hole has the introduction part and first fixed part.Wherein, introduction part than first fixed part near circuit board.In addition, guide pillar is to protrude in circuit board and pass pilot hole, and the guide pillar side also has groove.Wherein, guide pillar has first external diameter, and guide pillar has second external diameter relatively in the groove place, and second external diameter is less than first external diameter.When radiating module moves suitable distance, groove will slip into first fixed part by introduction part, and guide pillar promptly forces shell fragment to be out of shape to circuit board, and fastens mutually with first fixed part, with fixing radiating module.Wherein, first internal diameter of introduction part is second internal diameter greater than first fixed part, and second internal diameter comes down to equal second external diameter.
Described according to one of the present invention embodiment, pilot hole for example is a hardy hole, and wherein introduction part is first hole, and first fixed part is second hole, and first hole then links to each other with second hole, to form the shape of hardy hole.
Described according to one of the present invention embodiment, electronic installation for example also comprises the guide pillar support, and guide pillar is to be fixed in the guide pillar support.Wherein, the guide pillar support contacts with the surface of circuit board, and meaning is that guide pillar is to pass circuit board.
Described according to one of the present invention embodiment, electronic installation for example also comprises at least one screw and a double-screw bolt, screw in order to the locking radiating module in double-screw bolt.Wherein, double-screw bolt for example is to be fixed on the guide pillar support and to protrude in circuit board.
Described according to one of the present invention embodiment, shell fragment for example is the rubber-like metal.
Described according to one of the present invention embodiment, radiating module for example more comprises at least one radiating fin.Wherein, radiating fin is positioned at first of base, and second of base with respect to first and contact with heater element.
Described according to one of the present invention embodiment, pilot hole for example is the ladder platform that is positioned at shell fragment.
Based on above-mentioned, in electronic installation of the present invention, only must make the radiating module suitable distance of sliding, can cooperatively interact with the guide pillar that is arranged on the guide pillar support by the shell fragment that is arranged on the radiating module, and make the shell fragment on the radiating module can give radiating module downward pressure, radiating module thereby can remain on tight state of contact with heater element.In addition, only need a screw radiating module can be locked in double-screw bolt, the relative position between shell fragment and guide pillar thereby can fix, so shell fragment can continue to remain on the state to pressing down, the also sustainable and heater element of heating radiator remains on tight state of contact.Thus, can radiating module be fastened on the heater element, to reduce the time of assembling in the mode of ease of Use.In addition, the present invention also can save the use amount of screw.
State with other purpose, feature and advantage and can become apparent on the present invention for allowing, preferred embodiment cited below particularly, and conjunction with figs. are described in detail below.
Description of drawings
Fig. 1 is the three-dimensional exploded view of known a kind of electronic installation.
Fig. 2 is the constitutional diagram of a kind of electronic installation of preferred embodiment of the present invention.
Fig. 3 is the three-dimensional exploded view of electronic installation shown in Figure 2.
Fig. 4 is the stereographic map of shell fragment shown in Figure 3.
Fig. 5 is the three-dimensional exploded view of radiating module shown in Figure 3.
Fig. 6 a is the vertical view of radiating module when closely not contacting with heater element shown in Figure 3.
Fig. 6 b is the profile of the radiating module shown in Fig. 6 a along profile line A-A '.
Fig. 7 a is a radiating module shown in Figure 3 and vertical view after heater element closely contacts.
Fig. 7 b is the profile of the radiating module shown in Fig. 7 a along profile line A-A '.
The main element description of symbols
100,200: electronic installation
110,210: circuit board
120,220: radiating module
130,212: heater element
130a, 212a: surface in contact
140: the locking backboard
142,270: double-screw bolt
150,250: shell fragment
152: through hole
160,260: screw
222: base
222a: first
222b: second
224: the second fixed parts
226: radiating fin
228: protuberance
230: guide pillar
232: groove
240: the guide pillar support
250a: kink
252: pilot hole
252a: minimum-value aperture portion
254: introduction part
256: the first fixed parts
P1: first platform
P2: second platform
Embodiment
Fig. 2 is the constitutional diagram of a kind of electronic installation of preferred embodiment of the present invention, and Fig. 3 is the three-dimensional exploded view of electronic installation shown in Figure 2.Please be simultaneously with reference to Fig. 2 and Fig. 3, in the present embodiment, electronic installation 200 comprises circuit board 210, radiating module 220 and one or more guide pillar 230.Wherein, circuit board 210 is provided with heater element 212, and heater element 212 for example is electronic components such as the central processing unit (Central Processing Unit is called for short CPU) of computer-internal, or north bridge (North Bridge) chip.In addition, radiating module 220 is to be positioned on the heater element 212, and contacts with surface in contact 212a on the heater element 212.Radiating module 220 is in order to assisting heater element 212 that its internal heat is distributed, and reducing the temperature of heater element 212, so heater element 212 can be because of not overheated, and temporary or nonvolatil inefficacy takes place, and then has influence on the operation of electronic installation 200.
Electronic installation 200 for example also comprises guide pillar support 240, and guide pillar support 240 is with so that radiating module 220 can interfix with it, and then radiating module 220 can closely be in contact with one another with heater element 212.Fixing by 240 on radiating module 220 and guide pillar support can be avoided radiating module 220 and motherboard 210 directly fixing, and cause the damage and the distortion of motherboard 210.Wherein, guide pillar support 240 is adjacent with the surface (bottom surface of circuit board 210) of circuit board 210.In addition, guide pillar 230 is to be fixed on the guide pillar support 240, and in other words, guide pillar 230 is to pass circuit board 210.Certainly, guide pillar 230 also can directly lock and interfixes on motherboard 210 or with cooperating of other fixed sturcture.
In addition, radiating module 220 promptly is closely to contact with heater element 212 with one or more shell fragments 250 on radiating module 220 is set by above-mentioned guide pillar 230, and shell fragment 250 for example is the rubber-like metal.Wherein, shell fragment 250 is with respect to the guide pillar on the guide pillar support 240 230 in the position that is provided with on the radiating module 220, by cooperatively interacting of 250 on guide pillar 230 and shell fragment, can make shell fragment 250 can give radiating module 220 downward pressure, make radiating module 220 to be in tight state of contact with heater element 212.
Fig. 4 is the stereographic map of the shell fragment of Fig. 3.Please refer to Fig. 4, shell fragment 250 has pilot hole 252, pilot hole 252 has the introduction part 254 and first fixed part 256, wherein introduction part 254 has the first internal diameter (not shown), and first fixed part 256 has the second internal diameter (not shown), and first internal diameter of introduction part 254 is second internal diameters greater than first fixed part 256.In addition, also can form kink 250a on the shell fragment 250, wherein the 252a of minimum-value aperture portion of pilot hole 252 is positioned on the kink 250a, so that two larger aperture portions of pilot hole 252 are positioned on the Different Plane respectively, for example the larger aperture of introduction part 254 is positioned on the first platform P1, and the larger aperture of first fixed part 256 is positioned on the second platform P2, and wherein introduction part 254 to the first fixed parts 256 are near circuit board 210.
As mentioned above, introduction part 254 is first hole for example, and first fixed part 256 for example is second hole, and first hole is connected with second hole and is the shape of hardy hole.On the other hand, guide pillar 230 is to protrude in circuit board 210 and be arranged in pilot hole 252.Wherein, the side of guide pillar 230 has groove 232, and groove 232 is that the side by machining guide pillar 230 forms, and for example be the indentation that cuts appropriate depth by milling cutter in the side of guide pillar 230, and groove 232 is to engage with first fixed part 256.In addition, guide pillar 230 has the first external diameter (not shown), and guide pillar 230 has the second external diameter (not shown) in groove 232 places, and second external diameter is less than first external diameter.Second external diameter for example is the less external diameter that guide pillar 230 is produced after machining, and wherein second external diameter comes down to equal second internal diameter of first fixed part 256.
Hereinafter will describe the set-up mode of shell fragment 250 on radiating module 220 and the mutual kinematic relation of 250 on guide pillar 230 and shell fragment in detail.
Fig. 5 is the three-dimensional exploded view of radiating module shown in Figure 3.Please be simultaneously with reference to Fig. 3 and Fig. 5, radiating module 220 for example comprises base 222, second fixed part 224 and one or more radiating fin 226.Wherein, it promptly is to be positioned on the protuberance 228 that base 222 sides have a plurality of protuberance 228, the second fixed parts 224, and shell fragment 250 is assembled in two adjacent protuberances 228.By shell fragment 250 being riveted on second fixed part 224 on the protuberance 228, can finish that shell fragment 250 is arranged at action on the radiating module 220.In addition, radiating fin 226 is first 222a that is positioned at base 222, and second 222b of base 222 contacts with respect to first 222a and with the surface in contact 212a of heater element 212, wherein the material of base 222 and the radiating fin 226 preferable material of heat conductivity such as copper or aluminium for example.
In the present embodiment, radiating module 220 can and heater element 212 to be in tight state of contact be mutual motion by 250 on guide pillar 230 and shell fragment.At this, i.e. mutual motion at 250 on guide pillar 230 and shell fragment is described further.Fig. 6 a is the vertical view of radiating module when closely not contacting with heater element shown in Figure 3, and Fig. 6 b is the profile of the radiating module shown in Fig. 6 a along profile line A-A '.Please be simultaneously with reference to Fig. 6 a and Fig. 6 b, when radiating module 220 did not closely contact with heater element 212, guide pillar 230 was the introduction parts 254 that are arranged in pilot hole 252.Wherein, second external diameter of guide pillar 230 is first internal diameters less than introduction part 254, so guide pillar 230 is states of keeping interference fit with introduction part 254.Therefore, only must give the power of translation to radiating module 220, guide pillar 230 can buckle into first fixed part 256 from introduction part 254 easily, and said process will be in hereinafter being described in detail.
Please refer to Fig. 7 a, it is a radiating module shown in Figure 3 and vertical view after heater element closely contacts.As seen from the figure, when the power that gives radiating module 220 translations so that after radiating module 220 moves suitable distance, the position that guide pillar 230 is arranged in pilot hole will buckle into first fixed part 256 from introduction part 254, this moment, second external diameter of guide pillar 230 was second internal diameters that equal first fixed part 256, so guide pillar 230 and 256 of first fixed parts are to be the state of closely cooperating.Then please refer to Fig. 7 b, it is the profile of the radiating module shown in Fig. 7 a along profile line A-A '.As seen from the figure, buckle into the process of first fixed part 256 from introduction part 254 at guide pillar 230, because the introduction part 254 and first fixed part 256 lay respectively at the first platform P1 and the second platform P2 of stepped change and go up (as shown in Figure 4), and introduction part 254 to the first fixed parts 256 are near circuit board 210 (shown in Fig. 6 b), when so groove 232 slips into first fixed part 256 by introduction part 254, guide pillar 230 will force shell fragment 250 to circuit board 210 distortion and impose on the downward pressure of radiating module 220, radiating module 220 thereby can be in tight state of contact with heater element 212.
After guide pillar 230 is fastened on first fixed part 256, guide pillar 230 continues to be fastened in first fixed part 256 in order to make fixedly, can use one or more screws 260 side of radiating module 220 is locked in double-screw bolt 270 on the guide pillar support 240, wherein double-screw bolt 270 protrudes in circuit board 210.So the relative position that shell fragment 250 and guide pillar are 230 thereby can fix makes shell fragment 250 can continue to remain in the state to pressing down, the also sustainable and heater element of heating radiator remains on close-fitting state.
Present embodiment only illustrates that the mutual motion with 230 of shell fragment 250 and guide pillars makes radiating module 220 be subjected to the downward pressure of shell fragment 250.In the present invention, can use a plurality of shell fragments 250 guide pillar 230 corresponding with it gives radiating module 220 downward pressure, so that radiating module 220 closely contacts with heater element 212, the mutual motion process that a plurality of shell fragments 250 guide pillar corresponding with it is 230, all identical with the explanation of present embodiment, so no longer be repeated in this description in this.
In sum, in electronic installation of the present invention, only must make the radiating module suitable distance of sliding, can cooperatively interact with the guide pillar that is arranged on the guide pillar support by the shell fragment that is arranged on the radiating module, and make the shell fragment on the radiating module can give radiating module downward pressure, radiating module thereby can remain on tight state of contact with heater element.In addition, only need a screw radiating module can be locked in double-screw bolt, the relative position between shell fragment and guide pillar thereby can fix makes shell fragment can continue to remain in the state to pressing down, and heating radiator is also sustainable to remain on tight state of contact with heater element.Thus, can radiating module be fastened on the heater element, to reduce the time of assembling in the mode of ease of Use.In other words, the present invention also can save the use amount of screw and the time of screw locking contraposition.
In addition, knownly a plurality of screws are locked in double-screw bolt so that radiating module can fix radiating module in the process of heater element by shell fragment, if the locking tightness between each screw double-screw bolt corresponding with it is different, to make the radiating module that is fixed on the heater element be in the state of discontinuity equalization, and then have influence on the heat dissipation of radiating module on heater element and the total quality of electronic installation.Yet, in electronic installation of the present invention, radiating module is to cooperatively interact to be fixed on the heater element by shell fragment and guide pillar, so the radiating module that is fixed on the heater element of the present invention can be in the state of stress equalization, make radiating module that good heat dissipation be arranged on heater element, and then improve the total quality of electronic installation.
Though the present invention discloses as above with preferred embodiment; right its is not in order to limit the present invention; any person of ordinary skill in the field; without departing from the spirit and scope of the invention; when can doing a little change and improvement, so protection scope of the present invention is as the criterion when looking the claim person of defining.

Claims (8)

1. electronic installation with sliding radiation module is characterized in that comprising:
Circuit board, this circuit board is provided with heater element;
Radiating module, be positioned on this heater element, and comprise with the contacted base of this heater element and be positioned at second fixed part of a side of this base, this radiating module is provided with at least one shell fragment, this shell fragment is fixed in this second fixed part, and have pilot hole, this pilot hole has the introduction part and first fixed part, and this introduction part than this first fixed part near this circuit board; And
At least one guide pillar, protrude in this circuit board and pass this pilot hole, the side of this guide pillar has groove, this guide pillar has first external diameter, and this guide pillar has second external diameter relatively in this groove place, and this second external diameter is less than this first external diameter, when this radiating module moves a certain distance when making this groove slip into this first fixed part by this introduction part, this guide pillar forces this shell fragment to this circuit board distortion, and makes this first fixed part be fastened on this groove, to fix this radiating module;
Wherein first internal diameter of this introduction part is greater than second internal diameter of this first fixed part, and this second internal diameter equals this second external diameter in fact.
2. the electronic installation with sliding radiation module according to claim 1, it is characterized in that this pilot hole is a hardy hole, this introduction part is first hole, and this first fixed part is second hole, this first hole links to each other with this second bore portion, to form the shape of this hardy hole.
3. the electronic installation with sliding radiation module according to claim 1 is characterized in that also comprising the guide pillar support, and this guide pillar is fixed in this guide pillar support, and this guide pillar support contacts with the surface of this circuit board, and this guide pillar passes this circuit board.
4. the electronic installation with sliding radiation module according to claim 1 is characterized in that also comprising at least one screw and a double-screw bolt, and this screw locks this radiating module in this double-screw bolt, and this double-screw bolt protrudes from this circuit board.
5. the electronic installation with sliding radiation module according to claim 4 is characterized in that this double-screw bolt is fixed on this guide pillar support.
6. the electronic installation with sliding radiation module according to claim 1 is characterized in that this shell fragment is the rubber-like metal.
7. the electronic installation with sliding radiation module according to claim 1, it is characterized in that this radiating module more comprises at least one radiating fin, this radiating fin is positioned at first of this base, and second of this base with respect to this first and contact with this heater element.
8. the electronic installation with sliding radiation module according to claim 1 is characterized in that this pilot hole is positioned at the kink of this shell fragment.
CNB200510088623XA 2005-07-29 2005-07-29 Electronic apparatus with sliding radiation module Active CN100397297C (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CNB200510088623XA CN100397297C (en) 2005-07-29 2005-07-29 Electronic apparatus with sliding radiation module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CNB200510088623XA CN100397297C (en) 2005-07-29 2005-07-29 Electronic apparatus with sliding radiation module

Publications (2)

Publication Number Publication Date
CN1904801A CN1904801A (en) 2007-01-31
CN100397297C true CN100397297C (en) 2008-06-25

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Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN108337857B (en) * 2018-02-01 2020-04-07 深圳创维-Rgb电子有限公司 Television receiver

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2352990Y (en) * 1998-09-23 1999-12-08 宏桦国际股份有限公司 Means for locking CPU cooling device
CN2657343Y (en) * 2003-11-01 2004-11-17 鸿富锦精密工业(深圳)有限公司 Fixed device for radiator
CN2681217Y (en) * 2004-01-14 2005-02-23 鸿富锦精密工业(深圳)有限公司 Locking device for radiator

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN2352990Y (en) * 1998-09-23 1999-12-08 宏桦国际股份有限公司 Means for locking CPU cooling device
CN2657343Y (en) * 2003-11-01 2004-11-17 鸿富锦精密工业(深圳)有限公司 Fixed device for radiator
CN2681217Y (en) * 2004-01-14 2005-02-23 鸿富锦精密工业(深圳)有限公司 Locking device for radiator

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